CN111244077A - Double-color temperature COB light source and manufacturing method thereof - Google Patents
Double-color temperature COB light source and manufacturing method thereof Download PDFInfo
- Publication number
- CN111244077A CN111244077A CN201910519863.2A CN201910519863A CN111244077A CN 111244077 A CN111244077 A CN 111244077A CN 201910519863 A CN201910519863 A CN 201910519863A CN 111244077 A CN111244077 A CN 111244077A
- Authority
- CN
- China
- Prior art keywords
- color temperature
- low
- color
- temperature
- fluorescent glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000004020 luminiscence type Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 description 9
- 238000009826 distribution Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of LED, in particular to a double-color temperature COB light source and a manufacturing method thereof, which comprises a substrate, a plurality of LED chips distributed on the substrate and fluorescent glue for adjusting color, wherein the LED chips are fixed on bonding pads of the substrate, the LED chips form a plurality of corresponding high and low color temperature areas, the low color temperature areas are formed by coating the low color temperature fluorescent glue on the LED chips in a dot mode, the high color temperature areas are formed by integrally filling the high color temperature fluorescent glue in a light emitting surface to cover the LED chips, during manufacturing, an LED blue light chip is firstly fixed on the bonding pads of the substrate in an inverted mode, then the low color temperature fluorescent glue is dotted on the chips at corresponding positions, and finally a layer of fluorescent glue is integrally filled. The chip can be integrated in high density, and has low cost, good reliability and simple manufacturing process.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a two-color temperature COB light source and a manufacturing method thereof.
Background
The COB light source is a high-light-efficiency integrated surface light source which directly fixes an LED chip on a substrate, is bonded with a circuit board by a bonding lead or other modes by adopting a COB packaging technology and is covered by resin or silica gel to ensure reliability.
At present, the COB light source majority can only show a colour temperature, can't carry out the conversion of two kinds of colour temperatures in same COB the inside, can't satisfy the demand that some scenes were used, and the COB light source of single colour temperature has also brought certain limitation for the application of COB light source lamps and lanterns moreover. Some of the COB light sources with adjustable color temperature in the market mainly include fluorescent glue for controlling high and low color temperature by half-filling, ring-filling and strip-filling, and CSP with high and low color temperature or CSP with low color temperature and blue light chip arranged on a substrate, and then a layer of fluorescent glue layer is covered to achieve the purpose of changing color temperature. The first three forms have large filling area, large luminous surface, no uniform light emission and halation, the light type can be changed during adjustment, the light color quality is poor, high and low color temperature regions are separated by a dam in the interior, the process is complex, most of packaging processes are normally COBs, and the dead light rate is high. The latter two forms have larger interval between the LED chips due to too high cost and large volume of the CSP, and the COB light source cannot realize high-density integration.
Disclosure of Invention
The present invention is directed to a dual color temperature COB light source and a manufacturing method thereof, so as to solve the problems mentioned in the background art. The double-color temperature COB light source and the manufacturing method can realize the uniform cross distribution of high and low color temperatures on optical color mixing by using a flip COB packaging form, the light mixing is uniform, the light color quality is good, meanwhile, the high and low color temperatures are not required to be separated by using a dam form, the chip can be integrated in high density, the product cost is low, the reliability is good, and the manufacturing process is simple.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a double-colored temperature COB light source, includes base plate, a plurality of LED chip of distributing on the base plate and is used for the photochromic fluorescent glue, the LED chip is admittedly on the pad of base plate, the LED chip forms a plurality of high low colour temperature regions that correspond, high low colour temperature region is including high colour temperature region, low colour temperature region, and for even cross distribution, the low colour temperature region is that to scribble the low colour temperature fluorescent glue spot at the LED chip and realize, high colour temperature region is that to wholly fill the high colour temperature fluorescent glue in the luminescent surface and cover the LED chip and realize.
Further, the base plate is the flip-chip COB base plate, the LED chip is flip-chip LED blue light core.
Furthermore, the number of the LED chips in the high and low color temperature regions is one or more, and the high and low color temperature regions are not required to be separated by a box dam.
Furthermore, the low color temperature region comprises a plurality of low color temperature dispensing regions with small areas at corresponding positions, and the high color temperature region comprises a high color temperature dispensing region which is a whole except the low color temperature region.
