JP2013140823A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device suitable for power supplies with various capacities, and a light-emitting device with an improved light extraction efficiency capable of increasing a series connection number, in the light-emitting device in which a plurality of light-emitting elements are arranged on a substrate.SOLUTION: A light-emitting device comprises: a substrate; a light-emission part comprising a plurality of light-emitting elements arranged to a mounting region on the substrate; a positive electrode and a negative electrode each having a pad part and a wiring part and applying a voltage to the light-emission part via the wiring part; and a light reflection resin formed on the substrate so as to cover at least the wiring part. A relay wiring part is formed along the circumference of the mounting region. The relay wiring part is covered with the light reflection resin.

Description

  The present invention relates to a light emitting device that can be used as a lighting source such as an LED bulb, a display device, a display, a backlight light source of a liquid crystal display, and the like.

  2. Description of the Related Art In recent years, various light emitting devices have been developed that use light emitting diodes (LEDs) as light emitting elements that generate less heat and consume less power than incandescent light sources such as incandescent bulbs.

  For example, in Patent Document 1, a base on which a plurality of light emitting diode elements are mounted, a printed circuit board disposed on the upper surface of the base, and a region on which the plurality of light emitting diode elements are mounted are sandwiched between the printed circuit boards. There has been proposed a light-emitting diode light source unit including a cathode and an anode terminal electrode.

  Moreover, in patent document 2, the board | substrate with which the glass layer was formed in the upper part, the some LED chip installed on the glass layer, and the positive electrode exterior formed so that several LED chip might be pinched | interposed on a glass layer A light-emitting device including a connection terminal and a negative electrode external connection terminal has been proposed.

JP 2006-295085 A (see FIG. 1) Japanese Patent Laying-Open No. 2010-034487 (see FIG. 7B)

  Conventionally, in order to improve the luminance of a light emitting device, development of a light emitting device in which several tens of light emitting elements are arranged on a substrate has been actively conducted. And in such a light-emitting device mounted with a plurality of light-emitting elements, the light-emitting device cannot be driven or the voltage needs to be boosted due to the capacity of the power source connected to the light-emitting device, and the light-emitting efficiency deteriorates. Problems occur. For example, in a light emitting device in which 10 light emitting elements having a forward voltage Vf of 3 V are connected in series, it is preferable to use a power supply with a capacity of 30 V, and when a power supply with a capacity of 20 V is used, the voltage needs to be boosted and driven. In addition, if a 60V power source is used, the light emission efficiency is deteriorated. In other words, a light emitting device suitable for the capacity of a power source connected to the light emitting device is desired, and in a light emitting device in which a plurality of light emitting elements are arranged, it depends on how many light emitting elements are connected in series. become. However, there is a limit to the size of the light-emitting device, and the number of light-emitting elements connected in series provided in a light-emitting device of a certain size is also limited, as brightness improvement is required.

  The present invention has been made in view of the above-described problems, and provides a light-emitting device suitable for a power supply having various capacities, and can increase the number of series connections and improve light extraction efficiency. It is an object to provide a light-emitting device.

  In order to solve the above problems, a light-emitting device according to the present invention includes a substrate, a light-emitting unit including a plurality of light-emitting elements arranged in a mounting region on the substrate, and a pad unit and a wiring unit, A light emitting device comprising: a positive electrode and a negative electrode that apply a voltage to the light emitting unit through the wiring unit; and a light reflecting resin formed on the substrate so as to cover at least the wiring unit, wherein the mounting region A relay wiring portion is formed along the periphery of the, and the relay wiring portion is covered with the light reflecting resin.

  According to such a configuration, the number of light emitting elements connected in series can be increased within a limited area of the mounting region, and the loss of emitted light can be reduced, and the light extraction efficiency is improved. An improved light emitting device can be obtained.

  The plurality of light-emitting elements each include a p-electrode formed on one side and an n-electrode formed on the other side, and the plurality of light-emitting elements are connected to the relay wiring portion with respect to the p-electrode. It is preferable to include a light emitting element connected to the electrode and a light emitting element connected to the n electrode.

  According to such a configuration, the light emitting elements connected in series from the positive electrode and the light emitting elements connected in series toward the negative electrode can be connected, and the number of light emitting elements connected in series as the light emitting device is increased. be able to. Furthermore, within a limited area of the mounting area, a plurality of light emitting elements can be densely arranged, and a light emitting device with improved power consumption with respect to constant luminance or light emission with respect to constant power consumption. A light-emitting device with improved efficiency can be obtained.

