CN205480223U - High stable pottery COB encapsulation LED lamp - Google Patents
High stable pottery COB encapsulation LED lamp Download PDFInfo
- Publication number
- CN205480223U CN205480223U CN201521124568.0U CN201521124568U CN205480223U CN 205480223 U CN205480223 U CN 205480223U CN 201521124568 U CN201521124568 U CN 201521124568U CN 205480223 U CN205480223 U CN 205480223U
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- led chip
- led
- chip array
- ceramic substrate
- high stable
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
The utility model discloses a high stable pottery COB encapsulation LED lamp, including ceramic substrate, last LED chip array and the drive circuit of being equipped with of ceramic substrate, LED chip array is realized by a plurality of chip connection in series -parallel, be equipped with a confined box dam around the LED chip array, the encapsulation is glued and is filled in the box dam and cover on LED chip array, drive circuit includes rectifier unit and constant current drive unit, and rectifier unit, LED chip array and constant current drive unit be electric connection in order. The utility model discloses a circuit is done to the 96% alumina ceramics base plate, because of ceramic substrate has excellent insulating nature and stability, consequently can do AC COB product, and can cross an ampere rule authentication. The insulating effect of 96% alumina ceramics base plate is good, has guaranteed the fail safe nature of the high voltage that LED chip and rectifier diode chip pass through. From the safe corner degree, eliminated the potential safety hazard completely, because of the power short circuit leads to hidden danger of catching fire and environmental pollution that the power caused, there has not been power conversion efficiency's loss before not had.
Description
Technical field
This utility model relates to LED and manufactures field, the LED of a kind of COB based on ceramic substrate encapsulation.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode); its basic structure is one piece of electroluminescent chip of semiconductor material; with on elargol or latex solidified to support; then chip and circuit board are connected with silver wire or gold thread; then surrounding epoxy sealing; play the effect of protection internal core, shell is finally installed, so the anti-seismic performance of LED is good.It addition, LED also has, volume is little, power consumption is low, length in service life, high brightness, low in calories, environmental protection, the advantage such as sturdy and durable, be therefore widely used in daily household electrical appliances and the machinery production aspects such as mobile phone, desk lamp, household electrical appliances.
LED chip encapsulation technology mainly has two kinds of forms: a kind of COB technology (chip On board, chip on board encapsulates), another kind is flip chip technology (Flip Chip).Wherein, COB technology, it is simply that bare chip conduction or non-conductive adhesive are adhered to or be mounted on interconnection substrates, then carries out wire bonding and realizes its electrical connection, and cover to guarantee reliability with resin.But, it is slow that the LED lamp of existing COB encapsulation has packaging efficiency, and power volume is big, takies the problems such as light fixture space, and light fixture volume is big so that light fixture appearance design is limited；Meanwhile, existing LED lamp also has the problem that the conversion efficiency of power supply is low.
Utility model content
Therefore, for above-mentioned problem, the utility model proposes a kind of high stable pottery COB and encapsulate LED, improving existing LED lamp, solve current LED lamp packaging efficiency slow, power volume is big, take light fixture space, light fixture volume is big, and light fixture outward appearance is limited, and the problem that power supply conversion efficiency is low.
In order to solve above-mentioned technical problem, this utility model be employed technical scheme comprise that, a kind of high stable pottery COB encapsulates LED, and including ceramic substrate, ceramic substrate is provided with LED chip array and drive circuit, and LED chip array is realized by multiple chip connection in series-parallel；The box dam being formed around a closing of LED chip array, packaging plastic is filled in box dam and covers on LED chip array；Drive circuit includes that rectification unit and constant current driving unit, rectification unit, LED chip array and constant current driving unit are sequentially electrically connected with.
As a feasible scheme, described LED chip array is realized by gold thread connection in series-parallel by multiple blue chips.
As a feasible scheme, described ceramic substrate is to be realized by 96% aluminium oxide ceramic substrate.
As a feasible scheme, the full-bridge rectifier of specifically four diode compositions of described rectification unit.
As a feasible scheme, described constant current driving unit can be driven IC to realize by temperature-control constant-current, and such as model is the LED constant current driving chip of CYT3000A.
Further, the cross section of described box dam is a circle, namely this box dam arranges a circle around LED chip array.
