CN205863213U - A kind of encapsulating structure of LED drive chip - Google Patents
A kind of encapsulating structure of LED drive chip Download PDFInfo
- Publication number
- CN205863213U CN205863213U CN201620294772.5U CN201620294772U CN205863213U CN 205863213 U CN205863213 U CN 205863213U CN 201620294772 U CN201620294772 U CN 201620294772U CN 205863213 U CN205863213 U CN 205863213U
- Authority
- CN
- China
- Prior art keywords
- substrate
- driving chip
- encapsulating structure
- chip
- led drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses the encapsulating structure of a kind of LED drive chip, including support, substrate and driving chip, described substrate is inlayed on the bracket, described driving chip is fixing on the substrate, described substrate has exposed pin outside support, electrically connecting with the pin of described driving chip, driving chip surface is coated with glue-line.Driving chip is fixed on silver-plated copper substrate by this utility model, and is embedded on support by substrate, it is not necessary to driving chip and substrate entirety are wrapped in support, reduces encapsulation volume.This encapsulating structure is simple, and package dimension is little, and can directly process on existing LED semiconductor packaging device, it is not necessary to purchases new sealed in unit, reduces production cost.
Description
Technical field
This utility model relates to LED drive chip technical field, particularly to the encapsulating structure of a kind of LED drive chip.
Background technology
Along with driving chip extensively the applying in LED of package body structure, LED constant-current drive circuit structure obtains
Simplifying, greatly reduce the use of components and parts, circuit layout is more succinct, produces more efficient, and the good stability of IC circuit, drives
Electric current output is stable, can guarantee that the service life of LED.But existing driving chip encapsulating structure package dimension is big, impact
LED wiring and luminous, and new equipment have to be purchased for encapsulation process, add entreprise cost burden.
Summary of the invention
The purpose of this utility model is to provide the envelope of a kind of undersized LED drive chip for the deficiencies in the prior art
Assembling structure, simplifies encapsulating structure as far as possible, reduces package dimension, to reduce driving chip to the wiring of LED and luminescence
The impact of angle, and mate the working ability of existing sealed in unit.
For achieving the above object, this utility model adopts the following technical scheme that
There is provided the encapsulating structure of a kind of LED drive chip, including support, substrate and driving chip, it is characterised in that described
Substrate is inlayed on the bracket, and described driving chip is fixing on the substrate, and described substrate has exposed drawing outside support
Foot, electrically connects with the pin of described driving chip, and driving chip surface is coated with glue-line.
Wherein, described substrate is copper base.
Wherein, described substrate surface is coated with silver layer.
Wherein, described driving chip have power supply VIN foot, hold GND foot and three pins of drain terminal DRAIN foot, drive with described
The described substrate draw-foot that the drain terminal DRAIN foot of dynamic chip connects covers in the outside of support non-fixed drive chip one side.
Wherein, described driving chip is connected with electrode, and described pin is by electrode and described substrate draw-foot wire bonding.
Wherein, described support is PPA stock support.
The beneficial effects of the utility model are: driving chip is fixed on silver-plated copper substrate by this utility model,
And substrate is embedded on support, it is not necessary to driving chip and substrate entirety are wrapped in support, reduce encapsulation volume.This envelope
Assembling structure is simple, and package dimension is little, and can directly process on existing LED semiconductor packaging device, it is not necessary to buying is new
Sealed in unit, reduce production cost.
Accompanying drawing explanation
The invention will be further described to utilize accompanying drawing, but the embodiment in accompanying drawing does not constitute any limit to the present invention
System, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain according to the following drawings
Other accompanying drawing.
Fig. 1 is Facad structure figure of the present utility model.
Detailed description of the invention
With the following Examples this utility model is further described.
The encapsulating structure of a kind of LED drive chip of the present utility model, as it is shown in figure 1, include support 1, substrate 2 and drive
Chip 3, support 1 blocks bottom and the surrounding of substrate 2, makes substrate 2 be embedded on support 1, and driving chip 3 is fixing on a substrate 2.
Substrate 2 is copper substrate, has good heat conductivility, silver coated on copper substrate 2, can produce more preferable heat conduction effect
Really, the heat produced when driving chip 3 works can quickly be derived by silver coated copper substrate 2, makes the driving chip 3 will not mistake
Heat burns out.Be coated with glue-line on driving chip 3 surface, protection components and parts exempt to be affected by the surrounding environment.Described support 1 is PPA
Stock support, also is able to keep good dimensional stability under continuous high temperature, makes driving chip 3 producing and can use
Journey keeps Stability Analysis of Structures.
