CN209104187U

CN209104187U - A kind of LED package

Info

Publication number: CN209104187U
Application number: CN201821594323.8U
Authority: CN
Inventors: 李若尧
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-09-28
Filing date: 2018-09-28
Publication date: 2019-07-12
Anticipated expiration: 2028-09-28

Abstract

The utility model relates to a kind of LED packages, including package support and LED chip with bowl, the LED chip die bond is in bowl, there is First terrace and second step face in the bowl of the package support, the First terrace, the side wall of second step face and bowl formed from bowl opening inside internal diameter be gradually reduced it is ladder-like, the height in the second step face is not less than the LED chip light extraction face being fixed in bowl, also there is the first layer of silica gel in the bowl, fluorescent adhesive layer and the second layer of silica gel, first layer of silica gel is located at the bottom of bowl, the fluorescent adhesive layer is covered in the first layer of silica gel, second layer of silica gel is covered on fluorescent adhesive layer, to solve the problems, such as that the packing colloid of existing LED package easily occurs to be detached from package support.

Description

A kind of LED package

Technical field

The utility model relates to LED encapsulation fields, are specifically related to a kind of LED package.

Background technique

With the fast development of Light-emitting diode LED technology, the performances such as brightness, service life of LED have all obtained greatly mentioning It rises, so that the application field of LED is more and more extensive, the room lightings such as from outdoor lightings such as street lamps to ornament lamp are numerous and confused to use Or LED is replaced with as light source.Meanwhile LED is with high-efficient, the service life is long, power and energy saving, vibration strength is good, reaction speed is fast, can By property height, Environmental Safety, without the harmful substances such as Hg the advantages that, be more and more widely used every field in illumination.

The encapsulating structure of LED surface pasting type (SMD) applies the advantages such as convenient and small in size to have become master due to it The packing forms wanted.LED surface surface mount package structure commonly used in the prior art generally comprises a bracket, has one in bracket The LED chip being mounted on by die bond technique in bracket.Rack surface is provided with metal lead wire, the metal in LED chip two sides Electrode is provided on lead, the positive and negative electrode of LED chip is electrically connected with the electrode on bracket respectively by gold thread.But due to envelope The thermal expansion coefficient difference filled between bracket and packing colloid is larger, and packing colloid can occur after working long hours for LED lamp bead The phenomenon that being detached between package support can enter to inside package support so as to cause external steam, influence LED lamp bead Service life.

Utility model content

The utility model is intended to provide a kind of LED package, is easily occurred with solving the packing colloid of existing LED package The problem of being detached from package support.

Concrete scheme is as follows:

A kind of LED package, including package support and LED chip with bowl, the LED chip die bond is in bowl It is interior, in the bowl of the package support have First terrace and second step face, the First terrace, second step face and The side wall of bowl forms that internal diameter is gradually reduced ladder-like inside from bowl opening, and the height in the second step face is not less than solid It is scheduled on the LED chip light extraction face in bowl, also there is the first layer of silica gel, fluorescent adhesive layer and the second layer of silica gel, institute in the bowl State the bottom that the first layer of silica gel is located at bowl, and light-emitting surface of the thickness of the first layer of silica gel not less than LED chip and bowl bottom surface Between linear distance, the fluorescent adhesive layer is covered in the first layer of silica gel, and second layer of silica gel is covered on fluorescent adhesive layer, And second layer of silica gel thickness not less than First terrace and bowl opening linear distance.

Further, the refractive index of first layer of silica gel, fluorescent adhesive layer and the second layer of silica gel is sequentially reduced.

Further, there is an annular groove on the First terrace, be filled with the second silica gel in the annular groove Layer.

Further, the section of the annular groove is bell shape with large opening and small interior.

Further, arc transition between the second step face and the side wall of bowl, the First terrace and bowl Side wall between form corner angle.

