CN104576900A - Packaging method of LED chip - Google Patents
Packaging method of LED chip Download PDFInfo
- Publication number
- CN104576900A CN104576900A CN201510006030.8A CN201510006030A CN104576900A CN 104576900 A CN104576900 A CN 104576900A CN 201510006030 A CN201510006030 A CN 201510006030A CN 104576900 A CN104576900 A CN 104576900A
- Authority
- CN
- China
- Prior art keywords
- substrate
- led chip
- led
- hole
- packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000084 colloidal system Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000012856 packing Methods 0.000 claims description 13
- 239000012528 membrane Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000499 gel Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 3
- 239000002313 adhesive film Substances 0.000 abstract 3
- 238000012858 packaging process Methods 0.000 abstract 1
- 229960001866 silicon dioxide Drugs 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000192 social effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A packaging method of an LED chip includes the following steps that step1, a substrate with through holes arranged in an array type is manufactured; step2, an adhesive film is pasted to the back surface of the substrate with the through holes arranged in the array type; step3, the LED chip to be packaged is placed on and adheres to the center of the part, exposed out of the through holes of the substrate, of the adhesive film; step4, the through holes are filled with glue which submerges the surface of the LED chip and is flush with the upper surface of the substrate; step5, solidifying is performed; step6, the edges of the glue are separated from the side walls of the through holes in the substrate, the adhesive film is separated from the substrate, in this way, an array type LED packaging body is formed, and then packaging is completed. The LED packaging body obtained through the packaging method can simplify the LED packaging processes, the size of the LED packaging body is reduced, the LED packaging cost is lowered, product uniformity is improved, the productivity is improved, heat resistance is reduced, and the reliability of the LED packaging body is improved.
Description
Technical field
The invention belongs to technical field of semiconductors, refer to a kind of light-emitting diode (LED) method for packing especially.
Background technology
LED (light emitting diode), i.e. light-emitting diode, as new and effective solid light source, there is the remarkable advantages such as long-life, energy-conservation, environmental protection, it is the leap again that the mankind are thrown light in history after incandescent lamp, fluorescent lamp, be considered to the illumination new technology in the 3rd generation, its economy and social effect huge.
The packaged type of tradition LED product is bonding by crystal-bonding adhesive, LED chip is fixed on support by the mode of flip chip bonding or eutectic welding, crystal-bonding adhesive LED chip that is bonding or eutectic welding is used generally to use gold thread that the positive pole of wafer is connected to the positive pole of support, the negative pole of wafer is connected to the negative pole of support, and uses the chip of flip chip bonding to utilize gold goal to be directly connected with the both positive and negative polarity of substrate.Then meet the phosphor gel of colour temperature requirement in chip surface covering and solidify.The silica-gel lens of last injecting glue stripping forming dome-type again completes the encapsulation flow process of whole LED chip.The encapsulation process step of LED chip is many, needs to use multiple stage specialty automatic equipment, and as automatic bonder, upside-down mounting ball attachment machine, Au wire bonding machine, automatic dispensing machine etc., equipment is many, has high input, and cost is high.The LED product volume of support encapsulation is large, is not suitable for the occasion being used in many Integrated predict model.Due to support, phosphor gel, different for the thermal coefficient of expansion of the colloid of bonding wafer, easily in support, phosphor gel, gold thread, colloid etc., there is integrity problem; And LED support is of a great variety, the material of bonding wafer and support both positive and negative polarity mostly is PPA, PCT and EMC material, its heat-resisting quantity, and air-tightness all has larger defect, and then affects the reliability of LED product.Flip chip bonding ceramics bracket used has good heat-resisting quantity and good air-tightness, but support cost is high, and ceramics bracket packaged LED equipment investment is large, and cause the LED product production capacity of ceramics bracket little, price is high.
Therefore, the LED product of support encapsulated structure is in reliability, and in useful life, manufacturing cost and defect are in price all larger obstructions that LED product substitutes traditional lighting products.
Summary of the invention
The object of the invention is to, the method for packing of a kind of LED is provided, the LED body obtained by this method for packing can simplify the encapsulation flow process of LED, reduce the volume of LED body, reduce the packaging cost of LED, improve homogeneity of product, improve production capacity, reduce thermal resistance, improve the reliability of LED body.