  The p-electrode is arranged so as to face one direction with respect to the mounting region between the positive wiring portion and the relay wiring portion, and between the negative wiring portion and the relay wiring portion. It is preferable that the p electrodes are arranged so as to face the other direction with respect to the mounting region.

  According to such a configuration, the relay wiring portion is formed along the periphery of the mounting area, and the light emitting elements are arranged so that the direction is reversed with the relay wiring portion as a boundary, thereby connecting the light emitting elements to each other. The number of light emitting elements connected in series can be increased within a limited area of the mounting region without complicating wiring to be performed. Furthermore, within a limited area of the mounting area, a plurality of light emitting elements can be densely arranged, and a light emitting device with improved power consumption with respect to constant luminance or light emission with respect to constant power consumption. A light-emitting device with improved efficiency can be obtained.

Further, it is preferable that a plurality of the relay wiring portions are provided and a part of the plurality of light emitting elements is sandwiched between the two relay wiring portions.
According to such a configuration, the number of serial connections between the light emitting elements can be further increased within a limited area of the mounting region without complicating the wiring for connecting the light emitting elements. Furthermore, within a limited area of the mounting area, a plurality of light emitting elements can be densely arranged, and a light emitting device with improved power consumption with respect to constant luminance or light emission with respect to constant power consumption. A light-emitting device with improved efficiency can be obtained.

  Moreover, it is preferable that the light emitting device according to the present invention has a configuration in which the plurality of light emitting elements are electrically connected to each other in series and in parallel by wires.

  According to such a configuration, by connecting a plurality of light emitting elements in parallel as well as in series, even if there is a variation in the forward voltage drop for each of the plurality of light emitting elements, they are connected in parallel. The forward voltage drop of the light emitting elements can be made equal. Thereby, the light emission nonuniformity by the dispersion | variation in the forward voltage drop between light emitting elements can be suppressed.

  Moreover, it is preferable that the light emitting device according to the present invention has a configuration in which the reflective resin is formed so as to surround the mounting area.

  According to such a configuration, by forming the light reflecting resin so as to surround the periphery of the mounting region, the light toward the periphery of the mounting region of the substrate can also be reflected by the light reflecting resin. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device can be improved.

  In addition, the light emitting device according to the present invention preferably has a configuration in which a metal film is formed on the mounting region, and the plurality of light emitting elements are arranged via the metal film.

  According to such a configuration, by forming a metal film on the mounting region and disposing a plurality of light emitting elements thereon, light directed toward the mounting region side of the substrate can also be reflected by the metal film. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device can be improved.

  Moreover, it is preferable that the light emitting device according to the present invention has a configuration in which the light reflecting resin is formed so as to cover a part of the periphery of the mounting region.

  According to such a configuration, by forming the light reflecting resin so as to cover a part of the periphery of the mounting region, a region where the substrate is exposed is formed between the wiring portion and the metal film on the mounting region. Nothing will happen. Therefore, since all the light emitted from the light emitting element can be reflected in the inner region where the light reflecting resin is formed, the loss of the emitted light can be reduced to the maximum, and the light extraction efficiency of the light emitting device can be reduced. Can be further improved.

  According to the light emitting device of the present invention, the number of light emitting elements connected in series can be increased and the loss of emitted light can be reduced within the limited area of the mounting region, and light extraction can be performed. A light-emitting device with improved efficiency can be obtained.

It is a perspective view which shows the whole structure of the light-emitting device which concerns on embodiment of this invention. It is a front view which shows the structure of the light-emitting device which concerns on 1st Embodiment of this invention. It is an enlarged front view which shows the structure of the light emitting element which concerns on 1st Embodiment. It is a side view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is a front view which shows the structure of the other light-emitting device which concerns on 1st Embodiment of this invention. It is a front view which shows the structure of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a front view which shows the structure of the light-emitting device which concerns on 3rd Embodiment of this invention.

