CN103227277A - Welding-wire-free LED packaging method and LED packaging structure - Google Patents
Welding-wire-free LED packaging method and LED packaging structure Download PDFInfo
- Publication number
- CN103227277A CN103227277A CN2013101205451A CN201310120545A CN103227277A CN 103227277 A CN103227277 A CN 103227277A CN 2013101205451 A CN2013101205451 A CN 2013101205451A CN 201310120545 A CN201310120545 A CN 201310120545A CN 103227277 A CN103227277 A CN 103227277A
- Authority
- CN
- China
- Prior art keywords
- led
- electrode
- led chip
- carrier
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention provides a welding-wire-free LED (light emitting diode) packaging method and an LED packaging structure. Particularly, the welding-wire-free LED packaging method comprises the steps that an LED chip with an electrode facing outward is placed and fixed on a carrier; the electrode of the LED chip is bonded with an external circuit by a viscous electric conductor to form electric conduction connection; and curing treatment is performed to ensure that the electrode of the LED chip is firmly combined with and is in electric conduction communication with the external circuit. Compared with the traditional LED chip packaging, the electrode of the LED chip is in welding connection and is communicated with the circuit by the viscous electric conductor instead of a metal wire, so that the method and the structure are simple to operate, high in efficiency, low in cost and flexible.
Description
Technical field
The invention belongs to the LED application, be specifically related to a kind of LED method for packing and LED encapsulating structure without bonding wire.
Background technology
Traditional LED encapsulation, the electrode of the led chip of its formal dress was communicated with by welded wire with being communicated with all of external circuit, and the electrode of another kind of flip-chip welds or bonding the connection with circuit inwardly, but manufacturing technique requirent is very strict, and difficulty is big.
The present invention does not have the one side of electrode to be adhesively fixed on the carrier led chip, the electrode that makes led chip outwardly, adopt the viscosity electric conductor that the electrode of led chip is connected with the bonding formation conduction of external circuit, by replace the spun gold welding with the viscosity electric conductor, it is simple to operate, flexible, efficient is high, makes cost reduce.
Summary of the invention
The present invention is communicated with circuit bonding with the electrode of a kind of viscosity electric conductor with electrode led chip outwardly, form a kind of LED encapsulation without bonding wire, it is simple to operate, flexible, efficient is high, by replace the spun gold welding with the viscosity electric conductor, provide cost savings, make cost reduce.
Main design of the present invention is, adopts a kind of viscosity electric conductor that the electrode of electrode led chip outwardly is communicated with circuit bonding, replaces traditional welded wire to be communicated with.
A kind of LED encapsulation of the present invention without bonding wire, it is simple to operate, flexible, efficient is high, replaces the spun gold welding with the viscosity electric conductor, and cost is low.
More specifically, according to an aspect of the present invention, a kind of LED method for packing without bonding wire is provided, comprise: electrode led chip storing outwardly is fixed on the carrier, adopt the viscosity electric conductor that the electrode of led chip is connected with the bonding formation conduction of external circuit, and carry out cured, make electrode and the described external circuit strong bonded and the conductive communication of led chip.
According to one embodiment of the invention, described carrier is a led support.
According to one embodiment of the invention, described carrier is a LED light fixture radiator.
According to one embodiment of the invention, described carrier is a wiring board.
According to one embodiment of the invention, described viscosity electric conductor is conducting resinl, conductive paste or conductive paste.
According to one embodiment of the invention, described conductive paste is a conductive silver paste.
According to one embodiment of the invention, described LED method for packing does not adopt the mode of any bonding wire that described electrode and external circuit are formed conductive communication.
According to one embodiment of the invention, described external circuit comprises two telegraph circuits that are spaced apart from each other that are positioned on the described carrier, between described two telegraph circuits, arrange crystal-bonding adhesive, the side that electrode is not set with described led chip sticks on the described crystal-bonding adhesive then, thereby is fixed on the described carrier.
According to one embodiment of the invention, described led chip is located such that its side that is provided with electrode up.
The present invention also provides a kind of LED encapsulating structure without bonding wire, comprising: the carrier of arranging or be equipped with circuit on it; Electrode led chip up, wherein, the side that electrode is not set of described led chip is fixed on the described carrier with crystal-bonding adhesive; With with the described electrode of described led chip and the related circuit on the described carrier is bonding and form the viscosity electric conductor of conductive communication.
In following description, will set forth one or more embodiments of the detail of the present invention to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
The schematic cross-section of Fig. 1 for the electrode of electrode led chip outwardly being communicated with circuit bonding with the viscosity electric conductor.
Fig. 2 is wiring board and LED light fixture carrier contraposition applying schematic diagram.
Fig. 3 fits together for wiring board and LED light fixture carrier, the schematic diagram after the curing.
