CN206584946U - CSP light sources and its manufacture mould - Google Patents
CSP light sources and its manufacture mould Download PDFInfo
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- CN206584946U CN206584946U CN201621069484.6U CN201621069484U CN206584946U CN 206584946 U CN206584946 U CN 206584946U CN 201621069484 U CN201621069484 U CN 201621069484U CN 206584946 U CN206584946 U CN 206584946U
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- colloid layer
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Abstract
The utility model provides a kind of CSP light sources and it manufactures mould, the CSP light sources include luminescence chip, fluorescent colloid layer is provided with the top of the luminescence chip, the surrounding of the luminescence chip, which is surrounded, the reflective glue-line with reflective function, the fluorescent colloid layer is incline structure with reflective glue-line binding site.Boss and groove are interval with the utility model CSP light sources manufacture mold cavity.The light that flip chip is sent can be gathered at the top of light source by the utility model, and light is avoided well and is leaked out from bottom, the overall light extraction efficiency of light source is improved.
Description
【Technical field】
The utility model is related to lighting field, more particularly, to a kind of high light-emitting rate CSP light sources and its manufacture mould.
【Background technology】
Existing common five face lights CSP light source (Chip Scale Package, wafer-level package) structure institute as shown in Figure 1, Figure 2
Show, it is constituted by the luminescence chip 110 positioned at middle part and from the fluorescent colloid 120 for surrounding luminescence chip with surrounding above.Wherein,
Luminescence chip 110 is the flip-chip that electrode is located at chip bottom, light source is directly welded with application end substrate, saves defluxing
Line procedures, easily break the trust sex chromosome mosaicism of dead lamp while avoiding traditional SMD light sources；Fluorescent glue is by transparent silica gel, fluorescent material
Mixed with auxiliary additive.
Existing common five face light CSP light sources the characteristics of be that rising angle is very big, not only can from surrounding and above
Five faces are lighted, and some light is also sent from the peripheral colloid of bottom-emission chip, and due to this feature, common five face lights
CSP light sources are by splendid optical uniformity；In addition, the CSP light sources of this five face light extraction are few because of simple in construction, material composition species,
So that this light source can save a large amount of materials and processing procedure and technique are relatively easy.
But existing five face lights, the structure of CSP light sources also brings new ask while with larger rising angle
Topic：
(1) because five faces all light, light source center luminance shortage is caused, it is impossible to applied in such as mobile phone flashlight etc.
The higher field of heart brightness demand；
(2) in the fluorescent glue of luminescence chip bottom periphery, after the blue light sent by luminescence chip is excited, the light of generation can be from
Bottom is sent, and this part of light would generally cause the overall luminous flux of light source to drop because of the repeatedly rapid decay such as refraction, reflection
Low, the utilization rate of light is not also high；
(3) because fluorescent colloid is exposed in periphery, when phosphor concentration is too high in colloid, the luminous CSP in five faces is being used
During light source, easily there is colloid fragmentation, damaged situation, when this occurs, chromaticity coordinates, the color of CSP light sources
Larger skew will occur for the performance parameters such as temperature, and this aberrations in property of CSP light sources is flagrant, is especially carried on the back in TV
The of a relatively high occasion of the photoelectric color parameter precision to light source such as light, display screen technology；
(4) the luminous CSP light sources in common five face, luminescence chip bonding with fluorescent colloid is the intrinsic bonding carried by colloid
Performance, this bonding force very little so that this CSP light sources fluorescent colloid occur and departed from luminescence chip in use, easily,
Cause the situation of light source fails.
Therefore it provides a kind of brightness uniformity, center brightness foot, luminous flux are high, colour temperature is stable, constitutionally stable CSP light sources
And its manufacture method is actually necessary.
【The content of the invention】
The purpose of this utility model is to provide a kind of high light-emitting rate CSP light sources and its manufacture mould.
To realize the utility model purpose, there is provided following technical scheme：
The utility model provides a kind of CSP light sources, and it includes luminescence chip, and fluorescent colloid is provided with the top of the luminescence chip
Layer, the surrounding of the luminescence chip, which is surrounded, the reflective glue-line with reflective function, the fluorescent colloid layer and reflective glue-line joint portion
Position is incline structure.
