CN209169176U - A kind of white glue encapsulating structure promoting LED luminance - Google Patents
A kind of white glue encapsulating structure promoting LED luminance Download PDFInfo
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- CN209169176U CN209169176U CN201822072381.0U CN201822072381U CN209169176U CN 209169176 U CN209169176 U CN 209169176U CN 201822072381 U CN201822072381 U CN 201822072381U CN 209169176 U CN209169176 U CN 209169176U
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- bracket
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- silver coating
- groove
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Abstract
A kind of white glue encapsulating structure promoting LED luminance, the utility model relates to LED encapsulation technology fields；It includes bracket, bracket silver coating, chip, groove, bonding gold thread, fluorescent glue；Bottom is equipped with bracket silver coating in the bowl of bracket, and the middle part on bracket silver coating is fixed with chip, and the bowl bottom of the bracket of chip perimeter opens up fluted, and the positive and negative anodes of chip pass through bonding gold thread respectively and connect with bracket silver coating；It also includes high reflectance white glue, which fills out in the bowl for being located at the bracket of groove periphery on bottom；The fluorescent glue, which is filled out, to be located in the bowl of bracket, and its upper surface flushes setting with the upper surface of bracket.Improve LED lamp bead in chip light emitting angle, and in lifting bracket bottom layer reflectivity, to increase the brightness of LED lamp bead, practicability is stronger.
Description
Technical field
The utility model relates to LED encapsulation technology fields, and in particular to a kind of white glue encapsulating structure for promoting LED luminance.
Background technique
Light emitting diode abbreviation LED, is made of the compound containing gallium, arsenic, phosphorus, nitrogen etc., when by electronics and hole-recombination
Visible light can be given off, thus can be used to that light emitting diode is made.Wherein, gallium arsenide diode glows, two pole of gallium phosphide
Pipe green light, silicon carbide diode Yellow light-emitting low temperature, gallium nitride diode blue light-emitting.It is mostly used at the beginning as indicator light, display luminous two
Pole pipe plate etc.；With the appearance of white light LEDs, gradually it is used as illuminating.Currently, white light LEDs have been widely used in various illumination necks
Domain, such as portable lighting, backlight, flash lamp, automotive lighting；But the smaller size of more and more product demands and higher
Brightness seem too impatient to wait, while as market competition is aggravated, LED component cost reduction factor, market is to low price high brightness
The demand of LED component is more and more obvious.Therefore by some structures of transformation bracket, light emitting angle and the promotion of chip are promoted
The reflectivity of LED support bottom makes LED lamp bead luminance raising.
Summary of the invention
The purpose of this utility model is that in view of the drawbacks of the prior art and insufficient, provide that a kind of structure is simple, and design is closed
Reason, the white glue encapsulating structure easy to use for promoting LED luminance, improve the chip light emitting angle in LED lamp bead, and lifting bracket
The reflectivity of interior bottom layer, to increase the brightness of LED lamp bead, practicability is stronger.
To achieve the above object, the white glue encapsulating structure of promotion LED luminance described in the utility model: it includes branch
Frame, bracket silver coating, chip, groove, bonding gold thread, fluorescent glue；Bottom is equipped with bracket silver coating, bracket in the bowl of bracket
Middle part on silver coating is fixed with chip, and the bowl bottom of the bracket of chip perimeter opens up fluted, the positive and negative anodes difference of chip
It is connect by bonding gold thread with bracket silver coating；It also includes high reflectance white glue, which, which fills out, is located at outside groove
In the bowl of the bracket enclosed on bottom；The fluorescent glue, which is filled out, to be located in the bowl of bracket, and the upper end of its upper surface and bracket
Face flushes setting.
Further, the bottom of the bracket is embedded with normal society, and normal society is arranged on the right side of the periphery of groove.
Further, the high reflectance white glue fill out be located in groove and the bowl of the bracket of groove periphery in bottom
On.
After adopting the above structure, the utility model has the beneficial effect that a kind of the white of promotion LED luminance described in the utility model
Glue encapsulating structure, chip surface are equipped with fluorescent glue, and fluorescent glue excites compound generation white light by chip；The light that chip issues passes through
The reflecting layer that high reflectance white glue is formed is reflected, and the chip light emitting angle in LED lamp bead, and bottom in lifting bracket are improved
The reflectivity of layer, to increase the brightness of LED lamp bead.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structure sectional view of specific embodiment one.
Fig. 3 is the structure sectional view of specific embodiment two.
Description of symbols:
Bracket 1, bracket silver coating 1-1, chip 2, groove 3, bonding gold thread 4, high reflectance white glue 5, fluorescent glue 6, normal society
7。
Specific embodiment
The utility model will be further described below with reference to the accompanying drawings.
Specific embodiment 1:
Referring to as Figure 1-Figure 2, present embodiment the technical solution adopted is that: it includes that bracket 1, bracket are silver-plated
Layer 1-1, chip 2, groove 3, bonding gold thread 4, fluorescent glue 6；Bottom is equipped with bracket silver coating 1-1, bracket in the bowl of bracket 1
Middle part on silver coating 1-1 is fixed with chip 2, and the bowl bottom of the bracket 1 on 2 periphery of chip opens up fluted 3, and chip 2 is just
Cathode passes through bonding gold thread 4 respectively and connect with bracket silver coating 1-1；It also includes high reflectance white glue 5, the high reflectance white glue
5 fill out in the bowl for being located at the bracket 1 of 3 periphery of groove on bottom；The fluorescent glue 6 is filled out in the bowl for being located at bracket 1, and thereon
Surface flushes setting with the upper surface of bracket 1.
