CN207966975U - A kind of novel white-light light emitting diode - Google Patents
A kind of novel white-light light emitting diode Download PDFInfo
- Publication number
- CN207966975U CN207966975U CN201820133498.2U CN201820133498U CN207966975U CN 207966975 U CN207966975 U CN 207966975U CN 201820133498 U CN201820133498 U CN 201820133498U CN 207966975 U CN207966975 U CN 207966975U
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- CN
- China
- Prior art keywords
- light
- chip
- wire support
- blue light
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The utility model discloses a kind of novel white-light light emitting diodes, including diode body and bonding wire, the first wire support is interspersed on the right side of diode body, the upper end of first wire support forms fluted, the inner bottom surface of groove is installed with the first blue light diode chip, the first red diodes chip is fixed on the right side of first blue light diode chip, the second wire support is fixed on the left of first wire support, it is connected with blue light bonding wire between second wire support and the first blue light diode chip, and second is connected with feux rouges bonding wire between wire support and the first red diodes chip.This kind of novel white-light light emitting diode increases the first red diodes chip and carries out colour mixture and toning, colour temperature effect is adjusted to play, realization colour temperature smooth linear is excessive and improves colour rendering, the color of object inherently can really be restored, suitable for the production and use of novel white-light light emitting diode, there is good development prospect.
Description
Technical field
The utility model is related to LED technology field, specially a kind of novel white-light light emitting diode.
Background technology
Light emitting diode is referred to as LED, and the compound by containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N) etc. is made, and works as electricity
Visible light can be given off when son is with hole-recombination, thus can be used for that light emitting diode is made, and be used as and referred in circuit and instrument
Show that lamp, or composition word or number display, gallium arsenide diode glow, gallium phosphide diode green light, two pole of silicon carbide
Pipe Yellow light-emitting low temperature, gallium nitride diode blue light-emitting, because chemical property is divided into Organic Light Emitting Diode OLED and inorganic light-emitting diode
LED。
Existing light emitting diode, generally polychrome are mixed into wavelength white light, differ since different directions are photochromic, no
Equal white light easily is mixed out, colour rendering is low, and color rendition degree is poor, on the basis of blue is encapsulated with yellow fluorescent powder, Wu Faqi
To the effect for adjusting colour temperature.
Utility model content
The purpose of this utility model is to provide a kind of novel white-light light emitting diodes, to solve to carry in above-mentioned background technology
It is low to go out colour rendering, color rendition degree is poor, the problem of can not playing the role of adjusting colour temperature.
To achieve the above object, the utility model provides the following technical solutions：A kind of novel white-light light emitting diode, including
Diode body and bonding wire are interspersed with the first wire support, first wire support on the right side of the diode body
Upper end formed fluted, the inner bottom surface of the groove is installed with the first blue light diode chip, and described first is blue
The first red diodes chip is fixed on the right side of luminous diode chip, being fixed with second on the left of first wire support leads
Line bracket is connected with blue light bonding wire between second wire support and the first blue light diode chip, and second leads
Feux rouges bonding wire is connected between line bracket and the first red diodes chip, the inside of the groove is fitted with the first Huang
The upper end of optical fluorescence, first wire support and second wire support is sheathed with the first packing colloid, two pole
The bottom end of pipe main body is fixed with substrate, and the upper end of the substrate is fitted with layer printed circuit board, and the top surface of the layer printed circuit board is left
Side is fixed with the second blue light diode chip, and is fixed with the second red diodes core on the right side of the top surface of the layer printed circuit board
It is provided with the second yellow light fluorescence coating above piece, the second blue light diode chip and the second red diodes chip,
It is provided with the second packing colloid on the outside of the second yellow light fluorescence coating.
Preferably, first wire support interts with first packing colloid with second wire support and connects
It connects, the groove is fixedly connected with the upper end left side of first wire support.
Preferably, the first blue light diode chip and the first red diodes chip are interior with the groove
Portion bottom surface is fixedly connected, and the first yellow light fluorescence coating is bonded with the inner tight of the groove.
Preferably, the first blue light diode chip and the first red diodes chip and the second conducting wire branch
Frame is electrically connected by blue light bonding wire and the feux rouges bonding wire respectively.
Preferably, the layer printed circuit board is fixedly connected with the top surface of the substrate, the second blue light diode chip
It is fixedly connected with the top surface of the layer printed circuit board with the second red diodes chip.
Preferably, the second blue light diode chip and the second red diodes chip and the layer printed circuit board
It is electrically connected by the bonding wire, and the upper inner wall of layer printed circuit board is fitted closely with the second yellow light fluorescence coating.