The position that the fluorescent adhesive layer of CSP light sources described in the utility model and reflective glue-line are combined is inclined structure, is formed
Up big and down small structure, the structure and the characteristic perfect adaptation of luminescence chip top light emitting, can gather the light that flip chip is sent
Collection avoids light and leaked out from bottom, improve the overall light extraction efficiency of light source well at the top of light source.
It is preferred that, the fluorescent colloid layer is inclined-plane with reflective glue-line binding site, and the fluorescent colloid layer is handstand prismatoid,
The fluorescent colloid layer is line in top surface intersection with reflective glue-line.
It is preferred that, the fluorescent colloid layer is inclined-plane with reflective glue-line binding site, and the fluorescent colloid layer is handstand prismatoid,
The fluorescent colloid layer is formed with plane with reflective glue-line in top surface intersection.
It is preferred that, the fluorescent colloid layer is cambered surface with reflective glue-line binding site, and the fluorescent colloid layer shape is up big and down small,
The fluorescent colloid layer is line in top surface intersection with reflective glue-line.
It is preferred that, the fluorescent colloid layer is cambered surface with reflective glue-line binding site, and the fluorescent colloid layer shape is up big and down small,
The fluorescent colloid layer is formed with plane with reflective glue-line in top surface intersection.
The utility model also provides a kind of CSP light sources manufacture mould, and boss and groove are interval with mold cavity, is used for
Manufacture CSP light sources as described above.
It is preferred that, the groove is V-groove, or handstand dovetail groove, or swallow-wing type groove, or bottom is provided with the swallow-wing type of plane
Groove.
Prior art is contrasted, the utility model has advantages below：
Due to, as reflective glue-line, foring concentration structure with the white glue with high reflectance, beneficial to optically focused, reduce light and lead to
Amount loss, improves the overall brightness of light source, and increase central light strength；
The white glue has stronger tensile break strength, and elasticity is good, surrounds after fluorescent coating and luminescence chip, makes
Cushioning effect is played during, when light source falls or collided, fluorescent coating and luminescence chip will not be damaged；
Because fluorescent adhesive layer is located at the surface of blue light emitting chip, fluorescent material can be excited fully, improve light source
Light extraction efficiency.
The position that the fluorescent adhesive layer of CSP light sources described in the utility model and reflective glue-line are combined is inclined structure, is formed
Up big and down small structure, the structure and the characteristic perfect adaptation of luminescence chip top light emitting, can gather the light that flip chip is sent
Collection avoids light and leaked out from bottom, improve the overall light extraction efficiency of light source well at the top of light source.
【Brief description of the drawings】
Fig. 1 is prior art CSP light source front views；
Fig. 2 is prior art CSP light source top views；
Fig. 3 is the front view of the utility model high light-emitting rate CSP light source embodiments one；
Fig. 4 is the top view of the utility model high light-emitting rate CSP light source embodiments one；
Fig. 5 is the utility model high light-emitting rate CSP lamp condenser schematic diagrames；
Fig. 6 is that the utility model high light-emitting rate CSP light sources manufacture the sectional view of Die Embodiment one；
Fig. 7 is that the utility model high light-emitting rate CSP light sources manufacture the top view of Die Embodiment one；
Fig. 8 is the utility model high light-emitting rate CSP light source manufacture method schematic flow sheets；
Fig. 9 is that the utility model high light-emitting rate CSP light sources manufacture the sectional view of Die Embodiment two；
Figure 10 is the front view of the utility model high light-emitting rate CSP light source embodiments two；
Figure 11 is that the utility model high light-emitting rate CSP light sources manufacture the sectional view of Die Embodiment three；
Figure 12 is the front view of the utility model high light-emitting rate CSP light source embodiments three；
Figure 13 is that the utility model high light-emitting rate CSP light sources manufacture the sectional view of Die Embodiment four；
Figure 14 is the front view of the utility model high light-emitting rate CSP light source embodiments four.
