CN103050604B - A kind of manufacture method of MLCOB light source module - Google Patents

A kind of manufacture method of MLCOB light source module Download PDF

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Publication number
CN103050604B
CN103050604B CN201210501388.4A CN201210501388A CN103050604B CN 103050604 B CN103050604 B CN 103050604B CN 201210501388 A CN201210501388 A CN 201210501388A CN 103050604 B CN103050604 B CN 103050604B
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China
Prior art keywords
glue
substrate
light source
deg
source module
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CN201210501388.4A
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Chinese (zh)
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CN103050604A (en
Inventor
吴乾
石超
周志勇
黄巍
王跃飞
李国平
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广州市鸿利光电股份有限公司
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Publication of CN103050604A publication Critical patent/CN103050604A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

A manufacture method for MLCOB light source module, comprises the following steps: (1) makes substrate; (2) die bond bonding wire is carried out in the welding disking area on substrate; (3) substrate is placed in a plastic clip tool, then puts into baking box and carry out the pre-heat treatment; (4) after basal plate preheating process, be positioned on the preheating zone of point gum machine platform heating platform fast, be then slowly sent to the glue application region of point gum machine platform heating platform by conveyer belt, period is heated by preheating zone and carrys out the thermally-stabilised of holding point plastic clip tool; (5) in a glue process, heating platform glue application region temperature constant is between 130 DEG C ~ 250 DEG C, and the plastic emitting of Glue dripping head is wanted evenly; (6) put glue rapid curing in the complete 0-5S of glue and form lens; (7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing.Lens are by some glue straight forming, and manufacture craft is simple, with low cost.

Description

A kind of manufacture method of MLCOB light source module

Technical field

The present invention relates to LED field, especially the manufacture method of MLCOB LED light source module, refer in particular to the manufacture method for application product MLCOB LED light source modules such as fluorescent lamp, Panel light, desk lamps.

Background technology

In recent years, LED light source gets most of the attention in the application of lighting field.It is large that traditional incandescent lamp consumes electric energy, the electromagnetic interference that fluorescent lamp brings and electromagnetic pollution more serious, and the stability of high-voltage gas discharging light and fail safe are all poor, by contrast, LED has Superstrong energy-saving, environmental protection, low pressure, easily control as lighting source, not fragile, without absolute predominances such as ultraviolets, it will become the light source of new generation of the conventional light source such as alternative incandescent lamp, fluorescent lamp and high-voltage gas discharging light.

LED light source point mainly contains discrete part light source and integrated-type light source (referring generally to COB LED light source) two kinds according to integrated level.Traditional LED fluorescent lamp tube light source module is the discrete part LED light sources such as use 3528,3014,5050, and the mode through SMT is welded on substrate shaping.But this manufacture craft is loaded down with trivial details, and LED light source needed Reflow Soldering, easily degradation bad phenomenon under the dead lamp of appearance, open circuit, photoelectric parameter, and processing cost is high.Therefore increasing commercial lighting, lighting of home bring into use emission uniformity good now, without zebra-stripe, and the COB LED product of no color differnece.COB LED product is surface source luminescence, have bright dipping soft, do not hinder the points such as excellent, power saving, light nature such as eye, power saving, light nature, and COB LED product need not make pcb board in addition, assembling and cost of labor can be saved, decrease application product process procedure, accelerate life cycle of the product.

COB LED product is divided into two large classes at present: a class is traditional integrated COB product, namely on substrate, makes fence dam, forms a large bowl cup, installs multiple chips and carry out circuit by wire bonds to connect in cup, then carries out coating fluorescent material and sealing.Another kind of is that many glasss of integrated COB(are also MCOB, the english abbreviation of Multiple Chips On Board) product, namely on substrate, multiple bowls of cups are made, minimum installation one chips in each bowl of cup, carry out circuit by wire bonds between chip to connect or chip carries out circuit with substrate wire bonds and is connected, then carry out fluorescent material sealing.Its advantage is, silica gel consumption is less, surface source luminescence, and photochromic consistency is good, and light extraction efficiency is higher than traditional integrated COB, dispels the heat relatively better.

The tradition substrate of integrated COB product and structure generally have two kinds of forms: the first makes fence dam, then in specific region, carries out chip installation, then carry out circuit with lead-in wire and connect, in region, fence dam, apply fluorescent glue.Its advantage is that technique is simple and convenient, surface source luminescence, and photochromic consistency easily controls.But this product light efficiency is relatively low, because chip is installed concentratedly, there is larger problem in heat radiation.And more to the encapsulating material such as fluorescent material, casting glue demand, also need to make fence dam, cause whole product cost relatively high.The second first makes the MCPCB thin slice with circuit, adopt and be bonded in metallic substrate surfaces formation substrate in various manners, admittedly weld area periphery at substrate and make fence dam, then in specific region, chip installation is carried out, carry out circuit with lead-in wire again to connect, in region, fence dam, apply fluorescent glue.Its advantage have employed metal substrate, and heat conduction is relatively good, but this substrate needs substrate bottom surface and sidewall to have very high reflectivity, and substrate cost is high.More to the encapsulating material such as fluorescent material, casting glue demand, also need to make fence dam, cause whole product cost relatively high.