As it is shown in figure 1, substrate 2 has exposed the first pin the 4, second pin 5 and the 3rd pin 6 outside support 1, it is fixed on
Driving chip 3 on substrate 2 is connected with electrode, and is bonded with the pinless lead of substrate 2 by electrode, concrete, driving chip 3
The first pin power supply VIN foot electrically connect with the first pin 4 of substrate 2, second pin ground end GND foot draw with the second of substrate 2
Foot 5 electrically connects, and three-prong drain terminal DRAIN foot electrically connects with the 3rd pin 6 of substrate 2.First pin 4 of substrate 2 is for electricity
Source input and constant-current source export, and the second pin 5 is for current sample, and outer meeting resistance is to ground, and the 3rd pin covers at support not
The outside of fixed drive chip one side, is used for dispelling the heat.So encapsulating structure circuit of design connects simple, decreases components and parts
Using, wiring is more succinct, and the circuit stability of driving chip is good, drives electric current output stable, can guarantee that the use of LED
Life-span.
Last it should be noted that, above example is only in order to illustrate the technical solution of the utility model, rather than to this reality
With the restriction of novel protected scope, although having made to explain to this utility model with reference to preferred embodiment, this area general
Logical it will be appreciated by the skilled person that the technical solution of the utility model can be modified or equivalent, without deviating from this
The spirit and scope of utility model technical scheme.
Claims (6)
1. an encapsulating structure for LED drive chip, including support, substrate and driving chip, it is characterised in that described substrate is inlayed
Embedding on the bracket, described driving chip is fixing on the substrate, and described substrate has exposed pin outside support, with institute
Stating the pin electrical connection of driving chip, driving chip surface is coated with glue-line.
The encapsulating structure of LED drive chip the most according to claim 1, is characterized in that: described substrate is copper base.
The encapsulating structure of LED drive chip the most according to claim 1 and 2, is characterized in that: described substrate surface is coated with silver
Layer.
The encapsulating structure of LED drive chip the most according to claim 1, is characterized in that: described driving chip has power supply VIN
Foot, hold GND foot and three pins of drain terminal DRAIN foot, the described substrate being connected with the drain terminal DRAIN foot of described driving chip draws
Foot covers the outside in support non-fixed drive chip one side.
The encapsulating structure of LED drive chip the most according to claim 4, is characterized in that: described driving chip is connected with electrode,
Described pin is by electrode and described substrate draw-foot wire bonding.
The encapsulating structure of LED drive chip the most according to claim 1, is characterized in that: described support is that PPA material props up
Frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620294772.5U CN205863213U (en) | 2016-04-11 | 2016-04-11 | A kind of encapsulating structure of LED drive chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620294772.5U CN205863213U (en) | 2016-04-11 | 2016-04-11 | A kind of encapsulating structure of LED drive chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205863213U true CN205863213U (en) | 2017-01-04 |
Family
ID=57642326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620294772.5U Active CN205863213U (en) | 2016-04-11 | 2016-04-11 | A kind of encapsulating structure of LED drive chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205863213U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
| CN108366462A (en) * | 2018-04-20 | 2018-08-03 | 上海路傲电子科技有限公司 | A kind of linear constant current driving chip and multi-chip parallel connection LED lighting circuit |
| CN109860371A (en) * | 2019-01-23 | 2019-06-07 | 佛山市国星光电股份有限公司 | Supporting structure, support array and LED component |
| CN110312348A (en) * | 2019-08-07 | 2019-10-08 | 深圳市鑫宇昊科技有限公司 | Bikini upside-down mounting constant-current driven chip and LED light |
-
2016
- 2016-04-11 CN CN201620294772.5U patent/CN205863213U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
| CN108366462A (en) * | 2018-04-20 | 2018-08-03 | 上海路傲电子科技有限公司 | A kind of linear constant current driving chip and multi-chip parallel connection LED lighting circuit |
| CN108366462B (en) * | 2018-04-20 | 2020-08-21 | 上海路傲电子科技有限公司 | Linear constant-current driving chip and multi-chip parallel LED lighting circuit |
| CN111935874A (en) * | 2018-04-20 | 2020-11-13 | 上海路傲电子科技有限公司 | Linear constant-current driving chip and multi-chip parallel LED lighting circuit |
| CN111935874B (en) * | 2018-04-20 | 2023-09-05 | 上海路傲电子科技有限公司 | Linear constant current driving chip and multi-chip parallel LED lighting circuit |
| CN109860371A (en) * | 2019-01-23 | 2019-06-07 | 佛山市国星光电股份有限公司 | Supporting structure, support array and LED component |
| CN110312348A (en) * | 2019-08-07 | 2019-10-08 | 深圳市鑫宇昊科技有限公司 | Bikini upside-down mounting constant-current driven chip and LED light |
| CN110312348B (en) * | 2019-08-07 | 2024-05-24 | 深圳市炫鼎光电科技有限公司 | Three-point type flip constant current driving chip and LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 338000 No. 2688, hengsan Road, high tech Development Zone, Xinyu City, Jiangxi Province Patentee after: XINYU MULINSEN CIRCUIT BOARD Co.,Ltd. Address before: 338000 Guangming Road 888, Xinyu High-tech Zone, Jiangxi Province Patentee before: JIANGXI MULINSEN PHOTOELECTRIC TECHNOLOGY CO.,LTD. |
|
| CP03 | Change of name, title or address |