CN104022109A - Spot-free COB integrated light source with lens and preparation method thereof - Google Patents
Spot-free COB integrated light source with lens and preparation method thereof Download PDFInfo
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- CN104022109A CN104022109A CN201410143602.2A CN201410143602A CN104022109A CN 104022109 A CN104022109 A CN 104022109A CN 201410143602 A CN201410143602 A CN 201410143602A CN 104022109 A CN104022109 A CN 104022109A
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- lens
- bare chip
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- die bond
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Abstract
The invention discloses a spot-free COB integrated light source with a lens and a preparation method thereof. The light source comprises a radiating substrate, a dam glue body, a bare chip array, an anode lead, a cathode lead, a first fluorescent glue layer and a second lens glue layer, wherein anode and cathode conductors are formed on the radiating substrate, the dam glue body is fixed in the middle of the radiating substrate, the bare chip array is accommodated in the dam glue body, and electrically connected with the anode and cathode conductors of the radiating substrate, a first solid crystallization space is enclosed by the first fluorescent glue layer and the dam glue body, the bare chip array is packaged in the first solid crystallization space, a second solid crystallization space is enclosed by the second lens glue layer and the radiating substrate, and the first solid crystallization space, the anode lead, the cathode lead and part of the cathode and anode conductors are packaged in the second solid crystallization space. The first fluorescent glue layer is separate from the second lens glue layer, thereby avoiding generation of spots, and improving the reliability.
Description
Technical field
The present invention relates to lighting technical field, relate in particular to a kind of unglazed articulate fascia lens COB integrated optical source and preparation method thereof.
Background technology
COB integrated optical source is chip On board, exactly bare chip is sticked on interconnect substrates by conduction or non-conductive adhesive, then carries out the light source implementation that Bonding is realized its electrical connection, and COB integrated optical source is again COB area source.COB integrated optical source is widely used in the products such as LED ball bubble, LED Lamp cup, LED shot-light, LED Down lamp, LED Ceiling light, LED bean container lamp, is one of main flow trend of current LED lighting source.But the phosphor powder layer skewness of existing COB integrated optical source, easily produces hot spot effect, and lighting angle is all in 120 about degree, and lighting angle is too little.
Summary of the invention
For the weak point existing in above-mentioned technology, the invention provides a kind of unglazed articulate fascia lens COB integrated optical source and preparation method thereof.
For achieving the above object, the invention provides a kind of unglazed articulate fascia lens COB integrated optical source, comprise the heat-radiating substrate, box dam colloid, bare chip array, positive wire, negative wire, the first fluorescent adhesive layer and the second lens glue-line that are formed with both positive and negative polarity conductor; Described box dam colloid is fixed on the middle part of heat-radiating substrate, described bare chip array is contained in box dam colloid, and the positive pole of these bare chip arrays is electrically connected to the anodal conductor of heat-radiating substrate by positive wire, and the negative pole of these bare chip arrays is electrically connected to the cathode conductor of heat-radiating substrate by negative wire; Described the first fluorescent adhesive layer and box dam colloid enclose the first die bond space, described bare chip array package is in the first die bond space, described the second lens glue-line and heat-radiating substrate enclose the second die bond space, and described the first die bond space, positive wire, negative wire and part both positive and negative polarity conductor are all encapsulated in the second die bond space.
Wherein, described heat-radiating substrate is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
Wherein, described box dam colloid is cubic trellis, and in grid, is provided with bare chip Marking the cell, and each sign lattice is used for fixing a bare chip, and bare chip is fixed by crystal-bonding adhesive and the heat-radiating substrate of bottom.
For achieving the above object, the invention provides a kind of unglazed articulate fascia lens COB integrated optical source manufacture method, comprise the following steps:
Step 1, puts into spot gluing equipment fixture by substrate, and transparent box dam mucilage binding is entered to needle tubing, carries out luminous zone box dam operation;
Step 2, after box dam completes, enters baking box baking; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 3, thaws die bond silica gel after 1 hour, adds die bond machine lacquer disk(-sc), and substrate is put into die bond fixture, carries out die bond operation, after die bond completes, substrate taking-up is put into baking box and again toasts; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 4, turns finished product after baking to expect bonding wire station, with BSOB gold thread welding manner, carries out operation;
Step 5, the carrier that bonding wire is good proceeds to a glue station, carries out a glue operation, first prepares fluorescent glue, and point is to luminous zone;
Step 6, the substrate of some glue good glue is put into 100 ℃ of baking boxs 1.5 hours;
Step 7, carries out gluing process for the second time, and transparent lens glue is put to luminous zone upper limb, forms lens;
Step 8, puts into baking box baking by the lens of having put, and wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 3 hours;
Step 9, luminous flux, colour temperature, the color rendering index of the two or more color temperature light sources of test after going out to bake.
