CN210073846U

CN210073846U - Light emitting diode and lamp

Info

Publication number: CN210073846U
Application number: CN201920971905.1U
Authority: CN
Inventors: 卢长军; 马莉; 余杰; 刘志勇
Original assignee: Leyard Optoelectronic Co Ltd
Current assignee: Leyard Optoelectronic Co Ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2020-02-14
Anticipated expiration: 2029-06-25

Abstract

The application provides a light-emitting diode and a lamp, the light-emitting diode comprises a substrate, an LED crystal grain and an active driving chip, wherein the anode and the cathode of the LED crystal grain are positioned on the same side of the LED crystal grain, the anode and the cathode are welded on the front surface of the substrate, pins of an active driving chip are also welded on the front surface of the substrate, the active driving chip is used for driving and lighting the LED crystal grains, wherein, the power supply terminal VCC of the active driving chip is connected to the anode of the LED crystal grain, the current output terminal of the active driving chip is connected to the cathode of the LED crystal grain, or, the power source terminal VCC of the active driving chip is connected to the cathode of the LED crystal grain, the current output end of the active driving chip is connected to the anode of the LED crystal grain, and by adopting the scheme, the lead wire is simple to connect, the space is saved, and the problem that the lead wire in the LED lamp is complex in the related technology is solved.

Description

Light emitting diode and lamp

Technical Field

The present application relates to, but is not limited to, the field of transistors, and in particular, to a light emitting diode and a lamp.

Background

In the related art, an LED die (light Emitting Diode, LED for short) and an IC chip (Integrated Circuit, IC for short) are separately and independently packaged, and when the technology is applied to display, the two are respectively disposed on two sides of a Printed Circuit Board (PCB), and electrical connection is realized through a Circuit in the PCB, which is a technology that the wiring difficulty of the PCB is high, and especially when the pixel pitch is smaller and smaller, the number of layers of the PCB needs to be increased to meet the design requirement; in the related art, an LED die and an IC chip are integrally packaged, a lead is disposed between an electrode of the LED die and a pin of a driver IC chip, and the LED die and the driver IC chip are electrically connected by the lead.

Aiming at the problem that the lead wire in the LED lamp in the related art is complex, no effective solution is available at present.

Disclosure of Invention

The embodiment of the application provides a light-emitting diode and a lamp, and aims to at least solve the problem that a lead in an LED lamp in the related art is complex.

According to an embodiment of the present application, there is provided a light emitting diode including: a substrate including a front side and a back side thereon; the anode and the cathode of the LED crystal grain are positioned on the same side of the LED crystal grain, and the anode and the cathode are welded on the front surface of the substrate; the LED chip comprises an active driving chip, wherein a pin of the active driving chip is welded on the front surface of the substrate, the active driving chip is used for driving and lighting the LED crystal grains, the power end VCC of the active driving chip is connected to the anode of the LED crystal grains, the current output end of the active driving chip is connected to the cathode of the LED crystal grains, or the power end VCC of the active driving chip is connected to the cathode of the LED crystal grains, and the current output end of the active driving chip is connected to the anode of the LED crystal grains.

According to another embodiment of the present application, there is also provided a luminaire including: a plurality of light emitting diodes as set forth in the above embodiments, and a PCB board for establishing electrical connection with the back surfaces of the substrates of the plurality of light emitting diodes.

