CN106449950A - Manufacturing method of MLCOB light source - Google Patents
Manufacturing method of MLCOB light source Download PDFInfo
- Publication number
- CN106449950A CN106449950A CN201610736544.3A CN201610736544A CN106449950A CN 106449950 A CN106449950 A CN 106449950A CN 201610736544 A CN201610736544 A CN 201610736544A CN 106449950 A CN106449950 A CN 106449950A
- Authority
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- China
- Prior art keywords
- light source
- mlcob
- substrate
- glue
- manufacture method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000003292 glue Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000741 silica gel Substances 0.000 claims abstract description 11
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 6
- 238000009826 distribution Methods 0.000 abstract description 4
- 238000001556 precipitation Methods 0.000 abstract description 3
- 230000001795 light effect Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a manufacturing method of an MLCOB light source. The method comprises the following steps of manufacturing a substrate; molding cup bodies; carrying out surface pretreatment of the cup bodies; fixing chips into the cup bodies; separately dispensing fluorescent glue into the cup bodies and carrying out precuring after the cup bodies become flat cups; dispensing a layer of relatively thin silica gel or silicone rubber with a slightly bigger refractive index on a functional region on the basis of the above and carrying out precuring; and carrying out fluorescent glue coating operation on the functional region on the basis of the above. According to the manufacturing method, the problems of fluorescent powder precipitation and uneven light distribution in the dispensing process are solved through improving a light source dispensing technology; the quality of light is effectively improved; and the MLCOB light source has the characteristics of being high in light effect and even in light.
Description
Technical field
The present invention relates to LED encapsulation technology field, more particularly to a kind of manufacture method of MLCOB light source.
Background technology
Day by day ripe with LED technology, LED product all trades and professions application is more and more diversified, standardization, wherein
Being no lack of some products becomes the standard of industry.Based on traditional SMD discrete device and high-power integrated device, wherein with 2835,
3014 grades are that application of the representational middle low power discrete device in fluorescent tube, panel, ball bubble is more universal；With COB product it is
Application of the big functional device for representing in Down lamp, ball bubble, shot-light, track lamp, street lamp and Tunnel Lamp etc. is more universal.Tradition
Discrete device need in application process to be mounted on lamp bead on lamp bar/plate through SMT technique, easily cause dead lamp, failure welding,
Photoelectric parameter declines while increased processing cost；COB product is luminous uniform with which, and color tolerance is little, no hot spot, and volume tightly promotees,
Secondary optical design is simple, it is easy to by dress the advantages of be more and more used widely in commercial lighting, outdoor lighting with
Promote.
Wherein with many glasss of integrated class COB light source, i.e. MCOB or MLCOB is the extension of traditional COB encapsulation technology, and it is
Multiple band optics cup body structure are manufactured by certain rule on original substrate, by LED chip by being placed in respective optical cup, respectively
Circuit connection is carried out between cup by way of wire bonding, then respectively fluorescent glue coating is being carried out to each chip, its advantage
It is, the area source that such COB constitutes for point source, the more traditional COB of independent its light extraction efficiency of LENS molding of each cup unit
Height, photochromic one to property is good, heat relative distribution, and glue quantity is also relative to reduce such light source generally using spray in manufacturing process
Applying technique carries out LENS molding, the present invention is intended to provide a kind of MLCOB light source preparation method is to solve in common process production easily
There is fluorescent material the uneven or glare problem of light distribution for connecting glue with cup and causing is precipitated with further improving product light quality.
Therefore, how to provide a kind of manufacture method of the MLCOB light source with the high and uniform feature of light of light efficiency is this area
The problem of technical staff's urgent need to resolve.
Content of the invention
In view of this, the invention provides a kind of manufacture method of the MLCOB light source with the high and uniform feature of light of light efficiency.
For achieving the above object, the present invention provides following technical scheme：
A kind of manufacture method of MLCOB light source, it is characterised in that include：Substrate, optics cup, functional areas, location hole and
Electrode；Wherein, the substrate material is mirror-surface aluminum base board, and the inwall of the optics cup will do reflective and fineness and process, and
Can cross and scribble highly-reflective coating or coating one kind therein.
Preferably, in a kind of above-mentioned manufacture method of MLCOB light source, chip is set inside the optics cup, and
The number of chips is not limited.
