CN203721761U - High-reliability light-emitting diode bracket - Google Patents
High-reliability light-emitting diode bracket Download PDFInfo
- Publication number
- CN203721761U CN203721761U CN201320890791.0U CN201320890791U CN203721761U CN 203721761 U CN203721761 U CN 203721761U CN 201320890791 U CN201320890791 U CN 201320890791U CN 203721761 U CN203721761 U CN 203721761U
- Authority
- CN
- China
- Prior art keywords
- groove
- lead frame
- pedestal
- gap
- high reliability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000005260 corrosion Methods 0.000 claims abstract description 19
- 230000007797 corrosion Effects 0.000 claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 6
- 239000012535 impurity Substances 0.000 abstract description 6
- 239000001301 oxygen Substances 0.000 abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 4
- 238000013007 heat curing Methods 0.000 abstract 3
- 230000005855 radiation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model brings forward a high-reliability light-emitting diode bracket comprising a lead wire framework and a pedestal which is arranged on the lead wire framework. One reflection recessed chamber is defined by the lead wire framework and the pedestal. The lead wire framework comprises a positive electrode framework and a negative electrode framework, and a gap is arranged between the positive and negative electrode frameworks which are provided with grooves communicated with the gap. The gap and the grooves are filled with insulating parts. The groove bottom surfaces of the grooves are provided with coarse parts which extend along length direction of the grooves and are treated by chemical corrosion. The pedestal is a heat curing resin pedestal. The insulating parts are heat curing resin layers. In the light-emitting diode bracket, difficulty of external moisture, oxygen and impurities in entering into the internal part of the bracket is increased via arrangement of one groove. Besides, the groove bottom surfaces of the grooves are provided with the coarse parts which are treated by chemical corrosion so that bonding force is increased, sealing performance is enhanced, and reliability and the service life of the bracket are enhanced. The pedestal and the insulating parts are made of heat curing resin so as to be better in heat radiation capability.
Description
Technical field
The utility model relates to luminescent device, is specifically related to a kind of high reliability LED support.
Background technology
LED device, owing to having the features such as luminous efficiency is high, volume is little, pollution-free, is just being widely used in the fields such as TV is backlight, graphic display screen, decorative lighting.Along with the reduction of the raw material prices such as chip, encapsulation glue, support, the improving constantly of chip light emitting efficiency, light-emitting diode has started to enter the room lighting such as commercial lighting, lighting of home field.
LED device generally includes support and luminescence chip, and support comprises pedestal and lead frame, and both surround catoptric arrangement, there is a reflecting and concave-cavity, luminescence chip is located at the bottom of reflecting and concave-cavity, and pedestal adopts insulating material to make conventionally, and lead frame comprises positive and negative electrode.The hang-up that the LED device of this structure faces is conventionally sealing problem.Because, between positive and negative electrode, need insulation gap, and for improving the reflective function of lead frame, conventionally carry out electroplating processes, form bright coating, even if adopt filling insulating material therebetween, between insulating material and coating, sealing effectiveness is not good, extraneous moisture, oxygen, impurity etc. infiltrate along junction between insulating material and metal material, often this place becomes the source of seepage, service time one is long, will cause light to send out the parts such as chip, gold thread and be affected, thereby cause LED device reliability to reduce.
Utility model content
In view of this, provide that a kind of illumination effect is good, the high reliability LED support of long service life.
A kind of high reliability LED support, it comprises lead frame and is located at the pedestal on lead frame, described lead frame and pedestal limit a reflecting and concave-cavity, described lead frame comprises positive electrode framework and negative electrode framework, between described positive electrode framework and negative electrode framework, there is gap, on described positive electrode framework and negative electrode framework, there is the groove communicating with gap, in described gap and groove, be filled with insulating element, the groove bottom of described groove has along the coarse part of the extension of flute length direction and process chemical corrosion processing, described pedestal is thermosetting resin pedestal, described insulating element is thermosetting resin layer.
Further, the groove width of described groove is greater than the width in described gap, and the cross section of described groove and combinations of gaps is in T shape.
Further, described groove is caved inward near the edge in gap or is caved inward and form near the edge in gap by lead frame upper surface by lead frame bottom surface.
