CN218069889U - Anti-vulcanization LED device - Google Patents
Anti-vulcanization LED device Download PDFInfo
- Publication number
- CN218069889U CN218069889U CN202120491964.6U CN202120491964U CN218069889U CN 218069889 U CN218069889 U CN 218069889U CN 202120491964 U CN202120491964 U CN 202120491964U CN 218069889 U CN218069889 U CN 218069889U
- Authority
- CN
- China
- Prior art keywords
- led
- bowl
- cup structure
- bracket
- vulcanization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides an anti-vulcanization LED device, include: an LED support; the LED bracket is provided with a bowl-cup structure; the LED chip is arranged at the bottom of the LED support bowl cup structure; the LED chip is electrically connected with the LED bracket through a lead; and a white glue layer is filled between the side wall of the LED chip and the side wall of the LED support bowl-cup structure. Compared with the prior art, the utility model adopts the technological process of firstly fixing the crystal and welding the wire and then protecting the silver coating, and the white glue layer is filled between the side wall of the LED chip and the side wall of the bowl-cup structure of the LED bracket, which can effectively block the contact between the silver coating of the LED bracket and the external environment, prevent the vulcanization, and avoid the problems that the LED chip and the welding point of the lead are easy to be peeled off and fall off from the bracket while solving the vulcanization problem of the LED bracket; and the white glue layer can shield the side light of the chip, reduce the light emitting angle and improve the illumination of the light source.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, especially, relate to an anti-vulcanization LED device.
Background
As a lighting technology in the latest appearance time, the LED lamp has many advantages such as small size, low power consumption, long service life, high brightness, low heat, environmental protection, and durability. The LED lamp bead generally comprises a support, a bowl cup arranged on the support, an LED chip arranged on the bottom surface of the bowl cup and fluorescent glue encapsulated in the bowl cup. The bottom of the support of the current LED lamp bead, namely the bottom surface of the bowl cup, is usually a silver plating layer, and sulfur or sulfur-containing elements and the like easily penetrate through the fluorescent glue to enter the bottom of the support to generate a vulcanization reaction with silver.
In order to prevent sulfur element and the like from entering the bottom of the support through the fluorescent glue and generating a vulcanization reaction with silver, an anti-vulcanization coating is directly coated on the bottom surface and the side surface of the bowl cup (as shown in fig. 1, fig. 1 is a schematic structural diagram of the existing anti-vulcanization LED device, wherein 1 is an LED support, 2 is an anti-vulcanization protective film or anti-vulcanization liquid medicine, 3 is an LED chip, 4 is a lead, and 5 is the fluorescent glue), and then the LED chip is fixed at the bottom of the bowl cup by using the crystal glue, so that although the sulfur element and the like can be prevented from entering the bottom of the support through the fluorescent glue and generating a vulcanization reaction with silver, the problems that the LED chip and a gold wire welding point are peeled and fall off from the support in the using process of the LED lamp bead are easily caused, and a certain degree of vulcanization blackening phenomenon still exists along with the passing of the using time.
SUMMERY OF THE UTILITY MODEL
In view of this, the to-be-solved technical problem of the present invention is to provide an anti-vulcanization LED device that is not easy to fall off and has high illumination.
The utility model provides an anti-vulcanization LED device, include:
an LED support; the LED bracket is provided with a bowl-cup structure;
the LED chip is arranged at the bottom of the LED support bowl cup structure; the LED chip is electrically connected with the LED bracket through a lead;
and a white glue layer is filled between the side wall of the LED chip and the side wall of the LED support bowl cup structure.
Preferably, the height of the white glue layer is the same as that of the LED chip.
Preferably, the connecting point of the lead and the LED bracket is covered by a white glue layer.
Preferably, the surface of the white glue layer opposite to the bottom contact surface of the bowl-cup structure and the surface of the LED chip opposite to the bottom contact surface of the bowl-cup structure are both provided with fluorescent glue layers.
The utility model also provides a preparation method of anti-vulcanization LED device, include:
fixing the LED chip at the bottom of the LED support bowl cup structure by using die bond adhesive, then electrically connecting the LED chip with the LED support by using a wire, filling white adhesive between the side wall of the LED chip and the side wall of the LED support bowl cup structure, and heating and curing to obtain the anti-vulcanization LED device.
Preferably, the temperature for heating and curing is 100-150 ℃; the time for heating and curing is 3-5 h.
Preferably, the heating and curing are specifically as follows:
firstly heating to 100-110 ℃ and preserving heat for 20-40 min, then heating to 140-160 ℃ and preserving heat for 2-4 h.
Preferably, after heating and curing, the fluorescent glue is filled in the LED support bowl-cup structure, the white glue after heating and curing and the surface of the LED chip are heated and cured, and the anti-vulcanization LED device is obtained after curing.
