CN106992237A - A kind of Novel LED support and LED lamp bead - Google Patents
A kind of Novel LED support and LED lamp bead Download PDFInfo
- Publication number
- CN106992237A CN106992237A CN201710114479.5A CN201710114479A CN106992237A CN 106992237 A CN106992237 A CN 106992237A CN 201710114479 A CN201710114479 A CN 201710114479A CN 106992237 A CN106992237 A CN 106992237A
- Authority
- CN
- China
- Prior art keywords
- pin
- led support
- matrix
- novel led
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000011159 matrix material Substances 0.000 claims abstract description 38
- 229920000491 Polyphenylsulfone Polymers 0.000 claims abstract description 18
- 238000004020 luminiscence type Methods 0.000 claims abstract description 14
- 238000002347 injection Methods 0.000 claims abstract description 6
- 239000007924 injection Substances 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 5
- 238000002955 isolation Methods 0.000 claims description 8
- 238000007493 shaping process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000001746 injection moulding Methods 0.000 abstract description 5
- 238000004383 yellowing Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013036 cure process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to LED technical field, specifically related to a kind of Novel LED support and LED lamp bead, Novel LED support includes the pin of matrix and embedded matrix, one end of pin is used to electrically connect luminescence chip, the other end of pin is used to electrically connect external power supply, matrix is the plastic matrix being molded by PPSU material injections, because PPSU materials can be using injection molding as LED support, this significantly improves the production efficiency of LED support, in addition, because PPSU materials being capable of high-low temperature resistant, especially resisting high-temperature yellowing performance, so that LED support can realize that light decay is low under larger temperature difference environment, the characteristic of dimensionally stable, due also to PPSU materials have good translucency, the LED lamp bead for being packaged with the LED support is enabled to realize that 360 degrees omnidirection lights.
Description
Technical field
The present invention relates to LED technical field, and in particular to a kind of Novel LED support and LED lamp bead.
Background technology
LED lamp bead mainly has LED support and luminescence chip encapsulation to form, and in the prior art, LED support mainly has PPA materials
Material, PCT materials or EMC materials are made, and wherein the LED support of PPA and PCT materials is typically completed by injection molding process,
Although so shaping efficiency is high, the LED support being molded by PPA and PCT material injections, it can occur xanthochromia and show at high temperature
As, cause its light decay larger, this causes the service life of LED to reduce, and PPA and PCT material injections shaping after have compared with
High fragility, is unfavorable for the processing in later stage and uses very much, process is mounted in particular for the SMD of FPC, in high/low temperature
Under alternation environment, its dimensional stability of the LED support of PPA and PCT materials shaping is poor so that after support encapsulation
The quality of LED lamp bead cannot ensure that these cause PPA and PCT materials limited using scope in LED field, in addition,
Its air-tightness of the LED support of PPA and PCT materials shaping is poor, especially PCT materials, and its air-tightness is worse, and this will limit PPA
With the application of PCT materials out of doors.And the LED support of EMC materials can only typically be completed by cure process, curing molding
Although LED support can be made to have low light attenuation performance, curing molding is extremely inefficient, and cost is high, and this will seriously reduce LED branch
The production efficiency of frame, the low production efficiency of EMC materials will limit its large-scale production, so that its cost is high, this
Promoting the use of for the EMC materials is limited, therefore, PPA materials and PCT materials are not the optimal material choosing for being molded LED support
Select.Outside, existing LED support is general to be made of glass material or epoxy resin cure to increase its translucency, still
The production efficiency of curing molding is extremely low, and this will further decrease production efficiency.
The content of the invention
It is an object of the invention to high, applicable larger there is provided a kind of production efficiency for deficiency of the prior art
Under temperature difference environment, low light attenuation, and with good light permeability Novel LED support and LED lamp bead.
The invention thinking of the present inventor：Due to PPA, PCT and EMC material and deposit what is be previously mentioned in the introduction
Many defects, inventor chance on be commonly used to be molded infant feeding bottle PPSU materials can not only high temperature resistant without sending out
Xanthochromia performance and translucency is good, dimensionally stable, can also be using the higher injection molding of production efficiency, and then, inventor attempts to adopt
After PPSU materials shaping LED support, find not only to significantly improve the production efficiency of LED support, and in larger temperature difference environment
The light decay of lower LED support is low, dimensionally stable, can also realize 360 degrees omnidirection printing opacity.
