CN206040704U - Bowl - shaped structure chip scale package illuminator - Google Patents
Bowl - shaped structure chip scale package illuminator Download PDFInfo
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- CN206040704U CN206040704U CN201620715570.3U CN201620715570U CN206040704U CN 206040704 U CN206040704 U CN 206040704U CN 201620715570 U CN201620715570 U CN 201620715570U CN 206040704 U CN206040704 U CN 206040704U
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- bowl
- fluorescent coating
- luminescence chip
- colloid
- chip
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Abstract
The utility model discloses bowl - shaped structure chip scale package illuminator is equipped with the fluorescence glued membrane including sending out optical chip on this optical chip, surround the colloid of the bowl form of an optical chip and fluorescence glued membrane. The utility model discloses bowl - shaped structure chip scale package illuminator's structure is equipped with bowl form colloid and surrounds an optical chip and a fluorescence glued membrane, does benefit to spotlight, reduces the luminous flux loss, has promoted the global brightness of light source to central light intensity has been increased, this colloid has stronger tensile break strength, and elasticity is good, and the colloid plays the cushioning effect after surrounding the fluorescence glued membrane and sending out optical chip in the use, and the light source falls or the upon impact, and the fluorescence glued membrane can not damage with an optical chip.
Description
【Technical field】
This utility model is related to lighting field, more particularly, to a kind of wafer-level package light-emitting device.
【Background technology】
Existing common five face lights CSP (Chip Scale Package, wafer-level package) light-source structure institute as shown in Figure 1, Figure 2
Show, it is by the luminescence chip 110 positioned at middle part and is in outside from 120 groups of fluorescent colloid for surrounding luminescence chip above with surrounding
Into；Wherein, luminescence chip 110 is the flip-chip that electrode is located at chip bottom, can save bonding wire operation, directly lead to light source
Cross solder to be welded on substrate；Fluorescent colloid 120 is mixed by transparent silica gel, fluorescent material and auxiliary additive.It is existing common
The characteristics of luminous CSP light sources in five faces is that lighting area is very big, not only can be from surrounding and five faces are luminous above, has one
Part light is also sent from the peripheral colloid of bottom-emission chip, and due to this feature, the luminous CSP light sources in common five face are by splendid light
Uniformity；Additionally, this five face goes out the CSP light sources of light because simple structure, material composition species are few so that this light source can be saved
A large amount of materials are saved and processing procedure and technique are relatively easy.
But, the structure of the luminous CSP light sources in existing five face brings new asking while with larger rising angle, also
Topic：
(1) as five faces all light, cause light source center luminance shortage, it is impossible to applied high in center brightness demand
Field；
(2), in the fluorescent glue of luminescence chip bottom periphery, after the blue light sent by luminescence chip is excited, the light of generation can be from
Bottom sends, and this part of light would generally be decayed because repeatedly refraction, reflection etc. are rapid, causes the overall luminous flux drop of light source
Low, the utilization rate of light is not also high；
(3) as fluorescent colloid is exposed in periphery, when in colloid, phosphor concentration is too high, using the luminous CSP in five faces
During light source, easily there is colloid fragmentation, damaged situation, when this occurs, the chromaticity coordinates of CSP light sources, color
The performance parameters such as temperature will occur larger skew, and this aberrations in property of CSP light sources is flagrant, is especially carried on the back in TV
The occasion of a relatively high to the photoelectric color parameter precision of light source such as light, display screen technology；
(4) the luminous CSP light sources in common five face, it is the intrinsic bonding carried by colloid that luminescence chip is bonding with fluorescent colloid
Performance, this bonding force very little so that this CSP light sources are occurred fluorescent colloid in use, easily and departed from luminescence chip,
Cause the situation of light source fails.
Therefore it provides a kind of center brightness it is high, it is luminous it is uniform, light decay is few, colour temperature performance is good, constitutionally stable chip-scale envelope
Dress light-emitting device and its manufacture method are actually necessary.