Wherein, the substrate using in step 1 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
Wherein, in the step of carrying out box dam operation of step 1, also comprise the setting of box dam colloid is to cubic trellis, and in grid, be provided for the corresponding fixedly Marking the cell of bare chip one by one.
The invention has the beneficial effects as follows: compared with prior art, unglazed articulate fascia lens COB integrated optical source provided by the invention and preparation method thereof,, have the following advantages:
1, phosphor powder is directly in chip light emitting effective coverage, and then reaches without hot spot effect;
2, add optical lens No. 2 times. increase lighting angle, save finished product light fixture secondary lens cost;
3, can be with less lamp pearl. cover large scope, and then save lamp pearl and use a number;
4, for LED finished product light fixtures such as bulb lamp, street lamp, street lamp, shot-light, ceiling lights.
Accompanying drawing explanation
Fig. 1 is the flow chart of unglazed articulate fascia lens COB integrated optical source manufacture method of the present invention;
Fig. 2 is the structure of heat dissipation substrate figure of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 3 is the box dam structure chart of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 4 is the die bond structure chart of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 5 is the bonding wire structure figure of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 6 is the vertical view of the first fluorescent adhesive layer of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 7 is the front view of the first fluorescent adhesive layer of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 8 is the vertical view of the second lens glue-line of unglazed articulate fascia lens COB integrated optical source of the present invention;
Fig. 9 is the front view of the second lens glue-line of unglazed articulate fascia lens COB integrated optical source of the present invention.
Main element symbol description is as follows:
10, heat-radiating substrate 11, box dam colloid
12, bare chip array 13, positive wire
14, negative wire 15, the first fluorescent adhesive layer
16, the second lens glue-line
Embodiment
In order more clearly to explain the present invention, below in conjunction with accompanying drawing, the present invention is further described.
Refer to Fig. 1, the invention provides a kind of unglazed articulate fascia lens COB integrated optical source manufacture method, comprise the following steps:
Step 1, puts into spot gluing equipment fixture by substrate, and transparent box dam mucilage binding is entered to needle tubing, carries out luminous zone box dam operation;
Step 2, after box dam completes, enters baking box baking; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 3, thaws die bond silica gel after 1 hour, adds die bond machine lacquer disk(-sc), and substrate is put into die bond fixture, carries out die bond operation, after die bond completes, substrate taking-up is put into baking box and again toasts; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 4, turns finished product after baking to expect bonding wire station, with BSOB gold thread welding manner, carries out operation;
Step 5, the carrier that bonding wire is good proceeds to a glue station, carries out a glue operation, first prepares fluorescent glue, and point is to luminous zone;
Step 6, the substrate of some glue good glue is put into 100 ℃ of baking boxs 1.5 hours;
Step 7, carries out gluing process for the second time, and transparent lens glue is put to luminous zone upper limb, forms lens;
Step 8, puts into baking box baking by the lens of having put, and wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 3 hours;
Step 9, luminous flux, colour temperature, the color rendering index of the two or more color temperature light sources of test after going out to bake.
In the present embodiment, the substrate using in step 1 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.Certainly; this case is not limited to the material of heat-radiating substrate 10; can also be other commercially available main flow baseplate materials; as long as for realizing and dispelling the heat in fixing bare chip; and the mode that adopts the first fluorescent adhesive layer 15 and the second lens glue-line 16 to separate; avoid producing the embodiment of hot spot, all drop into the protection range of this case.
In the present embodiment, in the step of carrying out box dam operation of step 1, also comprise the setting of box dam colloid is to cubic trellis, and in grid, be provided for the corresponding fixedly Marking the cell of bare chip one by one.Certainly; this case is not limited to the shape that adopts cubic trellis; can also be other shapes; as long as for the fixing box dam colloid 11 of bare chip; and the mode that adopts the first fluorescent adhesive layer 15 and the second lens glue-line 16 to separate; avoid producing the embodiment of hot spot, all drop into the protection range of this case.
