CN109272877A - A kind of LED display of high integration - Google Patents
A kind of LED display of high integration Download PDFInfo
- Publication number
- CN109272877A CN109272877A CN201810855000.8A CN201810855000A CN109272877A CN 109272877 A CN109272877 A CN 109272877A CN 201810855000 A CN201810855000 A CN 201810855000A CN 109272877 A CN109272877 A CN 109272877A
- Authority
- CN
- China
- Prior art keywords
- led
- chip
- pad
- high integration
- led display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
With the development of LED display technology, LED display spacing is smaller and smaller, and pixel unit density is higher and higher.However due to the SMD technique of LED encapsulation, pixel unit spacing limited by packaging body, is difficult further to reduce, thus COB display applications and give birth to.COB display screen technology solves the problems, such as LED packaging technology at present, but drive part still is limited to the volumetric constraint of SSOP-24 and the QFN-24 encapsulation of traditional integrated circuit, the wiring problem of pcb board can no doubt be solved for the moment even with multichannel integrated circuit, but the small clearance display screen of LED still can only accomplish scan screen.A kind of LED display of high integration, including basal disc, three-color LED chip, IC chip and gold thread and light transmission colloid, the basal disc includes integrated circuit pad, LED pad and external pad, and the three-color LED chip further includes issuing feux rouges, green light, blue light respectively.
Description
Technical field
The present invention relates to a kind of LED displays of high integration, are in particular a kind of integrated using integrated circuit
The LED display of packing forms.
Background technique
With the development of LED display technology, LED display spacing is smaller and smaller, and pixel unit density is higher and higher.So
And due to the SMD technique of LED encapsulation, pixel unit spacing is limited by packaging body, is difficult further to reduce, therefore COB is aobvious
Display screen is applied and is given birth to.COB display screen technology solves the problems, such as LED packaging technology at present, but drive part still is limited to pass
The volumetric constraint of SSOP-24 and the QFN-24 encapsulation of system integrated circuit, no doubt can be for the moment even with multichannel integrated circuit
The wiring problem of pcb board is solved, but the small clearance display screen of LED still can only accomplish scan screen.
It is well known that in order to realize the high index for refreshing high gray scale in more scan drive circuits, it is necessary to use built-in SRAM
PWM integrated circuit, the cost of integrated circuit brings very big promotion, simultaneously because the parasitism of LED light and horizontal drive circuit
Capacity effect, there are the problems of low ash effect, such as early stage to perplex the first of industry and sweep partially dark problem for small clearance display screen,
Later period high comparison coupled problem difficult to deal with, straddle color difference problem etc..
Summary of the invention
It is an object of the present invention to provide a kind of LED displays of multi-functional high integration, since the number of plies of the PCB of wiring subtracts
It is few, have than either traditional LED encapsulates small clearance display screen or COB display screen has in cost on the market at present absolute
Advantage, but also can accomplish static drive, thoroughly solve small clearance display screen first and sweep that partially dark, low ash is uneven, high comparison
The problems such as coupling, straddle color difference, promotion is haveed a qualitative leap in display effect.
To achieve the above object, the invention adopts the following technical scheme:
Design a kind of LED display of high integration, including basal disc, three-color LED chip, IC chip and gold thread and
Light transmission colloid, the basal disc include integrated circuit pad, LED pad and external pad, and the three-color LED chip further includes difference
Issue feux rouges, green light, blue light.
The LED pad and integrated circuit pad are distributed to be corresponded by connection.
The LED chip pad is connected with integrated circuit pad by gold thread.
The light transmission colloid further includes by high-precision dot gluing equipment epoxy resin red, turquoise chip and integrated circuit
Chip o'clock is at a pixel.
The LED chip and IC chip pass through 2*2 array packages in a whole pixel.Remove tradition SMD device
Part bracket concept and integrated circuit SSOP encapsulation and GFN encapsulate concept, have not only reduced material and facility cost, but also reduce PCB
Be routed to number.
The IC chip further includes providing constant current driving, has serial date transfer output function.