【The content of the invention】
The purpose of this utility model is to provide a kind of brightness height, luminous uniform, constitutionally stable wafer-level package to light
Device.
For realizing this utility model purpose, there is provided technical scheme below：
This utility model provides a kind of bowl structure wafer-level package light-emitting device, and which includes luminescence chip, the luminous core
Fluorescent coating being provided with above piece, and also including surrounding the bowl-shape colloid of luminescence chip and fluorescent coating, the fluorescent coating sets
The luminescence chip upper surface is put in luminescence chip upper surface and extends, the bowl-shape colloid directly wraps up the luminescence chip four
Week, and the lower surface of parcel fluorescent coating surrounding and the part that extends out, the bowl-shape colloid and the luminescence chip and fluorescent glue
Film surrounding profile coincide.
The structure of this utility model bowl structure wafer-level package light-emitting device be provided with bowl-shape colloid surround luminescence chip and
Fluorescent coating, beneficial to optically focused, reduces luminous flux loss, improves the overall brightness of light source, and increase central light strength；Colloid
After surrounding fluorescent coating and luminescence chip, cushioning effect is played in use, when light source falls or collides, fluorescent coating
Will not damage with luminescence chip.
Preferably, bonding agent is provided between the luminescence chip and fluorescent coating, is strengthened between fluorescent coating and luminescence chip
Bonding, enhancing structure stability.Preferably, the bonding agent adopts transparent high heat conduction bonding agent, fluorescent coating and luminescence chip
Between by water white high heat conduction bonding agent connect so that the combination of fluorescent coating and luminescence chip is tight enough, is difficult to take off
Fall.
Preferably, the bowl-shape colloid is the white colloidal with high tensile and excellent reflectivity.Due to with height
The white glue of reflectance high tensile forms the structure of bowl type, more conducively optically focused, reduces luminous flux loss, improves light source
Overall brightness, increases central light strength.The white glue has stronger tensile break strength, and elasticity is good, to fluorescent coating and luminous
Chip has preferably protection and strengthens.
Preferably, the bowl-shape colloid upper end is concordant with fluorescent coating upper surface.
Preferably, there is step in the bowl-shape colloid, the step is concordant with the fluorescent coating lower surface.
The manufacture method of this utility model bowl structure wafer-level package light-emitting device comprises the steps：
(1) fluorescent coating is fixed on substrate；
(2) by the electrode of luminescence chip upward, it is luminous place face-down after press；
(3) coating colloid parcel fluorescent coating and luminescence chip, then solidify the colloid.
Preferably, also including step (10) after step (1)：Bonding agent is coated on fluorescent coating；Then will in step (2)
The electrode of luminescence chip is upward, luminous to be placed on bonding agent pressing afterwards face-down.
Wherein, unnecessary on the electrode after step (3) by luminescence chip colloid is removed, and exposes electrode, sending out molding
Electro-optical device is separated with substrate.
The manufacture method of this utility model bowl structure wafer-level package light-emitting device, can also adopt multiple light-emitting devices
Arrangement manufacture, improve production efficiency, which comprises the steps：
1) fluorescent coating is fixed on substrate；
2) bonding agent is coated on fluorescent coating；
3) by the electrode of multiple luminescence chips upward, it is luminous be placed on bonding agent face-down after pressing；
4) centre position by fluorescent coating along chip with chip cuts apart；
5) expand the spacing of chip and chip after cutting, so as to expand fluorescent coating width of slit；
6) white colloidal is coated between the joint-cutting and luminescence chip of fluorescent coating, then solidify the colloid.
7) along chip and the central authorities of chip, white colloidal is cut apart.
Preferably, unnecessary on the electrode after step (7) by luminescence chip colloid is removed, and exposes electrode, by molding
Light-emitting device is separated with substrate.It is preferred that electrode can be exposed using the white glue of mightiness belt sticky removing excess surface.