  Hereinafter, light-emitting devices according to embodiments of the present invention will be described with reference to the drawings. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members in principle, and the detailed description will be omitted as appropriate. 2 and 5 to 7 referred to in the following description, the p-electrode and the n-electrode (see FIG. 3) of the light-emitting element are arranged at four locations on the mounting region or 6 in order to indicate the direction of each light-emitting element. Only the portions are illustrated, and illustration is omitted in other portions on the mounting area.

[First Embodiment]
The light emitting device 101 according to the first embodiment will be described in detail with reference to FIGS. In the following description, the overall configuration of the light emitting device 101 is described first, and then each configuration is described. For convenience of explanation, the light reflecting resin 6 in FIGS. 2 and 5 is shown in a state in which only the outer shape is shown by lines and transmitted. 6 and 7 described in other embodiments are also shown in a transparent state.

<Overall configuration>
The light emitting device 101 is a device used for a lighting device such as an LED bulb, a display device, a display, a backlight light source of a liquid crystal display, or the like. As shown in FIGS. 1, 2, and 4, the light emitting device 101 includes a substrate 1, a plurality of light emitting elements 2 arranged in a mounting region 1 a of the substrate 1, and a positive electrode 3 and a negative electrode 4 formed on the substrate 1. And the relay wiring portion 8 formed separately from the positive electrode 3 and the negative electrode 4, the electronic components such as the light emitting element 2, the positive electrode 3, the negative electrode 4, the relay wiring portion 8 and the light emitting element 2, and the light emitting elements 2 to each other. A wire W to be connected and a light reflecting resin 6 formed on the substrate 1 are provided as main components. Here, the light emitting device 101 has a configuration in which the light reflecting resin 6 is filled with the sealing member 7.

<Board>
The substrate 1 is for arranging electronic components such as the light emitting element 2. As shown in FIGS. 1 and 2, the substrate 1 is formed in a rectangular flat plate shape. On the substrate 1, a mounting region 1 a for arranging a plurality of light emitting elements 2 is defined as shown in FIG. 2. The size of the substrate 1 is not particularly limited, and can be appropriately selected according to the purpose and application such as the number of the light emitting elements 2.

As a material for the substrate 1, an insulating material is preferably used, and a material that hardly transmits light emitted from the light-emitting element 2, external light, or the like is preferably used. Moreover, it is preferable to use a material having a certain degree of strength. Specific examples include ceramics (Al ₂ O ₃ , AlN, etc.), phenol resins, epoxy resins, polyimide resins, BT resins (bismaleimide triazine resin), polyphthalamide (PPA), and the like.

<Mounting area>
The mounting area 1 a is an area for arranging a plurality of light emitting elements 2. As shown in FIG. 2, the mounting area 1 a is partitioned into a central area of the substrate 1. The mounting region 1a is formed in a predetermined shape having sides facing each other, and more specifically, is formed in a substantially rectangular shape with rounded corners as shown in FIG. The size of the mounting region 1a is not particularly limited, and can be appropriately selected according to the purpose and application such as the number of light emitting elements 2 and the arrangement interval.

  A part of the wiring part 3b and a part of the wiring part 4b are formed around the mounting area 1a along the left side of the mounting area 1a in the front view of FIG. A part of the wiring part 4b is formed along the side of the wiring, and the relay wiring part 8 is formed along the right side of the mounting region 1a. Here, the periphery of the mounting region 1a means a periphery at a predetermined interval from the periphery of the mounting region 1a, as shown in FIG.

  The mounting region 1a may be a region partitioned on the substrate 1 for arranging the plurality of light emitting elements 2, that is, a region made of the same material as the substrate 1, but for example, reflects light on the mounting region 1a. It is preferable to form a metal film and arrange a plurality of light emitting elements 2 through the metal film. Thus, by forming the metal film on the mounting region 1a and arranging the plurality of light emitting elements 2 thereon, the light emitted from the light emitting element 2 is also directed toward the mounting region 1a of the substrate 1. It can be reflected by the metal film. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 101 can be improved.

The metal film formed on the mounting region 1a is preferably formed by electrolytic plating or electroless plating. The material of the metal film is not particularly limited as long as it can be plated. For example, Ag (silver) or Au (gold) is preferably used, and Ag (silver) is particularly preferably used. Au has a characteristic of easily absorbing light. For example, the light reflectance can be increased by further forming a TiO ₂ film on the surface of Au plating. In addition, since Ag has a higher light reflectance than Au, the light extraction efficiency of the light-emitting device 101 can be improved compared to plating with Au alone. The thickness of the metal film formed on the mounting region 1a is not particularly limited and can be appropriately selected according to the purpose and application.