Further, the bottom of the bracket 1 is embedded with normal society 7, and normal society 7 is arranged on the right side of the periphery of groove 3.
Chip 2 in present embodiment uses blue light single-chip, and blue light single wafer surface is encapsulated glimmering by outer surface
Optical cement 6 (glue mixes yellow, red, green etc.) excites compound generation white light by blue chip, and the light that chip 2 issues is through excessively high anti-
The reflecting layer of the formation of rate white glue 5 is penetrated, reflectivity increases, to be luminance raising, encapsulation is completed, and colour consistency is good, colour temperature collection
In, it is consistent with market LED light source versatility.
The encapsulation step of present embodiment is as follows:
Step 1: using stamping technology, bottom punch forming is recessed in 1 bowl of bracket equipped with bracket silver coating 1-1 first
Slot 3；
Step 2: in die bond, Glue dripping head by die bond glue point in the bowl of bracket 1 on the position of bottom fixed chip 2,
Make die bond adhesive curing by high-temperature baking, so that chip 2 is fixed on the bracket silver coating 1-1 of bottom in 1 bowl of bracket；
Step 3: solder bonds gold thread 4, the positive and negative anodes of chip 2 are connect using bonding gold thread 4 with bracket silver coating 1-1
Conducting；
Step 4: high reflectance white glue 5 to be filled in the periphery of the groove 3 of bottom in the bowl of bracket 1 in dispensing；
High reflectance white glue 5 passes through high-temperature baking, is solidified into reflecting layer；Fluorescent glue 6, and fluorescent glue 6 are equipped on the outside of high reflectance white glue 5
It is filled in the bowl of bracket 1, by high-temperature baking, solidifies fluorescent glue 6.
After adopting the above structure, the utility model has the beneficial effect that a kind of the white of promotion LED luminance described in the utility model
Glue encapsulating structure, chip surface are equipped with fluorescent glue, and fluorescent glue excites compound generation white light by chip；The light that chip issues passes through
The reflecting layer that high reflectance white glue is formed is reflected, and the chip light emitting angle in LED lamp bead, and bottom in lifting bracket are improved
The reflectivity of layer, to increase the brightness of LED lamp bead.
Specific embodiment 2:
Referring to Fig. 3, present embodiment and specific embodiment one the difference is that: the high reflectance is white
Glue 5 fill out be located in groove 3 and the bowl of the bracket 1 of 3 periphery of groove on bottom, remaining structure and connection relationship with tool
Body embodiment one is identical.
The white glue packaging method of promotion LED luminance in present embodiment and the encapsulation side in specific embodiment one
Method the difference is that: in dispensing, by high anti-glue white glue 5 be filled in bottom in the bowl of bracket 13 inside of groove and
At the periphery of groove 3, remaining encapsulation step is same as the specific embodiment one.
The above is merely intended for describing the technical solutions of the present application, but not for limiting the present application, those of ordinary skill in the art couple
The other modifications or equivalent replacement that the technical solution of the utility model is made, without departing from technical solutions of the utility model
Spirit and scope should all cover in the scope of the claims of the utility model.
Claims (3)
1. it is a kind of promoted LED luminance white glue encapsulating structure, it is characterised in that: it include bracket (1), bracket silver coating (1-1),
Chip (2), groove (3), bonding gold thread (4), fluorescent glue (6)；Bottom is equipped with bracket silver coating (1- in the bowl of bracket (1)
1), the middle part on bracket silver coating (1-1) is fixed with chip (2), and the bowl bottom of the bracket (1) on chip (2) periphery offers
Groove (3), the positive and negative anodes of chip (2) pass through bonding gold thread (4) respectively and connect with bracket silver coating (1-1)；It also includes high anti-
Rate white glue (5) are penetrated, which fills out in the bowl for being located at the bracket (1) of groove (3) periphery on bottom；Described
Fluorescent glue (6) is filled out in the bowl for being located at bracket (1), and its upper surface flushes setting with the upper surface of bracket (1).
2. a kind of white glue encapsulating structure for promoting LED luminance according to claim 1, it is characterised in that: the bracket
(1) bottom is embedded with normal society (7), and normal society (7) setting is on the periphery right side of groove (3).
3. a kind of white glue encapsulating structure for promoting LED luminance according to claim 1, it is characterised in that: the height is anti-
Penetrate rate white glue (5) fill out be located in groove (3) and the bowl of the bracket (1) of groove (3) periphery on bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822072381.0U CN209169176U (en) | 2018-12-11 | 2018-12-11 | A kind of white glue encapsulating structure promoting LED luminance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822072381.0U CN209169176U (en) | 2018-12-11 | 2018-12-11 | A kind of white glue encapsulating structure promoting LED luminance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209169176U true CN209169176U (en) | 2019-07-26 |
Family
ID=67343166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822072381.0U Active CN209169176U (en) | 2018-12-11 | 2018-12-11 | A kind of white glue encapsulating structure promoting LED luminance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209169176U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114724468A (en) * | 2021-01-04 | 2022-07-08 | 群创光电股份有限公司 | Display device |
-
2018
- 2018-12-11 CN CN201822072381.0U patent/CN209169176U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114724468A (en) * | 2021-01-04 | 2022-07-08 | 群创光电股份有限公司 | Display device |
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