CN212230459U

CN212230459U - Display unit and display

Info

Publication number: CN212230459U
Application number: CN202020134735.4U
Authority: CN
Inventors: 刁鸿浩; 黄玲溪
Original assignee: Vision Technology Venture Capital Pte Ltd; Beijing Ivisual 3D Technology Co Ltd
Current assignee: Beijing Ivisual 3D Technology Co Ltd
Priority date: 2020-01-20
Filing date: 2020-01-20
Publication date: 2020-12-25
Anticipated expiration: 2030-01-20

Abstract

The application relates to the technical field of display, and discloses a display unit, which comprises: an insulating layer, a conductive layer and a light-transmitting carrier plate; the light emitting diode LED light emitting structure and the light conversion layer are arranged between the insulating layer and the light transmission carrier plate; the conductive layer is electrically connected with the LED light-emitting structure and is electrically connected with the conductive through hole in the insulating layer. The application also discloses a display. The display unit and the display avoid the peripheral wiring mode, so that the wiring frame does not exist, the display effect is improved, and the cost is reduced.

Description

Display unit and display

Technical Field

The present application relates to the field of display technology, for example to a display unit and a display.

Background

At present, when wiring for power supply, control and the like of a Light Emitting Diode (LED) display device is designed, a peripheral wiring manner is generally adopted.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

the peripheral wiring mode causes the LED display device to have wiring frames, the display effect is affected, and the cost is increased.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a display unit and a display, and aims to solve the technical problems that the LED display device has a wiring frame due to a peripheral wiring mode, the display effect is influenced, and the cost is increased.

The display unit that this disclosed embodiment provided includes:

an insulating layer, a conductive layer and a light-transmitting carrier plate; and

the LED light-emitting structure and the light conversion layer are arranged between the insulating layer and the light-transmitting carrier plate;

the conductive layer is electrically connected with the LED light-emitting structure and is electrically connected with the conductive through hole in the insulating layer.

In some embodiments, the light conversion layer may be disposed between the light transmissive carrier plate and the LED light emitting structure.

In some embodiments, the LED light emitting structure may be partially or fully disposed in the light conversion layer.

In some embodiments, in a case that the LED light emitting structure is partially disposed in the light conversion layer, the LED light emitting structure may be disposed on a side of the light conversion layer away from the light transmissive carrier.

In some embodiments, the peak wavelength of the excitation spectrum of the light conversion layer can include any wavelength or band of wavelengths greater than or equal to 200 nanometers and less than or equal to 480 nanometers.

In some embodiments, the wavelengths of the emission spectrum of the light conversion layer may include any wavelength or band of wavelengths greater than or equal to 490 nanometers and less than or equal to 720 nanometers.

In some embodiments, the light conversion layer may include at least one of: a red light conversion material, a green light conversion material, a white light conversion material, a blue light conversion material.

In some embodiments, the light conversion material may include a fluorescent material or a quantum dot material.

In some embodiments, the LED light emitting structure may comprise a micro LED light emitting device.

In some embodiments, the micro LED light emitting device may include an N-type layer, an active layer, and a P-type layer.

In some embodiments, the active layer may include a quantum well layer.

In some embodiments, the conductive layer may be electrically connected to the N-type layer or the P-type layer.

In some embodiments, the conductive layer may be disposed between the light-transmitting carrier plate and the light-converting layer. Alternatively, the conductive layer may be partially or entirely disposed in the light conversion layer. Alternatively, a conductive layer may be disposed between the LED light emitting structure and the insulating layer. Alternatively, the conductive layer may be partially or entirely disposed in the insulating layer.

In some embodiments, the conductive layer may be electrically connected to the conductive material filled in the conductive via of the insulating layer.

In some embodiments, the conductive layer may include at least two layers of conductive traces.

In some embodiments, the conductive traces can be arranged in a matrix.

In some embodiments, from the insulating layer to the light-transmitting carrier plate, there may be sequentially disposed: the LED light-emitting structure comprises a conductive layer, an LED light-emitting structure and a light conversion layer.

In some embodiments, an end of the conductive via in the insulating layer, which is far away from the conductive layer, may be electrically connected to the bonding element.

In some embodiments, the bonding member may include at least one of: pad, chip, Printed Circuit Board (PCB), flexible circuit board (FPC), connector.

The display provided by the embodiment of the disclosure comprises the display unit.