The application provides a structure of a light-emitting diode, which comprises a substrate, an LED crystal grain and an active drive chip, wherein the substrate comprises a front surface and a back surface, the anode and the cathode of the LED crystal grain are positioned at the same side of the LED crystal grain, the anode and the cathode are both welded at the front surface of the substrate, a pin of the active drive chip is also welded at the front surface of the substrate, the active drive chip is used for driving and lightening the LED crystal grain, wherein the VCC of the power end of the active drive chip is connected to the anode of the LED crystal grain, the current output end of the active drive chip is connected to the cathode of the LED crystal grain, or the VCC of the active drive chip is connected to the cathode of the LED crystal grain, the current output end of the active drive chip is connected to the anode of the LED crystal grain, the scheme is adopted, the LED crystal grain and the active drive, the LED crystal grains are driven and lightened by the active driving chip, the lead is simple to connect, the space is saved, and the problem that the lead in the LED lamp is complex in the related technology is solved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic diagram of a light emitting diode according to an embodiment of the present application;

FIG. 2 is a schematic illustration of soldering of the front side of a substrate according to another embodiment of the present application;

fig. 3 is a schematic diagram of a pad location on the backside of a substrate according to another embodiment of the present application.

Detailed Description

The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

The following technical terms in the present document are explained:

the flip chip bonding technique is a technique in which an IC chip is directly connected to a package case or a wiring substrate with its surface facing downward, and is also called a flip chip bonding technique.

Example one

According to another embodiment of the present application, there is provided a light emitting diode, and fig. 1 is a schematic view of a light emitting diode according to an embodiment of the present application, as shown in fig. 1, the light emitting diode including:

a substrate 102 comprising a front side 104 and a back side thereon;

the positive electrode and the negative electrode of the LED crystal grain 106 are positioned on the same side of the LED crystal grain, and the positive electrode and the negative electrode are welded on the front surface of the substrate;

the LED die typically has multiple faces, e.g., 6 faces, and the positive and negative electrodes in this document are located on the same face of the multiple faces.

The active driving chip 108, pins of the active driving chip 108 are soldered to the front surface of the substrate, a power source terminal VCC (VCC for short) of the active driving chip 108 is connected to the anode of the LED die, a Current output terminal of the active driving chip 108 is connected to the cathode of the LED die 106, and LS is used as a Current output terminal in fig. 1, where the active driving chip 108 is used for driving and lighting the LED die 106.

Alternatively, the power source terminal VCC of the active driving chip 108 is connected to the cathode of the LED die 106, and the current output terminal of the active driving chip 108 is connected to the anode of the LED die 106.

By adopting the scheme, the LED crystal grains and the active driving chip are welded on the front surface of the substrate, the LED crystal grains are driven and lightened by the active driving chip, the lead connection is simple, the space is saved, and the problem that the lead in the LED lamp is complex in the related technology is solved.

Optionally, the substrate is a multilayer board, and a connection circuit is disposed inside the substrate. By adopting the scheme, the substrate is a multilayer board, and the multilayer boards can be mutually connected.

Optionally, the pins of the active driving chip are soldered to the front surface of the substrate, and the method includes: each pin of the active driving chip is flip-chip welded on a corresponding bonding pad on the front surface of the substrate; wherein, the active driving chip at least comprises the following pins: the circuit comprises a power supply terminal VCC, a ground terminal GND (ground), a DATA input terminal DATA, a scanning control signal terminal S _ SIG, a first current output terminal, a second current output terminal and a third current output terminal.

Optionally, the LED die is a set of RGB LED dies, the set of RGB LED dies including: Red-LED dies, Green-LED dies, and Blue-LED dies.

Optionally, the positive electrode and the negative electrode are both welded on the front surface of the substrate, and the method includes: the anode of the Red-LED crystal grain is in flip-chip welding with a first bonding pad on the front surface of the substrate, and the cathode of the Red-LED crystal grain is in flip-chip welding with a second bonding pad on the front surface of the substrate; the anode of the Green-LED crystal grain is in flip-chip bonding with the third bonding pad on the front surface of the substrate, and the cathode of the Green-LED crystal grain is in flip-chip bonding with the fourth bonding pad on the front surface of the substrate; and the anode of the Blue-LED crystal grain is in flip-chip bonding with the fifth bonding pad on the front surface of the substrate, and the cathode of the Blue-LED crystal grain is in flip-chip bonding with the sixth bonding pad on the front surface of the substrate. By adopting the scheme, different poles of the LED crystal grains are welded to different welding pads on the front surface of the substrate.

