CN105789418A - Jelly and LED packaging structure - Google Patents
Jelly and LED packaging structure Download PDFInfo
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- CN105789418A CN105789418A CN201410805089.9A CN201410805089A CN105789418A CN 105789418 A CN105789418 A CN 105789418A CN 201410805089 A CN201410805089 A CN 201410805089A CN 105789418 A CN105789418 A CN 105789418A
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- jelly
- reflecting layer
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- package structure
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Abstract
The invention discloses a jelly. The jelly comprises a non-solidified substrate and particles distributed in the substrate. The particles are one or more selected from silicon dioxide, silicon nitride, ceramic powder and calcium carbonate; the mass percentage of the particles in the jelly is not less than 30%. The invention also provides an LED (Light Emitting Diode) packaging structure which comprises a bracket and an LED chip arranged on the bracket and electrically connected with the bracket; the LED packaging structure further comprises a reflecting layer which is formed on the bracket and is located aside the LED chip; and the reflecting layer is formed by the solidified jelly. The reflecting layer made of the jelly provided by the invention when being used in the LED packaging structure can improve the light reflection efficiency and can prevent the bracket from absorbing lights due to vulcanization.
Description
Technical field
The present invention relates to field of semiconductor devices, particularly relate to a kind of light emitting diode (LED) encapsulating structure, further relate to a kind of jelly, wherein this package structure for LED utilizes this jelly to form reflector layer.
Background technology
In LED encapsulation field, the light sent in order to avoid LED chip is absorbed by metal basal board, causes light loss, the way of current industry is, at the electroplate of metal basal board, utilize the high reflectance characteristic of silver, the light being mapped to substrate surface is reflexed to LED chip and the layer of silica gel of parcel LED chip.But silver plating process complexity has pollution, cost is high.On the other hand, in LED encapsulation structure use procedure, also can penetrate into package interior because of extraneous element sulphur, react with the silver of substrate surface, generating the Argentous sulfide. of black namely the sulfuration being commonly called as, the Argentous sulfide. of black has influence on the light extraction efficiency of LED encapsulation structure because of extinction.
Summary of the invention
Based on this, it is necessary to for drawbacks described above, it is provided that a kind of can the package structure for LED of improving extraction efficiency, also provide for a kind of jelly, utilize this jelly to be formed in package structure for LED to reach the effect of improving extraction efficiency.
A kind of jelly, including being uncured matrix, and the granule that distribution is in the base, one or more in silicon dioxide, silicon nitride, ceramics and calcium carbonate of described granule, described granule accounts for the mass percent of jelly and is not less than 30%.
Wherein in an embodiment, this matrix is silica gel or epoxy glue.
Wherein in an embodiment, described granule accounts for the mass percent of jelly and is not less than 50%.
Wherein in an embodiment, described grain diameter is less than 30 μm.
Wherein in an embodiment, described jelly is shabri.
A kind of package structure for LED, including support and be arranged on support and form, with support, the light-emitting diode chip for backlight unit that electrically connects, also include reflecting layer, described reflecting layer is formed on the bracket and is positioned at light-emitting diode chip for backlight unit side, and described reflecting layer is formed after being solidified by above-mentioned jelly.
Wherein in an embodiment, described support includes the electrode that two mutually insulateds are arranged, and described support is also formed packaging body, light-emitting diode chip for backlight unit and reflecting layer described in described packaging body environmental sealing.
Wherein in an embodiment, described support also forming the coat of metal, described reflecting layer is formed on the described coat of metal and covers the described coat of metal.
Wherein in an embodiment, the thickness in described reflecting layer is be more than or equal to 40 μm, and forms the thickness less than described light-emitting diode chip for backlight unit of the thickness after on support.
Wherein in an embodiment, the reflecting rate in described reflecting layer is be more than or equal to 93%.
The reflecting layer that jelly provided by the invention is made utilizes in package structure for LED, reflector efficiency can be promoted, and can prevent support because of sulfuration extinction, therefore identical brightness requirement can be reached with more low power light-emitting diode chip for backlight unit, or higher brightness can be reached with the light-emitting diode chip for backlight unit of equal-wattage, improve light-out effect, save cost.
Accompanying drawing explanation
The cross-sectional schematic of the package structure for LED that Fig. 1 provides for one embodiment of the invention.
The cross-sectional schematic of the package structure for LED that Fig. 2 provides for another embodiment of the present invention.