The purpose of the present invention is achieved through the following technical solutions.
A kind of Novel LED support, including matrix and the pin of embedded described matrix are provided, described matrix is by PPSU materials
The plastic matrix of injection molding.
Wherein, the pin is embedded in described matrix by mold insert Shooting Technique in film.
Wherein, the pin includes the first pin and second pin, and described matrix, which is provided with, to be used to place the recessed of luminescence chip
Groove, the first pin and second pin are electrically connected with luminescence chip.
Wherein, the bottom land of the groove includes part, the part of second pin of the first pin, and for isolating first
The part of pin and the isolation part of the part of the first pin.
Wherein, the isolation part is integrally formed with described matrix.
Wherein, the bottom surface of the pin is flushed with the bottom surface of described matrix.
Wherein, the pin is provided with fixing hole, and the fixing hole is built-in with and the integrally formed fixed column of described matrix.
A kind of Novel LED lamp bulb, including LED support and the luminescence chip being installed on the LED support are also provided, it is described
LED support is described Novel LED support.
Wherein, in addition to the resin colloid for being encapsulated in the luminescence chip on the LED support.
Beneficial effects of the present invention：
The Novel LED support of the present invention, its structure includes the pin of matrix and embedded matrix, and one end of pin is used for the sending and receiving that are electrically connected
Optical chip, the other end of pin is used to electrically connect external power supply, and matrix is the plastic matrix being molded by PPSU material injections, due to
PPSU materials can be using injection molding as LED support, and this significantly improves the production efficiency of LED support, further, since PPSU materials
Being capable of high-low temperature resistant, especially resisting high-temperature yellowing performance so that LED support can be realized under larger temperature difference environment light decay it is low,
The characteristic of dimensionally stable, due also to PPSU materials have good translucency so that be packaged with the LED lamp bead energy of the LED support
Enough realize that 360 degrees omnidirection lights.
Brief description of the drawings
Using accompanying drawing, the invention will be further described, but the embodiment in accompanying drawing does not constitute any limit to the present invention
System, for one of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to the following drawings
Other accompanying drawings.
Fig. 1 is a kind of positive structural representation of Novel LED support of the present invention.
Fig. 2 is a kind of structural representation of the reverse side of Novel LED support of the present invention.
Include in Fig. 1 and Fig. 2：
1- matrixes；
2- grooves；
3- isolation parts；
4- fixed columns；
5- pins, the electric connecting terminals of 51- first, the electric connecting terminals of 52- second；
6- fixing holes.
Embodiment
The invention will be further described with the following Examples, a kind of Novel LED support of the invention, such as Fig. 1 and Fig. 2
Shown, its structure includes the pin 5 of matrix 1 and embedded matrix 1, and pin 5 is embedded in matrix 1 by mold insert Shooting Technique in film,
First electric connecting terminal 51 of pin 5 is used to electrically connect luminescence chip, and the first electric connecting terminal 51 of pin 5 is used to electrically connect external electricity
In source, the present embodiment, pin 5 is the pin 5 of strip of sheet, and pin 5 has two, respectively the first pin and second pin, first
Pin and the first electric connecting terminal 51 of second pin stretch out matrix 1, for electrically connecting external power supply.
In the present embodiment, matrix 1 is the plastic matrix 1 being molded by PPSU material injections, because PPSU materials can be molded
Be shaped to LED support, this significantly improves the production efficiency of LED support, further, since PPSU materials can high-low temperature resistant, especially
It is resisting high-temperature yellowing performance so that LED support can realize that light decay is low, dimensionally stable characteristic under larger temperature difference environment,
Due also to PPSU materials have good translucency so that 360 degree of sides entirely can be realized by being packaged with the LED lamp bead of the LED support
Position is luminous.
In the present embodiment, because PPSU materials and the associativity of metal pins 5 are more preferable so that using the LED branch of PPSU materials
The LED lamp bead of frame encapsulation has good air-tightness, can reach good red ink penetration testing effect.