Fig. 4 is for being fixed on schematic diagram on the carrier with electrode led chip outwardly with crystal-bonding adhesive.
The schematic diagram of Fig. 5 for the electrode of led chip being communicated with circuit bonding with the viscosity electric conductor.
Fig. 6 is for being encapsulated in schematic diagram in the light fixture carrier reflector with silica gel with led chip and viscosity electric conductor.
Fig. 7 is the schematic diagram of LED light fixture carrier contraposition lid lampshade.
Embodiment
The specific embodiment without the LED of bonding wire encapsulation below in conjunction with the LED light fixture is described in more detail the present invention.But these specific embodiments only play and specify and demonstrate effect of the present invention, and scope of the present invention is not had any restriction.Protection scope of the present invention is only limited by claims.
As shown in Figure 2, the wiring board 3 that scribbles hot-setting adhesive is fit together with 4 contrapositions of LED light fixture carrier, solidify then, make wiring board 3 and LED light fixture carrier 4 good bond (as shown in Figure 3) together.
Between the two circuit 3a that are spaced apart from each other of the reflector 5 of as shown in Figure 3 LED light fixture carrier, drip crystal-bonding adhesive 5a (as shown in Figure 1), then led chip electrode 1a and 1b are made progress, led chip 1 storing is sticked on crystal-bonding adhesive 5a go up (as Fig. 4, shown in Figure 1), baking-curing.
As shown in Figure 5, use conductive paste, for example conductive silver paste 2, two electrode 1a and the 1b and the bonding respectively formation conductive communication that couples together of two circuit 3a of the led chip 1 that electrode is made progress, baking-curing then, make the electrode of led chip 1 be connected conducting (, shown in Figure 1) by conductive silver paste 2 strong bonded as Fig. 5 with circuit 3a.Certainly, persons of ordinary skill in the art may appreciate that also can adopt any suitable conducting objects to replace leads conductive paste, for example conducting resinl, conductive paste or the like, these all belong in the category of the present invention.
Then, test-based examination is encapsulated in led chip 1 and conductive silver paste 2 in the reflector 5 of light fixture carrier 4 (as shown in Figure 6) with silica gel 6 subsequently, baking-curing then, and the LED encapsulation without bonding wire is finished in test again.
Cover lamp lampshade 7 (as shown in Figure 7), the packing warehouse-in.
Below in conjunction with the accompanying drawings a kind of specific embodiment of the LED method for packing without bonding wire is described in detail the present invention.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present invention, especially the scope of claim does not have any restriction.
Claims (10)
1. LED method for packing without bonding wire comprises:
Electrode led chip storing outwardly is fixed on the carrier, adopts the viscosity electric conductor that the electrode of led chip is connected with the bonding formation conduction of external circuit, and carry out cured, make electrode and the described external circuit strong bonded and the conductive communication of led chip.
2. LED method for packing according to claim 1 is characterized in that described carrier is a led support.
3. LED method for packing according to claim 1 is characterized in that, described carrier is a LED light fixture radiator.
4. LED method for packing according to claim 1 is characterized in that described carrier is a wiring board.
5. LED method for packing according to claim 1 is characterized in that, described viscosity electric conductor is conducting resinl, conductive paste or conductive paste.
6. LED method for packing according to claim 5 is characterized in that described conductive paste is a conductive silver paste.
7. LED method for packing according to claim 1 is characterized in that, described LED method for packing does not adopt the mode of any bonding wire that described electrode and external circuit are formed conductive communication.
8. LED method for packing according to claim 1, it is characterized in that, described external circuit comprises two telegraph circuits that are spaced apart from each other that are positioned on the described carrier, between described two telegraph circuits, arrange crystal-bonding adhesive, the side that electrode is not set with described led chip sticks on the described crystal-bonding adhesive then, thereby is fixed on the described carrier.
9. LED method for packing according to claim 8 is characterized in that, described led chip is located such that its side that is provided with electrode up.
