CN102386312A

CN102386312A - LED packaging process

Info

Publication number: CN102386312A
Application number: CN2011103999714A
Authority: CN
Inventors: 王海波; 施丰华
Original assignee: CHANGSHU QIGUANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Current assignee: CHANGSHU QIGUANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date: 2011-12-06
Filing date: 2011-12-06
Publication date: 2012-03-21

Abstract

The invention discloses an LED (light emitting diode) packaging process. The packaging process comprises the following steps: 1) cleaning the surface of a bracket 3, taking out silver paste or solder paste and defrosting; 2) manually or automatically fixing a chip 1 at the bottom of the bracket 3 by using the silver paste or the solder paste; 3) baking to fix the chip 1; 4) welding an anode and a cathode of the chip 1 by using a gold thread 2 and performing circuit conduction with the bracket 3; 5) covering a remote fluorescent lens 5 on the bracket 3 and fixing, injecting adhesion agent 4 between the bracket 3 and the remote fluorescent lens 5, and placing a light source in an oven for baking; or injecting the adhesion agent 4 to the bracket 3, placing in the oven for baking, and then combining the remote fluorescent lens 5 and the bracket 3 and fixing; 6) inspecting and packaging the packaged light source. The LED packaging process provided by the invention can be applied to an SMD (surface mount device) LED, a high-power LED and a COB (chip on board) integrated packaged LED; and meanwhile, the LED adopted the packaging process can simplify the production process, improve the production efficiency and reduce the light attenuation of fluorescent powder, as well as improve the consistency and uniformity of the light emergent performance.

Description

A kind of LED packaging technology

Technical field: the present invention relates to a kind of LED packaging technology, belong to the solid-state illumination field.

Background technology: the following technology of the general employing of existing LED encapsulation: 1, led chip is fixed on middle part, support bottom surface with silver slurry or tin cream; 2, the chip both positive and negative polarity is connected respectively in the circuit of support with gold thread; 3, with fluorescent material and silica gel or epoxy resin mixing and stirring, the bubble of bleeding; 4, carry out a glue with point gum machine or the manual support that solid brilliant bonding wire is finished; 5, the support of having put glue is tested and mended powder 6, places the baking oven baking-curing to the light source of having mended powder; 7, the paster light source beam split color separation of encapsulation being accomplished; 8, will be in same color and in the light source tape package.This is modal patch-type LED or high-power encapsulating structure, also is the encapsulating structure of development comparative maturity.

But this encapsulating structure exists some intrinsic shortcomings because of its technological problems.At first when glue; The concentration of fluorescent material is difficult to being consistent all along, because fluorescent material is present in the binding agent with graininess, and density is a lot of greatly than binding agent; Fluorescent material can slowly precipitate therein; The process of the bubble of exhaust simultaneously also promotes the deposition of fluorescent material, so the ratio of rubber powder is inconsistent in whole some glue process, it is incomplete same to cause different batches even same batch of LED that produces to go out photochromism; Need classify according to the chromaticity coordinates error at last, part do not get into that required color divides and in light source be substandard products; Second; Fluorescent material is the decay of luminescence problem that causes because be heated and since existing LED packaging technology all be directly with the mixing object point glue of fluorescent material and binding agent to chip, and chip is when working; Can give out a large amount of heat; Chip temperature is on every side raise rapidly, and the luminous efficiency of fluorescent material constantly descends owing to be heated as a result, finally directly has influence on the life-span of led light source.The 3rd, this structure is also comparatively loaded down with trivial details, is unfavorable for producing in batches.

Summary of the invention:

The object of the invention is exactly some shortcomings to existing LED encapsulation set forth above, proposes a kind of brand-new LED packaging technology, improves existing LED encapsulation largely because the deficiency that technological reason occurs.

Concrete technical scheme of the present invention may further comprise the steps:

1) cleans support 3 surfaces, and silver slurry or tin cream taking-up are thawed;

2) manually or certainly employ silver slurry or tin cream chip 1 is fixed on frame bottom;

The support 3 that 3) will fix chip 1 places baking oven to toast, and makes chip 1 be fixed on support 3 bottoms;

4) with gold thread 2 with chip 1 both positive and negative polarity and support 3 circuit turn-ons;

5) remote fluorescence lens 5 are covered on support 3 and fixing, toward injection binding agent 4 between support 3 and the remote fluorescence lens 5, place baking oven to toast light source then; Perhaps in support 3, inject binding agent 4 earlier, place baking oven to toast, then remote fluorescence lens 5 are engaged with support 3 and fix;

6) the light source go-on-go packing that encapsulation is finished.