Refer to Fig. 2-Fig. 9, unglazed articulate fascia lens COB integrated optical source of the present invention, comprise the heat-radiating substrate 10 that is formed with both positive and negative polarity conductor, box dam colloid 11, bare chip array 12, positive wire 13, negative wire 14, the first fluorescent adhesive layer 15 and the second lens glue-line 16, box dam colloid 11 is fixed on the middle part of heat-radiating substrate 10, bare chip array 12 is contained in box dam colloid 11, and the positive pole of these bare chip arrays 12 is electrically connected to the anodal conductor of heat-radiating substrate 10 by positive wire 13, the negative pole of these bare chip arrays 12 is electrically connected to the cathode conductor of heat-radiating substrate 10 by negative wire 14, the first fluorescent adhesive layer 15 encloses the first die bond space with box dam colloid 11, bare chip array 12 is encapsulated in the first die bond space, the second lens glue-line 16 encloses the second die bond space with heat-radiating substrate 10, and the part both positive and negative polarity conductor of the first die bond space, positive wire 13, negative wire 14 and heat-radiating substrate 10 is all encapsulated in the second die bond space.
In the present embodiment, above-mentioned heat-radiating substrate 10 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.Certainly; this case is not limited to the material of heat-radiating substrate 10; can also be other commercially available main flow baseplate materials; as long as for realizing and dispelling the heat in fixing bare chip; and the mode that adopts the first fluorescent adhesive layer 15 and the second lens glue-line 16 to separate; avoid producing the embodiment of hot spot, all drop into the protection range of this case.
In the present embodiment, above-mentioned box dam colloid 11 is cubic trellis, and in grid, is provided with bare chip Marking the cell, and each sign lattice is used for fixing a bare chip, and bare chip is fixed by crystal-bonding adhesive and the heat-radiating substrate of bottom.Certainly; this case is not limited to the shape that adopts cubic trellis; can also be other shapes; as long as for the fixing box dam colloid 11 of bare chip; and the mode that adopts the first fluorescent adhesive layer 15 and the second lens glue-line 16 to separate; avoid producing the embodiment of hot spot, all drop into the protection range of this case.
Advantage of the present invention is: unglazed articulate fascia lens COB integrated optical source provided by the invention and preparation method thereof, has the following advantages:
1, phosphor powder is directly in chip light emitting effective coverage, and then reaches without hot spot effect;
2, add optical lens No. 2 times. increase lighting angle, save finished product light fixture secondary lens cost;
3, can be with less lamp pearl. cover large scope, and then save lamp pearl and use a number;
4, for LED finished product light fixtures such as bulb lamp, street lamp, street lamp, shot-light, ceiling lights.
Disclosed is above only several specific embodiment of the present invention, but the present invention is not limited thereto, and the changes that any person skilled in the art can think of all should fall into protection scope of the present invention.
Claims (6)
1. a unglazed articulate fascia lens COB integrated optical source, is characterized in that, comprises the heat-radiating substrate, box dam colloid, bare chip array, positive wire, negative wire, the first fluorescent adhesive layer and the second lens glue-line that are formed with both positive and negative polarity conductor; Described box dam colloid is fixed on the middle part of heat-radiating substrate, described bare chip array is contained in box dam colloid, and the positive pole of these bare chip arrays is electrically connected to the anodal conductor of heat-radiating substrate by positive wire, and the negative pole of these bare chip arrays is electrically connected to the cathode conductor of heat-radiating substrate by negative wire; Described the first fluorescent adhesive layer and box dam colloid enclose the first die bond space, described bare chip array package is in the first die bond space, described the second lens glue-line and heat-radiating substrate enclose the second die bond space, and described the first die bond space, positive wire, negative wire and part both positive and negative polarity conductor are all encapsulated in the second die bond space.
2. unglazed articulate fascia lens COB integrated optical source according to claim 1, is characterized in that, described heat-radiating substrate is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
3. unglazed articulate fascia lens COB integrated optical source according to claim 1, it is characterized in that, described box dam colloid is cubic trellis, and in grid, is provided with bare chip Marking the cell, each sign lattice is used for fixing a bare chip, and bare chip is fixed by crystal-bonding adhesive and the heat-radiating substrate of bottom.