Preferably, in a kind of above-mentioned manufacture method of MLCOB light source, layer of silica gel and fluorescence are scribbled on the functional areas
Glue-line.
Preferably, in a kind of above-mentioned manufacture method of MLCOB light source, concrete steps also include：
A, the making substrate and the optics cup；
B, the chip is positioned in the cup of substrate, and carries out die bond bonding wire；
C, the substrate being soldered admittedly is carried out baking dehumidifying, and carry out dispensing operation；
D, the functional areas are carried out with the silica gel of overall point layer, and precuring is carried out, to function after its solidification
Area carries out secondary fluorescent glue；
E, by put glue the substrate send into baking box solidified.
Preferably, in a kind of above-mentioned manufacture method of MLCOB light source, the concretely comprising the following steps of step a：Insulate in base material
Layer on do one layer of BT line layer, by injection mo(u)lding or punch forming process, optics cup body structure is processed, and with institute
State substrate to press together.
Preferably, in a kind of above-mentioned manufacture method of MLCOB light source, the comprising the concrete steps that of step c：Need before dispensing by
Admittedly the substrate for welding is put into baking box and carries out at 80 DEG C dehumidifying 1 hour or carry out dehumidifying half an hour, Ran Hougen at 150 DEG C
Require to select corresponding fluorescent material and glue, fluorescent material: glue is mixed in 1: 10～1: 20 ratio according to colour temperature and aobvious finger
And stir, uniform mix after carry out vacuum defoamation process, after glue is poured into syringe, according to the program that automatic dispensing machine sets
Carry out dispensing operation.
Preferably, in a kind of above-mentioned manufacture method of MLCOB light source, the dispensing operation was divided into the next stage；In list
Fluorescent glue is put on only optics cup；Silica gel is integrally put on the functional areas；Fluorescent glue is integrally put on the functional areas.
Understand via above-mentioned technical scheme, compared with prior art, the present invention leads to a light source gluing process by improving,
Solve easily to occur fluorescent material precipitation during dispensing and light distribution is uneven, the quality of light is effectively raised, with light efficiency
The high and uniform feature of light.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for technology description is had to be briefly described, it should be apparent that, drawings in the following description are only this
Inventive embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 accompanying drawing is the light-source structure schematic diagram of the present invention.
Fig. 2 accompanying drawing is the light source integrated molding structural representation of the present invention.
Fig. 3 accompanying drawing is illustrated for the light source LENS molding structure of the present invention.
In FIG：
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the invention discloses a kind of manufacture method of the MLCOB light source with the high and uniform feature of light of light efficiency.
Accompanying drawing 1, accompanying drawing 2, accompanying drawing 3 is referred to, is a kind of manufacture method of MLCOB light source disclosed by the invention, concrete bag
Include：
Substrate 1, optics cup 2, functional areas 3, location hole 4 and electrode 5；Wherein, 1 material of substrate is mirror-surface aluminum base board, light
The inwall for learning cup 2 will do reflective and fineness and process, and can cross and scribble highly-reflective coating or coating one kind therein.
The present invention is solved easily to occur fluorescent material precipitation during dispensing and light divides by improving logical light source gluing process
Cloth is uneven, effectively raises the quality of light, with the high and uniform feature of light of light efficiency.
In order to optimize technique scheme further, chip 6 is set inside optics cup 2, and 6 quantity of chip is not limited.
In order to optimize technique scheme further, layer of silica gel 7 and fluorescent adhesive layer 8 is scribbled on functional areas 3.In order to enter one
Step optimizes technique scheme, and concrete steps also include：
A, making substrate 1 and optics cup 2；
B, chip 6 is positioned in the cup of substrate, and carries out die bond bonding wire；
C, the substrate 1 being soldered admittedly is carried out baking dehumidifying, and carry out dispensing operation；
D, functional areas 3 are carried out with the silica gel of overall point layer, and precuring is carried out, after its solidification, functional areas are entered
Secondary fluorescent glue of row；
E, the substrate 1 for having put glue is sent into baking box solidified.
In order to optimize technique scheme further, the concretely comprising the following steps of step a：One layer of BT line is made on base material insulating barrier
Road floor, is processed to optics cup body structure by injection mo(u)lding or punch forming process, and is pressed together with substrate 1.
