CN201927634U - Surface-mounted LED for decorative lamp - Google Patents

Surface-mounted LED for decorative lamp Download PDF

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Publication number
CN201927634U
CN201927634U CN2010206055556U CN201020605555U CN201927634U CN 201927634 U CN201927634 U CN 201927634U CN 2010206055556 U CN2010206055556 U CN 2010206055556U CN 201020605555 U CN201020605555 U CN 201020605555U CN 201927634 U CN201927634 U CN 201927634U
Authority
CN
China
Prior art keywords
pin
rubber base
decorative lamp
mounted led
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206055556U
Other languages
Chinese (zh)
Inventor
樊邦扬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEO-NEON LED LIGHTING INTERNATIONAL Ltd
Original Assignee
NEO-NEON LED LIGHTING INTERNATIONAL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEO-NEON LED LIGHTING INTERNATIONAL Ltd filed Critical NEO-NEON LED LIGHTING INTERNATIONAL Ltd
Priority to CN2010206055556U priority Critical patent/CN201927634U/en
Application granted granted Critical
Publication of CN201927634U publication Critical patent/CN201927634U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147Copper (Cu) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

The utility model discloses a surface-mounted LED for a decorative lamp, which belongs to the field of light emitting diodes and comprises a plastic holder, a light emitting chip, a positive pin, a negative pin and package colloid. The light emitting chip fixed in a hollow function area is arranged in the middle of the plastic holder, the positive pin and the negative pin are respectively fixedly connected into the plastic holder and electrically connected with the light emitting chip, the positive pin and the negative pin horizontally extend out of the plastic holder from the interior of the function area and are kept straight, and the package colloid is filled into the function area of the plastic holder to cover the light emitting chip. Bent pins of an original surfaced-mounted LED are changed into straight pins, and thereby the LED is more convenient in welding during manufacture of the decorative lamp. Further, bent positions of the pins are not easy to deform or break due to frequent straightening and large straightening force, and product quality can be improved.