Contrast prior art, this utility model have advantages below：
The structure of this utility model bowl structure wafer-level package light-emitting device be provided with bowl-shape colloid surround luminescence chip and
Fluorescent coating, beneficial to optically focused, reduces luminous flux loss, improves the overall brightness of light source, and increase central light strength；The glue
Body has stronger tensile break strength, and elasticity is good, after colloid surrounds fluorescent coating and luminescence chip, in use
Cushioning effect is played, when light source falls or collides, fluorescent coating and luminescence chip will not be damaged.The luminescence chip and fluorescent coating
Between be provided with bonding agent, strengthen the bonding between fluorescent coating and luminescence chip, enhancing structure stability.
【Description of the drawings】
Fig. 1 is the front view of the luminous CSP light-source structures in existing common five face；
Fig. 2 is the top view of the luminous CSP light-source structures in existing common five face；
Front views of the Fig. 3 for this utility model bowl structure wafer-level package light-emitting device；
Top views of the Fig. 4 for this utility model bowl structure wafer-level package light-emitting device；
Schematic flow sheets of the Fig. 5 for this utility model bowl structure wafer-level package method for producing light-emitting device；
Fig. 6 is the cutting schematic diagram in this utility model bowl structure wafer-level package method for producing light-emitting device.
【Specific embodiment】
Refer to Fig. 3 and Fig. 4, this utility model bowl structure wafer-level package light-emitting device include luminescence chip 210, according to
The secondary bonding agent 230 being arranged on luminescence chip and fluorescent coating 240, surround the bowl-shape of luminescence chip 210 and fluorescent coating 240
Colloid 220.Specifically, the fluorescent coating 240 is arranged on 210 upper surface of luminescence chip and extends the luminescence chip upper table
The luminescence chip surrounding is directly wrapped up in face, the bowl-shape colloid 220, and is wrapped up fluorescent coating surrounding and extended out under part
Surface, the bowl-shape colloid are coincide with the luminescence chip and fluorescent coating surrounding profile.
From figure 3, it can be seen that the structure of this utility model bowl structure wafer-level package light-emitting device divides three from top to bottom
Layer：Fluorescent coating 240, bonding agent 230, luminescence chip 210.Divide two-layer from outside to inside：Bowl-shape colloid 220, and be wrapped in
The fluorescent coating 240 of bowl-shape colloid 220, bonding agent 230, luminescence chip 210.It is the luminescence chip 210 of upside-down mounting in the middle of bottom, most
Upper strata is special fluorescent coating 240, between flip-chip 210 and fluorescent coating 240, there are and plays the saturating of bonding effect
Bright high heat conduction bonding agent 230；The white colloidal 220 of internal three-decker is surrounded simultaneously, and the outermost positioned at whole light source is formed
Inner recess structure, together constitutes complete bowl shape with the chip light emitting chip 210 of upside-down mounting.
The bowl-shape colloid 220 is the white colloidal with high tensile and excellent reflectivity, and this white colloidal 220 has
There are high tensile strength and excellent reflectance, more conducively optically focused, light is reduced with losing, improve the overall brightness of light source,
Increase central light strength；Meanwhile, the white colloidal 220 have stronger tensile break strength, and elasticity it is good, to fluorescent coating and send out
Optical chip has preferably protection and strengthens, and plays cushioning effect in use, when light source falls or collide, fluorescent coating with
Luminescence chip will not be damaged.
As shown in figure 3,220 upper end of bowl-shape colloid is concordant with 240 upper surface of fluorescent coating, have in the bowl-shape colloid 220
Step, the step are concordant with 240 lower surface of the fluorescent coating.
