CN204130588U

CN204130588U - A kind of COB light source without packaged chip

Info

Publication number: CN204130588U
Application number: CN201420400399.8U
Authority: CN
Inventors: 罗锦长
Original assignee: Huizhou Lei Tong Photoelectric Device Co Ltd
Current assignee: Huizhou Lei Tong Photoelectric Device Co Ltd
Priority date: 2014-07-18
Filing date: 2014-07-18
Publication date: 2015-01-28
Anticipated expiration: 2024-07-18

Abstract

A kind of COB light source without packaged chip, comprise surface arrange fluorescence coating without packaged chip and substrate, described substrate arranges conducting wire, describedly to be fitted in by crystal-bonding adhesive layer on the conducting wire of described substrate without packaged chip, form electrical connection, describedly form substratum transparent without packaged chip periphery, described substratum transparent covers described without packaged chip.The utility model designs conducting wire on substrate, adopt die bond glue-line will fix on substrate without packaged chip nation, and realizes being electrically connected with conducting wire, then that transparent adhesive tape is shaping and covering is without packaged chip, achieve the area source of traditional LED COB, solve the problem that product light efficiency is low.

Description

A kind of COB light source without packaged chip

Technical field

The utility model belongs to LED technical field, particularly relates to a kind of COB light source without packaged chip.

Background technology

Light emitting semiconductor device, as light-emitting diode (LED) or laser diode etc. are widely used in a lot of field.The appearance of light emitting semiconductor device brings the light source of energy covering visible light spectrum and higher luminous efficiency and solid state stability.

Current LED chip mainly adopts support to encapsulate.The LED component adopting support to encapsulate comprises package support, the recessed cup of the support be arranged on package support, in the recessed cup of support, metal bonding wire is set, LED chip is arranged in the recessed cup of support, and form circuit by metal wire and package support and be connected, in the recessed cup of support, be filled with the packaging plastic being coated with fluorescent material.Adopt the exiting surface of the LED chip of support encapsulation upwards, because package support and the recessed cup of support are made up of transparent materials, therefore, LED component only has upper surface can bright dipping, and light emission rate is low, and around LED chip, packed support is coated, and radiating effect is not good.

Along with the continuous progress and development of technology of LED whole industry chain, current industry has been developed always without packaged chip, and namely spraying or mold pressing fluorescence coating on the basis of light-emitting diode, make it to send white light.So, traditional LED industry chain is die terminals, potted ends, application end have become die terminals and directly arrived application end, and potted ends, just without the need to being present in, due to the cost saving potted ends, thus reduces the cost of LED light source.

But this light source without packaged chip is combined by point-source of light white chip, and traditional LED COB light source is area source, therefore this hot spot sent without the light source of packaged chip is inferior to traditional COB light source, can not substitute COB light source completely; Secondly, directly exposed in the external world without packaged chip, equivalent not traditional LED COB light source, by one or more layers fluorescent glue---the mixture of transparent glue and fluorescent material, in being wrapped in by chip, the reliability therefore without packaged chip light source can be inferior to traditional COB light source, due to not yet ripe without the technology of packaged chip at present, limit applying of the new LED light source combined by it, traditional LED COB light source cannot be replaced in a short time.

Utility model content

The purpose of this utility model is the COB light source without packaged chip that can realize area source providing a kind of structure to improve.

To achieve these goals, the utility model takes following technical solution:

A kind of COB light source without packaged chip, comprise surface arrange fluorescence coating without packaged chip and substrate, described substrate arranges conducting wire, describedly to be fitted in by crystal-bonding adhesive layer on the conducting wire of described substrate without packaged chip, form electrical connection, describedly form substratum transparent without packaged chip periphery, described substratum transparent covers described without packaged chip.

Substrate of the present utility model is aluminium base or ceramic substrate or resin substrate or plastic base.

Of the present utility model is flip-chip without packaged chip, and the electrode of chip bottom is connected with the conducting wire on substrate.

Substrate of the present utility model is provided with box dam, and described substratum transparent is filling in described box dam, and cover be positioned at described box dam without packaged chip.

Box dam of the present utility model is transparent box dam, and the lighting angle of LED is 180 degree.

Box dam of the present utility model is white box dam, and the lighting angle of LED is 120 degree.

From above technical scheme, the utility model is on the basis of the novel LED light source without packaged chip, adopting die bond glue-line chip nation to be fixed on devises on the substrate of conducting wire, conducting wire is formed with chip and is electrically connected, then transparent adhesive tape is adopted to carry out embedding, form the die bond glue-line covering chip, not only can protect white chip better, and chip is high-index material, through the fluorescent glue of the high index of refraction on its surface, pass through the transparent glue of the low-refraction be close with air again, improve light efficiency thus, the area source of traditional LED COB can be equal to.