Description

A kind of adopting surface mounted LED that is used for decorative lamp
[technical field]
The utility model relates to a kind of light emitting diode construction, refers in particular to a kind of adopting surface mounted LED structure that is used for decorative lamp.
[background technology]
Light-emitting diode (Light Emitting Diode, LED) be a kind of light emitting semiconductor device that electric energy can be converted into luminous energy, have that volume is little, plurality of advantages such as cold light source, response fast, luminous efficiency height, vibration resistance, explosion-proof and reliable, long service life (generally can up to more than 100,000 hours), driving voltage be low, energy saving, be a kind of desirable luminous element, be widely used on the various decorative lamps as urban look, road surface brightening and the lamp light source interspersed.
See also Fig. 1, for often being applied at present the adopting surface mounted LED structural representation on the decorative lamp, it comprises rubber base 1, pedestal 2, LED crystal particle 4, pin 3 and packaging plastic 5, the functional areas that have hollow structure in the inside of rubber base 1, pedestal 2 is fixed in the described rubber base 1 and is positioned at described functional areas, LED crystal particle 4 is installed on the described pedestal 2, described pin 3 is fixed in the described rubber base 1 respectively and respectively is equipped on the both sides of described pedestal 2, and be electrically connected with described LED crystal particle 4, described packaging plastic 5 is filled in the functional areas of described rubber base 1, to cover described LED crystal particle 4, fit in the bottom surface of rubber base after all can bending after wherein said pin extends from rubber base.The LED of this kind structure can be welded on earlier on the circuit board in use, and therefore bending fits in the leg structure of rubber base, can weld described LED very easily.When the LED of this kind structure is used on the decorative lamp, just produced such problem: when making decorative lamp, we overlap the last layer crust after earlier the pin of number LEDs being connected into the lamp string by lead more outside, the LED decorative lamp cost of Zhi Zuoing is shortened greatly like this, but in the follow-up link of producing, if the pulling force at lead and LED pin place is excessive, perhaps pullling frequently just is easy to cause the bending part of pin to be drawn back even produce fracture, pin is drawn back each LED that makes in the lamp string and can't be on the same horizontal plane, will have a strong impact on the attractive in appearance of whole decorative lamp after putting crust; If pin is broken, LED lamp string will be opened circuit or loose contact, influence product quality.
[utility model content]
Technical problem to be solved in the utility model is: drawn back easily because of bending or rupture and cause the underproof defective of product quality thereby overcome in the prior art LED pin, provide a kind of when being used for decorative lamp, the adopting surface mounted LED structure that welding easily, lamp base is firm.
In order to solve the problems of the technologies described above, technical solution adopted in the utility model is: a kind of adopting surface mounted LED structure that is used for decorative lamp comprises: a rubber base, and its inside has the functional areas of a hollow structure; Luminescent wafer is fixed in the functional areas in the described rubber base; Positive and negative pin is fixed in respectively in the described rubber base, and is electrically connected with described luminescent wafer, and described pin is straight by respectively extending horizontally to the outside and whole maintenance of described rubber base in the described functional areas; Packing colloid is filled in the functional areas of described rubber base, to cover described luminescent wafer.
The beneficial effects of the utility model are: because the pin of original paster type light emitting type bending has been become straight pin, therefore when making decorative lamp, make that the welding between light-emitting diode is convenient, and stretching pin makes in follow-up processing, be not easy to be drawn back or rupture because of pullling bending part frequent or that the power of pullling causes pin greatly, avoid opening circuit or loose contact of lamp string, can improve the quality of product.
Preferably, described positive and negative pin is concordant with described rubber base bottom surface, is on the same horizontal plane.Adopt such structure, can either very easily LED be welded on the circuit board, plurality of LEDs can be made into the lamp string by wire bonds again together.
Preferably, be formed with through hole on described positive and negative pin, adopt such structure, when welding LED, welding wire melts fills described through hole, makes the welding of LED and power line more firm, tight.
Preferably, described positive and negative pin is the T font, with convenient processing and welding.
Preferably, on the edge of described positive and negative pin, also be formed with circular pad structure.
[description of drawings]
For further detailed elaboration inventive concept of the present utility model, the utility model is done further detailed description below in conjunction with accompanying drawing.
Fig. 1 is the adopting surface mounted LED structural representation that is used for decorative lamp of the prior art;
Fig. 2 is the first kind of example structure schematic diagram that is used for the adopting surface mounted LED of decorative lamp in the utility model;
Fig. 3 is the second kind of example structure schematic diagram that is used for the adopting surface mounted LED of decorative lamp in the utility model;
Fig. 4 is the third example structure schematic diagram that is used for the adopting surface mounted LED of decorative lamp in the utility model;
Fig. 5 is the 4th kind of example structure schematic diagram that is used for the adopting surface mounted LED of decorative lamp in the utility model;
Fig. 6 is the perspective view of the third embodiment of the adopting surface mounted LED that is used for decorative lamp in the utility model.
[embodiment]
See also accompanying drawing 2, a kind of adopting surface mounted LED structure that is used for decorative lamp comprises: a rubber base 1, its inside have the functional areas 11 of a hollow structure; Luminescent wafer 4 is fixed in the functional areas 11 on the described rubber base 1; Positive and negative pin 3 is fixed in respectively in the described rubber base 1, and is electrically connected with described luminescent wafer 4, and described positive and negative pin 3 is straight by respectively extending horizontally to described rubber base 1 outside and whole maintenance in the described functional areas 11; Packing colloid 5 is filled in function 11 districts of described rubber base 1, to cover described luminescent wafer 4.
Described rubber base 1 external form roughly is the rectangle body, one end inside is formed with indent and is the functional areas 11 of inclined design, this rubber base 1 can be selected non-conducting material for use, for example Merlon, polyphthalamide, polybutylene terephthalate, polymethyl methacrylate, or other known thermoplastic resin etc.In described rubber base 1, also be provided with a pedestal 2, described pedestal 2 can be aluminium base, copper base or ceramic substrate, and this pedestal 2 can be to be recessed in the described rubber base 1, also can be the bottom surface that is fixed on described functional areas 11, be preferably and be recessed in the described rubber base 1, can save sizing material like this.Described luminescent wafer 4 is fixed on the described pedestal 2, and described pedestal 2 mainly is to play a part fixing and heat radiation to placing superincumbent luminescent wafer 4, can certainly save described pedestal 11, directly luminescent wafer 4 is fixed in the functional areas 11 by elargol etc.The material that described positive and negative pin 3 is a conductivity is made, as copper, metal materials such as iron, each pin 3 is fixed in this rubber base 1 respectively and is provided in the both sides of described pedestal 2, and described pin 3 is by respectively extending horizontally to described rubber base 1 outside in the functional areas 11 and keeping straight, with two pins in scheming is example, one of them is anodal pin, another is the negative pole pin, two pins 3 expose the part of functional areas respectively with pedestal 2 on luminescent wafer 4 be connected by bonding wire 6, this bonding wire 6 is preferably gold thread, can also be copper cash etc., extend pin part the fixing of rubber base 1 outside with convenient follow-up LED.Except that aforesaid two pins, also can be provided with three or the pin more than four according to the demand of reality, on described each pin 3, be formed with through hole 31, adopt such structure, when welding LED, welding wire melts fills described through hole 31, makes the welding of LED and power line more firm, tight, is not easy to be pullled disconnected.Rubber base 1 is to utilize technology such as injection mo(u)lding to form, and its gap by filling 3 of described pedestal 2 and described positive and negative pins is adopted this kind method to produce in large quantity, thereby saved manufacturing cost with affixed each pin 3.Described packing colloid 5 is an epoxy resin, also can add an amount of fluorescent material inside as required, and this packing colloid 5 is filled the functional areas of described rubber base 1, to cover described luminescent wafer 4.
See also Fig. 3 and Fig. 5, convenient when welding in order to make LED, described positive and negative pin 3 is the T font, perhaps is provided with the weld zone 32 that is used for source of welding current line in the end of described positive and negative pin 3.
See also Fig. 4 and Fig. 6, described positive and negative pin 3 is concordant with described rubber base 2 bottom surfaces, the bottom surface that is described positive and negative pin 3 and described rubber base 1 is on the same horizontal plane, adopt such structure, pin bottom surface and rubber base concordant made things convenient for that LED contacts with the good of circuit board in the subsequent applications, stretching pin can be made into the lamp string with plurality of LEDs by wire bonds again easily together, and in follow-up pullling, and has improved the defective that the pin of bending is drawn back or ruptures at bending part easily.
In the utility model, owing to become the pin of original adopting surface mounted LED bending straight, therefore when making decorative lamp, make that the welding between light-emitting diode is convenient, and stretching pin makes in follow-up making, the LED pin is not easy to be drawn back or rupture because of pullling the bending part that frequently causes pin, also just can not cause opening circuit or loose contact of lamp string, can improve the quality of product.