Optionally, the power source terminal VCC of the active driving chip is connected to the anode of the LED die, and the current output terminal of the active driving chip is connected to the cathode of the LED die, including: the positive electrode of the Red-LED crystal grain, the positive electrode of the Green-LED crystal grain and the positive electrode of the Blue-LED crystal grain are respectively and electrically connected with the VCC end of the active driving chip through a connecting circuit in the substrate; connecting the cathode of the Red-LED crystal grain with the first current output end through a connecting circuit in the substrate, connecting the cathode of the Green-LED crystal grain with the second current output end, and connecting the cathode of the Blue-LED crystal grain with the third current output end; alternatively, the first and second electrodes may be,

the power end VCC of the active driving chip is connected to the cathode of the LED crystal grain, the current output end of the active driving chip is connected to the anode of the LED crystal grain, and the LED driving chip comprises: the negative electrode of the Red-LED crystal grain, the negative electrode of the Green-LED crystal grain and the negative electrode of the Blue-LED crystal grain are respectively and electrically connected with the VCC end of the active driving chip through a connecting circuit in the substrate; and connecting the anode of the Red-LED crystal grain with the first current output end through a connecting circuit in the substrate, connecting the anode of the Green-LED crystal grain with the second current output end, and connecting the anode of the Blue-LED crystal grain with the third current output end.

Optionally, the following pins of the active driving chip are led out to the back surface of the substrate through a connection circuit inside the substrate: the power supply terminal VCC, the ground terminal GND, the DATA input terminal DATA, and the scanning control signal terminal S-SIG; and a bonding pad corresponding to the power supply terminal VCC, a bonding pad corresponding to the ground terminal GND, a bonding pad corresponding to the DATA input terminal DATA, and a bonding pad corresponding to the scanning control signal terminal S-SIG are arranged on the back surface of the substrate.

Optionally, the LED die and the active driving chip are wrapped by a package adhesive, the package adhesive in the area where the LED die is located is a transparent package adhesive, and the package adhesive in the area where the LED die is not located is an opaque black adhesive. By adopting the scheme, the LED crystal grains and the active driving chip are distinguished by adopting the adhesive tapes with different transparencies, and the display contrast is ensured.

Optionally, the light emitting diode further comprises: and the printed circuit PCB is used for establishing electrical connection with the back surface of the substrate. By adopting the scheme, the PCB board is large enough and can be electrically connected with other light-emitting diodes, namely the PCB board can also belong to other light-emitting diodes and is shared by a plurality of light-emitting diodes, thereby forming an integral lamp tube.

According to another embodiment of the present application, there is also provided a luminaire including:

a plurality of light emitting diodes as described in the above embodiments;

a PCB board for establishing electrical connection with the back side of the substrate of the plurality of light emitting diodes.

The following description is made in conjunction with another embodiment of the present application.

Another embodiment of the present application provides an LED lamp, which includes a substrate, a set of RGB LED dies, and a driving IC chip, wherein the driving IC chip is an active driving chip (AM chip) for driving and lighting the RGB LED dies. The driving IC chip comprises a power supply terminal VCC, a ground terminal GND, a DATA input terminal DATA, a scanning control signal terminal S _ SIG and three current output terminals. The positive and negative electrodes of the RGB LED crystal grain are positioned on the same side.

The substrate is a multilayer board, and the substrate contains a connecting circuit. A plurality of bonding pads are arranged on one surface of the substrate in advance, and seven pins of the driving IC chip are respectively welded on the corresponding bonding pads. A group of RGB LED dies includes a Red-LED die, a Green-LED die, and a Blue-LED die, each die having a positive and a negative electrode. Respectively flip-chip welding the anode and the cathode of the Red-LED crystal grain on corresponding bonding pads on one surface of the substrate; respectively flip-chip welding the anode and the cathode of the Green-LED crystal grain on corresponding bonding pads on one surface of the substrate; and respectively flip-chip welding the anode and the cathode of the Blue-LED crystal grain on corresponding bonding pads on one surface of the substrate.