As shown in figure 1, the middle part of matrix 1, which is provided with, is used to placing the groove 2 of luminescence chip, the first pin and second pin
Second electric connecting terminal 52 stretches into the second electric connecting terminal 52 of the bottom land of groove 2, i.e. the first pin, the second of second pin is electrically connected
Connect the isolation part between end 52 and the second electric connecting terminal 52 and the second electric connecting terminal 52 of second pin positioned at the first pin
3 collectively constitute the bottom land of groove 2, and isolation part 3 is used for the of the second electric connecting terminal 52 for isolating the first pin and second pin
Two electric connecting terminals 52, to prevent occurring short circuit.The bottom land of groove 2 is directly made up of the second electric connecting terminal 52 of pin 5, is thus saved
The gold thread gone between the second electric connecting terminal 52 of electrical connection pins 5 and luminescence chip, saves material cost, but also due to
The bottom surface of pin 5 is flushed with the bottom surface of matrix 1（As shown in Figure 2）, the second electric connecting terminal 52 of pin 5 can also be played to the core that lights
Piece carries out the function of heat conduction and radiating, so can save thermal conductive metal plate again, reduce further material cost.
Isolation part 3 is integrally formed with matrix 1, will so strengthen the fastness that is consolidated with matrix 1 of pin 5 and splendid airtight
Property, especially air-tightness, can reach good red ink penetration testing effect.
As shown in Fig. 2 pin 5 be provided with fixing hole 6, fixing hole 6 be built-in with the integrally formed fixed column of matrix 14, so
Further enhance fastness and air-tightness that pin 5 is consolidated with matrix 1.
A kind of Novel LED lamp bulb in the present embodiment, including described LED support and be installed on luminous on LED support
Luminescence chip is encapsulated on LED support by chip, resin colloid.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than to present invention guarantor
The limitation of scope is protected, although being explained with reference to preferred embodiment to the present invention, one of ordinary skill in the art should
Work as understanding, technical scheme can be modified or equivalent substitution, without departing from the reality of technical solution of the present invention
Matter and scope.
Claims (9)
1. a kind of Novel LED support, including matrix and the pin of embedded described matrix, it is characterised in that：Described matrix is served as reasons
The plastic matrix of PPSU material injections shaping.
2. a kind of Novel LED support according to claim 1, it is characterised in that：The pin is molded by mold insert in film
Technique is embedded in described matrix.
3. a kind of Novel LED support according to claim 1, it is characterised in that：The pin includes the first pin and the
Two pins, described matrix is provided with the groove for being used for placing luminescence chip, and the first pin and second pin are electrically connected with luminescence chip
Connect.
4. a kind of Novel LED support according to claim 3, it is characterised in that：The bottom land of the groove draws including first
The part of pin, the part of second pin, and for isolating the isolation part of the part of the first pin and the part of the first pin.
5. a kind of Novel LED support according to claim 4, it is characterised in that：The isolation part and described matrix one
Shaping.
6. a kind of Novel LED support according to claim 4, it is characterised in that：The bottom surface of the pin and described matrix
Bottom surface flush.
7. a kind of Novel LED support according to claim 1, it is characterised in that：The pin is provided with fixing hole, described solid
Determine hole to be built-in with and the integrally formed fixed column of described matrix.
8. a kind of Novel LED lamp bulb, including LED support and the luminescence chip being installed on the LED support, it is characterised in that：
Novel LED support of the LED support for power 1 into power 7 described in any one.