  In the present embodiment, as shown in FIGS. 1 and 4, a sealing member 7 to be described later is filled in the upper portion of the mounting region 1 a, and the plurality of light emitting elements 2 on the mounting region 1 a and the plurality of light emitting elements 2 are included. The wire W connected to is protected from dust, moisture, external force and the like.

<Light emitting element>
The light emitting element 2 is a semiconductor element that emits light by applying a voltage. As shown in FIG. 2, a plurality of light emitting elements 2 are arranged in the mounting region 1 a of the substrate 1, and the plurality of light emitting elements 2 together constitute a light emitting unit 20 of the light emitting device 101. The light emitting element 2 is bonded to the mounting region 1a by a bonding member (not shown). As a bonding method, for example, a bonding method using resin or solder paste as the bonding member can be used. Note that the illustrated light emitting unit 20 simply indicates a region where the light emitting element 2 is placed, and it is needless to say that light emission in the light emitting unit is light emitted from the light emitting element 2.

  Each of the light emitting elements 2 is formed in a rectangular shape as shown in FIG. As shown in FIG. 3, the light emitting element 2 is a face-up (FU) element in which a p electrode 2 </ b> A is provided on one side of the upper surface and an n electrode 2 </ b> B is provided on the other side of the light emitting element 2. In the present embodiment, the metal film 30 on which the light-emitting element 2 is placed and the metal member 40 that constitutes the positive electrode 3 and the negative electrode 4 are arranged apart from each other, and therefore, as shown in FIG. It is preferable to use a light emitting element formed on the same surface side and adhere the surface opposite to the electrode forming surface to the metal film 30. As shown in FIG. 3, the p electrode 2A and the n electrode 2B are auxiliary electrodes for diffusing the current supplied to the light emitting element 2 and the p pad electrode 2Aa and the n pad electrode 2Ba which are electrode terminals. Each of the extending conductive portions 2Ab and 2Bb is provided. In the light emitting element, at least the p pad electrode 2Aa and the n pad electrode 2Ba need only be on the same surface side, and the extended conductive portions 2Ab and 2Bb need not be provided. Although not shown, the light emitting element 2 has a structure in which a plurality of semiconductor layers including an n-type semiconductor layer and a p-type semiconductor layer are stacked in a side view.

Specifically, a light-emitting diode is preferably used as the light-emitting element 2, and a light-emitting element having an arbitrary wavelength can be selected according to the application. For example, as a light emitting element 2 of blue (light with a wavelength of 430 nm to 490 nm) and green (light with a wavelength of 490 nm to 570 nm), ZnSe, nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X , 0 ≦ Y, X + Y ≦ 1), GaP, or the like can be used. Further, as the red light emitting element 2 (light having a wavelength of 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used.

As will be described later, when a fluorescent material is introduced into the sealing member 7 (see FIG. 1), a nitride semiconductor (In _X Al _Y Ga ₁ capable of emitting light of a short wavelength that can efficiently excite the fluorescent material). _-X-YN , 0≤X, 0≤Y, X + Y≤1) are preferably used. However, the component composition, emission color, size, and the like of the light emitting element 2 are not limited to the above, and can be appropriately selected according to the purpose. Moreover, the light emitting element 2 can also be comprised with the element which outputs not only the light of a visible light range but an ultraviolet-ray and infrared rays. In order to increase the output, the number of light emitting elements 2 is preferably in the range of, for example, 10 or more and 20 to 150.

  As shown in FIG. 2, the light emitting elements 2 are arranged at equal intervals in the vertical direction and the horizontal direction on the mounting area 1a. Here, a total of 40 light emitting elements 8 × 5 horizontal elements are arranged. Yes. As shown in FIG. 2, the light emitting elements 2 are connected in series by electrically connecting the light emitting elements 2 adjacent to each other in the horizontal direction with respect to the mounting region 1a by a conductive wire W. Here, the series connection means a state in which the p-electrode 2A and the n-electrode 2B in the adjacent light-emitting elements 2 are electrically connected by the wire W as shown in FIG.