Then, the positive electrode of the Red-LED crystal grain, the positive electrode of the Green-LED crystal grain and the positive electrode of the Blue-LED crystal grain are respectively and electrically connected with the VCC end of the drive IC chip by utilizing a connecting circuit which is arranged in the substrate in advance; the negative electrodes of the Red-LED crystal grains, the Green-LED crystal grains and the Blue-LED crystal grains are respectively and electrically connected with the current output end of the drive IC chip by utilizing a connecting circuit which is arranged in the substrate in advance, each negative electrode of the LED crystal grains is correspondingly connected with one current output end, namely the negative electrodes of the LED crystal grains are electrically connected with the current output ends in a one-to-one correspondence manner; therefore, the effect of lightening the RGB LED crystal grains by using the driving IC chip is achieved. Fig. 2 is a schematic diagram of bonding on the front surface of a substrate according to another embodiment of the present application, as shown in fig. 2, in an LED lamp, an LED die is flip-chip bonded to a pad already arranged on one surface of the substrate, and a driver IC chip is flip-chip bonded to a pad already arranged on one surface of the substrate. The electrodes of the LED crystal grains are electrically connected with the electrodes of the driving IC chip through a connecting circuit in the substrate. The positive electrodes of the RGB LEDs are electrically connected to the power source terminal VCC of the driver IC chip, the negative electrodes of the RGB LEDs are electrically connected to the current output terminals of the driver IC chip in a one-to-one correspondence, and LS in fig. 2 represents the current output terminal.

The power supply terminal VCC, the ground terminal GND, the DATA input terminal DATA of the driving IC chip, and the scanning control signal terminal S _ SIG are led out to the other surface of the substrate (namely the back surface of the substrate) through a connecting circuit in the substrate. The back surface of the substrate is provided with four bonding pads which respectively correspond to a VCC end, a GND end, a DATA end and an S _ SIG end of the driving IC chip. The four pads on the back side of the substrate are used to electrically connect the LED lamp to the PCB, fig. 3 is a schematic diagram of the location of the pads on the back side of the substrate according to another embodiment of the present application, and as shown in fig. 3, there are 4 pads 304 on the back side 302 of the substrate.

In the related art, the display contrast is affected by adopting glue with the same transparency to package the LED die and the driver IC chip, and in order to solve the above problem, another embodiment of the present application provides an LED lamp further including a package glue covering one surface of the substrate (i.e., the front surface of the substrate) for completely wrapping the RGB LED die and the driver IC chip. Transparent packaging glue is correspondingly arranged in the area for placing the RGB LED crystal grains, and opaque black glue is correspondingly arranged in the rest areas.

By adopting the scheme, the following technical effects are realized.

a. And single-pixel independent driving is realized, and the driving current and the product power consumption are reduced.

b. The LED chip and the driving IC chip are integrally packaged, the PCB wiring difficulty in display application is reduced, and the driving IC is not required to be arranged on the PCB, so that the production cost can be reduced.

c. And the LED crystal grains and the drive IC chip are all subjected to flip-chip welding, so that the reliability of the element is effectively improved.

d. And the LED crystal grains and the drive IC chip are respectively packaged by adopting glue with different transparencies, so that the display contrast is greatly improved.

Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but the former is a better implementation mode in many cases. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present application.

