CN203910845U - Lambert type LED large power packaging structure - Google Patents
Lambert type LED large power packaging structure Download PDFInfo
- Publication number
- CN203910845U CN203910845U CN201420153770.5U CN201420153770U CN203910845U CN 203910845 U CN203910845 U CN 203910845U CN 201420153770 U CN201420153770 U CN 201420153770U CN 203910845 U CN203910845 U CN 203910845U
- Authority
- CN
- China
- Prior art keywords
- led chip
- lens
- support
- lambert
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 241000218202 Coptis Species 0.000 claims description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 10
- 239000004568 cement Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 238000000605 extraction Methods 0.000 abstract 1
- 239000002932 luster Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a Lambert type LED large power packaging structure comprising an LED chip and a lens; a copper rod and a support are formed through plastic injection moulding; the LED chip is bonded on the copper rod and is connected with a support pin through a metal wire; the LED chip and the metal wire are sealed through the lens; silica gel is arranged in a sealing cavity; the LED chip is bonded to a center position on a surface of the copper rod; the copper rod and the support are pure copper material, and a surface is provided with a silver luster coating; the lens is made of plastic rubber with high temperature resistant and high light transmittance. The Lambert type LED large power packaging structure has 1W lambert type high light extraction rate profile, and multichip integration high power package is easy to paste; the structure is simple, and convenient in usage.
Description
Technical field
The utility model relates to LED light source field, more particularly, relates to the high-power encapsulating structure of a kind of lambert's type LED.
Background technology
Lambert's 1W type product has the advantage that light emission rate is high; The integrated module of multi-chip high power mounts advantage easily.But the product structure of lambert's 1W type can not be applied to high-power integration packaging, the defective value of described prior art must improve.
Utility model content
The purpose of this utility model is for above-mentioned technological deficiency, the high-power encapsulating structure of a kind of lambert's type LED is provided, the high-power encapsulating structure of this kind of lambert's type LED has had the contour structures of the high light-emitting rate of lambert's 1W type, has realized again multi-chip integrated high power and has encapsulated the feature that is easy to mount.
The technical scheme that its technical solution problem of the utility model adopts is as described below: the high-power encapsulating structure of a kind of lambert's type LED, comprise LED chip and lens, it is characterized in that, copper post and support and plastic-injection moulding, described LED chip is adhered on copper post, and be connected with support pin through gold thread, this LED chip and gold thread seal through lens, are provided with silica gel in seal chamber.
Described LED chip is adhered to copper post centre of surface position.
Described copper post and support are fine copper material, and surface is provided with silver lustre coating.
Described lens are plastic cement high temperature resistant, high transmission rate.
According to the utility model of said structure, its beneficial effect is, the utility model has had the contour structures of the high light-emitting rate of lambert's 1W type, has realized again multi-chip integrated high power and has encapsulated the feature that is easy to mount.It is simple in structure, easy to use.
Brief description of the drawings
Below in conjunction with accompanying drawing and execution mode, the utility model is conducted further description:
Fig. 1 is the utility model structural representation;
Fig. 2 be in Fig. 1 A-A ' to cutaway view.
Embodiment
As shown in Figure 1, 2, the high-power encapsulating structure of a kind of lambert type LED, copper post 1 and support 2 are by injection molding machine and plastic cement 3 injection mo(u)ldings, LED chip 5 is bonded on copper post 1 through elargol, the pin of chip 5 and support 6 is connected through gold thread 4, and the circuit of LED chip 5 is connected to string compound mode, and LED chip 5 and gold thread 4 seal through lens 6, in seal chamber, be provided with silica gel 7, discharge air and make LED chip 5 and gold thread 6 and air insulation.