The utility model provides an anti-vulcanization LED device, include: an LED support; the LED bracket is provided with a bowl-cup structure; the LED chip is arranged at the bottom of the LED support bowl-cup structure; the LED chip is electrically connected with the LED bracket through a lead; and a white glue layer is filled between the side wall of the LED chip and the side wall of the LED support bowl cup structure. Compared with the prior art, the utility model adopts the process flow of firstly fixing the die and welding the wires and then protecting the silver coating, and the white glue layer is filled between the side wall of the LED chip and the side wall of the bowl-cup structure of the LED bracket, which can effectively block the contact between the silver coating of the LED bracket and the external environment, prevent vulcanization, and avoid the problems that the LED chip and the welding points of the wires are easy to be peeled off and fall off from the bracket while solving the problem of vulcanization of the LED bracket; and the white glue layer can shield the side light of the chip, reduce the light emitting angle and improve the illumination of the light source.
Drawings
FIG. 1 is a schematic structural diagram of a conventional anti-sulfuration LED device;
fig. 2 is a schematic structural diagram of a chemical defense LED device provided by the present invention;
fig. 3 is a schematic view of a manufacturing process of the anti-sulfuration LED device provided by the present invention;
fig. 4 is a schematic view of a manufacturing process of the anti-sulfuration LED device provided by the present invention;
fig. 5 is a schematic view of a manufacturing process of the anti-sulfuration LED device provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides an anti-vulcanization LED device, include:
an LED support; the LED bracket is provided with a bowl-cup structure;
the LED chip is arranged at the bottom of the LED support bowl-cup structure; the LED chip is electrically connected with the LED bracket through a lead;
and a white glue layer is filled between the side wall of the LED chip and the side wall of the LED support bowl cup structure.
Referring to fig. 2, fig. 2 is the utility model provides a prevent changing the structural schematic diagram of LED device, wherein 6 are the LED support, 7 are the LED chip, 8 are the wire, and 9 are the white glue layer, and 7 are fluorescent glue.
The utility model provides an anti-vulcanization LED device, which comprises an LED bracket; the LED support is preferably a 2835 support or a 3528 support; the LED bracket is provided with a bowl-cup structure; the bottom of the bowl cup structure is preferably provided with a silver coating.
The bottom of the LED support bowl cup structure is provided with an LED chip; the LED chip is preferably fixed at the bottom of the LED support bowl-cup structure through die bonding glue; the LED chip is electrically connected with the LED bracket through a lead; the conducting wire is preferably a gold wire or a silver wire; the connection point of the lead and the LED support is preferably covered by a white glue layer.
A white glue layer is filled between the side wall of the LED chip and the side wall of the LED support bowl cup structure; the white glue layer can effectively block the contact of the silver coating of the LED support and the external environment, so that vulcanization is prevented. The height of the white glue layer is preferably the same as that of the LED chip, so that the white glue layer can shield the side light of the chip, reduce the light emitting angle and improve the illumination of the light source.
The one side that the white glue film is relative with bowl cup structure bottom contact surface and LED chip all are provided with the fluorescence glue film on the one side relative with bowl cup structure bottom contact surface. The fluorescent glue layer is level with the surface of the LED support bowl cup structure, and fills the whole bowl cup structure.
The utility model also provides a preparation method of above-mentioned vulcanization-proof LED device, include: fixing the LED chip at the bottom of the LED support bowl-cup structure by using die bonding glue, then electrically connecting the LED chip with the LED support by using a conducting wire, filling white glue between the side wall of the LED chip and the side wall of the LED support bowl-cup structure, and heating and curing to obtain the vulcanization-proof LED device.
Referring to fig. 3 to 5, fig. 3 to 5 are schematic diagrams illustrating a process for manufacturing an anti-vulcanization LED device according to the present invention.
The utility model has no special limitation to the source of all raw materials, and can be sold in the market.
And fixing the LED chip at the bottom of the LED support bowl cup structure by using the die bonding adhesive, preferably fixing the LED chip on the surface of the silver plating layer at the bottom of the LED support bowl cup structure by using the die bonding adhesive.
Then, electrically connecting the LED chip with the LED bracket by using a wire, filling white glue between the side wall of the LED chip and the side wall of the bowl-cup structure of the LED bracket, preferably heating and curing the white glue after the white glue is leveled to the height of the chip; the white glue is formed by mixing an A object and a B object according to the ratio of 1; the heating and curing temperature is preferably 100-150 ℃; the time for heating and curing is preferably 3-5 h; in the present invention, the step of heating and curing is more preferably specifically: firstly heating to 100-110 ℃ and preserving heat for 20-40 min, then heating to 140-160 ℃ and preserving heat for 2-4 h; and preferably, heating to 100 ℃, preserving heat for 30min, and then heating to 150 ℃, and preserving heat for 3h. The cured structure can effectively block the contact between the silver coating of the LED bracket and the external environment, thereby preventing vulcanization; and the side light of the chip is shielded, the light emitting angle is reduced, and the illumination of the light source is improved.