Further, described groove is caved inward near the edge in gap by lead frame upper surface, described groove extends through second side relative with the first side by the first side of lead frame, the upper surface of described lead frame has with described the first intersection, side indent the first side groove communicating with groove, and the upper surface of described lead frame has with described the second intersection, side indent the second side groove communicating with groove.Further, described the first side groove extends along whole the first side surface direction, described the second side groove extends along whole the second side surface direction, the groove bottom of described the first side groove has along the coarse part of the extension of flute length direction and process chemical corrosion processing, and the groove bottom of described the second side groove has along the coarse part of the extension of flute length direction and process chemical corrosion processing.
Further, in described the first side groove and the second side groove, be filled with respectively insulating barrier, described pedestal, insulating element and insulating barrier are the integrated structure of same material.
Further, described lead frame upper surface comprises and is exposed to reflecting and concave-cavity for the die bond face of die bond and the faying face of being combined with pedestal, and described faying face is at least processed and formed coarse part through chemical corrosion at the annular section around reflecting and concave-cavity bottom.
Further, described pedestal comprises the top base that is covered in lead frame faying face and the bottom base that is coated on lead frame side, and described bottom base is connected with insulating element.
Further, described pedestal is thermosetting epoxy resin pedestal, and described insulating element is thermosetting epoxy resin layer.
In above-mentioned high reliability LED support, between positive electrode framework and negative electrode framework, gap location is established a groove again, increases the difficulty that extraneous moisture, oxygen, impurity enter internal stent.And the groove bottom of groove has the process of extending along flute length direction at the coarse part of chemical corrosion processing, has both increased the adhesion of insulating element and framework, also further raising sealing property, the reliability of lifting bracket and useful life.Secondly, pedestal and insulating element are to be made up of thermosetting resin, and traditional material is thermoplastic resin, and thermosetting resin has better heat-sinking capability than thermoplastic resin.
Brief description of the drawings
Fig. 1 is the schematic diagram of the stereochemical structure of the high reliability LED support of the utility model embodiment.
Fig. 2 is the sectional structure schematic diagram of the high reliability LED support of the utility model embodiment.
Fig. 3 is the plan structure schematic diagram of the high reliability LED support of the utility model embodiment.
Fig. 4 is the bottom view of the high reliability LED support of the utility model embodiment.
Fig. 5 is the lead frame plan structure schematic diagram of the high reliability LED support of the utility model embodiment.
Fig. 6 is that the lead frame in the high reliability LED support of the utility model embodiment is looked up perspective view.
Embodiment
Below with reference to the drawings and the specific embodiments, the utility model is elaborated.
Refer to Fig. 1 to Fig. 6, the high reliability LED support 100 of the utility model embodiment is shown, it comprises lead frame 2 and is located at the pedestal 1 on lead frame 2, lead frame 2 and pedestal 1 limit a reflecting and concave-cavity 4, lead frame 2 comprises positive electrode framework 21 and negative electrode framework 22, between described positive electrode framework 21 and negative electrode framework 22, there is gap 24, on described positive electrode framework 21 and negative electrode framework 22, there is the groove 25 communicating with gap 24, in described gap 24 and groove 25, be filled with insulating element 26, the groove bottom of described groove 25 has along the coarse part of the extension of flute length direction and process chemical corrosion processing.Described pedestal 1 is thermosetting resin pedestal, and described insulating element 26 is thermosetting resin layers.
Preferably, the groove width of groove 25 is greater than the width in gap 24, and thermosetting resin is preferably thermosetting epoxy resin.The cross section that combine in described groove 25 and gap 24 is in T shape.In the embodiment shown in Figure 2, the bottom surface of described lead frame 2 is concaved with the groove 25 communicating with gap 24, and groove 25 also can be extended inward by the upper surface of lead frame 2, is about to groove 25 in diagram and is inverted with gap 24.