In order to optimize technique scheme further, the comprising the concrete steps that of step c：Need the substrate for welding admittedly before dispensing
1 is put into baking box carries out at 80 DEG C dehumidifying 1 hour or carries out dehumidifying half an hour at 150 DEG C, then will according to colour temperature and aobvious finger
The corresponding fluorescent material of selection and glue, fluorescent material: glue is mixed and stirred for, uniform mixing is asked in 1: 10～1: 20 ratio
After carry out vacuum defoamation process, after glue is poured into syringe, dispensing operation is carried out according to the program that automatic dispensing machine sets.
In order to optimize technique scheme further, dispensing operation was divided into the next stage；Point on single optics cup 2
Fluorescent glue；Silica gel is integrally put on functional areas 3；Fluorescent glue is integrally put on functional areas 3.
In order to optimize technique scheme further, substrate 1 is high reflectance minute surface aluminium base, first in 1 insulating barrier of substrate
On do one layer of BT line layer, BT layer THICKNESS CONTROL using plating or changes plating to circuit on BT layer and pad area in 0.1-0.25mm
Mode is processed, and scribbles the good white oil of one layer of yellowing-resistant, high temperature resistant, reflective spy on line layer；Then do on BT line layer corresponding
Optics cup body structure, selects the injection material (as PCT, EMC) of the high light-reflecting property yellowing-resistant of high heat conduction by the way of injection mo(u)lding
Form respective optical cup 2 or using printed wiring board etching and punch forming mode with base material pressing molding and in cup
The process of corresponding fineness is done at wall and cup bottom.
In order to optimize technique scheme further, dispensing operation is concretely comprised the following steps：Each cup on substrate 1 is carried out individually
Point fluorescent glue, should control total glue amount and spraying rate each cup hose lining amount point during point fluorescent glue and stop to flat cup, Glue dripping head
To next cup move when, needed 1S or so dead time before Glue dripping head is lifted in case leukorrhagia stopping plays colloid or adjacent cup glue
Body phase even, after the completion of remove substrate and be put into baking box and carry out prebake conditions, prebake conditions temperature be；Then will
Baked substrate is put on another dispensing board to functional areas 3 carries out overall point silica gel, controls corresponding glue in proportion, amount
And plastic emitting speed is uniform, treating that its levelling is removed substrate and is put into baking box carries out prebake conditions, and baking temperature control is at 100 DEG C～120 DEG C
Half an hour；Finally baked substrate is taken out and be put on the previous dispensing board for preparing fluorescent glue, two are carried out to functional areas
Secondary overall point fluorescent glue.
In this specification, each embodiment is described by the way of going forward one by one, and what each embodiment was stressed is and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.For device disclosed in embodiment
For, as which corresponds to the method disclosed in Example, so description is fairly simple, related part is said referring to method part
Bright.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
Multiple modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope for causing.
Claims (7)
1. a kind of manufacture method of MLCOB light source, it is characterised in that include：Substrate (1), optics cup (2), functional areas (3),
Location hole (4) and electrode (5)；Wherein, described substrate (1) material is that mirror-surface aluminum base board, the inwall of optics cup (2) will do
Reflective and fineness is processed, and can be crossed and scribbled highly-reflective coating or coating one kind therein.
2. the manufacture method of a kind of MLCOB light source according to claim 1, it is characterised in that in optics cup (2)
Inside arranges chip (6), and the chip (6) quantity is not limited.
3. the manufacture method of a kind of MLCOB light source according to claim 1, it is characterised in that on the functional areas (3)
Scribble layer of silica gel (7) and fluorescent adhesive layer (8).
4. the manufacture method of a kind of MLCOB light source according to claim 1, it is characterised in that concrete steps also include：
A, making substrate (1) and the optics cup (2)；
B, the chip (6) is positioned in the cup of substrate, and carries out die bond bonding wire；
C, the substrate (1) being soldered admittedly is carried out baking dehumidifying, and carry out dispensing operation；
D, the functional areas (3) are carried out with the silica gel of overall point layer, and precuring is carried out, to functional areas after its solidification
Carry out secondary fluorescent glue；
E, by put glue the substrate (1) send into baking box solidified.