This utility model passes through such scheme, compared with prior art, has the advantage that
1, in drive circuit, positive pole is through the rectification of rectification unit, positive pole is provided to power for LED chip array, by providing cathode voltage for constant current driving unit after LED chip array, another foot of constant current driving unit connects negative pole, thus forms loop, and then reach the effect that 220V directly powers, light it is to say, this utility model can be used directly alternating current 110/220V, it is not necessary to additional power source；
2, this utility model uses 96% aluminium oxide ceramic substrate to do circuit, has a specular removal, low thermal resistance, pressure height, the characteristic such as safe and reliable；Because ceramic substrate has excellent insulating properties and stability, therefore can be COB and encapsulate LED lamp, and Safety Approval can be crossed；Further, from security standpoint, completely eliminate potential safety hazard, without before cause the environmental pollution that hidden danger on fire and power supply caused, without the loss of power supply conversion efficiency because of power supply short circuit；It addition, 96% aluminium oxide ceramic substrate good insulating effect, it is ensured that the high-tension security reliability that LED chip and rectifier diode chip are passed through.
3, constant current driving unit can be selected for the temperature of IC chip controls LED of controllable temperature, can promote the service life of LED；
4, this utility model simple in construction, volume are little, easy to install and use, multiple can be combined into super high power, and light source tunable optical, toning, meanwhile, its drive circuit no electrolytic capacitor, can accomplish the real long-life therefore have good practicality.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is structural representation two of the present utility model；
Fig. 3 is the sectional view of Fig. 1；
Fig. 4 is circuit theory diagrams of the present utility model.
Detailed description of the invention
In conjunction with the drawings and specific embodiments, this utility model is further illustrated.
Seeing Fig. 1, Fig. 2 and Fig. 3, in figure, label is as follows: 100: ceramic substrate, 1:AC input pad, and 2: commutation diode, 3: box dam, 4:LED chip, 5: gold thread, 6: packaging plastic, 7:IC chip.
As a specific embodiment, seeing Fig. 1-Fig. 4, a kind of high stable pottery COB of the present utility model and encapsulate LED, including ceramic substrate 100, ceramic substrate 100 is provided with LED chip array and drive circuit.LED chip array is realized by gold thread 5 connection in series-parallel by multiple LED chip 4；The box dam 3 being formed around a closing of LED chip array, in packaging plastic 6 is filled in box dam 3 and cover on LED chip array；Box dam 3 is realized by box dam glue, and packaging plastic 6 is realized by the potting resin being mixed with fluorescent material.
Drive circuit includes that rectification unit and constant current driving unit, rectification unit, LED chip array and constant current driving unit are sequentially electrically connected with.The full-bridge rectifier of specifically four commutation diode 2 compositions of rectification unit.Constant current driving unit is realized by IC chip 7.
Wherein, in the present embodiment, LED chip array is to be realized by gold thread connection in series-parallel by multiple blue chips.Ceramic substrate 100 is to be realized by 96% aluminium oxide ceramic substrate.The cross section of box dam 3 is a circle, namely this box dam arranges a circle around LED chip array.
To sum up, this utility model realizes a AC input pottery COB area light source LED, and it is made up of 96% aluminium oxide ceramic substrate, LED chip (blue chip), commutation diode, IC chip.See Fig. 4, four commutation diode composition full-bridge rectifiers, provide positive pole to power for LED chip, after LED chip mutual connection in series-parallel composition LED chip array, providing cathode voltage for IC chip, another foot of IC chip connects negative pole, form loop, thus reach the effect that 220V directly powers.
As a concrete example, below as a example by the manufacturing specification AC pottery COB area light source LED as 12*15*1.0mm, first: by solid for the commutation diode 2 in Fig. 1 on the ceramic substrate 100 of solid good blue chip, again by solid on ceramic substrate 100 for the IC chip 7 of temperature-control constant-current, wherein 1 label in Fig. 1 and Fig. 2 represents AC input pad；Secondly: connect the pad energising of LED chip 4, commutation diode 2, IC chip 7 and ceramic substrate 100 with the gold thread 5 of 99.99% purity, a circular box dam 3 is surrounded again with box dam glue, drying in the packaging plastic 6 of mixed fluorescent material drips to this box dam 3, whole product completes.In figure one 1 is AC input pad of the present utility model, and 2 is commutation diode of the present utility model.