Preferably, said remote fluorescence lens 5 adopt fluorescent material and the moulding of Merlon mixed injection molding.

Preferably, said chip 1 size is 45mil * 45mil.

Preferably, said support 3 specifications are high-power imitative lumen support.

Beneficial effect of the present invention is:

1, fluorescent material is evenly distributed in the remote fluorescence prefabricated board in the present technique scheme; Away from chip surface; Promptly away from thermal source, just do not have fluorescent material in the existing packaging technology causes the serious and color shift of light decay because of being heated for a long time problem, the stability of maintenance color;

2, fluorescent material and macromolecular compound blend in the present technique scheme can make fluorescent material be evenly distributed on very much in the macromolecular compound matrix, avoided precipitating because of fluorescent material the problem of the same batch of light source lack of homogeneity that causes;

3, adopt a kind of LED packaging technology in the present technique scheme; Cut some glue in the existing packaging technology, mended operation such as powder; Consistency of product and yields have been improved; Simplify the production process for encapsulating flow process, enhanced productivity, improved the cost that the consistency that optical property and uniformity have reduced product.

Description of drawings:

Fig. 1 packaging technology flow chart 1 of the present invention;

Fig. 2 packaging technology flow chart 2 of the present invention

The sectional view of Fig. 3 an embodiment of the present invention;

The vertical view of Fig. 4 an embodiment of the present invention;

Embodiment:

Embodiment 1:

1) at first cleaning the silver-colored slurry of high-power imitative lumen rack surface and taking-up thaws for use;

2) be that the chip of 45mil is fixed on high-power imitative lumen frame bottom through silver slurry with size;

3) having fixed chip is placed in the baking oven at 150 degree and toasted 1 hour down;

4) with gold thread with chip both positive and negative polarity and support circuitry conducting;

5) will by yellow fluorescent powder YAG mix with polycarbonate and the remote fluorescence lens cover of injection mo(u)lding on support and fixing, PC: YAG=5: 1;

6) inject silica gel through hole for injecting glue toward gap between support and the remote fluorescence lens;

7) light source that will annotate silica gel places baking oven 120 degree bakings 2 hours;

8) at last the light source go-on-go of encapsulated moulding and packing.

Embodiment 2:

1) at first cleaning the silver-colored slurry of 5050 rack surfaces and taking-up thaws for use;

2) be that the chip of 45mil is fixed in 5050 supports through silver slurry with size;

5) in 5050 supports, inject silica gel earlier;

6) light source that will annotate glue places baking oven 120 degree bakings 2 hours;

7) will mix and the remote fluorescence lens of injection mo(u)lding engage with support and fix PC: YAG=5: 1 by yellow fluorescent powder YAG and polycarbonate;

8) at last the light source go-on-go of encapsulated moulding and packing.

Claims

1. LED packaging technology, its characteristic may further comprise the steps:

2) manually or certainly employ silver slurry or tin cream chip 1 is fixed on support 3 bottoms;

3) support 3 with the chip that fixes 1 places baking oven to toast, and makes chip 1 be fixed on support 3 bottoms;

6) the light source go-on-go packing that encapsulation is finished.

2. a kind of LED packaging technology according to claim 1 is characterized in that described remote fluorescence lens 5 are fluorescent material and macromolecular material mixture, and wherein fluorescent material is one or more in yellow, redness, the green emitting phosphor; Macromolecular material is a kind of in Merlon, polymethyl methacrylate, epoxy resin, the silica gel; Wherein the mass ratio of fluorescent material and macromolecular material is 1: 2～10;

3. a kind of LED packaging technology according to claim 1 is characterized in that described binding agent 4 is silica gel or epoxy resin.

4. a kind of LED packaging technology according to claim 1 is characterized in that described support 3 is 3014 or 3020 or 3528 or 5050 or 5630 or 6720 patch-type led supports or high-power LED bracket or the integrated base plate for packaging of COB.

5. a kind of patch-type LED encapsulating structure according to claim 1 is characterized in that the chip of described chip 1 for 9x11mil or 12x12mil or 24x24mil or 38x38mil or 45x45mil or 50x50mil or 55x55mil specification.