As shown in Figure 5, described lead frame 2 upper surfaces comprise and are exposed to the die bond for the die bond surface 211 of reflecting and concave-cavity 4 and the faying face 221 with pedestal 1 combination, and described faying face 221 is at least processed and formed coarse parts through chemical corrosions at the annular section 27 around reflecting and concave-cavity 4 bottoms.As shown in Figure 6, the bottom surface of lead frame 2 comprise the bottom surface 210 of positive electrode framework 21 and bottom surface 210,220,220, two of the bottom surfaces of negative electrode framework 22 coplanar.Diagram is caved inward as example near the edge in gap 24 by lead frame 2 bottom surfaces with groove 25, groove 25 extends through second side 202 relative with the first side 201 by the first side 201 of lead frame 2, there is with described the first side 201 intersection indents the first side groove 203 communicating with groove 25 bottom surface 210,220 of described lead frame 2, and there is with described the second side 202 intersection indents the second side groove 204 communicating with groove 25 bottom surface of described lead frame 2.In another embodiment, groove 25 also can be caved inward near the edge in gap 24 by lead frame 2 upper surfaces, form respectively with intersection, side indent and have the side groove communicating with groove 25 at lead frame 2 upper surfaces equally, structure is substantially similar, does not repeat them here.
Further, described the first side groove 203 extends along whole the first side 201 directions, and described the second side groove 204 extends along whole the second side 202 directions, and groove 25 and the first side groove 203, the second side groove 204 form I-shaped groove thus.Further, the cell wall of described groove 25 has step, the difficulty that enters internal stent further to improve extraneous moisture, oxygen, impurity.Preferably, die bond face 211 has reflecting coating, to improve reflecting rate.As shown in Fig. 5 and 6, the second side groove 204 extends along whole the second side surface direction.The interior insulating barrier that is filled with respectively of described the first side groove 203 and the second side groove 204.
Preferably, as shown in the figure, the whole groove bottom of groove 25 is the rough surface through chemical corrosion processing.In other embodiments, the region that can extend along flute length direction in the groove bottom of groove 25, through chemical corrosion processing, forms strip coarse part.Equally preferably, the whole groove bottom of the first side groove 203 and the second side groove 204 is the rough surface through chemical corrosion processing.Certainly, be understandable that, the region that the first side groove 203 and the second side groove 204 also can only extend along flute length direction in groove bottom, through chemical corrosion processing, forms strip coarse part.These groove bottom are at least being processed with roughening through chemical corrosion along flute length direction, are mainly the paths of blocking extraneous moisture, oxygen, impurity and enter support.
Pedestal 1 comprises the top base 11 that is covered in lead frame 2 faying faces and the bottom base 12 that is coated on lead frame 2 sides, and bottom base 12 is connected with insulating element 26.Pedestal 1, insulating element 26 and insulating barrier are the integrated structure of same material, and can be by the structure of compression molding with lead frame 2.
As from the foregoing, in high reliability LED support 100, between positive electrode framework 21 and negative electrode framework 22,24 places, gap establish a groove 25 again, increase the difficulty that extraneous moisture, oxygen, impurity enter support 100 inside.And the groove bottom of groove 25 has the coarse part through chemical corrosion processing extending along flute length direction, both increased the adhesion of insulating element 26 and framework 2, also further improve sealing property, the reliability of lifting bracket 100 and useful life.Secondly, pedestal 1 and insulating element 26 are to be made up of thermosetting resin, and traditional material is thermoplastic resin, and thermosetting resin has better heat-sinking capability than thermoplastic resin.
It should be noted that; the utility model is not limited to above-mentioned execution mode; according to creative spirit of the present utility model; those skilled in the art can also make other variations; the variation that these do according to creative spirit of the present utility model, within all should being included in the utility model scope required for protection.
Claims (10)
1. a high reliability LED support, it comprises lead frame and is located at the pedestal on lead frame, described lead frame and pedestal limit a reflecting and concave-cavity, described lead frame comprises positive electrode framework and negative electrode framework, it is characterized in that, between described positive electrode framework and negative electrode framework, there is gap, on described positive electrode framework and negative electrode framework, there is the groove communicating with gap, in described gap and groove, be filled with insulating element, the groove bottom of described groove has along the coarse part of the extension of flute length direction and process chemical corrosion processing, described pedestal is thermosetting resin pedestal, described insulating element is thermosetting resin layer.