Generally there are three kinds of forms in the substrate of MCOB product and modular structure present stage:

Be make the substrate with circuit in advance, adopt injection molding on substrate, form bowl cup, at bowl cup internal fixtion chip, adopt lead-in wire to carry out circuit connection, in bowl cup, apply fluorescent glue.Its advantage is that shaping bowl cup consistency is good, and easily produce in enormous quantities, shortcoming is that die sinking price is high, injection moulding matter material and substrate associativity poor, easily occur leaking the bad phenomenon such as glue.

The second is that metal material substrate adopts and drags for hole mode and form bowl cup, makes circuit, at bowl cup internal fixtion chip, adopt lead-in wire to carry out circuit with the line layer of substrate surface and be connected, in bowl cup, apply fluorescent glue above metal.Its advantage is that the capacity of heat transmission is strong, easily processes; Shortcoming is the metal surface be produced on due to circuit outside bowl cup; with one end during lead-in wire connecting circuit in bowl cup on chip electrode; one end is on the line layer of bowl cup outer metal surface; fluorescent glue is applied in bowl cup; protect exposed lead-in wire at bowl cup external demand point one deck glue, in manufacturing process, easily occur the bad phenomenon such as short circuit, broken string.Meanwhile, in bowl cup manufacturing process, be difficult to the evenness ensureing bowl cup bottom surface and sidewall surfaces, cause reflectivity low, affect light extraction efficiency, this type substrate price is higher.

The third is that metal material substrate adopts stamping forming mode to form bowl cup.The fixing multiple chips in bowl cup inside, adopts wire bonds to form circuit, then is connected with the line layer being embedded in metal substrate two ends, realize the connection to external circuit, then apply fluorescent glue in bowl cup above chip between chip.Its advantage is that the substrate capacity of heat transmission is strong, easily shaping.Shortcoming is that easily appearance is bad in the substrate course of processing, and embedded line layer complex process, between chip with chip, circuit is connected and easily causes failure welding, affects properties of product.

MLCOB product is the third-largest class in COB product, and the thought of its product adopts chip to be directly fixed on substrate, its manufacture craft letter, with low cost its can be larger raising light efficiency.

Summary of the invention

Technical problem to be solved by this invention is to provide a kind of manufacture method of MLCOB light source module, its manufacture craft simple, with low cost and can be larger raising light efficiency.

For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of manufacture method of MLCOB light source module, comprises the following steps:

(1) substrate is made;

(2) die bond bonding wire is carried out in the welding disking area on substrate;

(3) substrate is placed in a plastic clip tool, then puts into baking box and carry out the pre-heat treatment;

(4) after basal plate preheating process, be positioned on the preheating zone of point gum machine platform heating platform fast, be then slowly sent to the glue application region of point gum machine platform heating platform by conveyer belt, period is heated by preheating zone and carrys out the thermally-stabilised of holding point plastic clip tool;

(5) in a glue process, heating platform glue application region temperature constant is between 130 DEG C ~ 250 DEG C, and the plastic emitting of Glue dripping head is wanted evenly;

(6) put glue rapid curing in the complete 0-5S of glue and form lens;

(7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing.

MLCOB LED light source module manufacture method of the present invention is without the need to bowl cup, substrate distributes multiple point-source of light, simultaneously on each light source with lens, form multi-point source and poly-lens, form a MLCOB LED light source module, this structure finally creates a kind of MLCOB LED light source module of new construction.The lens moulding process of this light source module is simple, cost is low, precision is high.

As improvement, described substrate comprises the insulating barrier, line layer, the welding resisting layer that are arranged in order from bottom to up; White oil layer thickness is 0.01 ~ 0.1mm; Described welding disking area adopts plated metal or chemical precipitation technique to process.Adopt the ink of high reflectance to be coated in substrate surface and form white oil layer, the light that this white oil layer can make light source side send reflects on substrate, increase the rising angle of light source module, make light source energy bright dipping within the scope of approximate 180 degree, thus improve light extraction efficiency.

As improvement, described oven temperature is set to 100 ~ 200 DEG C, carries out 10 ~ 30min the pre-heat treatment to described substrate.

As improvement, described preheating zone temperature is between 100 ~ 150 DEG C.

As improvement, described glue application region temperature at 130 DEG C ~ 250 DEG C, described preheating zone and ejecting plate district temperature all low than glue application region 10 DEG C ~ 50 DEG C, so just can better ensure consistency and the production efficiency of lens bulb.