Refer to Fig. 5 and Fig. 6, the manufacture method of this utility model bowl structure wafer-level package light-emitting device includes as follows
Step：
100) special fluorescent coating is fixed on substrate；
200) according to certain rule coating high heat conduction bonding agent on fluorescent coating；
300) by the electrode of multiple luminescence chips upward, it is luminous be placed on bonding agent face-down after pressing；
400) luminescence chip it is bonding with fluorescent coating it is firm after, the centre position by fluorescent coating along chip with chip is cut
Cut and separate, cutting herein should be cut off fluorescent coating but not switch to substrate；
500) expand the spacing of chip and chip after cutting, so as to expand fluorescent coating width of slit；
600) white colloidal is coated between the joint-cutting and luminescence chip of fluorescent coating, then solidify the colloid；With strong
On power adhesive tape sticky removing luminescence chip electrode, unnecessary colloid, exposes electrode；
700) along chip and the central authorities of chip, white colloidal is cut apart, obtains single bowl structure chip-scale envelope
Dress light-emitting device；
800) the single bowl structure wafer-level package light-emitting device of molding is separated with substrate, and is inverted.
Preferred embodiment of the present utility model is the foregoing is only, protection domain of the present utility model is not limited thereto,
Any equivalent transformation based in technical solutions of the utility model is belonged within this utility model protection domain.
Claims (6)
1. a kind of bowl structure wafer-level package light-emitting device, which includes luminescence chip, it is characterised in that above the luminescence chip
Fluorescent coating is provided with, the bowl-shape colloid for surrounding luminescence chip and fluorescent coating is also included, the fluorescent coating is arranged on luminous
Chip upper surface and extend the luminescence chip upper surface, the bowl-shape colloid directly wraps up the luminescence chip surrounding, and bag
The lower surface that fluorescent coating surrounding is wrapped up in the part that extends out, the bowl-shape colloid and the luminescence chip and fluorescent coating surrounding profile
It coincide.
2. bowl structure wafer-level package light-emitting device as claimed in claim 1, it is characterised in that the luminescence chip and fluorescence
Bonding agent is provided between glued membrane.
3. bowl structure wafer-level package light-emitting device as claimed in claim 2, it is characterised in that the bonding agent is using transparent
High heat conduction bonding agent.
4. the bowl structure wafer-level package light-emitting device as described in any one of claims 1 to 3, it is characterised in that this is bowl-shape
Colloid is the white colloidal with high tensile and excellent reflectivity.
5. bowl structure wafer-level package light-emitting device as claimed in claim 4, it is characterised in that the bowl-shape colloid upper end with
Fluorescent coating upper surface is concordant.
6. bowl structure wafer-level package light-emitting device as claimed in claim 4, it is characterised in that have platform in the bowl-shape colloid
Rank, the step are concordant with the fluorescent coating lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620715570.3U CN206040704U (en) | 2016-07-08 | 2016-07-08 | Bowl - shaped structure chip scale package illuminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620715570.3U CN206040704U (en) | 2016-07-08 | 2016-07-08 | Bowl - shaped structure chip scale package illuminator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206040704U true CN206040704U (en) | 2017-03-22 |
Family
ID=58310874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620715570.3U Active CN206040704U (en) | 2016-07-08 | 2016-07-08 | Bowl - shaped structure chip scale package illuminator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206040704U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108695424A (en) * | 2017-04-05 | 2018-10-23 | 深圳市斯迈得半导体有限公司 | One kind is added lustre to type single side light emitting-type CSPLED and its processing method |
-
2016
- 2016-07-08 CN CN201620715570.3U patent/CN206040704U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108695424A (en) * | 2017-04-05 | 2018-10-23 | 深圳市斯迈得半导体有限公司 | One kind is added lustre to type single side light emitting-type CSPLED and its processing method |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: 330012 No.199, Hujia Road, Changdong Industrial Park, Qingshanhu District, Nanchang City, Jiangxi Province (office building) (1st-3rd floor) Patentee after: Jiangxi zhaochi Guangyuan Technology Co.,Ltd. Address before: 518000 zhaochi Innovation Industrial Park, No.1, LiLang Road, xialilang community, Nanwan street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MTC OPTRONICS Co.,Ltd. |