Compared with prior art, the utility model has the beneficial effects that：This kind of novel white-light light emitting diode, the first conducting wire
With the interspersed connection of the first packing colloid, the upper end left side of groove and the first wire support is fixed for holder and the second wire support
Connection, the first blue light diode chip and the first red diodes chip are fixedly connected with the inner bottom surface of groove, and first is yellow
Optical fluorescence is bonded with the inner tight of groove, and existing light emitting diode, generally polychrome are mixed into wavelength white light, due to not
It is equidirectional it is photochromic differ, therefore be not easy to mix out equal white light, colour rendering is low, and color rendition degree is poor, this kind of novel white-light shines
Diode increases first on the basis of the first blue light diode chip coordinates the warm white encapsulating structure of the first yellow light fluorescence coating
Red diodes chip carries out colour mixture and toning, adjusts colour temperature effect to play, realizes colour temperature smooth linear excessively and carry
High-color rendering can really restore the color of object inherently, the second blue light diode chip and the second red diodes chip
It is electrically connected by bonding wire with layer printed circuit board, and the upper inner wall of layer printed circuit board is fitted closely with the second yellow light fluorescence coating,
Existing light emitting diode can not play the role of adjusting colour temperature, second is yellow on the basis of blue is encapsulated with yellow fluorescent powder
After the blue light illumination that yellow fluorescent powder in optical fluorescence is sent out by the second blue light diode chip, it is glimmering yellow can be sent out
Light, mixed light becomes warm white, warm white and the second red diodes chip institute to sodium yellow together with no absorbed blue light again
The warm white of high-color rendering is become after the feux rouges colour mixture sent out, and has both good color reducibility, even if in low color temperature
In the case of, color developing effect is also high.
Description of the drawings
Fig. 1 is that the utility model is applied to bulb type encapsulating structure schematic diagram；
Fig. 2 is that the utility model is applied to SMD LED surface-mount device LED encapsulating structure schematic diagram.
In figure：1, diode body, the 2, first wire support, 3, groove, the 4, first blue light diode chip, 5, first is red
Luminous diode chip, 6, blue light bonding wire, 7, feux rouges bonding wire, the 8, second wire support, the 9, first yellow light fluorescence coating, the 10, first envelope
Fill colloid, 11, layer printed circuit board, 12, substrate, the 13, second blue light diode chip, the 14, second red diodes chip, 15,
Bonding wire, the 16, second yellow light fluorescence coating, the 17, second packing colloid.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
It please refers to Fig.1 to 2, the utility model provides a kind of technical solution：A kind of novel white-light light emitting diode, including two
Pole pipe main body 1, the first wire support 2, groove 3, the first blue light diode chip 4, the first red diodes chip 5, blue light weldering
Line 6, feux rouges bonding wire 7, the second wire support 8, the first yellow light fluorescence coating 9, the first packing colloid 10, layer printed circuit board 11, substrate
12, the second blue light diode chip 13, the second red diodes chip 14, bonding wire 15, the second yellow light fluorescence coating 16 and the second envelope
Fill colloid 17, the right side of diode body 1 is interspersed with the first wire support 2, and the upper end of the first wire support 2 forms fluted
3, the inner bottom surface of groove 3 is installed with the first blue light diode chip 4, and the right side of the first blue light diode chip 4 is fixed
Have the first red diodes chip 5, the left side of the first wire support 2 is fixed with the second wire support 8, the second wire support 8 with
Blue light bonding wire 6, and the second wire support 8 and the first red diodes chip 5 are connected between first blue light diode chip 4
Between be connected with feux rouges bonding wire 7, the inside of groove 3 is fitted with the first yellow light fluorescence coating 9, existing light emitting diode, generally
It is mixed into wavelength white light for polychrome, is differed since different directions are photochromic, is not easy to mix out equal white light, colour rendering is low, color
Reduction degree is poor, this kind of novel white-light light emitting diode coordinates the warm of the first yellow light fluorescence coating 9 in the first blue light diode chip 4
It on the basis of white light encapsulating structure, increases the first red diodes chip 5 and carries out colour mixture and toning, colour temperature effect is adjusted to play
Fruit realizes colour temperature smooth linear excessively and improves colour rendering, can really restore the color of object inherently, the first conducting wire branch
The upper end of frame 2 and the second wire support 8 is sheathed with the first packing colloid 10, and the bottom end of diode body 1 is fixed with substrate 12, base
The upper end of plate 12 is fitted with layer printed circuit board 11, and the second blue light diode chip is fixed on the left of the top surface of layer printed circuit board 11
13, and the second red diodes chip 14 is fixed on the right side of the top surface of layer printed circuit board 11, the second blue light diode chip 13 with
The top of second red diodes chip 14 is provided with the second yellow light fluorescence coating 16, and the outside of the second yellow light fluorescence coating 16 is provided with
Second packing colloid 17, existing light emitting diode can not play adjusting color on the basis of blue is encapsulated with yellow fluorescent powder
The effect of temperature, the yellow fluorescent powder in the second yellow light fluorescence coating 16 are shone by the blue light that the second blue light diode chip 13 is sent out
After penetrating, yellow fluorescence can be sent out, the mixed light together with no absorbed blue light becomes warm white to sodium yellow again, warm white and the
The warm white of high-color rendering is become after the feux rouges colour mixture that two red diodes chips 14 are sent out, and has both good color also
Originality, even if in the case of low color temperature, color developing effect is also high.