As improvement, in described step (7), oven temperature is 150 DEG C, and substrate needs baking 2 hours.

As improvement, before some glue, mixed with the ratio of (1:5 ~ 1:15) by fluorescent material and fully stir in special glue material, then vacuumize, then pouring syringe into vacuumizes again, is being installed on point gum machine platform after guaranteeing bubble-free; Described special glue material predominant amount is silicone oil polymer, and VMQ resin, polymethyl siloxane, and platinum catalyst, wherein platinum catalyst content ratio is greater than 0.1%.

As improvement, described lens diameter is less than 8mm.

As improvement, described glue speed is greater than 0.3s/PCS, is less than 5s/PCS, and some glue speed is determined according to heating platen temperature change.

The beneficial effect that the present invention is compared with prior art brought is:

MLCOB LED light source module manufacture method of the present invention is without the need to bowl cup, substrate distributes multiple point-source of light, lens simultaneously on each light source are directly shaping on substrate by some glue, form multi-point source and poly-lens, form a MLCOB LED light source module, this structure finally creates a kind of MLCOB LED light source module of new construction.The lens moulding process of this light source module is simple, cost is low, precision is high.

Accompanying drawing explanation

Fig. 1 is product structure schematic diagram.

Fig. 2 is manufacture method flow chart.

Embodiment

Below in conjunction with Figure of description, the invention will be further described.

As shown in Figure 1, 2, a kind of manufacture method of MLCOB light source module, comprises the following steps:

(1) substrate is made; Described substrate comprises the insulating barrier 1, line layer 2, the welding resisting layer 3 that are arranged in order from bottom to up; Its manufacture method is: choose glass mat and make the main material of substrate, substrate makes line layer 2, on line layer 2, printing white printing forms white oil layer, and on final online road floor 2, reserved area makes pad; On substrate, white oil layer thickness is 0.01 ~ 0.1mm, adopt the ink of high reflectance to be coated in substrate surface and form white oil layer, the light that this white oil layer can make light source side send reflects on substrate, increase the rising angle of light source module, make light source energy bright dipping within the scope of approximate 180 degree, thus improve light extraction efficiency; Line layer 2 is distributed with pad, and pad adopts plating or chemical plating process to process;

(2) die bond bonding wire is carried out in the welding disking area on substrate; Chip 5 in welding disking area, and adopt gold thread to carry out chip 5 to be connected with the circuit of line layer 2;

(3) be placed in by constant temperature roaster near point gum machine platform, the substrate admittedly welded is positioned in a plastic clip tool, more whole some plastic clip tool is put into baking box carry out 10 ~ 30min the pre-heat treatment, oven temperature is set to 100 ~ 200 DEG C;

(4) after basal plate preheating process, be positioned on the preheating zone of point gum machine platform heating platform fast, described preheating zone temperature is between 100 ~ 150 DEG C; Then be slowly sent to the glue application region of point gum machine platform heating platform by conveyer belt, period is heated by preheating zone and carrys out the thermally-stabilised of holding point plastic clip tool;

(5) in a glue process, heating platform glue application region temperature constant is between 130 DEG C ~ 250 DEG C, and the plastic emitting of Glue dripping head is wanted evenly, and some glue speed is greater than 0.3s/PCS, is less than 5s/PCS; The large low height of the lens pointed out according to the correlative factor such as needle height, gel quantity and determine, general needle height is less than 10mm, is easy to the raising of the shaping and production efficiency of lens;

(6) put glue rapid curing in the complete 0 ~ 5S of glue and form lens 4, lens 4 diameter is less than 8mm;

(7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing.

The making of described some plastic clip tool needs to determine according to product material size, point plastic clip tool area is less than heating platform heating region area, and width is less than transmission track width, and some plastic clip tool material can be the high-thermal conductive metal such as copper, aluminium, thickness is less than 1 centimetre, is easy to heating platform heat conduction.

Heating platform divides three parts: preheating zone, glue application region, ejecting plate district, and preheating zone is all low than glue application region 10 DEG C-50 DEG C with ejecting plate district temperature, so just can better ensure consistency and the production efficiency of lens bulb.

Before some glue, mixed with the ratio of (1:5 ~ 1:15) by fluorescent material and fully stir in special glue material, then vacuumize, then pouring syringe into vacuumizes again, is being installed on point gum machine platform after guaranteeing bubble-free; Described special glue material predominant amount is silicone oil polymer, and VMQ resin, polymethyl siloxane, and platinum catalyst, wherein platinum catalyst content ratio is greater than 0.1%.