5. a kind of manufacture method of MLCOB light source according to claim 4, it is characterised in that the concrete steps of step a
For：One layer of BT line layer is done on base material insulating barrier, by injection mo(u)lding or punch forming process, optics cup body structure is entered
Row processing, and press together with the substrate (1).
6. a kind of manufacture method of MLCOB light source according to claim 1, it is characterised in that the concrete steps of step c
It is：Before dispensing, need the substrate (1) that will weld admittedly to be put into baking box carries out at 80 DEG C dehumidifying 1 hour or enters at 150 DEG C
Row dehumidifying half an hour, then according to colour temperature and aobvious refer to require to select corresponding fluorescent material and glue, fluorescent material: glue by 1: 10～
1: 20 ratio is mixed and stirred for, uniform mix after carry out vacuum defoamation process, after glue is poured into syringe, according to automatic
The program that point gum machine sets carries out dispensing operation.
7. the manufacture method of a kind of MLCOB light source according to claim 6, it is characterised in that the dispensing operation is divided into
With the next stage；In individually described optics cup (2) upper point fluorescent glue；Described functional areas (3) upper overall point silica gel；The function
The upper overall point fluorescent glue in area (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736544.3A CN106449950A (en) | 2016-08-25 | 2016-08-25 | Manufacturing method of MLCOB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736544.3A CN106449950A (en) | 2016-08-25 | 2016-08-25 | Manufacturing method of MLCOB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449950A true CN106449950A (en) | 2017-02-22 |
Family
ID=58181875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610736544.3A Pending CN106449950A (en) | 2016-08-25 | 2016-08-25 | Manufacturing method of MLCOB light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449950A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818972A (en) * | 2017-10-18 | 2018-03-20 | 通元科技(惠州)有限公司 | A kind of LED circuit board and preparation method of band COB package substrates |
| CN108336080A (en) * | 2018-04-03 | 2018-07-27 | 广东雷腾智能光电有限公司 | A kind of manufacturing method of COB light source |
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| CN101558501A (en) * | 2006-10-12 | 2009-10-14 | 科锐Led照明科技公司 | Lighting device and method of making same |
| CN202076267U (en) * | 2011-05-27 | 2011-12-14 | 广州市鸿利光电股份有限公司 | Light emitting diode (LED) with chip on board (COB) packaging structure |
| CN102361058A (en) * | 2011-11-07 | 2012-02-22 | 福建省苍乐电子企业有限公司 | Method for improving light quality of chip-on-board (COB) packaging of white light-emitting diode (LED) |
| CN102779908A (en) * | 2011-05-10 | 2012-11-14 | 惠州多尔数码科技有限公司 | Graphite heat conduction high-powder flat plane light source encapsulation method |
| CN104022213A (en) * | 2014-04-11 | 2014-09-03 | 深圳市迈克光电子科技有限公司 | Remote phosphor COB integrated light source and preparation method thereof |
-
2016
- 2016-08-25 CN CN201610736544.3A patent/CN106449950A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101558501A (en) * | 2006-10-12 | 2009-10-14 | 科锐Led照明科技公司 | Lighting device and method of making same |
| CN102779908A (en) * | 2011-05-10 | 2012-11-14 | 惠州多尔数码科技有限公司 | Graphite heat conduction high-powder flat plane light source encapsulation method |
| CN202076267U (en) * | 2011-05-27 | 2011-12-14 | 广州市鸿利光电股份有限公司 | Light emitting diode (LED) with chip on board (COB) packaging structure |
| CN102361058A (en) * | 2011-11-07 | 2012-02-22 | 福建省苍乐电子企业有限公司 | Method for improving light quality of chip-on-board (COB) packaging of white light-emitting diode (LED) |
| CN104022213A (en) * | 2014-04-11 | 2014-09-03 | 深圳市迈克光电子科技有限公司 | Remote phosphor COB integrated light source and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818972A (en) * | 2017-10-18 | 2018-03-20 | 通元科技(惠州)有限公司 | A kind of LED circuit board and preparation method of band COB package substrates |
| CN108336080A (en) * | 2018-04-03 | 2018-07-27 | 广东雷腾智能光电有限公司 | A kind of manufacturing method of COB light source |
| CN108336080B (en) * | 2018-04-03 | 2019-11-05 | 广东雷腾智能光电有限公司 | A kind of manufacturing method of COB light source |
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Application publication date: 20170222 |
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