LED package provided by the utility model has the advantage that the utility model provides compared with prior art LED package in the side wall of bowl be stair-stepping, and have and the first layer of silica gel of respective ladder height uniform thickness and the Second silica gel layer, fluorescent adhesive layer are then clipped between the first layer of silica gel and the second layer of silica gel, can reduce because of package support and packaging plastic Because thermal expansion coefficient difference leads to the probability being detached between packing colloid and package support between body, to improve LED package Service life.

Detailed description of the invention

Fig. 1 shows the top view of LED package.

Fig. 2 shows the cross-sectional views of LED package.

Fig. 3 shows the enlarged drawing in Fig. 2 at A.

Fig. 4 shows the schematic diagram of transition between the side wall of bowl and First terrace and second step face.

Specific embodiment

To further illustrate each embodiment, the utility model is provided with attached drawing.These attached drawings are in the utility model discloses A part of appearance mainly to illustrate embodiment, and can cooperate the associated description of specification former come the running for explaining embodiment Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and sheet are practical new The advantages of type.Component in figure is not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.

Now in conjunction with the drawings and specific embodiments, the present invention will be further described.

As depicted in figs. 1 and 2, the utility model provides a kind of LED package, which includes having bowl Package support 1 and LED chip 2, wherein package support 1 include insulation plastic-sealed body 10 and be fixed on plastic-sealed body 10 and make For the first metallic support 12 and the second metallic support 14 of positive and negative electrode, the first metallic support 12 and the second metallic support 14 it Between realized in electric isolution between the two and insulation river 16 by insulation river 16 and be filled with plastic-sealed body 10, the plastic-sealed body 10 On also form a bowl 18, wherein plastic-sealed body 10 can be made of materials such as PPA, EMC.In the present embodiment, section of bowl 18 Face is rectangle, and but not limited to this, can also be other shapes, such as circle, polygon etc..In the present embodiment, LED core Piece 2 is packed LED chip, therefore LED chip 2 is fixed in bowl 18 by crystal-bonding adhesive, and passes through bonding line 20 and the first gold medal Belong to bracket 12 and the second metallic support 14 realizes electrical connection, but not limited to this, can also be also possible to upside-down mounting with LED chip 2 Chip or vertical chip.

It is between package support and existing package support in the present embodiment the difference is that, it is referring to figs. 2 and 3, described There is First terrace 180 and second step face 182, the First terrace 180, second in the bowl 18 of package support 1 Internal diameter is gradually reduced ladder-like, the second step face inside from bowl opening for terrace 182 and the formation of the side wall of bowl 184 182 height is not less than the LED chip light extraction face that is fixed in bowl, also has the first layer of silica gel 30, glimmering in the bowl 18 Optical cement layer 32 and the second layer of silica gel 34, wherein the first layer of silica gel 30 is located at the bottom of bowl 18, and the thickness of the first layer of silica gel 30 Not less than the linear distance between 18 bottom surface of light-emitting surface and bowl of LED chip 2, i.e. the first layer of silica gel 30 is complete by LED chip 2 It covering, the fluorescent adhesive layer 32 is covered in the first layer of silica gel 30, and second layer of silica gel 34 is covered on fluorescent adhesive layer 32, And second layer of silica gel 34 thickness not less than First terrace 180 and bowl opening between linear distance, i.e. the second layer of silica gel 34 at least fill bowl completely.First layer of silica gel 30 and the second layer of silica gel 34 described here refers to the not encapsulation mixed with fluorescent powder Glue-line, fluorescent adhesive layer 32 refer to the encapsulation glue-line mixed with fluorescent powder, in the light excitation fluorescent adhesive layer 32 that LED chip 2 is emitted Fluorescent powder, and the white light for obtaining required colour temperature is mixed with the light inspired.