It will be apparent to those skilled in the art that the modules or steps of the present application described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and alternatively, they may be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A light emitting diode, comprising:

a substrate including a front side and a back side thereon;

the LED comprises an LED crystal grain, wherein the anode and the cathode of the LED crystal grain are positioned on the same side of the LED crystal grain, and the anode and the cathode are welded on the front surface of the substrate;

the LED chip comprises an active driving chip, wherein a pin of the active driving chip is welded on the front surface of the substrate, the active driving chip is used for driving and lighting the LED crystal grains, the power end VCC of the active driving chip is connected to the anode of the LED crystal grains, the current output end of the active driving chip is connected to the cathode of the LED crystal grains, or the power end VCC of the active driving chip is connected to the cathode of the LED crystal grains, and the current output end of the active driving chip is connected to the anode of the LED crystal grains.

2. The led of claim 1, wherein the substrate is a multi-layer board, and the substrate has a connection circuit disposed therein.

3. The light-emitting diode according to claim 1,

the pin welding of active driver chip is in the base plate front side includes: each pin of the active driving chip is flip-chip welded on a corresponding bonding pad on the front surface of the substrate;

wherein, the active driving chip at least comprises the following pins: the scanning circuit comprises a power supply terminal VCC, a ground terminal GND, a DATA input terminal DATA, a scanning control signal terminal S _ SIG, a first current output terminal, a second current output terminal and a third current output terminal.

4. The light-emitting diode according to claim 3,

the LED die is a group of RGB LED dies, the group of RGB LED dies comprises: Red-LED crystal grain, Green-LED crystal grain and Blue-LED crystal grain;

the positive pole with the negative pole all welds the base plate is positive, includes:

the anode of the Red-LED crystal grain is in flip-chip welding with a first bonding pad on the front surface of the substrate, and the cathode of the Red-LED crystal grain is in flip-chip welding with a second bonding pad on the front surface of the substrate;

the anode of the Green-LED crystal grain is in flip-chip bonding with the third bonding pad on the front surface of the substrate, and the cathode of the Green-LED crystal grain is in flip-chip bonding with the fourth bonding pad on the front surface of the substrate;

and the anode of the Blue-LED crystal grain is in flip-chip bonding with the fifth bonding pad on the front surface of the substrate, and the cathode of the Blue-LED crystal grain is in flip-chip bonding with the sixth bonding pad on the front surface of the substrate.

5. The light-emitting diode according to claim 4,

the power end VCC of the active driving chip is connected to the anode of the LED crystal grain, the current output end of the active driving chip is connected to the cathode of the LED crystal grain, and the LED driving chip comprises: the positive electrode of the Red-LED crystal grain, the positive electrode of the Green-LED crystal grain and the positive electrode of the Blue-LED crystal grain are respectively and electrically connected with the VCC end of the active driving chip through a connecting circuit in the substrate; connecting the cathode of the Red-LED crystal grain with the first current output end through a connecting circuit in the substrate, connecting the cathode of the Green-LED crystal grain with the second current output end, and connecting the cathode of the Blue-LED crystal grain with the third current output end; alternatively, the first and second electrodes may be,

6. The LED of claim 5, wherein the following pins of the active driving chip are led out to the back side of the substrate through a connection circuit inside the substrate:

the power supply terminal VCC, the ground terminal GND, the DATA input terminal DATA, and the scanning control signal terminal S-SIG;

and a bonding pad corresponding to the power supply terminal VCC, a bonding pad corresponding to the ground terminal GND, a bonding pad corresponding to the DATA input terminal DATA, and a bonding pad corresponding to the scanning control signal terminal S-SIG are arranged on the back surface of the substrate.

7. The light-emitting diode according to claim 1,

the LED crystal grains and the active driving chip are wrapped by packaging glue, the packaging glue of the area where the LED crystal grains are located is transparent packaging glue, and the packaging glue of the area where the LED crystal grains are not located is opaque black glue.

8. The light-emitting diode according to any one of claims 1 to 6, further comprising:

and the PCB is used for establishing electrical connection with the back surface of the substrate.

9. A light fixture, comprising:

a plurality of the light emitting diodes of any one of claims 1 to 7;