10. LED encapsulating structure without bonding wire comprises:
Arrange or be equipped with the carrier of circuit on it;
Electrode led chip up, wherein, the side that electrode is not set of described led chip is fixed on the described carrier with crystal-bonding adhesive; With
With the described electrode of described led chip and the related circuit on the described carrier is bonding and form the viscosity electric conductor of conductive communication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101205451A CN103227277A (en) | 2013-03-27 | 2013-03-27 | Welding-wire-free LED packaging method and LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101205451A CN103227277A (en) | 2013-03-27 | 2013-03-27 | Welding-wire-free LED packaging method and LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103227277A true CN103227277A (en) | 2013-07-31 |
Family
ID=48837639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101205451A Pending CN103227277A (en) | 2013-03-27 | 2013-03-27 | Welding-wire-free LED packaging method and LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103227277A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280780A (en) * | 2014-07-10 | 2016-01-27 | 邱罗利士公司 | Package structure, method for fabricating the same and carrier thereof |
| CN106898944A (en) * | 2017-03-01 | 2017-06-27 | 苏州达沃特光电科技有限公司 | The single capsulation structure for semiconductor laser and method of a kind of high efficiency and heat radiation |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101069291A (en) * | 2005-11-08 | 2007-11-07 | 金圣圭 | Transparent light emitting apparatus and manufacturing method thereof |
| EP1947693A1 (en) * | 2007-01-18 | 2008-07-23 | Polytron Technologies, Inc. | Plane structure of light-emitting diode lighting apparatus |
| CN201508856U (en) * | 2009-10-13 | 2010-06-16 | 华侨大学 | High-power white-light LED |
| CN101853914A (en) * | 2010-05-11 | 2010-10-06 | 张婷婷 | High-power LED white lighting source structure |
| CN201966241U (en) * | 2010-11-10 | 2011-09-07 | 秦彪 | LED chip and LED wafer |
| CN203260633U (en) * | 2013-03-27 | 2013-10-30 | 王定锋 | LED package structure requiring no welding line |
-
2013
- 2013-03-27 CN CN2013101205451A patent/CN103227277A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101069291A (en) * | 2005-11-08 | 2007-11-07 | 金圣圭 | Transparent light emitting apparatus and manufacturing method thereof |
| EP1947693A1 (en) * | 2007-01-18 | 2008-07-23 | Polytron Technologies, Inc. | Plane structure of light-emitting diode lighting apparatus |
| CN201508856U (en) * | 2009-10-13 | 2010-06-16 | 华侨大学 | High-power white-light LED |
| CN101853914A (en) * | 2010-05-11 | 2010-10-06 | 张婷婷 | High-power LED white lighting source structure |
| CN201966241U (en) * | 2010-11-10 | 2011-09-07 | 秦彪 | LED chip and LED wafer |
| CN203260633U (en) * | 2013-03-27 | 2013-10-30 | 王定锋 | LED package structure requiring no welding line |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280780A (en) * | 2014-07-10 | 2016-01-27 | 邱罗利士公司 | Package structure, method for fabricating the same and carrier thereof |
| CN106898944A (en) * | 2017-03-01 | 2017-06-27 | 苏州达沃特光电科技有限公司 | The single capsulation structure for semiconductor laser and method of a kind of high efficiency and heat radiation |
| CN106898944B (en) * | 2017-03-01 | 2019-05-31 | 苏州达沃特光电科技有限公司 | A kind of the single capsulation structure for semiconductor laser and method of high efficiency and heat radiation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206282838U (en) | The integrated encapsulation structure of passive device and active device | |
| CN205863213U (en) | A kind of encapsulating structure of LED drive chip | |
| CN105336275A (en) | High-density RGB (red green blue) inverted LED (light emitting diode) display screen encapsulation structure and manufacturing method | |
| CN205480223U (en) | High stable pottery COB encapsulation LED lamp | |
| CN203260633U (en) | LED package structure requiring no welding line | |
| CN103227277A (en) | Welding-wire-free LED packaging method and LED packaging structure | |
| US20160049358A1 (en) | Electronic circuit, production method thereof, and electronic component | |
| CN103489655A (en) | Novel planar array multi-core series-parallel solid tantalum capacitor and manufacturing method thereof | |
| CN204130528U (en) | A kind of lead frame posture high-power LED light source module | |
| CN103078043A (en) | Packaging structure and process of COB (Chip On board) LED (Light Emitting Diode) | |
| CN203038968U (en) | LED illumination module | |
| CN103346234A (en) | LED packaging structure and packaging method thereof | |
| CN202695439U (en) | LED die set with LED chip directly encapsulated on rigid-flexible circuit board | |
| CN203363722U (en) | Sandwich type LED light source module with two sides emitting light | |
| CN204834620U (en) | Two carrier LED drive circuit packaging parts of heat sink structure | |
| CN209822681U (en) | Flip SMD LED packaging structure | |
| CN207909874U (en) | A kind of 360 ° of upside-down mounting self-rectifying is light-emitting LED | |
| CN105914268A (en) | LED upside-down mounting process and LED upside-down mounting structure | |
| CN202695440U (en) | Led integrated light source | |
| CN105609620B (en) | A kind of preparation method of LED light engine encapsulating structure | |
| CN102544342B (en) | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof | |
| CN202647293U (en) | Light emitting diode (LED) lamp belt module capable of directly forming LED support on guide wires | |
| CN202268386U (en) | LED (Light Emitting Diode) packaging structure | |
| CN202259441U (en) | Novel LED chip | |
| CN206441725U (en) | A kind of multiple-level stack formula LED encapsulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130731 |