Claims (9)

1. a manufacture method for MLCOB light source module, is characterized in that, comprises the following steps:
(1) substrate is made;
(2) die bond bonding wire is carried out in the welding disking area on substrate;
(3) substrate is placed in a plastic clip tool, then puts into baking box and carry out the pre-heat treatment;
(4) after basal plate preheating process, be positioned on the preheating zone of point gum machine platform heating platform fast, be then slowly sent to the glue application region of point gum machine platform heating platform by conveyer belt, period is heated by preheating zone and carrys out the thermally-stabilised of holding point plastic clip tool;
(5) in a glue process, heating platform glue application region temperature constant is between 130 DEG C ~ 250 DEG C, and the plastic emitting of Glue dripping head is wanted evenly;
(6) put glue rapid curing in the complete 0-5S of glue and form lens;
(7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing;
Described glue speed is greater than 0.3s/PCS, is less than 5s/PCS.
2. the manufacture method of a kind of MLCOB light source module according to claim 1, is characterized in that: described substrate comprises the insulating barrier, line layer, the welding resisting layer that are arranged in order from bottom to up; White oil layer thickness is 0.01 ~ 0.1mm; Described welding disking area adopts plated metal or chemical precipitation technique to process.
3. the manufacture method of a kind of MLCOB light source module according to claim 1, is characterized in that: described oven temperature is set to 100 ~ 200 DEG C, carries out 10 ~ 30min the pre-heat treatment to described substrate.
4. the manufacture method of a kind of MLCOB light source module according to claim 1, is characterized in that: described preheating zone temperature is between 100 ~ 150 DEG C.
5. the manufacture method of a kind of MLCOB light source module according to claim 1, is characterized in that: described glue application region temperature is at 130 DEG C ~ 250 DEG C.
6. the manufacture method of a kind of MLCOB light source module according to claim 1, is characterized in that: described preheating zone and ejecting plate district temperature all low than glue application region 10 DEG C ~ 50 DEG C.
7. the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: in described step (7), oven temperature is 150 DEG C, and substrate needs baking 2 hours.
8. according to the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: before some glue, fluorescent material is mixed with the ratio of (1:5 ~ 1:15) and fully stirs in special glue material, vacuumize again, then pour syringe into vacuumize again, be installed on point gum machine platform after guaranteeing bubble-free; Described special glue material predominant amount is silicone oil polymer, and VMQ resin, polymethyl siloxane, and platinum catalyst, wherein platinum catalyst content ratio is greater than 0.1%.
9., according to the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: described lens diameter is less than 8mm.
CN201210501388.4A 2012-11-30 2012-11-30 A kind of manufacture method of MLCOB light source module CN103050604B (en)

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103354268A (en) * 2013-05-28 2013-10-16 惠州市大亚湾永昶电子工业有限公司 Planar LED one-step lens forming method
CN103296183A (en) * 2013-05-28 2013-09-11 惠州市大亚湾永昶电子工业有限公司 LED (light-emitting diode) lens forming method with temperature and glue control
CN104339509B (en) * 2013-07-25 2016-12-28 上海华银电器有限公司 A kind of Automatic encapsulation machine
CN103441206A (en) * 2013-08-22 2013-12-11 中山市光圣半导体科技有限责任公司 Method for improving color consistency of white-light LED devices
WO2015078003A1 (en) * 2013-11-29 2015-06-04 广州市鸿利光电股份有限公司 Manufacturing method for mlcob light source module
CN104659190A (en) * 2015-01-26 2015-05-27 华中科技大学 Fluorescent powder glue coating method and application thereof
CN106252338A (en) * 2016-09-26 2016-12-21 江苏稳润光电有限公司 A kind of method for packing of high heat conduction MCOB
CN107146839B (en) * 2017-05-04 2019-04-02 厦门大学 A kind of continuous crystal solidifying apparatus of LED and its die-bonding method
CN109742215A (en) * 2019-01-10 2019-05-10 广东品美电子科技有限公司 A kind of LED support preparation process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030611A (en) * 2006-03-05 2007-09-05 浙江古越龙山电子科技发展有限公司 Large-power light-emitting diodes gluing process
CN201956395U (en) * 2011-01-27 2011-08-31 复旦大学 Chip on board (COB) technology-based light emitting diode (LED) fluorescent glue dispensing structure
CN102185042A (en) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5527529B2 (en) * 2010-03-25 2014-06-18 スタンレー電気株式会社 Lighting device
KR20120077125A (en) * 2010-12-30 2012-07-10 엘지디스플레이 주식회사 Backlight unit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030611A (en) * 2006-03-05 2007-09-05 浙江古越龙山电子科技发展有限公司 Large-power light-emitting diodes gluing process
CN201956395U (en) * 2011-01-27 2011-08-31 复旦大学 Chip on board (COB) technology-based light emitting diode (LED) fluorescent glue dispensing structure
CN102185042A (en) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system

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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1

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