4. a unglazed articulate fascia lens COB integrated optical source manufacture method, is characterized in that, comprises the following steps:
Step 1, puts into spot gluing equipment fixture by substrate, and transparent box dam mucilage binding is entered to needle tubing, carries out luminous zone box dam operation;
Step 2, after box dam completes, enters baking box baking; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 3, thaws die bond silica gel after 1 hour, adds die bond machine lacquer disk(-sc), and substrate is put into die bond fixture, carries out die bond operation, after die bond completes, substrate taking-up is put into baking box and again toasts; Wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 2 hours;
Step 4, turns finished product after baking to expect bonding wire station, with BSOB gold thread welding manner, carries out operation;
Step 5, the carrier that bonding wire is good proceeds to a glue station, carries out a glue operation, first prepares fluorescent glue, and point is to luminous zone;
Step 6, the substrate of some glue good glue is put into 100 ℃ of baking boxs 1.5 hours;
Step 7, carries out gluing process for the second time, and transparent lens glue is put to luminous zone upper limb, forms lens;
Step 8, puts into baking box baking by the lens of having put, and wherein, baking condition is: first toast 100 ℃ 1 hour, then toast 150 ℃ 3 hours;
Step 9, luminous flux, colour temperature, the color rendering index of the two or more color temperature light sources of test after going out to bake.
5. unglazed articulate fascia lens COB integrated optical source manufacture method according to claim 4, is characterized in that, the substrate using in step 1 is aluminium base, aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
6. unglazed articulate fascia lens COB integrated optical source manufacture method according to claim 4, it is characterized in that, in the step of carrying out box dam operation of step 1, also comprise the setting of box dam colloid is to cubic trellis, and in grid, be provided for the corresponding fixedly Marking the cell of bare chip one by one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410143602.2A CN104022109A (en) | 2014-04-11 | 2014-04-11 | Spot-free COB integrated light source with lens and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410143602.2A CN104022109A (en) | 2014-04-11 | 2014-04-11 | Spot-free COB integrated light source with lens and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN104022109A true CN104022109A (en) | 2014-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410143602.2A Pending CN104022109A (en) | 2014-04-11 | 2014-04-11 | Spot-free COB integrated light source with lens and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017096640A1 (en) * | 2015-12-09 | 2017-06-15 | 华南师范大学 | Wire-bonding system and method for cob die-bonding |
| CN111208669A (en) * | 2018-11-21 | 2020-05-29 | 深圳市百柔新材料技术有限公司 | Light-emitting diode backlight plate and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386312A (en) * | 2011-12-06 | 2012-03-21 | 常熟琦光光电科技有限公司 | LED packaging process |
| CN202930379U (en) * | 2012-10-17 | 2013-05-08 | 广州市鸿利光电股份有限公司 | Light source module group for increasing light extraction efficiency |
| CN103413885A (en) * | 2013-07-31 | 2013-11-27 | 广州硅能照明有限公司 | Manufacturing method of isolation type COB light source module |
| CN203322806U (en) * | 2013-06-14 | 2013-12-04 | 杭州杭科光电股份有限公司 | LED (light-emitting diode) light source module capable of linear light emitting |
-
2014
- 2014-04-11 CN CN201410143602.2A patent/CN104022109A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386312A (en) * | 2011-12-06 | 2012-03-21 | 常熟琦光光电科技有限公司 | LED packaging process |
| CN202930379U (en) * | 2012-10-17 | 2013-05-08 | 广州市鸿利光电股份有限公司 | Light source module group for increasing light extraction efficiency |
| CN203322806U (en) * | 2013-06-14 | 2013-12-04 | 杭州杭科光电股份有限公司 | LED (light-emitting diode) light source module capable of linear light emitting |
| CN103413885A (en) * | 2013-07-31 | 2013-11-27 | 广州硅能照明有限公司 | Manufacturing method of isolation type COB light source module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017096640A1 (en) * | 2015-12-09 | 2017-06-15 | 华南师范大学 | Wire-bonding system and method for cob die-bonding |
| CN111208669A (en) * | 2018-11-21 | 2020-05-29 | 深圳市百柔新材料技术有限公司 | Light-emitting diode backlight plate and manufacturing method thereof |
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Application publication date: 20140903 |