Fig. 3 applies the package structure for LED of jelly provided by the invention and does not apply the brightness test comparison of package structure for LED of jelly provided by the invention.
Detailed description of the invention
A kind of jelly provided by the invention, this jelly is uncured state, for instance can have certain fluidity and be shape with a tendency to the state of liquid, it is possible in gel.This jelly outward appearance is rendered as white or silver gray.This jelly includes matrix and the granule that distribution is in the base.
Matrix can be silica gel or epoxy glue.Matrix can also is that other kinds of material, for instance in LED package field, the base material for the packaging body that wraps up light-emitting diode chip for backlight unit can also as the material of matrix.Matrix in the present invention is uncured state, and therefore granule can be distributed in the base.
Granule is selected from one or more in silicon dioxide, silicon nitride, ceramics and calcium carbonate.Described granule accounts for the mass percent of jelly and is not less than 30%.Further, described granule accounts for the mass percent of jelly and is not less than 50%.
Described grain diameter is less than 30 μm.
Refer to Fig. 1, a kind of package structure for LED that one embodiment of the invention provides, including support 10, arrange over the mount 10 and form, with support 10, the light-emitting diode chip for backlight unit 20 electrically connected, and forming on described support 10 and be positioned at the reflecting layer 30 on light-emitting diode chip for backlight unit 20 side, described reflecting layer 30 is formed after being solidified by above-mentioned jelly provided by the invention.
In one embodiment, as it is shown in figure 1, described support 10 includes the electrode 11,12 that two mutually insulateds are arranged.Two electrodes 11,12, all in block, arrange insulator 13 between two electrodes 11,12.Light-emitting diode chip for backlight unit 20 is fixed on the upper surface of electrode 12 by elargol 14 or the like.Light-emitting diode chip for backlight unit 20 is electrically connected two electrodes 11,12 again through two wires 24, electrically connects so that light emitting diode 20 is formed with electrode 11,12.Light-emitting diode chip for backlight unit 20 electrically connects as in figure 2 it is shown, can also adopt the form of flip to be formed with electrode 11,12.
Package structure for LED shown in Fig. 1 and Fig. 2 is when backend application, it is possible to adopt surface-pasted form the lower surface of electrode 11,12 and external circuit to be electrically connected.
This reflecting layer 30 arranges the upper surface that position concrete over the mount 10 can be electrode 11,12, and this reflecting layer 30 also can cover the upper surface of insulator 13.This reflecting layer 30 can connect with the side of light-emitting diode chip for backlight unit 20, arranges on all upper surfaces of light-emitting diode chip for backlight unit 20 so that reflecting layer 30 is distributed to remove over the mount 10.The reflecting rate in this reflecting layer 30 is be more than or equal to 93%.Even if support 10 being not provided with other the coat of metal, for instance silver-plated etc., by the high reflectance in this reflecting layer 30, it is possible to ensure the light extraction efficiency of package structure for LED.In other words, package structure for LED provided by the invention can adopt non-silver-plated support, to save cost.
Further, in certain embodiments, described support 10 also forming coat of metal (not shown), described reflecting layer 30 is formed on the described coat of metal and covers the described coat of metal.In such a case, owing to the coat of metal is covered by reflecting layer 30, it is possible to make the coat of metal exempt to cure and affect the light extraction efficiency of package structure for LED.In other words, package structure for LED provided by the invention is according to silver-plated support, then because of the setting in reflecting layer 30, can anti-vulcanize, thus improving extraction efficiency.
The generation type in this reflecting layer 30 is as follows: can after light-emitting diode chip for backlight unit 20 is fixed to this support 10 and electrically connects with support 10 formation, adopt the modes such as spraying, silk-screen, some glue, glue spraying, printing formed over the mount 10 by jelly provided by the invention and be arranged on light-emitting diode chip for backlight unit 20 side, then solidify to form described reflecting layer 30.
The thickness in described reflecting layer 30 is be more than or equal to 40 μm, and forms the thickness less than described light-emitting diode chip for backlight unit 20 of the thickness after over the mount 10.
Further, described support 10 also forming reflector 21, described reflector 21 is around described light-emitting diode chip for backlight unit 20.Reflector 21 can be used for the light that Refl-Luminous diode chip for backlight unit 20 sends.It is to be appreciated that some layers being beneficial to light line reflection can be arranged at reflector 21 on the surface of light-emitting diode chip for backlight unit 20, for instance argent, platinum etc..