Further, the fluorescent glue comprises high-color-temperature fluorescent glue and low-color-temperature fluorescent glue.
Furthermore, the fluorescent glue is a mixture of fluorescent powder and silica gel in different types and proportions, and the low color temperature part of the fluorescent glue has the characteristics of high viscosity and small fluidity.
The invention also provides a manufacturing method of the double-color temperature COB light source, which comprises the following steps:
step 1: firstly, fixing an LED chip on a bonding pad of a substrate;
step 2: then, the low color temperature fluorescent glue is spotted on the LED chips at the corresponding positions;
and step 3: and finally, filling a layer of high-color-temperature fluorescent glue integrally.
Further, in step 2-3: and (3) point-dispensing the low-color-temperature fluorescent glue with high viscosity and small fluidity in the low-color-temperature dispensing area to realize low-color-temperature luminescence, and then filling the high-color-temperature fluorescent glue in the high-color-temperature dispensing area.
Further, in step 2-3: and (3) realizing low color temperature luminescence by using the low color temperature fluorescent glue at the top of the die of the low color temperature glue dispensing area, and then filling the high color temperature fluorescent glue in the high color temperature glue dispensing area.
Further, in step 2-3: and spraying low-color-temperature fluorescent glue on the low-color-temperature glue dispensing area to realize low-color-temperature luminescence, and then filling the high-color-temperature fluorescent glue in the high-color-temperature glue dispensing area.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, high and low color temperature regions on the substrate do not need to be separated, and the COB light source with multiple color temperatures can be realized only by coating a layer of fluorescent glue with high viscosity and low fluidity on the LED chip on the corresponding low color temperature position and then integrally filling a layer of fluorescent glue in the filling region; during manufacturing, the flip LED blue light chip is fixed on the substrate, then the low color temperature fluorescent glue is dotted on the chip at the corresponding position, and finally a layer of fluorescent glue is filled integrally. Therefore, the uniform cross distribution of high and low color temperatures on optical color mixing can be realized, the light mixing is uniform, the light color quality is good, the high and low color temperatures are not required to be separated in a form of a dam, the chips can be integrated in high density, the product cost is low, the reliability is good, and the manufacturing process is simple.
Drawings
Fig. 1 shows a flip-chip COB substrate.
FIG. 2 is a schematic view of a point dam and a die bond on the substrate of FIG. 1.
FIG. 3 is a schematic view of dispensing fluorescent glue in a low color temperature dispensing region.
FIG. 4 is a schematic view of dispensing a fluorescent gel in a high color temperature dispensing region.
In the figure: the LED chip packaging structure comprises a substrate 1, a bonding pad 2, an LED chip 3, a dam 4, a low color temperature dispensing area 5 and a high color temperature dispensing area 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper/lower end", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed/sleeved," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides a technical solution:
a double-color COB light source comprises a substrate 1, a plurality of LED chips 3 distributed on the substrate 1 and fluorescent glue used for color mixing, wherein the substrate 1 is an inverted COB substrate, the LED chips 3 are fixedly arranged on bonding pads 2 of the substrate 1, the LED chips 3 are inverted LED blue chips, the LED chips 3 form a plurality of corresponding high and low color temperature areas, the high and low color temperature areas are uniformly distributed in an intersected manner, the quantity of the LED chips 3 on the high and low color temperature areas is one or more, the high and low color temperature areas are not required to be separated by a form of a dam 4, the low color temperature areas form a plurality of small-area low color temperature glue dispensing areas 5 and the rest areas are a whole high color temperature glue dispensing area 6, the low color temperature glue dispensing areas 5 are used for coating low color temperature fluorescent glue on the chips, the areas are small, the high color temperature glue dispensing area 6 is used for integrally filling the high color temperature fluorescent glue in a light emitting surface to cover the LED chips 3, the fluorescent glue is a mixture of fluorescent powder and silica gel in different types and proportions, and the low color temperature part of the fluorescent glue is low in viscosity and high in flowability. The fluorescent glue of this embodiment includes high colour temperature fluorescent glue and low colour temperature fluorescent glue, and the even cross-type distribution of high low colour temperature luminous region, thereby the flip-chip LED blue light chip produces the white light of different colour temperatures through arousing different fluorescent glue.
The preparation method of the COB of the invention has various methods:
1. as shown in fig. 1 and 2, after the dam 4 and the die bonding of the substrate 1 are completed, the low color temperature fluorescent glue with low viscosity and high fluidity is dispensed at 5 points in the low color temperature dispensing area as shown in fig. 3 to realize low color temperature luminescence, and then the high color temperature fluorescent glue is filled in the high color temperature dispensing area 6 as shown in fig. 4.
2. As shown in fig. 1 and 2, after the dam 4 and the die bonding of the substrate 1 are completed, the low color temperature fluorescent glue at the die top of the die is illuminated at the low color temperature dispensing area 5 as shown in fig. 3, and then the high color temperature fluorescent glue is filled in the high color temperature dispensing area 6 as shown in fig. 4.
3. As shown in fig. 1 and 2, after the dam 4 and the die bonding of the substrate 1 are completed, as shown in fig. 3, the low color temperature fluorescent glue is sprayed on the low color temperature dispensing area 5 to realize low color temperature luminescence, and as shown in fig. 4, the high color temperature dispensing area 6 is filled with the high color temperature fluorescent glue.
As an improvement, the high and low color temperature areas are realized by dispensing fluorescent glue and then filling a layer of fluorescent glue or silica gel without fluorescent powder above.
As an improvement, the high and low color temperature areas are realized by the mode of a die top, and then a layer of fluorescent glue or silica gel without fluorescent powder is filled above the die top.
As an improvement, the high and low color temperature areas are realized by powder spraying and then filling a layer of fluorescent glue or a silica gel without fluorescent powder above.
According to the invention, high and low color temperature regions on the substrate 1 do not need to be separated, only a layer of high-viscosity low-flow fluorescent glue is coated on the LED chip 3 points at the corresponding low color temperature position, and then a layer of fluorescent glue is integrally filled in the filling region, so that the multi-color temperature COB light source can be realized, and the light source has a simple structure and a simple manufacturing process; during manufacturing, the flip LED blue light chip is fixed on the bonding pad 2 of the substrate 1, then the low color temperature fluorescent glue is dotted on the chip at the corresponding position, and finally, a layer of fluorescent glue is integrally filled. Therefore, the uniform cross distribution of high and low color temperatures on optical color mixing can be realized, the light mixing is uniform, the light color quality is good, the high and low color temperatures are not required to be separated in a form of a dam, the chips can be integrated in high density, the product cost is low, the reliability is good, and the manufacturing process is simple.
According to the invention, the LED chips 3 on the substrate 1 are separated by the low-color-temperature fluorescent glue with high viscosity and low fluidity, the LED chips are dotted on the corresponding chips, and the high-color-temperature fluorescent glue is filled in the high-color-temperature glue dispensing area 6 to realize the multi-color-temperature COB light source, so that the light source has a simple structure and a simple manufacturing process; meanwhile, the uniform cross-type distribution of high and low color temperatures on optical color mixing is realized, the light mixing is uniform, and the light color quality is good; in addition, the LED chips 3 are all blue light chips, so that the cost is low, and the size is small, so that the high-density integration of the LED chips 3 can be realized; and the LED packaging process is a flip-chip process, so that the risk of lamp death of the product is low, and the reliability is good.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a two-color temperature COB light source which characterized in that: the LED fluorescent lamp comprises a substrate (1), a plurality of LED chips (3) distributed on the substrate (1) and fluorescent glue used for adjusting light color, wherein the LED chips (3) are fixedly arranged on a bonding pad (2) of the substrate (1), the LED chips (3) form a plurality of corresponding high and low color temperature regions, the high and low color temperature regions comprise high color temperature regions and low color temperature regions and are distributed in an even cross mode, the low color temperature regions are realized by point coating the low color temperature fluorescent glue on the LED chips (3), and the high color temperature regions are realized by integrally filling the high color temperature fluorescent glue in a luminous surface to cover the LED chips (3).
2. Two-color temperature COB light source according to claim 1, characterized in that: the substrate (1) is a flip chip COB substrate, and the LED chip (3) is a flip chip LED blue light chip.
3. Two-color temperature COB light source according to claim 1, characterized in that: the number of the LED chips (3) in the high and low color temperature regions is one or more, and the high and low color temperature regions are not separated by a dam (4).
4. Two-color temperature COB light source according to claim 1, characterized in that: the low color temperature region comprises a plurality of low color temperature dispensing regions (5) with small areas at corresponding positions, and the high color temperature region comprises a high color temperature dispensing region (6) which is a whole except the low color temperature region.
5. Two-color temperature COB light source according to claim 1, characterized in that: the fluorescent glue comprises high-color-temperature fluorescent glue and low-color-temperature fluorescent glue.
6. Two-color temperature COB light source according to claim 1, characterized in that: the fluorescent glue is a mixture of fluorescent powder and silica gel in different types and proportions, and the low color temperature part of the fluorescent glue is high in viscosity and small in fluidity.
7. A manufacturing method of a two-color temperature COB light source is characterized in that: the method comprises the following steps:
step 1: firstly, fixing an LED chip (3) on a bonding pad (2) of a substrate (1);
step 2: then, the low color temperature fluorescent glue is spotted on the LED chip (3) at the corresponding position;
and step 3: and finally, filling a layer of high-color-temperature fluorescent glue integrally.
8. The method for manufacturing a two-color temperature COB light source according to claim 7, wherein: in step 2-3: and (3) point-dispensing the low-color-temperature fluorescent glue with high viscosity and small fluidity in the low-color-temperature dispensing area (5) to realize low-color-temperature luminescence, and then filling the high-color-temperature fluorescent glue in the high-color-temperature dispensing area (6).
9. The method for manufacturing a two-color temperature COB light source according to claim 7, wherein: in step 2-3: and realizing low color temperature luminescence in the form of low color temperature fluorescent glue on the top of the die in the low color temperature glue dispensing area (5), and then filling the high color temperature fluorescent glue in the high color temperature glue dispensing area (6).
10. The method for manufacturing a two-color temperature COB light source according to claim 7, wherein: in step 2-3: and spraying low-color-temperature fluorescent glue on the low-color-temperature glue dispensing area (5) to realize low-color-temperature luminescence, and then filling high-color-temperature fluorescent glue in the high-color-temperature glue dispensing area (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910519863.2A CN111244077A (en) | 2019-06-17 | 2019-06-17 | Double-color temperature COB light source and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910519863.2A CN111244077A (en) | 2019-06-17 | 2019-06-17 | Double-color temperature COB light source and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111244077A true CN111244077A (en) | 2020-06-05 |
Family
ID=70876330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910519863.2A Pending CN111244077A (en) | 2019-06-17 | 2019-06-17 | Double-color temperature COB light source and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111244077A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490342A (en) * | 2020-12-08 | 2021-03-12 | 鸿利智汇集团股份有限公司 | Packaging method of two-color temperature COB |
| CN113471179A (en) * | 2021-06-11 | 2021-10-01 | 五邑大学 | Color temperature adjustable COB LED light source and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711312A (en) * | 2017-03-14 | 2017-05-24 | 宁波升谱光电股份有限公司 | Preparation method of dimming LED (light emitting diode) light source and dimming LED light source |
| CN106981482A (en) * | 2017-05-11 | 2017-07-25 | 宁波升谱光电股份有限公司 | A kind of LED dimmed light sources and preparation method thereof |
| CN108054252A (en) * | 2017-12-25 | 2018-05-18 | 鸿利智汇集团股份有限公司 | A kind of high density adjustable color COB manufacturing methods |
| CN208062091U (en) * | 2018-03-16 | 2018-11-06 | 宁波升谱光电股份有限公司 | A kind of multi color temperature COB light source |
| CN109244219A (en) * | 2018-09-14 | 2019-01-18 | 深圳市同方光电技术有限公司 | A kind of double-colored upside-down mounting COB of novel monochromatic warm upside-down mounting printing |
| CN208460762U (en) * | 2018-07-05 | 2019-02-01 | 瑞识科技（深圳）有限公司 | A kind of luminescent device and its mold |
| CN109360882A (en) * | 2018-09-14 | 2019-02-19 | 深圳市同方光电技术有限公司 | A kind of double-colored upside-down mounting COB that monochromatic front is luminous |
-
2019
- 2019-06-17 CN CN201910519863.2A patent/CN111244077A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711312A (en) * | 2017-03-14 | 2017-05-24 | 宁波升谱光电股份有限公司 | Preparation method of dimming LED (light emitting diode) light source and dimming LED light source |
| CN106981482A (en) * | 2017-05-11 | 2017-07-25 | 宁波升谱光电股份有限公司 | A kind of LED dimmed light sources and preparation method thereof |
| CN108054252A (en) * | 2017-12-25 | 2018-05-18 | 鸿利智汇集团股份有限公司 | A kind of high density adjustable color COB manufacturing methods |
| CN208062091U (en) * | 2018-03-16 | 2018-11-06 | 宁波升谱光电股份有限公司 | A kind of multi color temperature COB light source |
| CN208460762U (en) * | 2018-07-05 | 2019-02-01 | 瑞识科技（深圳）有限公司 | A kind of luminescent device and its mold |
| CN109244219A (en) * | 2018-09-14 | 2019-01-18 | 深圳市同方光电技术有限公司 | A kind of double-colored upside-down mounting COB of novel monochromatic warm upside-down mounting printing |
| CN109360882A (en) * | 2018-09-14 | 2019-02-19 | 深圳市同方光电技术有限公司 | A kind of double-colored upside-down mounting COB that monochromatic front is luminous |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490342A (en) * | 2020-12-08 | 2021-03-12 | 鸿利智汇集团股份有限公司 | Packaging method of two-color temperature COB |
| CN113471179A (en) * | 2021-06-11 | 2021-10-01 | 五邑大学 | Color temperature adjustable COB LED light source and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101761810A (en) | White light plane light source LED module and manufacturing method thereof | |
| CN208489233U (en) | LED light source component and light emitting device | |
| CN106058020A (en) | Bowl-shaped structure chip-scale package luminescence apparatus and manufacturing method thereof | |
| JP4617761B2 (en) | Method for manufacturing light emitting device | |
| CN111244077A (en) | Double-color temperature COB light source and manufacturing method thereof | |
| KR20080055549A (en) | Method for manufacturing led package | |
| CN107256921A (en) | COB LED encapsulation methods, display device and lighting device | |
| CN104851957A (en) | Light-emitting diode packaging structure | |
| EP4016649A1 (en) | Light-emitting device and manufacturing method, and display screen and lighting equipment comprising said light-emitting device | |
| CN109449145A (en) | High-reliability COB packaging structure and high-efficiency packaging method thereof | |
| CN206697479U (en) | The white light LEDs COB encapsulated using CSP chips and blue LED flip chip structure | |
| US20090108267A1 (en) | Composite light-emitting-diode packaging structure | |
| CN116314550A (en) | CSP (chip scale package) structure of forward-mounted LED (light emitting diode) chip, preparation method of CSP structure and COB (chip on board) light source | |
| CN208674166U (en) | LED component and light emitting device | |
| CN212392244U (en) | Double-color temperature COB light source | |
| CN209691752U (en) | A kind of double-colored temperature COB light source | |
| CN115472600A (en) | High-contrast LED device and manufacturing method thereof | |
| CN208889700U (en) | LED component and light emitting device | |
| CN208889652U (en) | Luminescent device and light emitting device | |
| KR20120018605A (en) | Led package and method for manufacturing the same | |
| CN207966975U (en) | A kind of novel white-light light emitting diode | |
| CN102610600B (en) | High-power white light emitting diode (LED) module encapsulated by nano silver solder paste and encapsulation method of high-power white light emitting diode module | |
| CN206992109U (en) | A kind of outdoor big spacing LED component and LED display | |
| CN211150557U (en) | Double-color temperature COB light source | |
| CN103022327A (en) | LED packaging structure and method for manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220505 Address after: 523000 Room 301, No. 16, West Sixth lane, Shanmei Xinzhuang, Houjie Town, Dongguan City, Guangdong Province Applicant after: Huachen Intelligent Technology (Dongguan) Co.,Ltd. Address before: 516000 3rd floor, No.5 factory building, Daxin group, Shuguang Avenue, Chenjiang sub district office, Zhongkai high tech Zone, Huizhou City, Guangdong Province Applicant before: Zhongkai photoelectric technology (Huizhou) Co.,Ltd. |