Wherein, constant current driving unit selects controllable temperature IC chip (such as can be selected for the LED constant current driving chip that model is CYT3000A), controls the temperature of LED, promotes the service life of LED.
This utility model uses 96% aluminium oxide ceramic substrate to do circuit, and 96% aluminium oxide ceramic substrate is existing product on existing market, and I will not elaborate, and it makes.Because ceramic substrate has excellent insulating properties and stability, therefore can do AC COB product, and Safety Approval can be crossed.96% aluminium oxide ceramic substrate good insulating effect, it is ensured that the high-tension security reliability that LED chip and rectifier diode chip are passed through.From security standpoint, completely eliminate potential safety hazard, without before cause the environmental pollution that hidden danger on fire and power supply caused, without the loss of power supply conversion efficiency because of power supply short circuit.
Although specifically showing in conjunction with preferred embodiment and describing this utility model; but those skilled in the art should be understood that; in the spirit and scope of the present utility model limited without departing from appended claims; this utility model can be made a variety of changes in the form and details, be protection domain of the present utility model.
Claims (6)
1. a high stable pottery COB encapsulates LED, it is characterised in that: including that ceramic substrate, ceramic substrate are provided with LED chip array and drive circuit, LED chip array is realized by multiple chip connection in series-parallel；The box dam being formed around a closing of LED chip array, packaging plastic is filled in box dam and covers on LED chip array；Drive circuit includes that rectification unit and constant current driving unit, rectification unit, LED chip array and constant current driving unit are sequentially electrically connected with.
A kind of high stable pottery COB the most according to claim 1 encapsulates LED, it is characterised in that: described LED chip array is realized by gold thread connection in series-parallel by multiple blue chips.
A kind of high stable pottery COB the most according to claim 1 encapsulates LED, it is characterised in that: described ceramic substrate is to be realized by 96% aluminium oxide ceramic substrate.
A kind of high stable pottery COB the most according to claim 1 encapsulates LED, it is characterised in that: described rectification unit is the full-bridge rectifier of four diode compositions.
A kind of high stable pottery COB the most according to claim 1 encapsulates LED, it is characterised in that: described constant current driving unit is driven IC to realize by temperature-control constant-current.
A kind of high stable pottery COB the most according to claim 1 encapsulates LED, it is characterised in that: the cross section of described box dam is a circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521124568.0U CN205480223U (en) | 2015-12-31 | 2015-12-31 | High stable pottery COB encapsulation LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521124568.0U CN205480223U (en) | 2015-12-31 | 2015-12-31 | High stable pottery COB encapsulation LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205480223U true CN205480223U (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521124568.0U Expired - Fee Related CN205480223U (en) | 2015-12-31 | 2015-12-31 | High stable pottery COB encapsulation LED lamp |
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| CN (1) | CN205480223U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106469709A (en) * | 2016-08-30 | 2017-03-01 | 天津睿泽科技发展有限公司 | The ceramic substrate structure that IC integration packaging uses |
| CN106801796A (en) * | 2017-02-10 | 2017-06-06 | 广东工业大学 | A kind of LED circuit board |
| CN107842719A (en) * | 2017-11-17 | 2018-03-27 | 广东晶科电子股份有限公司 | A kind of COB packaged light sources and preparation method thereof |
| CN109272877A (en) * | 2018-07-31 | 2019-01-25 | 深圳市创显光电有限公司 | A kind of LED display of high integration |
-
2015
- 2015-12-31 CN CN201521124568.0U patent/CN205480223U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106469709A (en) * | 2016-08-30 | 2017-03-01 | 天津睿泽科技发展有限公司 | The ceramic substrate structure that IC integration packaging uses |
| CN106469709B (en) * | 2016-08-30 | 2019-12-06 | 天津睿泽科技发展有限公司 | Ceramic substrate structure for IC integrated package |
| CN106801796A (en) * | 2017-02-10 | 2017-06-06 | 广东工业大学 | A kind of LED circuit board |
| CN106801796B (en) * | 2017-02-10 | 2019-12-06 | 广东工业大学 | LED circuit board |
| CN107842719A (en) * | 2017-11-17 | 2018-03-27 | 广东晶科电子股份有限公司 | A kind of COB packaged light sources and preparation method thereof |
| CN109272877A (en) * | 2018-07-31 | 2019-01-25 | 深圳市创显光电有限公司 | A kind of LED display of high integration |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20171231 |