Operation principle：Before using this kind of novel white-light light emitting diode, should letter first be done to the structure of diode body 1
Single understanding, first by blue light bonding wire 6 and feux rouges bonding wire 7 respectively with the first blue light diode chip 4 and the first red diodes
Chip 5 weld, the first wire support 2 and the second wire support 8 are interted with the first packing colloid 10 later, backward first
Wire support 2 and the second wire support 8 are powered, and coordinate the warm white of the first yellow light fluorescence coating 9 in the first blue light diode chip 4
It on the basis of encapsulating structure, increases the first red diodes chip 5 and carries out colour mixture and toning, colour temperature effect is adjusted to play,
Second blue light diode chip 13 and the second red diodes chip 14 are welded with layer printed circuit board 11 by bonding wire 15 later,
It is powered to layer printed circuit board 11, the yellow fluorescent powder in the second yellow light fluorescence coating 16 is sent out by the second blue light diode chip 13
After the blue light illumination gone out, yellow fluorescence can be sent out, mixed light becomes warm white to sodium yellow together with no absorbed blue light again,
The warm white of high-color rendering is become after the feux rouges colour mixture that warm white and the second red diodes chip 14 are sent out, it is above to be exactly
The entire operation principle of the utility model.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of novel white-light light emitting diode, including diode body (1) and bonding wire (15), it is characterised in that：Two pole
It is interspersed with the first wire support (2) on the right side of pipe main body (1), the upper end of first wire support (2) forms fluted
(3), the inner bottom surface of the groove (3) is installed with the first blue light diode chip (4), the first blue light diode core
The first red diodes chip (5) is fixed on the right side of piece (4), being fixed with second on the left of first wire support (2) leads
Line bracket (8) is connected with blue light bonding wire between second wire support (8) and the first blue light diode chip (4)
(6), it and between the second wire support (8) and the first red diodes chip (5) is connected with feux rouges bonding wire (7), it is described
The inside of groove (3) is fitted with the first yellow light fluorescence coating (9), first wire support (2) and second wire support (8)
Upper end be sheathed with the first packing colloid (10), the bottom end of the diode body (1) is fixed with substrate (12), the substrate
(12) upper end is fitted with layer printed circuit board (11), and two pole of the second blue light is fixed on the left of the top surface of the layer printed circuit board (11)
Tube chip (13), and the second red diodes chip (14) is fixed on the right side of the top surface of the layer printed circuit board (11), described the
It is provided with the second yellow light fluorescence coating above two blue light diode chips (13) and the second red diodes chip (14)
(16), it is provided with the second packing colloid (17) on the outside of the second yellow light fluorescence coating (16).
2. a kind of novel white-light light emitting diode according to claim 1, it is characterised in that：First wire support
(2) with second wire support (8) with the interspersed connection of first packing colloid (10), the groove (3) and described the
The upper end left side of one wire support (2) is fixedly connected.
3. a kind of novel white-light light emitting diode according to claim 1, it is characterised in that：First blue light diode
Chip (4) and the first red diodes chip (5) are fixedly connected with the inner bottom surface of the groove (3), and described first
Yellow light fluorescence coating (9) is bonded with the inner tight of the groove (3).
4. a kind of novel white-light light emitting diode according to claim 1, it is characterised in that：First blue light diode
Chip (4) and the first red diodes chip (5) and second wire support (8) respectively by blue light bonding wire (6) and
The feux rouges bonding wire (7) is electrically connected.
5. a kind of novel white-light light emitting diode according to claim 1, it is characterised in that：The layer printed circuit board (11)
It is fixedly connected with the top surface of the substrate (12), the second blue light diode chip (13) and the second red diodes core
Piece (14) is fixedly connected with the top surface of the layer printed circuit board (11).
6. a kind of novel white-light light emitting diode according to claim 1, it is characterised in that：Second blue light diode
Chip (13) and the second red diodes chip (14) and the layer printed circuit board (11) are electrical by the bonding wire (15)
Connection, and the upper inner wall of layer printed circuit board (11) is fitted closely with the second yellow light fluorescence coating (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820133498.2U CN207966975U (en) | 2018-01-25 | 2018-01-25 | A kind of novel white-light light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820133498.2U CN207966975U (en) | 2018-01-25 | 2018-01-25 | A kind of novel white-light light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207966975U true CN207966975U (en) | 2018-10-12 |
Family
ID=63735238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820133498.2U Expired - Fee Related CN207966975U (en) | 2018-01-25 | 2018-01-25 | A kind of novel white-light light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207966975U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111370551A (en) * | 2018-12-25 | 2020-07-03 | 亿光电子(中国)有限公司 | Light emitting device |
-
2018
- 2018-01-25 CN CN201820133498.2U patent/CN207966975U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111370551A (en) * | 2018-12-25 | 2020-07-03 | 亿光电子(中国)有限公司 | Light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181012 Termination date: 20210125 |