Further, reflector 21 can be identical with insulator 13 material.In certain embodiments, described reflector 21, insulator 13 can adopt the mode of injection mo(u)lding joined integrally with support 10.
Further, described support 10 also forms packaging body 22, light-emitting diode chip for backlight unit 20 and reflecting layer 30 described in described packaging body 22 environmental sealing.In the embodiment with reflector 21, packaging body 22 can be housed in the space that reflector 21 surrounds.It is appreciated that in packaging body 22 and can have fluorescent material, the light scalable that thus light-emitting diode chip for backlight unit 20 sends so that the glow color of package structure for LED can be diversified, in order to application is to different fields, for instance illumination, backlight, instruction etc..Further, packaging body 22 can be arranged with fluorescent material layering, for instance fluorescent material is arranged on the outer surface of packaging body 22, or fluorescent material may be used without specific carrier such as silica gel etc. and forms phosphor powder layer, and is arranged on the light-emitting area of light-emitting diode chip for backlight unit 20.
Above-described embodiment is only stated in package structure for LED with the explanation jelly application first provided by the invention that surface mounting type light-emitting diode encapsulating structure is exemplary, understandably, jelly provided by the invention can be applied to other kinds of package structure for LED, such as cannonball type package structure for LED, COB (ChiponBoard) formula package structure for LED etc., reflecting layer and/or anti-sulfuric horizon is served as on the surface of support to be formed, while promoting the light extraction efficiency of package structure for LED, the service life of package structure for LED can be extended.
In sum, jelly provided by the invention, for forming the reflecting layer of package structure for LED, can have the advantage that
1, jelly is coated near light-emitting diode chip for backlight unit, it is possible to block pad support, even if the silver coating of pad rack surface vulcanizes without extinction.Jelly can also be coated on the support not doing electroplating surface by the present invention, maintains or light emission rate more than 93%.
2, light is had good reflection efficiency by the shabri jelly that the present invention uses, and reflecting rate is be more than or equal to 93%.
3, the shabri jelly long-time high temperature not yellow that the present invention uses.
4, the shabri jelly that the present invention uses can bonding with the coat of metal on support, packaging body or reflector good without deviating from, form good sealing.
Some advantages of the present invention will be described with experimental data below.It is 75 DEG C as following table one and table two show different package structure for LED being placed in temperature, in the 100ml glass containing 0.2g Cosan, the light decay data of 8 hours front and back of duration.Wherein table one is the data of the package structure for LED of a certain model with the reflecting layer that make use of jelly provided by the invention to be formed, and table two is the data of the package structure for LED of a certain model not applying the reflecting layer that jelly provided by the invention is formed.
Table one
Table two
From data in table above, there is the package structure for LED in the reflecting layer that make use of jelly provided by the invention to be formed, under these experimental conditions, average light decay controls below 15%, package structure for LED without above-mentioned reflecting layer, under these experimental conditions, average light decay is 56.90%.Illustrate that the reflecting layer that jelly of the present invention is formed can have good anti-sulfurization, to ensure the light extraction efficiency of package structure for LED.
As shown in Figure 3 for applying the package structure for LED of jelly provided by the invention and not applying the brightness test comparison of package structure for LED of jelly provided by the invention.Wherein the longitudinal axis represents brightness, more represent that brightness is more big by longitudinal axis upper end, it is the distributed areas of the brightness experimental data of the package structure for LED with the reflecting layer that the jelly of the present invention is made near the region of the longitudinal axis above transverse axis, distributed areas away from the brightness experimental data that the region of the longitudinal axis is the package structure for LED without the reflecting layer that the jelly of the present invention is made, and the light-emitting diode chip for backlight unit in these package structure for LED is all same zone and same batch of production, and other parameters to ensure package structure for LED are identical.By in Fig. 3 it can be seen that the mean flow rate of the package structure for LED in reflecting layer made apparently higher than the jelly without the present invention of the mean flow rate of the package structure for LED in reflecting layer that the jelly with the present invention is made.The reflecting layer that jelly provided by the invention is made can promote the light extraction efficiency of package structure for LED.In other words, have employed jelly provided by the invention to make reflecting layer and be applied in package structure for LED, identical brightness requirement can be reached with more low power light-emitting diode chip for backlight unit, save cost, on the other hand, higher brightness can be reached with the light-emitting diode chip for backlight unit of equal-wattage, improve light-out effect.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a jelly, including being uncured matrix, and the granule that distribution is in the base, it is characterised in that, described granule is selected from one or more in silicon dioxide, silicon nitride, ceramics and calcium carbonate, and described granule accounts for the mass percent of jelly and is not less than 30%.