Claims (5)

1. adopting surface mounted LED structure that is used for decorative lamp comprises:
One rubber base, its inside has the functional areas of a hollow structure;
Luminescent wafer is fixed in the functional areas in the described rubber base;
Positive and negative pin is fixed in respectively in the described rubber base, and is electrically connected with described luminescent wafer;
Packing colloid is filled in the functional areas of described rubber base, to cover described luminescent wafer;
It is characterized in that: described positive and negative pin is straight by the outside and whole maintenance that respectively extends horizontally to described rubber base in the described functional areas.
2. the adopting surface mounted LED structure that is used for decorative lamp according to claim 1 is characterized in that: described positive and negative pin is concordant with described rubber base bottom surface.
3. the adopting surface mounted LED structure that is used for decorative lamp according to claim 1 is characterized in that: described positive and negative pin is provided with the through hole that is used for bonding wire.
4. the adopting surface mounted LED structure that is used for decorative lamp according to claim 1 is characterized in that: described positive and negative pin is the T font.
5. the adopting surface mounted LED structure that is used for decorative lamp according to claim 1 is characterized in that: be provided with the weld zone that is used for source of welding current line in the end of described positive and negative pin.
CN2010206055556U 2010-11-08 2010-11-08 Surface-mounted LED for decorative lamp Expired - Fee Related CN201927634U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206055556U CN201927634U (en) 2010-11-08 2010-11-08 Surface-mounted LED for decorative lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206055556U CN201927634U (en) 2010-11-08 2010-11-08 Surface-mounted LED for decorative lamp

Publications (1)

Publication Number Publication Date
CN201927634U true CN201927634U (en) 2011-08-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206055556U Expired - Fee Related CN201927634U (en) 2010-11-08 2010-11-08 Surface-mounted LED for decorative lamp

Country Status (1)

Country Link
CN (1) CN201927634U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015089947A1 (en) * 2013-12-17 2015-06-25 中山名创力电子有限公司 Manufacturing process for welded electronic part made from poorly weldable material
CN107946431A (en) * 2017-11-22 2018-04-20 深圳成光兴光电技术股份有限公司 A kind of patch type infrared transmitting tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015089947A1 (en) * 2013-12-17 2015-06-25 中山名创力电子有限公司 Manufacturing process for welded electronic part made from poorly weldable material
CN107946431A (en) * 2017-11-22 2018-04-20 深圳成光兴光电技术股份有限公司 A kind of patch type infrared transmitting tube

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110810

Termination date: 20151108

EXPY Termination of patent right or utility model