With reference to Fig. 1-Fig. 3, the first layer of silica gel 30, fluorescent adhesive layer 32 and the second layer of silica gel 34 are in expanded by heating, due to One layer of silica gel 30 is most close to LED chip 2, and the second layer of silica gel 34 is farthest apart from LED chip 2, thus the first layer of silica gel 30 Temperature highest, and the temperature of the second layer of silica gel 34 is minimum, and since the side wall of the bowl of package support 1 18 is in outer interior by being open It is diminishing ladder-like, therefore the amplitude of 34 expanded by heating of the second layer of silica gel is minimum, and 34 peripheral region of the second layer of silica gel Temperature can be less than the temperature of central area, the second layer of silica gel 34 can be always maintained at the leakproofness between package support, with External steam is avoided to enter in bowl.In addition, since fluorescent adhesive layer 32 is not directly to contact with LED chip 2, The temperature that fluorescent adhesive layer 32 can be reduced reduces the amplitude of its expanded by heating.

In the present embodiment, the refractive index of first layer of silica gel 30, fluorescent adhesive layer 32 and the second layer of silica gel 34 successively subtracts It is small, such as the first layer of silica gel 30 can use refractive index for 1.6 or so silica gel, the colloid in fluorescent adhesive layer 32 can be using folding Penetrate rate be 1.5 or so silica gel, and the second layer of silica gel 34 can use refractive index for 1.4 or so silica gel, to reduce LED chip The probability that the light of 2 outgoing is totally reflected between the second layer of silica gel 34 and Air Interface, can be improved the LED package External quantum efficiency, and since the price of refractive index silica gel is lower than the price of high refractive index silica gel, one can also be saved Fixed material cost.In the present embodiment, the first layer of silica gel 30, fluorescent adhesive layer 32 and the second layer of silica gel 34 are by being repeatedly layered Mode for dispensing glue first puts the first layer of silica gel 30, after then being solidified the first layer of silica gel 30 come what is realized in bowl 18 Fluorescent adhesive layer 32 is put again, puts the second layer of silica gel 34 again after the solidification of fluorescent adhesive layer 32.

With reference to Fig. 4, as one of the present embodiment preferred embodiment, there is an annular groove on the First terrace 1800, the annular groove 1800 is interior to be filled with the second layer of silica gel 34, to further prevent the second layer of silica gel 34 and package support Between separate, guarantee the air-tightness of the LED package.

Wherein preferred, the section of the annular groove 1800 is bell shape with large opening and small interior.

In the present embodiment, arc transition, the First between the second step face 182 and the side wall 184 of bowl Corner angle are formed between terrace 180 and the side wall of bowl 184, to further decrease the first layer of silica gel 30 and the second layer of silica gel 34 and bowl The probability that cup separates.

Although specifically showing and describing the utility model in conjunction with preferred embodiment, those skilled in the art is answered This is understood, in the spirit and scope for not departing from the utility model defined by the appended claims, in form and details On the utility model can be made a variety of changes, be the protection scope of the utility model.

Claims

1. a kind of LED package, including package support and LED chip with bowl, the LED chip die bond in bowl, It is characterized by: having First terrace and second step face, the First terrace, second in the bowl of the package support Its internal diameter is gradually reduced ladder-like, the height in the second step face inside from bowl opening for step surface and the formation of the side wall of bowl Degree is not less than the LED chip light extraction face being fixed in bowl, also has the first layer of silica gel, fluorescent adhesive layer and second in the bowl Layer of silica gel, first layer of silica gel are located at the bottom of bowl, and the thickness of the first layer of silica gel not less than LED chip light-emitting surface with Linear distance between bowl bottom surface, the fluorescent adhesive layer are covered in the first layer of silica gel, and second layer of silica gel is covered on glimmering On optical cement layer, and the thickness of the second layer of silica gel is not less than the linear distance between First terrace and bowl opening.

2. LED package according to claim 1, it is characterised in that: first layer of silica gel, fluorescent adhesive layer and the second silicon The refractive index of glue-line is sequentially reduced.

3. LED package according to claim 1, it is characterised in that: there is an annular groove on the First terrace, The second layer of silica gel is filled in the annular groove.

4. LED package according to claim 3, it is characterised in that: the section of the annular groove is opening large inner Small bell shape.

5. LED package according to claim 1, it is characterised in that: between the second step face and the side wall of bowl Arc transition forms corner angle between the First terrace and the side wall of bowl.