【Embodiment】
Refer to Fig. 3~5, the utility model CSP light source embodiments one, it includes luminescence chip 210, the luminescence chip
210 tops are provided with fluorescent colloid layer 220, and the surrounding of the luminescence chip 210, which is surrounded, the reflective glue-line 230 with reflective function,
The fluorescent colloid layer 220 is incline structure with the reflective binding site of glue-line 230, fluorescent colloid layer 220 is formed up big and down small
The light that flip chip is sent, can be gathered at the top of light source by structure, be revealed as shown in figure 5, avoiding light well from bottom
Go out, improve the overall light extraction efficiency of light source.
A kind of in the present embodiment, the fluorescent colloid layer 220 is inclined-plane, the fluorescent colloid with the reflective binding site of glue-line 230
Layer is handstand prismatoid, and the fluorescent colloid layer is line in top surface intersection with reflective glue-line.
Fig. 6 and Fig. 7 are referred to, the utility model CSP light sources manufacture the embodiment one of mould, between the intracavitary of mould 310
Every provided with boss 311 and groove 312, the groove 312 is V-groove, and embodiment one as described above can be produced using the mould
CSP light sources.
Referring to Fig. 8, the utility model CSP light source manufacture methods, Fig. 8, which is shown, to be implemented using CSP light sources manufacture mould
Example one manufactures CSP light sources, including step：
(S0) one layer of barrier film is laid on CSP light sources manufacture mould, the two sides of this barrier film laminating mould inner wall all has
There is adhesiveness, and viscosity reduces in a heated condition, under vacuum, barrier film can combine closely with mould inner wall, and
Prevent the generation of bubble；
(S1) luminescence chip 210 is fixed on the boss of CSP light sources manufacture mould；
(S2) white reflection glue is coated between luminescence chip and in groove, and under conditions of vacuum, heating, pressurization
Solidification, makes white reflection glue be combined closely with luminescence chip, seam crossing does not have bubble, is formed as described after the reflective adhesive curing
Reflective glue-line 230；
(S3) luminescence chip and reflective cementing zoarium are removed from the molds and be inverted；
(S4) fluorescent glue is filled up in luminescence chip and reflective cementing fit concave part, and under vacuum, heating condition
Solidification, seam crossing does not stay bubble, and the fluorescent adhesive layer 220 is formed as after the fluorescence adhesive curing；
(S5) module after solidification is cut open along the axis of adjacent luminescence chip, is divided into single arbitrary source.
CSP light sources manufacture mould can also be other structures embodiment, referring to Fig. 9, CSP light sources manufacture mould is real
Example two is applied, is interval with the intracavitary of mould 320 in boss 321 and groove 322, the present embodiment two, the groove 322 is the ladder that stands upside down
Shape groove.CSP light source embodiments two as shown in Figure 10 can be produced using the mould, it is glimmering at the top of the CSP light source luminescents chip 211
Light colloid layer 221 is inclined-plane with the reflective binding site of glue-line 231, and the fluorescent colloid layer 221 is handstand prismatoid, the fluorescent colloid
Layer 221 is formed with the plane 241 generated by reflective glue-line 231 in top surface intersection with reflective glue-line 231.
Figure 11 is referred to, CSP light sources manufacture Die Embodiment three is interval with the He of boss 331 in the intracavitary of mould 330
In groove 332, the present embodiment three, the surrounding of boss 331 is arc-shaped structure, and the groove 332 is swallow-wing type groove.Using the mould
CSP light source embodiments three as shown in figure 12 can be produced, the fluorescent colloid layer 222 at the top of the CSP light source luminescents chip 212 with it is anti-
Optical cement 232 binding site of layer are cambered surface, and the shape of fluorescent colloid layer 222 is up big and down small, the fluorescent colloid layer 222 and reflective glue-line
232 be line in top surface intersection.
Figure 13 is referred to, CSP light sources manufacture Die Embodiment four is interval with the He of boss 341 in the intracavitary of mould 340
In groove 342, the present embodiment four, the surrounding of boss 341 is arc-shaped structure, and the groove 342 is the swallow-wing that bottom is provided with plane
Type groove.CSP light source embodiments four as shown in figure 14 can be produced using the mould, it is glimmering at the top of the CSP light source luminescents chip 213
Light colloid layer 223 is cambered surface with the reflective binding site of glue-line 233, and the shape of fluorescent colloid layer 223 is up big and down small, the fluorescent colloid
Layer 223 is formed with the plane generated by reflective glue-line 233 in top surface intersection with reflective glue-line 233.