The invention provides a kind of method for packing of LED chip, comprise the steps:
Step 1: make the substrate with array arrangement through hole;
Step 2: the substrate back of band array arrangement through hole is sticked adhesive membrane;
Step 3: LED chip to be packaged is put and is pasted onto the center of the adhesive membrane that substrate through-hole exposes;
Step 4: fill colloid in through hole, the colloid of filling in each through hole do not have LED chip surface and with upper surface of base plate level;
Step 5: solidification;
Step 6: departed from by the sidewall of the edge of colloid and substrate through-hole, be separated by adhesive membrane with substrate, forms array-type LED packaging body, completes encapsulation.
The invention has the beneficial effects as follows, compared with the LED body that the LED body using this method to prepare and tradition adopt support or substrate package, described LED body 6 is only made up of LED chip 4 and transparent silica gel or phosphor gel, eliminate the raw material such as support, gold thread, avoid because support is different with the thermal coefficient of expansion of colloid and cause the problem of product reliability, and the stable performance of LED chip 4 and colloid, reliability is high
Accompanying drawing explanation
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated, wherein:
Fig. 1 is the structural representation of LED encapsulation method substrate of the present invention;
Fig. 2 is the structural representation of LED encapsulation method one embodiment of the present invention.
Embodiment
Refer to shown in Fig. 1, Fig. 2, the invention provides a kind of method for packing of LED chip, comprise the steps:
Step 1: make the substrate 1 with array arrangement through hole 2, the shape of described through hole 2 is square or circular, or other shapes, and different shapes can obtain the LED body 6 of different light distributions, to be applicable to different application scenarios.The size of through hole 2 is greater than the size (chatting afterwards) of LED chip 4, and the material of described substrate 1 is resin, glass, PCB substrate, copper or aluminium, and this substrate 1 material used easily processes easy cleaning, and cost is low, the high temperature of resistance to less than 200 degree, reusable.The thickness of described substrate 1 is identical with the thickness of LED body 6 and be greater than the thickness of LED chip; Be convenient at LED chip 4 upper surface coating colloid.
Step 2: adhesive membrane 3 is sticked at substrate 1 back side of band array arrangement through hole 2, and described adhesive membrane 3 is one-sided sticking; The high temperature of resistance to less than 200 degree, easily takes off, and stickum does not remain in the surface of LED body 6.
Step 3: LED chip 4 to be packaged is put and is pasted onto the center of the adhesive membrane 3 that substrate 1 through hole 2 exposes; Described LED chip 4 is inverted structure chip, and the lower surface of LED chip 4 has positive and negative electrode, and upper surface is exiting surface, together with the lower surface of LED chip 4 is pasted and fixed on adhesive membrane 3.
Step 4: fill colloid in through hole 2, the colloid of filling in each through hole 2 do not have LED chip 4 upper surface and with substrate 1 upper surface level, described colloid is silica gel or phosphor gel; Silica gel is the colloid of high index of refraction, phosphor gel is the mixture after the fluorescent material that excites by LED chip 4 and silica gel fully stir according to certain mass proportioning, the quality proportioning of fluorescent material and silica gel is generally between 1: 3 to 1: 20, and the Photochromic Properties according to required LED body 6 selects allotment.
Step 5: solidification; Populated colloid in the through hole 2 of substrate 1, need to put into high temperature oven and colloid is fully solidified, the heating-up temperature of high temperature oven is generally 100-150 degree Celsius, and heating time is generally 100-120 minute.
Step 6: departed from by the sidewall of the edge of colloid and substrate 1 through hole 2, be separated by adhesive membrane 3 with substrate 1, forms array-type LED packaging body 6, completes encapsulation.LED body 6 volume is little, controlled shape, during use, the positive and negative electrode that the positive and negative electrode of the lower surface of LED chip 4 in LED body 6 and heat radiating type circuit board surface make is bonded together, namely play the effect of conduction, the heat produced can be shed in time again during LED chip 4 luminescence.
The LED body 6 obtained by this method for packing can simplify the encapsulation flow process of LED, reduces the volume of LED body, reduces the packaging cost of LED, improves homogeneity of product, improves production capacity, reduces thermal resistance, improves the reliability of LED body.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a method for packing for LED chip, comprises the steps:
Step 1: make the substrate with array arrangement through hole;
Step 2: the substrate back of band array arrangement through hole is sticked adhesive membrane;
Step 3: LED chip to be packaged is put and is pasted onto the center of the adhesive membrane that substrate through-hole exposes;
Step 4: fill colloid in through hole, the colloid of filling in each through hole do not have LED chip surface and with upper surface of base plate level;
Step 5: solidification;
Step 6: departed from by the sidewall of the edge of colloid and substrate through-hole, be separated by adhesive membrane with substrate, forms array-type LED packaging body, completes encapsulation.