Copper post 1 adopts fine copper material, electroplating surface silver lustre, and Main Function is for heat conduction, fixing silicon chip, is also the thematic structure part of support;
Support 2 adopts copper sheet punch forming, and at its electroplating surface silver layer, is used for binding gold thread 4, does welding pin;
Plastic cement 3 adopts high temperature resistant, and the PPA plastic cement that reflectivity is high is mainly for enclosing silica gel 7 and structural member, adopts equipment injection mo(u)lding;
Gold thread 4 uses automatic wire bonding machine, the circuit of the both positive and negative polarity of LED chip 5 and product is welded together, make LED chip 5 and the circuit of pcb board form path, make LED chip 5 luminous thereby pressure drop can be passed to LED chip 5 in the time adding voltage to pcb board circuit;
The luminous component that LED chip 5 is product, adopts the bonding mode of elargol LED chip 5 to be bonded in to the center on copper post 1 surface;
Lens 6 adopt plastic cement high temperature resistant, high transmission rate, adopts injection moulding extrusion modling, and its effect is structural member;
Silica gel 7 adopts that two components are high, light transmittance, the silica gel that high temperature resistant, cementability is good, fills up support after mixing, and LED chip 5 and air insulated are ensured to the useful life of LED chip 5 and gold thread 4 are not subject to ectocine.
Although the utility model is described with reference to the above embodiments; but those of ordinary skill in the art can very clearly recognize that above embodiment is only for the utility model is described completely; wherein can make various changes and revise and not depart from a broad sense the utility model; so not conduct is to restriction of the present utility model; as long as within the scope of connotation of the present utility model, variation to above-described embodiment, distortion are all by within falling into the protection range that the utility model requires.
Claims (1)
1. the high-power encapsulating structure of lambert's type LED, comprise LED chip and lens, it is characterized in that, copper post and support and plastic-injection moulding, described LED chip is adhered to copper post centre of surface position, and be connected with support pin through gold thread, this LED chip and gold thread seal through lens, are provided with silica gel in seal chamber, and described copper post and support are fine copper material, surface is provided with silver lustre coating, and described lens are plastic cement high temperature resistant, high transmission rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420153770.5U CN203910845U (en) | 2014-04-01 | 2014-04-01 | Lambert type LED large power packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420153770.5U CN203910845U (en) | 2014-04-01 | 2014-04-01 | Lambert type LED large power packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203910845U true CN203910845U (en) | 2014-10-29 |
Family
ID=51785095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420153770.5U Expired - Fee Related CN203910845U (en) | 2014-04-01 | 2014-04-01 | Lambert type LED large power packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203910845U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405840A (en) * | 2015-12-04 | 2016-03-16 | 江苏稳润光电有限公司 | LED for night fishing lamp |
| CN106653984A (en) * | 2017-02-13 | 2017-05-10 | 陶尊伍 | Pouring and packaging type LED anti-explosion light source module and anti-explosion lamp |
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
-
2014
- 2014-04-01 CN CN201420153770.5U patent/CN203910845U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405840A (en) * | 2015-12-04 | 2016-03-16 | 江苏稳润光电有限公司 | LED for night fishing lamp |
| CN106653984A (en) * | 2017-02-13 | 2017-05-10 | 陶尊伍 | Pouring and packaging type LED anti-explosion light source module and anti-explosion lamp |
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: TDSPOWERS CO., LTD. Assignor: Mi Qiang Contract record no.: 2014440020448 Denomination of utility model: Lambert type LED large power packaging structure Granted publication date: 20141029 License type: Exclusive License Record date: 20141224 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151223 Address after: Baoan District Songgang street, Shenzhen city 518105 Guangdong Province, Guangzhou Shenzhen highway and the East Avenue Interchange southeast side copam electronic industrial factory building No. 5 Patentee after: TDSPOWERS CO., LTD. Address before: 610000, No. 2, building 10, building 1, building 153, North KELONG Road, Wuhou District, Sichuan, Chengdu, China Patentee before: Mi Qiang |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20150401 |
|
| EXPY | Termination of patent right or utility model |