And after heating and curing, preferably filling the fluorescent glue into the LED support bowl-cup structure, preferably filling the whole bowl-cup structure with the white glue and the LED chip surface after heating and curing, and curing to obtain the vulcanization-proof LED device.
The utility model adopts the technological process of firstly fixing the crystal and welding the wire and then protecting the silver coating, and the white glue layer is filled between the side wall of the LED chip and the side wall of the bowl-cup structure of the LED bracket, which can effectively block the contact between the silver coating of the LED bracket and the external environment, prevent the vulcanization, and avoid the problems that the LED chip and the welding point of the lead are easy to be peeled off and fall off from the bracket while solving the vulcanization problem of the LED bracket; and the white glue layer can shield the side light of the chip, reduce the light-emitting angle and improve the illumination of the light source.
In order to further explain the present invention, the following detailed description is made in conjunction with the embodiments for an anti-vulcanization LED device provided by the present invention.
The reagents used in the following examples are all commercially available.
Example 1
1.1 die bonding-the LED chip is fixed in a conventional LED2835 or 3528 bracket bowl cup by die bonding glue.
1.2 welding wires, namely, conducting wires made of gold wires or silver wires and other materials are used for electrically connecting the LED chips with the bracket.
1.3, dispensing white glue in a bowl cup of an LED bracket by using an automatic dispenser, leveling the leveled thickness of the white glue to be flush with the height of a chip, heating and curing (oven heating: 100 ℃/30min, then turning to 150/3 h), wherein the cured structure can effectively block a silver coating of the LED bracket from contacting with the external environment, so as to prevent vulcanization; and the side light of the chip is shielded, the light-emitting angle is reduced, and the illumination of the light source is improved.
1.4 fluorescent glue, and then filling the mixture of the fluorescent powder and the glue into a bowl cup, and curing to form a finished product.
Claims (4)
1. An anti-sulfuration LED device, comprising:
an LED support; the LED bracket is provided with a bowl-cup structure;
the LED chip is arranged at the bottom of the LED support bowl-cup structure; the LED chip is electrically connected with the LED bracket through a lead;
and a white glue layer is filled between the side wall of the LED chip and the side wall of the LED support bowl-cup structure.
2. The anti-vulcanization LED device of claim 1, wherein the height of the white glue layer is the same as the LED chip height.
3. The LED device of claim 1, wherein the connection point of the wire to the LED support is covered by a white glue layer.
4. The LED device of claim 1, wherein a fluorescent glue layer is disposed on a surface of the white glue layer opposite to the bottom contact surface of the bowl-cup structure and a surface of the LED chip opposite to the bottom contact surface of the bowl-cup structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120491964.6U CN218069889U (en) | 2021-03-08 | 2021-03-08 | Anti-vulcanization LED device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120491964.6U CN218069889U (en) | 2021-03-08 | 2021-03-08 | Anti-vulcanization LED device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN218069889U true CN218069889U (en) | 2022-12-16 |
Family
ID=84397063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202120491964.6U Active CN218069889U (en) | 2021-03-08 | 2021-03-08 | Anti-vulcanization LED device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN218069889U (en) |
-
2021
- 2021-03-08 CN CN202120491964.6U patent/CN218069889U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103199183B (en) | A kind of encapsulating structure improving vertical LED chip brightness | |
CN103050604B (en) | A kind of manufacture method of MLCOB light source module | |
CN1848463A (en) | LED white light source based on metal circuit board | |
CN103840071A (en) | LED lamp bar manufacturing method and LED lamp bar | |
CN101976720B (en) | Light emitting diode (LED) and encapsulating method thereof | |
CN101009340A (en) | LED encapsulation structure and its making method | |
CN106356437B (en) | A kind of white light LED packaging device and preparation method thereof | |
CN218069889U (en) | Anti-vulcanization LED device | |
CN105789418A (en) | Jelly and LED packaging structure | |
CN202513204U (en) | Packaging structure with white light surface attached with light emitting diode | |
CN104934515B (en) | Flexible light piece and its processing technology apply the lighting device and manufacture method of the lamp piece | |
CN104253199A (en) | A LED package structure and a manufacture method thereof | |
CN112786769A (en) | Anti-vulcanization LED device and preparation method thereof | |
CN111312878A (en) | White glue packaging structure for improving LED brightness and packaging method thereof | |
CN203721761U (en) | High-reliability light-emitting diode bracket | |
CN104241502A (en) | LED packaging structure | |
CN203883039U (en) | Surface mounted technology type LED | |
CN207558826U (en) | A kind of LED package of adjustable focus | |
CN103199184B (en) | A kind of encapsulating structure improving vertical LED chip brightness | |
CN209169176U (en) | A kind of white glue encapsulating structure promoting LED luminance | |
CN207558820U (en) | Light-emitting diode encapsulation structure | |
CN203250781U (en) | LED encapsulation structure | |
CN111628066A (en) | Process method for improving LED brightness | |
CN204760426U (en) | Light -emitting diode packaging structure | |
CN201829526U (en) | Packaging structure of light emitting diode (LED) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |