CN104022213A - Remote phosphor COB integrated light source and preparation method thereof - Google Patents

Remote phosphor COB integrated light source and preparation method thereof Download PDF

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Publication number
CN104022213A
CN104022213A CN201410143940.6A CN201410143940A CN104022213A CN 104022213 A CN104022213 A CN 104022213A CN 201410143940 A CN201410143940 A CN 201410143940A CN 104022213 A CN104022213 A CN 104022213A
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CN
China
Prior art keywords
glue
substrate
bare chip
die bond
baking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410143940.6A
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Chinese (zh)
Inventor
陈苏南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Mai Ke Photoelectron Science And Technology Ltd
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Shenzhen Mai Ke Photoelectron Science And Technology Ltd
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Application filed by Shenzhen Mai Ke Photoelectron Science And Technology Ltd filed Critical Shenzhen Mai Ke Photoelectron Science And Technology Ltd
Priority to CN201410143940.6A priority Critical patent/CN104022213A/en
Publication of CN104022213A publication Critical patent/CN104022213A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements

Abstract

The invention discloses a remote phosphor COB integrated light source and a preparation method thereof. The light source comprises a radiating substrate, a dam glue body, a bare chip array, an anode lead, a cathode lead, a short-range packaging glue layer and a remote fluorescent glue layer, wherein anode and cathode conductors are formed on the radiating substrate, the dam glue body is fixed in the middle of the radiating substrate, the bare chip array is accommodated in the dam glue body, and electrically connected with the anode and cathode conductors of the radiating substrate, a first solid crystallization space is enclosed by the short-range packaging glue layer and the dam glue layer, the bare chip array is packaged in the first solid crystallization space, the remote fluorescent glue layer forms a lens shape, a second solid crystallization space is enclosed by the remote fluorescent glue layer and the radiating substrate, and the first solid crystallization space, the anode lead, the cathode lead and part of the cathode and anode conductors are packaged in the second solid crystallization space. The short-range packaging glue layer is separate from the remote fluorescent glue layer, thereby avoiding phosphor from making direct contact with bare chips, improving the reliability and avoiding the phosphor from attenuation.

Description

Remote fluorescence powder COB integrated optical source and preparation method thereof
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Technical field
The present invention relates to lighting technical field field, relate in particular to a kind of remote fluorescence powder COB integrated optical source and preparation method thereof.
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Background technology
COB integrated optical source is chip On board, exactly bare chip is sticked on interconnect substrates by conduction or non-conductive adhesive, then carries out the light source implementation that Bonding is realized its electrical connection, and COB integrated optical source is again COB area source.COB integrated optical source is widely used in the products such as LED ball bubble, LED Lamp cup, LED shot-light, LED Down lamp, LED Ceiling light, LED bean container lamp, is one of main flow trend of current LED lighting source.The fluorescent material of existing COB integrated optical source and bare chip distance is too near, long-time time after, due to the high thermal effect of bare chip, cause fluorescent material to produce decay, thereby the luminous efficiency that causes light source reduces.
 
Summary of the invention
For the weak point existing in above-mentioned technology, the invention provides a kind of remote fluorescence powder COB integrated optical source and preparation method thereof.
For achieving the above object, the invention provides a kind of remote fluorescence powder COB integrated optical source, comprise the heat-radiating substrate, box dam colloid, bare chip array, positive wire, negative wire, short range encapsulation glue-line and the remote fluorescence glue-line that are formed with both positive and negative polarity conductor; Described box dam colloid is fixed on the middle part of heat-radiating substrate, described bare chip array is contained in box dam colloid, and the positive pole of these bare chip arrays is electrically connected to the anodal conductor of heat-radiating substrate by positive wire, and the negative pole of these bare chip arrays is electrically connected to the cathode conductor of heat-radiating substrate by negative wire; Described short range encapsulation glue-line and box dam colloid enclose the first die bond space, described bare chip array package is in the first die bond space, described remote fluorescence glue-line forms lenticular and encloses the second die bond space with heat-radiating substrate, and described the first die bond space, positive wire, negative wire and part both positive and negative polarity conductor are all encapsulated in the second die bond space.
Wherein, described heat-radiating substrate is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
Wherein, described box dam colloid is cubic trellis, and in grid, is provided with bare chip Marking the cell, and each sign lattice is used for fixing a bare chip, and bare chip is fixed by crystal-bonding adhesive and the heat-radiating substrate of bottom.
For achieving the above object, the invention provides a kind of remote fluorescence powder COB integrated optical source manufacture method, comprise the following steps:
Step 1, puts into spot gluing equipment fixture by substrate, and transparent box dam mucilage binding is entered to needle tubing, carries out luminous zone box dam operation;
Step 2, after box dam completes, enters baking box baking; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 3, thaws die bond silica gel after 1 hour, adds die bond machine lacquer disk(-sc), and substrate is put into die bond fixture, carries out die bond operation, after die bond completes, substrate taking-up is put into baking box and again toasts; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 4, turns finished product after baking to expect bonding wire station, with BSOB gold thread welding manner, carries out operation;
Step 5, the carrier that bonding wire is good proceeds to a glue station, carries out a glue operation, first prepares transparent adhesive tape, and point, to luminous zone, forms an interlayer, avoids chip to contact with phosphor powder;
Step 6, the substrate of some glue good glue is put into 100 ℃ of baking boxs 1.5 hours;
Step 7, carries out gluing process for the second time, and phosphor powder lens glue is stirred, and point, to luminous zone upper limb, forms lens;
Step 8, the substrate of some glue good glue is put into baking box baking, wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 3 hours;
Step 9, luminous flux, colour temperature, the color rendering index of the two or more color temperature light sources of test after going out to bake.
Wherein, the substrate using in step 1 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
Wherein, in the step of carrying out box dam operation of step 1, also comprise the setting of box dam colloid is to cubic trellis, and in grid, be provided for the corresponding fixedly Marking the cell of bare chip one by one.
The invention has the beneficial effects as follows: compared with prior art, remote fluorescence powder COB integrated optical source provided by the invention and preparation method thereof, has the following advantages:
1, use and transparently carry out enclosure wall glue, then on the carriers such as metal substrate or ceramic substrate, carry out the operation of square grids box dam, can, by bare chip array package in the first die bond space, improve the luminous efficiency of bare chip array.
2, add optical lens No. 2 times, increase lighting angle, save finished product light fixture secondary lens cost.
3, because chip caloric value is large, utilize separating of short range encapsulation glue-line and remote fluorescence glue-line, thereby avoid phosphor powder directly to contact with bare chip, can promote reliability, avoid fluorescent material to produce decay.
4, with the integrated bare chip array light-emitting of COB mode, can cover large scope with less lamp pearl, and then save lamp pearl and use a number.
5, for LED finished product light fixtures such as bulb lamp, street lamp, street lamp, shot-light, ceiling lights.
 
Accompanying drawing explanation
Fig. 1 is the flow chart of remote fluorescence powder COB integrated optical source manufacture method of the present invention;
Fig. 2 is the structure of heat dissipation substrate figure of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 3 is the box dam structure chart of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 4 is the die bond structure chart of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 5 is the bonding wire structure figure of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 6 is the vertical view of the short range encapsulation glue-line of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 7 is the front view of the short range encapsulation glue-line of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 8 is the vertical view of the remote fluorescence glue-line of remote fluorescence powder COB integrated optical source of the present invention;
Fig. 9 is the front view of the remote fluorescence glue-line of remote fluorescence powder COB integrated optical source of the present invention.
Main element symbol description is as follows:
10, heat-radiating substrate 11, box dam colloid
12, bare chip array 13, positive wire
14, negative wire 15, short range encapsulation glue-line
16, remote fluorescence glue-line
Embodiment
In order more clearly to explain the present invention, below in conjunction with accompanying drawing, the present invention is further described.
Refer to Fig. 1, the invention provides a kind of remote fluorescence powder COB integrated optical source manufacture method, comprise the following steps:
Step 1, puts into spot gluing equipment fixture by substrate, and transparent box dam mucilage binding is entered to needle tubing, carries out luminous zone box dam operation;
Step 2, after box dam completes, enters baking box baking; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 3, thaws die bond silica gel after 1 hour, adds die bond machine lacquer disk(-sc), and substrate is put into die bond fixture, carries out die bond operation, after die bond completes, substrate taking-up is put into baking box and again toasts; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 4, turns finished product after baking to expect bonding wire station, with BSOB gold thread welding manner, carries out operation;
Step 5, the carrier that bonding wire is good proceeds to a glue station, carries out a glue operation, first prepares transparent adhesive tape, and point, to luminous zone, forms an interlayer, avoids chip to contact with phosphor powder;
Step 6, the substrate of some glue good glue is put into 100 ℃ of baking boxs 1.5 hours;
Step 7, carries out gluing process for the second time, and phosphor powder lens glue is stirred, and point, to luminous zone upper limb, forms lens;
Step 8, the substrate of some glue good glue is put into baking box baking, wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 3 hours;
Step 9, luminous flux, colour temperature, the color rendering index of the two or more color temperature light sources of test after going out to bake.
In the present embodiment, the above-mentioned substrate using in step 1 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.Certainly; this case is not limited to the material of heat-radiating substrate 10; can also be other commercially available main flow baseplate materials; as long as for realizing and dispelling the heat in fixing bare chip; and the mode that adopts short range encapsulation glue-line 15 and remote fluorescence glue-line 16 to separate; avoid the embodiment of fluorescent material decay, all drop into the protection range of this case.
In the present embodiment, above-mentioned in the step of carrying out box dam operation of step 1, also comprise the setting of box dam colloid is to cubic trellis, and in grid, be provided for the corresponding fixedly Marking the cell of bare chip one by one.Certainly; this case is not limited to the shape that adopts cubic trellis; can also be other shapes; as long as for the fixing box dam colloid 11 of bare chip; and the mode that adopts short range encapsulation glue-line 15 and remote fluorescence glue-line 16 to separate; avoid the embodiment of fluorescent material decay, all drop into the protection range of this case.
Refer to Fig. 2-9, remote fluorescence powder COB integrated optical source provided by the invention, comprises the heat-radiating substrate 10, box dam colloid 11, bare chip array 12, positive wire 13, negative wire 14, short range encapsulation glue-line 15 and the remote fluorescence glue-line 16 that are formed with both positive and negative polarity conductor; Box dam colloid 11 is fixed on the middle part of heat-radiating substrate 10, bare chip array 12 is contained in box dam colloid 11, and the positive pole of these bare chip arrays 12 is electrically connected to the anodal conductor of heat-radiating substrate 10 by positive wire 13, and the negative pole of these bare chip arrays 12 is electrically connected to the cathode conductor of heat-radiating substrate 10 by negative wire 14; Short range encapsulation glue-line 15 encloses the first die bond space with box dam colloid 11, bare chip array 12 is encapsulated in the first die bond space, remote fluorescence glue-line 16 forms lenticular and encloses the second die bond space with heat-radiating substrate 10, and the part both positive and negative polarity conductor of the first die bond space, positive wire 13, negative wire 14 and heat-radiating substrate 10 is all encapsulated in the second die bond space.
In the present embodiment, above-mentioned heat-radiating substrate 10 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.Certainly; this case is not limited to the material of heat-radiating substrate 10; can also be other commercially available main flow baseplate materials; as long as for realizing and dispelling the heat in fixing bare chip; and the mode that adopts short range encapsulation glue-line 15 and remote fluorescence glue-line 16 to separate; avoid the embodiment of fluorescent material decay, all drop into the protection range of this case.
In the present embodiment, above-mentioned box dam colloid 11 is cubic trellis, and in grid, is provided with bare chip Marking the cell, and each sign lattice is used for fixing a bare chip, and bare chip is fixing by crystal-bonding adhesive and the heat-radiating substrate 10 of bottom.Certainly; this case is not limited to the shape that adopts cubic trellis; can also be other shapes; as long as for the fixing box dam colloid 11 of bare chip; and the mode that adopts short range encapsulation glue-line 15 and remote fluorescence glue-line 16 to separate; avoid the embodiment of fluorescent material decay, all drop into the protection range of this case.
Advantage of the present invention is:
1, use and transparently carry out enclosure wall glue, then on the carriers such as metal substrate or ceramic substrate, carry out the operation of square grids box dam, can, by bare chip array package in the first die bond space, improve the luminous efficiency of bare chip array.
2, add optical lens No. 2 times, increase lighting angle, save finished product light fixture secondary lens cost.
3, because chip caloric value is large, utilize separating of short range encapsulation glue-line and remote fluorescence glue-line, thereby avoid phosphor powder directly to contact with bare chip, can promote reliability, avoid fluorescent material to produce decay.
4, with the integrated bare chip array light-emitting of COB mode, can cover large scope with less lamp pearl, and then save lamp pearl and use a number.
5, for LED finished product light fixtures such as bulb lamp, street lamp, street lamp, shot-light, ceiling lights.
Disclosed is above only several specific embodiment of the present invention, but the present invention is not limited thereto, and the changes that any person skilled in the art can think of all should fall into protection scope of the present invention.

Claims (6)

1. a remote fluorescence powder COB integrated optical source, is characterized in that, comprises the heat-radiating substrate, box dam colloid, bare chip array, positive wire, negative wire, short range encapsulation glue-line and the remote fluorescence glue-line that are formed with both positive and negative polarity conductor; Described box dam colloid is fixed on the middle part of heat-radiating substrate, described bare chip array is contained in box dam colloid, and the positive pole of these bare chip arrays is electrically connected to the anodal conductor of heat-radiating substrate by positive wire, and the negative pole of these bare chip arrays is electrically connected to the cathode conductor of heat-radiating substrate by negative wire; Described short range encapsulation glue-line and box dam colloid enclose the first die bond space, described bare chip array package is in the first die bond space, described remote fluorescence glue-line forms lenticular and encloses the second die bond space with heat-radiating substrate, and described the first die bond space, positive wire, negative wire and part both positive and negative polarity conductor are all encapsulated in the second die bond space.
2. remote fluorescence powder COB integrated optical source according to claim 1, is characterized in that, described heat-radiating substrate is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
3. remote fluorescence powder COB integrated optical source according to claim 1, it is characterized in that, described box dam colloid is cubic trellis, and in grid, is provided with bare chip Marking the cell, each sign lattice is used for fixing a bare chip, and bare chip is fixed by crystal-bonding adhesive and the heat-radiating substrate of bottom.
4. a remote fluorescence powder COB integrated optical source manufacture method, is characterized in that, comprises the following steps:
Step 1, puts into spot gluing equipment fixture by substrate, and transparent box dam mucilage binding is entered to needle tubing, carries out luminous zone box dam operation;
Step 2, after box dam completes, enters baking box baking; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 3, thaws die bond silica gel after 1 hour, adds die bond machine lacquer disk(-sc), and substrate is put into die bond fixture, carries out die bond operation, after die bond completes, substrate taking-up is put into baking box and again toasts; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 4, turns finished product after baking to expect bonding wire station, with BSOB gold thread welding manner, carries out operation;
Step 5, the carrier that bonding wire is good proceeds to a glue station, carries out a glue operation, first prepares transparent adhesive tape, and point, to luminous zone, forms an interlayer, avoids chip to contact with phosphor powder;
Step 6, the substrate of some glue good glue is put into 100 ℃ of baking boxs 1.5 hours;
Step 7, carries out gluing process for the second time, and phosphor powder lens glue is stirred, and point, to luminous zone upper limb, forms lens;
Step 8, the substrate of some glue good glue is put into baking box baking, wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 3 hours;
Step 9, luminous flux, colour temperature, the color rendering index of the two or more color temperature light sources of test after going out to bake.
5. remote fluorescence powder COB integrated optical source manufacture method according to claim 4, is characterized in that, the substrate using in step 1 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
6. remote fluorescence powder COB integrated optical source manufacture method according to claim 4, it is characterized in that, in the step of carrying out box dam operation of step 1, also comprise the setting of box dam colloid is to cubic trellis, and in grid, be provided for the corresponding fixedly Marking the cell of bare chip one by one.
CN201410143940.6A 2014-04-11 2014-04-11 Remote phosphor COB integrated light source and preparation method thereof Pending CN104022213A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106229391A (en) * 2016-08-22 2016-12-14 安徽天众电子科技有限公司 A kind of processing technology of New LED wick
CN106449950A (en) * 2016-08-25 2017-02-22 深圳市晶台股份有限公司 Manufacturing method of MLCOB light source

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Publication number Priority date Publication date Assignee Title
CN106229391A (en) * 2016-08-22 2016-12-14 安徽天众电子科技有限公司 A kind of processing technology of New LED wick
CN106449950A (en) * 2016-08-25 2017-02-22 深圳市晶台股份有限公司 Manufacturing method of MLCOB light source

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Application publication date: 20140903