The display unit and the display provided by the embodiment of the disclosure can realize the following technical effects:

the peripheral wiring mode is avoided, so that a wiring frame does not exist, the display effect is improved, and the cost is reduced.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural diagram of a display unit provided in an embodiment of the present disclosure;

fig. 2A and fig. 2B are schematic views respectively illustrating an arrangement of a light conversion layer provided by an embodiment of the present disclosure;

fig. 3 is a schematic diagram of an arrangement of an LED light emitting structure provided by an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a micro LED light emitting device provided by an embodiment of the present disclosure;

fig. 5A, fig. 5B, fig. 5C, fig. 5D, and fig. 5E are schematic views respectively illustrating the arrangement of the conductive layer according to the embodiment of the disclosure;

fig. 6 is a schematic view of another arrangement of the conductive layer provided by the embodiment of the present disclosure;

fig. 7 is a schematic view of another arrangement of the conductive layer provided by the embodiment of the present disclosure;

FIG. 8 is a schematic diagram of an arrangement of insulating layers provided by an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a display provided in an embodiment of the present disclosure.

Reference numerals:

100: a display unit; 110: an insulating layer; 120: a conductive layer; 130: a light-transmitting carrier plate; 140: an LED light emitting structure; 150: a light conversion layer; 160: a conductive via; 170: an N-type layer; 180: an active layer; 190: a P-type layer; 210: a conductive material; 220: conducting wires; 230: a bonding piece; 240: a display.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

Referring to fig. 1, an embodiment of the present disclosure provides a display unit 100 including:

an insulating layer 110, a conductive layer 120, a transparent carrier 130; and

an LED light emitting structure 140 and a light conversion layer 150 disposed between the insulating layer 110 and the transparent carrier 130;

the conductive layer 120 is electrically connected to the LED light emitting structure 140 and electrically connected to the conductive via 160 in the insulating layer 110.

In some embodiments, the number of conductive vias 160 may be considered in accordance with practical considerations such as process requirements.

In some embodiments, the light conversion layer 150 may be disposed between the light-transmitting carrier plate 130 and the LED light emitting structure 140.

Referring to fig. 2A, in some embodiments, the LED light emitting structure 140 may be partially disposed in the light conversion layer 150.

Referring to fig. 2B, in some embodiments, the LED light emitting structures 140 may be entirely disposed in the light conversion layer 150.

In some embodiments, it is contemplated that the LED light emitting structure 140 may be partially disposed in the light conversion layer 150, or entirely disposed in the light conversion layer 150, depending on the actual process requirements and the like.

Referring to fig. 3, in some embodiments, in a case that the LED light emitting structure 140 is partially disposed in the light conversion layer 150, the LED light emitting structure 140 may be disposed on a side of the light conversion layer 150 away from the light transmissive carrier plate 130. Alternatively, in the case that the LED light emitting structure 140 is partially disposed in the light conversion layer 150, the LED light emitting structure 140 may also be disposed on one side of the light conversion layer 150 close to the light transmitting carrier 130.

In some embodiments, in the case that the LED light emitting structure 140 is partially disposed in the light conversion layer 150, the LED light emitting structure 140 can be disposed on a side of the light conversion layer 150 away from the light transmissive carrier 130 or a side of the light transmissive carrier 130 according to practical situations such as process requirements.

In some embodiments, the peak wavelength of the excitation spectrum of light conversion layer 150 can include any wavelength or band of wavelengths greater than or equal to 200 nanometers and less than or equal to 480 nanometers.

In some embodiments, the wavelengths of the emission spectrum of light conversion layer 150 may include any wavelength or band of wavelengths greater than or equal to 490 nanometers and less than or equal to 720 nanometers.

In some embodiments, the light conversion layer 150 can include at least one of: a red light conversion material, a green light conversion material, a white light conversion material, a blue light conversion material.

In some embodiments, the light conversion layer 150 may include epoxy, silicone glue, or the like, in which a light conversion material is mixed.

In some embodiments, the LED light emitting structure 140 may include a micro LED (micro LED) light emitting device.

Referring to fig. 4, in some embodiments, a micro LED light emitting device may include an N-type layer 170, an active layer 180, and a P-type layer 190. In fig. 4, the arrangement order among the N-type layer 170, the active layer 180, and the P-type layer 190 is exemplarily shown. Alternatively, active layer 180 is generally disposed between N-type layer 170 and P-type layer 190.