2. jelly according to claim 1, it is characterised in that this matrix is silica gel or epoxy glue.
3. jelly according to claim 1, it is characterised in that described granule accounts for the mass percent of jelly and is not less than 50%.
4. jelly according to claim 1, it is characterised in that described grain diameter is less than 30 μm.
5. jelly according to claim 1, it is characterised in that described jelly is shabri.
6. a package structure for LED, including support and be arranged on support and form, with support, the light-emitting diode chip for backlight unit that electrically connects, it is characterized in that, also include reflecting layer, described reflecting layer is formed on the bracket and is positioned at light-emitting diode chip for backlight unit side, and described reflecting layer jelly described in any one in claim 1-5 item is formed after solidifying.
7. package structure for LED according to claim 6, it is characterised in that described support includes the electrode that two mutually insulateds are arranged, and described support is also formed packaging body, light-emitting diode chip for backlight unit and reflecting layer described in described packaging body environmental sealing.
8. package structure for LED according to claim 6, it is characterised in that also form the coat of metal on described support, described reflecting layer is formed on the described coat of metal and covers the described coat of metal.
9. package structure for LED according to claim 6, it is characterised in that the thickness in described reflecting layer is be more than or equal to 40 μm, and forms the thickness less than described light-emitting diode chip for backlight unit of the thickness after on support.
10. package structure for LED according to claim 6, it is characterised in that the reflecting rate in described reflecting layer is be more than or equal to 93%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410805089.9A CN105789418A (en) | 2014-12-18 | 2014-12-18 | Jelly and LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410805089.9A CN105789418A (en) | 2014-12-18 | 2014-12-18 | Jelly and LED packaging structure |
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| Publication Number | Publication Date |
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| CN105789418A true CN105789418A (en) | 2016-07-20 |
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| CN201410805089.9A Pending CN105789418A (en) | 2014-12-18 | 2014-12-18 | Jelly and LED packaging structure |
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Cited By (5)
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| CN107221594A (en) * | 2017-05-26 | 2017-09-29 | 导装光电科技（深圳）有限公司 | Ceramic substrate LED of one side light extraction and preparation method thereof |
| CN107507826A (en) * | 2017-08-15 | 2017-12-22 | 广东聚科照明股份有限公司 | A kind of LED encapsulation structure with the reflective bottom of sulfuration resistant |
| CN109728152A (en) * | 2017-10-27 | 2019-05-07 | 深圳市聚飞光电股份有限公司 | LED encapsulation method and LED |
| CN112038463A (en) * | 2019-06-04 | 2020-12-04 | 佛山市国星光电股份有限公司 | Ultraviolet LED device and preparation method thereof |
| JP2021090077A (en) * | 2018-06-29 | 2021-06-10 | 日亜化学工業株式会社 | Light-emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109728152A (en) * | 2017-10-27 | 2019-05-07 | 深圳市聚飞光电股份有限公司 | LED encapsulation method and LED |
| JP2021090077A (en) * | 2018-06-29 | 2021-06-10 | 日亜化学工業株式会社 | Light-emitting device |
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| CN112038463A (en) * | 2019-06-04 | 2020-12-04 | 佛山市国星光电股份有限公司 | Ultraviolet LED device and preparation method thereof |
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Address after: 516000 No. 72 Huifeng 4th Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province (Factory Building) Applicant after: TCL Huarui Lighting Technology (Huizhou) Co., Ltd. Address before: 516000 Zhongkai hi tech Development Zone 19, Huizhou, Guangdong Applicant before: HUIZHOU HUARUI LIGHT SOURCE SCIENCE & TECHNOLOGY CO., LTD. |
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Effective date of registration: 20190125 Address after: 516000 No. 72 Huifeng 4th Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province (Factory Building) Applicant after: TCL Huarui Lighting Technology (Huizhou) Co., Ltd. Applicant after: Huarui photoelectric (Huizhou) Co. Ltd. Address before: 516000 No. 72 Huifeng 4th Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province (Factory Building) Applicant before: TCL Huarui Lighting Technology (Huizhou) Co., Ltd. |
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Application publication date: 20160720 |
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| RJ01 | Rejection of invention patent application after publication |