2. high reliability LED support as claimed in claim 1, is characterized in that, the groove width of described groove is greater than the width in described gap, and the cross section of described groove and combinations of gaps is in T shape.
3. high reliability LED support as claimed in claim 1, is characterized in that, described groove is caved inward near the edge in gap or caved inward and form near the edge in gap by lead frame upper surface by lead frame bottom surface.
4. high reliability LED support as claimed in claim 1, it is characterized in that, described groove is caved inward near the edge in gap by lead frame bottom surface, described groove extends through second side relative with the first side by the first side of lead frame, there is with described the first intersection, side indent the first side groove communicating with groove the bottom surface of described lead frame, and there is with described the second intersection, side indent the second side groove communicating with groove the bottom surface of described lead frame.
5. high reliability LED support as claimed in claim 1, it is characterized in that, described groove is caved inward near the edge in gap by lead frame upper surface, described groove extends through second side relative with the first side by the first side of lead frame, the upper surface of described lead frame has with described the first intersection, side indent the first side groove communicating with groove, and the upper surface of described lead frame has with described the second intersection, side indent the second side groove communicating with groove.
6. the high reliability LED support as described in claim 4 or 5, it is characterized in that, described the first side groove extends along whole the first side surface direction, described the second side groove extends along whole the second side surface direction, the groove bottom of described the first side groove has along the coarse part of the extension of flute length direction and process chemical corrosion processing, and the groove bottom of described the second side groove has along the coarse part of the extension of flute length direction and process chemical corrosion processing.
7. high reliability LED support as claimed in claim 6, is characterized in that, in described the first side groove and the second side groove, is filled with respectively insulating barrier, and described pedestal, insulating element and insulating barrier are the integrated structure of same material.
8. high reliability LED support as claimed in claim 1, it is characterized in that, described lead frame upper surface comprises and is exposed to reflecting and concave-cavity for the die bond face of die bond and the faying face of being combined with pedestal, and described faying face is at least processed and formed coarse part through chemical corrosion at the annular section around reflecting and concave-cavity bottom.
9. high reliability LED support as claimed in claim 1, is characterized in that, described pedestal comprises the top base that is covered in lead frame faying face and the bottom base that is coated on lead frame side, and described bottom base is connected with insulating element.
10. high reliability LED support as claimed in claim 1, is characterized in that, described pedestal is thermosetting epoxy resin pedestal, and described insulating element is thermosetting epoxy resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320890791.0U CN203721761U (en) | 2013-12-31 | 2013-12-31 | High-reliability light-emitting diode bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320890791.0U CN203721761U (en) | 2013-12-31 | 2013-12-31 | High-reliability light-emitting diode bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721761U true CN203721761U (en) | 2014-07-16 |
Family
ID=51160894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320890791.0U Expired - Lifetime CN203721761U (en) | 2013-12-31 | 2013-12-31 | High-reliability light-emitting diode bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203721761U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963045A (en) * | 2017-05-19 | 2018-12-07 | 东莞昶通精密五金有限公司 | A kind of white light LEDs bracket of high reliability |
| CN109817785A (en) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | A kind of light emitting diode and preparation method thereof |
-
2013
- 2013-12-31 CN CN201320890791.0U patent/CN203721761U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963045A (en) * | 2017-05-19 | 2018-12-07 | 东莞昶通精密五金有限公司 | A kind of white light LEDs bracket of high reliability |
| CN109817785A (en) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | A kind of light emitting diode and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518100 White Pine Road in Yuntai science and Technology Industrial Park, building 8, floor 9, 6 Patentee after: SHENZHEN SMART SEMICONDUCTOR Ltd. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518100 White Pine Road in Yuntai science and Technology Industrial Park, building 8, floor 9, 6 Patentee before: SHENZHEN SMALITE OPTOELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170315 Address after: 330000 Jiangxi Airport Economic Zone, small and medium enterprises in the first floor of Industrial Park Office Patentee after: JIANGXI HONGLI PHOTOELECTRIC Co.,Ltd. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518100 White Pine Road in Yuntai science and Technology Industrial Park, building 8, floor 9, 6 Patentee before: SHENZHEN SMART SEMICONDUCTOR Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140716 |
|
| CX01 | Expiry of patent term |