In some embodiments, the active layer 180 may include a quantum well layer. Alternatively, the quantum well layer may include at least one of a single quantum well layer and a multiple quantum well layer.

In some embodiments, conductive layer 120 may be electrically connected to N-type layer 170 or P-type layer 190.

In some embodiments, the number of conductive vias 160 may be considered based on the number of N-type layers 170 and P-type layers 190, as well as in combination with process requirements, among other practical considerations.

Referring to fig. 5A, in some embodiments, the conductive layer 120 may be disposed between the light-transmitting carrier plate 130 and the light-converting layer 150.

Referring to fig. 5B, in some embodiments, the conductive layer 120 may be partially disposed in the light conversion layer 150.

Referring to fig. 5C, in some embodiments, the conductive layer 120 may be entirely disposed in the light conversion layer 150.

In some embodiments, it is contemplated that the conductive layer 120 may be partially disposed in the light conversion layer 150 or entirely disposed in the light conversion layer 150, depending on the process requirements and the like.

Referring to fig. 1, in some embodiments, a conductive layer 120 may be disposed between the LED light emitting structure 140 and the insulating layer 110.

Referring to fig. 5D, in some embodiments, the conductive layer 120 may be partially disposed in the insulating layer 110.

Referring to fig. 5E, in some embodiments, the conductive layer 120 may be entirely disposed in the insulating layer 110.

In some embodiments, it is contemplated that the conductive layer 120 may be partially disposed in the insulating layer 110, or entirely disposed in the insulating layer 110, depending on process requirements, etc.

The arrangement of the conductive layer 120 can be determined according to the actual conditions such as the process requirements, as long as the normal conduction of the conductive layer 120 is not affected.

Referring to fig. 6, in some embodiments, the conductive layer 120 may be electrically connected to the conductive material 210 filled in the conductive via 160 of the insulating layer 110. Alternatively, the conductive material 210 filled in the conductive via 160 may be a metal, such as nickel or copper, which is conductive.

In some embodiments, the conductive material 210 may be filled into the walls of the conductive vias 160. Alternatively, the conductive material 210 may fill the entire conductive via 160, as long as the conductive material 210 can ensure the conductivity of the conductive via 160.

Referring to fig. 7, in some embodiments, the conductive layer 120 may include at least two layers of conductive traces 220. Fig. 7 only illustrates two layers of conductive traces 220. Optionally, the conductive layer 120 may include two, three, or more layers of conductive traces 220.

In some embodiments, the conductive traces 220 can be arranged in a matrix as shown in fig. 7. Optionally, in a case that the conductive layer 120 includes at least two layers of conductive traces 220, the structural relationship of each layer of conductive traces 220 may also be different from the matrix arrangement, but other arrangement forms.

In some embodiments, the number of layers of the conductive trace 220 included in the conductive layer 120 may be considered according to practical situations such as process requirements; the arrangement form of the conductive traces 220 in different layers can also be considered according to the actual conditions such as the process requirements.

In some embodiments, the conductive trace 220 may be a metal trace. Optionally, a non-metal with conductivity may be used as the conductive trace 220.

Referring to fig. 1, in some embodiments, from the insulating layer 110 to the light-transmitting carrier plate 130, there are sequentially disposed: a conductive layer 120, an LED light emitting structure 140, and a light conversion layer 150.

In some embodiments, different orders of arrangement than described above may be considered according to practical circumstances such as process requirements.

Referring to fig. 8, in some embodiments, an end of conductive via 160 in insulating layer 110, which is far from conductive layer 120, may be electrically connected to bonding element 230. Alternatively, bonding member 230 may be a different device having a different function; for example: bonding member 230 may be a device for providing load bearing, or bonding member 230 may be a device for controlling display unit 100, or bonding member 230 may be a device for providing electrical connections, etc.

In some embodiments, bonding member 230 may be: pads, chips, PCBs, flexible circuit boards (FPCs), connectors, etc.

In some embodiments, different display units 100 may be tiled together. Alternatively, the size of bonding element 230 may not exceed the coverage of display unit 100. Optionally, whether or not different display units 100 are tiled together, the size of bonding element 230 may also exceed the coverage of display units 100 without affecting the peripheral devices.