9. a kind of Novel LED lamp bulb according to claim 8, it is characterised in that：Also include being used for the luminescence chip
It is encapsulated in the resin colloid on the LED support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710114479.5A CN106992237A (en) | 2017-02-28 | 2017-02-28 | A kind of Novel LED support and LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710114479.5A CN106992237A (en) | 2017-02-28 | 2017-02-28 | A kind of Novel LED support and LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106992237A true CN106992237A (en) | 2017-07-28 |
Family
ID=59413156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710114479.5A Pending CN106992237A (en) | 2017-02-28 | 2017-02-28 | A kind of Novel LED support and LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106992237A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172679A (en) * | 2018-01-31 | 2018-06-15 | 吴相勇 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012009533A (en) * | 2010-06-23 | 2012-01-12 | Mitsubishi Chemicals Corp | Semiconductor light emitting device mounted circuit board, light emitting module, and lighting apparatus |
| CN103840060A (en) * | 2012-11-26 | 2014-06-04 | 梁建忠 | LED support and LED |
| CN203910845U (en) * | 2014-04-01 | 2014-10-29 | 密强 | Lambert type LED large power packaging structure |
| US20150021635A1 (en) * | 2012-08-17 | 2015-01-22 | Zhiqiang Qian | White Light Emitting LED Device |
| CN105662438A (en) * | 2010-12-27 | 2016-06-15 | 霍夫曼-拉罗奇有限公司 | Container made from composite of aluminium foil and polymer and used for analytical aids, and method for producing container |
| CN205863213U (en) * | 2016-04-11 | 2017-01-04 | 江西省木林森光电科技有限公司 | A kind of encapsulating structure of LED drive chip |
-
2017
- 2017-02-28 CN CN201710114479.5A patent/CN106992237A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012009533A (en) * | 2010-06-23 | 2012-01-12 | Mitsubishi Chemicals Corp | Semiconductor light emitting device mounted circuit board, light emitting module, and lighting apparatus |
| CN105662438A (en) * | 2010-12-27 | 2016-06-15 | 霍夫曼-拉罗奇有限公司 | Container made from composite of aluminium foil and polymer and used for analytical aids, and method for producing container |
| US20150021635A1 (en) * | 2012-08-17 | 2015-01-22 | Zhiqiang Qian | White Light Emitting LED Device |
| CN103840060A (en) * | 2012-11-26 | 2014-06-04 | 梁建忠 | LED support and LED |
| CN203910845U (en) * | 2014-04-01 | 2014-10-29 | 密强 | Lambert type LED large power packaging structure |
| CN205863213U (en) * | 2016-04-11 | 2017-01-04 | 江西省木林森光电科技有限公司 | A kind of encapsulating structure of LED drive chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172679A (en) * | 2018-01-31 | 2018-06-15 | 吴相勇 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201909192U (en) | Improved LED (light-emitting diode) module | |
| JP2020502779A (en) | QFN surface mount type RGB-LED package module and method of manufacturing the same | |
| CN102709438A (en) | Wireless packaging structure of high-power ceramic LED (Light-emitting Diode) | |
| CN101958387A (en) | Novel LED light resource module packaging structure | |
| CN202905777U (en) | LED bracket and LED device thereof | |
| CN204693116U (en) | Solid-state sealed LED bulb | |
| CN106992237A (en) | A kind of Novel LED support and LED lamp bead | |
| CN203631607U (en) | High-reliability LED light source and LED module light source | |
| CN206647784U (en) | A kind of Novel LED lamp bulb | |
| CN208422911U (en) | A kind of LED component | |
| CN203910845U (en) | Lambert type LED large power packaging structure | |
| CN203377266U (en) | Flexible COB (chip on board) packaging LED | |
| CN201689908U (en) | LED support | |
| CN103511890A (en) | LED injection molding module | |
| CN204614809U (en) | Full-color LED encapsulation structure | |
| CN204573938U (en) | Quoit is adopted to connect the syndeton of filament in LED bulb | |
| CN203312357U (en) | Patch type LED light source with all-angle lighting | |
| CN208620092U (en) | A kind of steady type luminous lamp strip | |
| CN202797063U (en) | LED packaging structure | |
| CN201887044U (en) | Encapsulating structure for LED light source module | |
| CN204879597U (en) | LED bulb and LED filament that has terminal structure thereof | |
| CN202678401U (en) | Packaging structure for high-power LED | |
| CN201732811U (en) | LED packaging structure of solderless gold wire | |
| CN202791389U (en) | Light-emitting diode (LED) device and illumination lamp using the same | |
| CN203071066U (en) | Parallelly connected welding wire structure of LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 343000 Ji'an city open area entrepreneurial Avenue Applicant after: Ji'an Mulinsen Industrial Co.,Ltd. Address before: 343000 Jiangxi Ji'an Jingkai District Pioneering Avenue Mulinsen Lighting Co., Ltd. Applicant before: JIANGXI MULINSEN LIGHTING CO.,LTD. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190814 Address after: 343000 No. 288 Nantang Road, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Applicant after: Ji'an Mulinsen Display Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Applicant before: Ji'an Mulinsen Industrial Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170728 |