Accompanying drawing explanation

In order to be illustrated more clearly in the utility model embodiment, simple introduction is done below by the accompanying drawing used required in embodiment or description of the prior art, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

Fig. 1 is the structural representation of the utility model embodiment;

Fig. 2 is the vertical view of Fig. 1;

Fig. 3 is the structural representation of the substrate having made conducting wire;

Fig. 4 is the vertical view of Fig. 3;

Fig. 5 is the structural representation of chip nation on substrate;

Fig. 6 is the vertical view of Fig. 5;

Fig. 7 is the enlarged diagram of I part in Fig. 5;

Fig. 8 is the structural representation adopting the shaping substratum transparent of box dam;

Fig. 9 is the vertical view of Fig. 8.

Embodiment

As depicted in figs. 1 and 2, the COB light source without packaged chip of the present utility model comprises substrate 1, conducting wire 2, die bond glue-line 3, without packaged chip 4 and substratum transparent 5, chip surface spraying or mold pressing have fluorescence coating (not shown).The substrate 1 of the present embodiment is aluminium base, and substrate can also be ceramic substrate or resin substrate or plastic base.Be designed with conducting wire (layer) 2 on substrate 1, conducting wire can according to the output current output voltage design series connection of LED power with in parallel, and conducting wire is used for being formed with the electrode without packaged chip being electrically connected.Be fitted on the conducting wire 2 of substrate 1 without packaged chip 4 by die bond glue-line 3, form electrical connection.Can be flip-chip without packaged chip 4, also can be positive cartridge chip, the present embodiment be flip-chip without packaged chip 4, the electrode of chip is positioned on its bottom surface.Die bond glue-line of the present utility model plays the effect be adhered to by chip 4 on the conducting wire 2 of substrate 1, and heat conduction and conduction, the material that crystal-bonding adhesive prioritizing selection bonding force is strong and the capacity of heat transmission is excellent.Substratum transparent 5 is shaping to be covered in without packaged chip 4 periphery.

Below in conjunction with Fig. 3 to Fig. 9, manufacturing process of the present utility model is described further:

With reference to Fig. 3 and Fig. 4, make conducting wire 2 according to designing requirement on substrate 1;

With reference to Fig. 5, Fig. 6 and Fig. 7, adopt die bond glue-line 3 without packaged chip 4 nation surely on substrate 1, chip will to be formed with conducting wire 2 and be electrically connected;

As shown in Figure 8 and Figure 9, enclose on substrate 1 by the shape that box dam glue 6 specifies by the size of regulation, in this example, the shape of box dam is annular;

Be poured into by transparent adhesive tape in box dam 5, form substratum transparent 5, substratum transparent 5 will cover without packaged chip 4, and shaping.Substratum transparent top shape after shaping can be plane, or convex, or spill.

Substratum transparent of the present utility model preferentially uses the glue of low-refraction high permeability, and as far as possible close to the refractive index of air, the light efficiency that LED sends thus just can reach higher.Box dam 6 can be transparent, and when adopting transparent box dam, the lighting angle of LED can close to 180 degree, and when adopting the box dam of white, the lighting angle of LED is at about 120 degree.Technological process shown in this example is without packaged chip paster, box dam, encapsulating, shaping; Also can be box dam, without packaged chip paster, encapsulating, shaping.If direct mould by transparent adhesive tape compression molding, does not then need box dam.

The utility model designs conductive circuit layer on substrate, adopt die bond glue-line will fix on substrate without packaged chip nation, and realizes being electrically connected with conducting wire, then that transparent adhesive tape is shaping and covering is without packaged chip, achieve the area source of traditional LED COB, solve the problem that product light efficiency is low.

Above embodiment is only in order to illustrate that the technical solution of the utility model is not intended to limit, although be described in detail the utility model with reference to above-described embodiment, those of ordinary skill in the field are to be understood that, still can modify to embodiment of the present utility model or equivalent replacement, and not departing from any amendment of the utility model spirit and scope or equivalent replacement, it all should be encompassed among right of the present utility model.

Claims

1. without a COB light source for packaged chip, comprise surface arrange fluorescence coating without packaged chip and substrate, it is characterized in that:

Described substrate arranges conducting wire, describedly to be fitted in by crystal-bonding adhesive layer on the conducting wire of described substrate without packaged chip, form electrical connection, describedly form substratum transparent without packaged chip periphery, described substratum transparent covering is described without packaged chip.

2. as claimed in claim 1 without the COB light source of packaged chip, it is characterized in that: described substrate is aluminium base or ceramic substrate or resin substrate or plastic base.

3., as claimed in claim 1 or 2 without the COB light source of packaged chip, it is characterized in that: described is flip-chip without packaged chip, and the electrode of chip bottom is connected with the conducting wire on substrate.

4. the COB light source without packaged chip as claimed in claim 1, it is characterized in that: described substrate is provided with box dam, described substratum transparent is filling in described box dam, and covering be positioned at described box dam without packaged chip.

5., as claimed in claim 4 without the COB light source of packaged chip, it is characterized in that: described box dam is transparent box dam, the lighting angle of LED is 180 degree.

6., as claimed in claim 4 without the COB light source of packaged chip, it is characterized in that: described box dam is white box dam, the lighting angle of LED is 120 degree.