Preferred embodiment of the present utility model is the foregoing is only, protection domain of the present utility model is not limited thereto,
Any equivalent transformation based in technical solutions of the utility model is belonged within the utility model protection domain.
Claims (7)
1. a kind of CSP light sources, it includes luminescence chip, it is characterised in that fluorescent colloid layer, the hair are provided with the top of the luminescence chip
The surrounding of optical chip, which is surrounded, the reflective glue-line with reflective function, and the fluorescent colloid layer is inclination with reflective glue-line binding site
Structure.
2. CSP light sources as claimed in claim 1, it is characterised in that the fluorescent colloid layer and reflective glue-line binding site are oblique
Face, the fluorescent colloid layer is handstand prismatoid, and the fluorescent colloid layer is line in top surface intersection with reflective glue-line.
3. CSP light sources as claimed in claim 1, it is characterised in that the fluorescent colloid layer and reflective glue-line binding site are oblique
Face, the fluorescent colloid layer is handstand prismatoid, and the fluorescent colloid layer is formed with plane with reflective glue-line in top surface intersection.
4. CSP light sources as claimed in claim 1, it is characterised in that the fluorescent colloid layer is arc with reflective glue-line binding site
Face, the fluorescent colloid layer shape is up big and down small, and the fluorescent colloid layer is line in top surface intersection with reflective glue-line.
5. CSP light sources as claimed in claim 1, it is characterised in that the fluorescent colloid layer is arc with reflective glue-line binding site
Face, the fluorescent colloid layer shape is up big and down small, and the fluorescent colloid layer is formed with plane with reflective glue-line in top surface intersection.
6. a kind of CSP light sources manufacture mould, for manufacturing the CSP light sources as described in any one of Claims 1 to 5, its feature exists
In being interval with boss and groove in mold cavity.
7. CSP light sources as claimed in claim 6 manufacture mould, it is characterised in that the groove is V-groove, or handstand dovetail groove,
Or swallow-wing type groove, or swallow-wing type groove of the bottom provided with plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621069484.6U CN206584946U (en) | 2016-09-21 | 2016-09-21 | CSP light sources and its manufacture mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621069484.6U CN206584946U (en) | 2016-09-21 | 2016-09-21 | CSP light sources and its manufacture mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206584946U true CN206584946U (en) | 2017-10-24 |
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ID=60107721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621069484.6U Active CN206584946U (en) | 2016-09-21 | 2016-09-21 | CSP light sources and its manufacture mould |
Country Status (1)
| Country | Link |
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| CN (1) | CN206584946U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845717A (en) * | 2016-09-21 | 2018-03-27 | 深圳市兆驰节能照明股份有限公司 | CSP light sources and its manufacture method and manufacture mould |
| CN108550679A (en) * | 2018-04-16 | 2018-09-18 | 绍兴职业技术学院 | A kind of white-light nixie tube display device and its packaging technology |
-
2016
- 2016-09-21 CN CN201621069484.6U patent/CN206584946U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845717A (en) * | 2016-09-21 | 2018-03-27 | 深圳市兆驰节能照明股份有限公司 | CSP light sources and its manufacture method and manufacture mould |
| CN108550679A (en) * | 2018-04-16 | 2018-09-18 | 绍兴职业技术学院 | A kind of white-light nixie tube display device and its packaging technology |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" |
Address after: 330012 No.199, Hujia Road, Changdong Industrial Park, Qingshanhu District, Nanchang City, Jiangxi Province (office building) (1st-3rd floor) Patentee after: Jiangxi zhaochi Guangyuan Technology Co.,Ltd. Address before: 518000 zhaochi Innovation Industrial Park, No.1, LiLang Road, xialilang community, Nanwan street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MTC OPTRONICS Co.,Ltd. |
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| CP03 | "change of name, title or address" |