2. the method for packing of LED chip as claimed in claim 1, the shape of the through hole of wherein said substrate is square or circular, and the size of through hole is greater than the size of LED chip.
3. the method for packing of LED chip as claimed in claim 1, the material of wherein said substrate is resin, glass, PCB substrate, copper or aluminium.
4. the method for packing of LED chip as claimed in claim 3, the thickness of wherein said substrate is identical with the thickness of LED body and be greater than the thickness of LED chip.
5. the method for packing of LED chip as claimed in claim 1, wherein said adhesive membrane is one-sided sticking.
6. the method for packing of LED chip as claimed in claim 1, wherein said colloid is silica gel or phosphor gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510006030.8A CN104576900A (en) | 2015-01-07 | 2015-01-07 | Packaging method of LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510006030.8A CN104576900A (en) | 2015-01-07 | 2015-01-07 | Packaging method of LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104576900A true CN104576900A (en) | 2015-04-29 |
Family
ID=53092509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510006030.8A Pending CN104576900A (en) | 2015-01-07 | 2015-01-07 | Packaging method of LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104576900A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690974A (en) * | 2016-01-21 | 2016-06-22 | 京东方科技集团股份有限公司 | Flexible thin film attaching method, flexible thin film stripping method, flexible substrate preparation method and base substrate |
| CN106328639A (en) * | 2016-10-24 | 2017-01-11 | 厦门煜明光电有限公司 | LED encapsulating structure and preparing method thereof |
| CN109817104A (en) * | 2019-01-08 | 2019-05-28 | 长春希达电子技术有限公司 | A kind of LED array of display mould group of thin-film package |
| CN109994390A (en) * | 2019-04-09 | 2019-07-09 | 深圳市圆方科技新材料有限公司 | A kind of pre-packaged method of chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101832478A (en) * | 2009-04-07 | 2010-09-15 | 武汉市闪亮科技有限公司 | Array-type LED chip and control circuit integration device and manufacturing method thereof |
| CN102222667A (en) * | 2011-07-14 | 2011-10-19 | 东莞市邦臣光电有限公司 | LED (light-emitting diode) light source module and packaging process thereof |
| US20130032842A1 (en) * | 2011-08-01 | 2013-02-07 | Park Jong Kil | Light emitting device package and method of manufacturing the same |
| CN103151445A (en) * | 2013-03-04 | 2013-06-12 | 中国科学院半导体研究所 | Low thermal resistance LED (Light Emitting Diode) packaging structure and packaging method |
| CN103151446A (en) * | 2013-03-04 | 2013-06-12 | 中国科学院半导体研究所 | Frameless light-emitting diode (LED) packaging structure and packaging method |
-
2015
- 2015-01-07 CN CN201510006030.8A patent/CN104576900A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101832478A (en) * | 2009-04-07 | 2010-09-15 | 武汉市闪亮科技有限公司 | Array-type LED chip and control circuit integration device and manufacturing method thereof |
| CN102222667A (en) * | 2011-07-14 | 2011-10-19 | 东莞市邦臣光电有限公司 | LED (light-emitting diode) light source module and packaging process thereof |
| US20130032842A1 (en) * | 2011-08-01 | 2013-02-07 | Park Jong Kil | Light emitting device package and method of manufacturing the same |
| CN103151445A (en) * | 2013-03-04 | 2013-06-12 | 中国科学院半导体研究所 | Low thermal resistance LED (Light Emitting Diode) packaging structure and packaging method |
| CN103151446A (en) * | 2013-03-04 | 2013-06-12 | 中国科学院半导体研究所 | Frameless light-emitting diode (LED) packaging structure and packaging method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690974A (en) * | 2016-01-21 | 2016-06-22 | 京东方科技集团股份有限公司 | Flexible thin film attaching method, flexible thin film stripping method, flexible substrate preparation method and base substrate |
| CN105690974B (en) * | 2016-01-21 | 2019-01-18 | 京东方科技集团股份有限公司 | Fexible film fitting and stripping means, flexible base board preparation method, underlay substrate |
| CN106328639A (en) * | 2016-10-24 | 2017-01-11 | 厦门煜明光电有限公司 | LED encapsulating structure and preparing method thereof |
| CN109817104A (en) * | 2019-01-08 | 2019-05-28 | 长春希达电子技术有限公司 | A kind of LED array of display mould group of thin-film package |
| CN109994390A (en) * | 2019-04-09 | 2019-07-09 | 深圳市圆方科技新材料有限公司 | A kind of pre-packaged method of chip |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150429 |
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| WD01 | Invention patent application deemed withdrawn after publication |