In some embodiments, the manner in which the different display units 100 are spliced together and the number of spliced display units 100 may be considered according to practical situations such as process requirements. Alternatively, it may be considered whether the size of the bonding member 230 exceeds the coverage of the display unit 100 according to actual conditions such as process requirements. No matter how the display units 100 are spliced together, and no matter whether the size of the bonding member 230 exceeds the coverage of the display units 100, no trace frame exists between the two spliced display units 100.

In some embodiments, the transparency of the light-transmitting carrier 130 can be flexibly set. Alternatively, the transparency of different regions in the light-transmitting carrier 130 may be the same or different.

In some embodiments, the light-transmitting carrier 130 may be a glass carrier, a flexible material carrier, an organic resin carrier, a touch screen, a sapphire carrier, or the like, as long as it can normally transmit light.

In some embodiments, the display unit 100 may perform 3D display.

Referring to fig. 9, a display 240 provided by the embodiment of the present disclosure includes a display unit 100.

In some embodiments, the display 240 may perform a 3D display.

In some embodiments, the display 240 may include at least one display unit 100; for example: the display 240 may include one, two, three, or more display units 100. Alternatively, the plurality of display units 100 constituting the display 240 may be in an array structure.

In some embodiments, in a display 240 made up of more than two display units 100, there is no trace bezel between the two display units 100 that are tiled together.

The display unit and the display provided by the embodiment of the disclosure avoid the peripheral wiring mode, so that no wiring frame exists, the display effect is improved, and the cost is reduced.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising one" does not exclude the presence of other like elements in a process, method or device that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.

In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit may be merely a division of a logical function, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

Claims

1. A display unit, comprising:

the light emitting diode LED light emitting structure and the light conversion layer are arranged between the insulating layer and the light transmitting carrier plate;

the conductive layer is electrically connected with the LED light-emitting structure and electrically connected with the conductive through hole in the insulating layer.

2. The display unit of claim 1,

the light conversion layer is arranged between the light transmission carrier plate and the LED light-emitting structure; or

The LED light emitting structure is partially or completely arranged in the light conversion layer.

3. The display unit according to claim 2, wherein the LED light emitting structure is disposed on a side of the light conversion layer away from the light transmissive carrier plate in a case where the LED light emitting structure is partially disposed in the light conversion layer.

4. The display unit of claim 1,

the peak wavelength of the excitation spectrum of the light conversion layer comprises any wavelength or waveband of more than or equal to 200 nanometers and less than or equal to 480 nanometers; or

The wavelength of the emission spectrum of the light conversion layer comprises any wavelength or waveband of 490 nm or more and 720 nm or less.

5. The display unit of claim 4, wherein the light conversion layer comprises at least one of: a red light conversion material, a green light conversion material, a white light conversion material, a blue light conversion material.

6. The display unit of claim 5, wherein the light conversion material comprises a fluorescent material or a quantum dot material.

7. The display unit of claim 1, wherein the LED light emitting structure comprises a micro LED light emitting device.

8. The display unit of claim 7, wherein the micro LED light emitting device comprises an N-type layer, an active layer, and a P-type layer.

9. The display cell of claim 8, wherein the active layer comprises a quantum well layer.

10. The display unit of claim 8, wherein the conductive layer is electrically connected to the N-type layer or the P-type layer.

11. The display unit according to any one of claims 1 to 10,

the conducting layer is arranged between the light-transmitting carrier plate and the light conversion layer; or

The conductive layer is partially or completely arranged in the light conversion layer; or

The conducting layer is arranged between the LED light-emitting structure and the insulating layer; or

The conductive layer is partially or fully disposed in the insulating layer.

12. The display unit of claim 11, wherein the conductive layer is electrically connected to a conductive material filled in the conductive via of the insulating layer.

13. The display unit of claim 11, wherein the conductive layer comprises at least two layers of conductive traces.

14. The display unit of claim 13, wherein the conductive traces are arranged in a matrix.

15. The display unit according to claim 1, wherein, from the insulating layer to the light-transmitting carrier plate, there are provided in order: the conducting layer, the LED light-emitting structure and the light conversion layer.

16. The display unit of any one of claims 1 to 10, wherein an end of the conductive via in the insulating layer, which is away from the conductive layer, is electrically connected to a bonding member.

17. The display unit of claim 16, wherein the bonding member comprises at least one of: pad, chip, printed circuit board PCB, flexible circuit board FPC, connector.

18. A display comprising a display unit according to any one of claims 1 to 17.