Detailed description of the invention: the 1) front schematic view of Fig. 1 apparatus of the present invention
2) schematic cross-section of Fig. 2 apparatus of the present invention
3) the LED chip schematic diagram of Fig. 3 apparatus of the present invention
4) the integrated circuit pad figure of Fig. 4 apparatus of the present invention
5) schematic rear view of Fig. 5 apparatus of the present invention
6) the multichannel spliced map of Fig. 6 apparatus of the present invention
1 indicates that LED pad, 2 indicate that IC chip, 3 indicate that multiple groups gold thread, 4 indicate external pad in figure, positioned at substrate
The back side, 5 indicate that light transmission colloid, 6 indicate that substrate, 7 indicate that LED chip, 8 indicate integrated circuit pad
Specific embodiment:
The present invention provides a kind of high integration display devices.The display device of that present invention includes: 6,4 three-color LED chips of substrate
7, multiple groups LED pad 1,2,1 groups of integrated circuit pads 8 of IC chip, a plurality of gold thread 3 and light transmission colloid 5, external pad 4.
With reference to attached drawing, first, in accordance with the point line space design substrate of setting, base is placed on according to the LED pad of 2*2 pixel arrangement
Position as defined in plate point spacing, integrated circuit pad are placed on the most central of substrate.
External pad is placed on the back side of substrate
Place IC chip
Place multiple groups LED chip
Gold thread is placed, so that IC chip is connected with LED chip
The LED display unit of last packing colloid, a 2*2 pixel arrangement is completed
The multichannel splicing that such as carry out 8*8, is shown in that 6 need of attached drawing two-by-two connect 2*2 pixel unit device i.e. by external pad
It can be achieved.
The foregoing is merely the preferred embodiments of this patent, are not intended to limit this patent, for those skilled in the art
For, this patent can be with various modifications and variations.Within the spirit and principles in the present invention, made any modification, is equally replaced
It changes, improve etc., it should be included in the protection scope of this patent.
Claims (6)
1. a kind of LED display of high integration, including basal disc, three-color LED chip, IC chip and gold thread and thoroughly
Optical cement body, it is characterised in that the basal disc further includes integrated circuit pad, LED pad and external pad, the three-color LED chip
It further include issuing feux rouges, green light, blue light respectively.
2. a kind of LED display of high integration according to claim 1, feature is just in the LED pad and collection
It is corresponded at circuit land distribution by connection.
3. a kind of LED display of high integration according to claim 1, it is characterised in that the LED chip pad
It is connected with integrated circuit pad by gold thread.
4. a kind of LED display of high integration according to claim 1, it is characterised in that the light transmission colloid also wraps
It includes through high-precision dot gluing equipment epoxy resin red, turquoise chip and IC chip o'clock into a pixel.
5. a kind of LED display of high integration according to claim 1, it is characterised in that the LED chip sum aggregate
At circuit chip by 2*2 array packages in a whole pixel.
6. a kind of LED display of high integration according to claim 1, it is characterised in that the IC chip
Further include that constant current driving is provided, there is serial date transfer output function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810855000.8A CN109272877A (en) | 2018-07-31 | 2018-07-31 | A kind of LED display of high integration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810855000.8A CN109272877A (en) | 2018-07-31 | 2018-07-31 | A kind of LED display of high integration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109272877A true CN109272877A (en) | 2019-01-25 |
Family
ID=65148206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810855000.8A Pending CN109272877A (en) | 2018-07-31 | 2018-07-31 | A kind of LED display of high integration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109272877A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968023A (en) * | 2021-02-05 | 2021-06-15 | 浙江英特来光电科技有限公司 | LED full-color display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102691981A (en) * | 2012-04-19 | 2012-09-26 | 浙江英特来光电科技有限公司 | High-density and integrally packaged RGB module and production method thereof |
| CN104979326A (en) * | 2015-07-09 | 2015-10-14 | 林谊 | LED lighting assembly, LED lighting panel and LED display screen |
| CN205480223U (en) * | 2015-12-31 | 2016-08-17 | 深圳市恒达光电子科技有限公司 | High stable pottery COB encapsulation LED lamp |
| CN106847803A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | A kind of surface-adhered type RGB LED encapsulation modules of integrated IC |
-
2018
- 2018-07-31 CN CN201810855000.8A patent/CN109272877A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102691981A (en) * | 2012-04-19 | 2012-09-26 | 浙江英特来光电科技有限公司 | High-density and integrally packaged RGB module and production method thereof |
| CN104979326A (en) * | 2015-07-09 | 2015-10-14 | 林谊 | LED lighting assembly, LED lighting panel and LED display screen |
| CN205480223U (en) * | 2015-12-31 | 2016-08-17 | 深圳市恒达光电子科技有限公司 | High stable pottery COB encapsulation LED lamp |
| CN106847803A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | A kind of surface-adhered type RGB LED encapsulation modules of integrated IC |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968023A (en) * | 2021-02-05 | 2021-06-15 | 浙江英特来光电科技有限公司 | LED full-color display device |
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