  Further, as shown in FIG. 2, the light emitting elements 2 are electrically connected by the conductive wires W between the light emitting elements 2 adjacent in the lateral direction with respect to the mounting region 1 a, and are connected not only in series but also in parallel. Preferably it is. In addition, the parallel connection here means the state in which the p electrodes 2A or the n electrodes 2B in the adjacent light emitting elements 2 are electrically connected by a wire W as shown in FIG.

In this way, even when the plurality of light emitting elements 2 are connected not only in series but also in parallel, even if the forward voltage drop (hereinafter referred to as V _f ) varies for each of the plurality of light emitting elements 2. The variation in V _f can be eliminated. Note that V _f is a voltage necessary for a current to flow in the forward direction with respect to the light emitting diode, that is, a voltage necessary for the light emitting diode to emit light.

Here, _if there is a variation in V _f for each of the plurality of light emitting elements 2, a current easily flows through the light emitting elements 2 having a low V _f , and an output difference occurs between the light emitting elements 2, so that uneven light emission is likely to occur. Therefore, as described above, by connecting a plurality of light emitting elements 2 in parallel, an output difference of each light emitting element due to a variation in V _f between the light emitting elements 2 connected in parallel can be reduced, and unevenness in light emission can be reduced. Can be suppressed.

  In addition, when connecting the some light emitting element 2 in parallel as mentioned above, as shown in FIG. 2, among the some light emitting elements 2, the light emitting element directly connected with wiring part 3b, 4b and the relay wiring part 8 is shown. The two are preferably not connected in parallel. That is, in the light emitting device 101, the p electrode 2A of the light emitting element 2 in the first row, first column, and second row, first column on the mounting region 1a directly connected to the wiring portion 3b, and the mounting directly connected to the wiring portion 4b. First row, fifth column, second row, fifth column, third row, fifth column directly connected to the n-electrode 2B of the light emitting element 2 in the first row, first row, first row, first row, and relay wiring portion 8 on the region 1a, 4th row and 5th column n electrode 2B and 5th row and 5th column, 6th row and 5th column, 7th row and 5th column, 8th row and 5th column p electrode 2A directly connected to relay wiring portion 8 are connected in parallel It has not been. As a result, the load applied by the wire can be reduced.

<Positive electrode and negative electrode>
The positive electrode 3 and the negative electrode 4 are for electrically connecting electronic components such as the plurality of light emitting elements 2 on the substrate 1 and an external power source (not shown), and applying a voltage from the external power source to these electronic components. belongs to. That is, the positive electrode 3 and the negative electrode 4 play a role as electrodes for energizing from the outside or a part thereof.

  The positive electrode 3 and the negative electrode 4 are comprised with the metal film on the board | substrate 1, as shown in FIG. As shown in FIG. 2, the positive electrode 3 and the negative electrode 4 have substantially rectangular pad portions (feeding portions) 3a and 4a and linear wiring portions 3b and 4b. The pad portions 3a and 4a The applied voltage is configured to be applied to the light emitting unit 20 including the plurality of light emitting elements 2 through the wiring units 3b and 4b. As shown in FIG. 2, a cathode mark CM indicating the cathode is formed on the wiring portion 4b of the negative electrode 4.

  The pad portions 3a and 4a are for applying a voltage from an external power source. As shown in FIG. 2, the pad portions 3 a and 4 a are formed as a pair at diagonal positions on the corners on the substrate 1. The pad portions 3a and 4a are electrically connected to an external power source (not shown) by a conductive wire W.

  The wiring portions 3b and 4b are for transmitting the voltage applied to the pad portions 3a and 4a from the external power source to the light emitting element 2 on the mounting region 1a. As shown in FIG. 2, the wiring portions 3b and 4b are formed so as to extend from the pad portions 3a and 4a, and are formed in a substantially L shape around the mounting region 1a.

  It is preferable to use Au as the material of the metal film constituting the positive electrode 3 and the negative electrode 4. This is because, as will be described later, when Au having excellent thermal conductivity is used as the material of the wire W, the wire W that is the same material can be firmly bonded.

  As a method for forming the metal film constituting the positive electrode 3 and the negative electrode 4, it is preferable to form the metal film by electrolytic plating or electroless plating in the same manner as the method for forming the metal film on the mounting region 1a. In addition, the thickness of the metal film which comprises the positive electrode 3 and the negative electrode 4 is not specifically limited, According to the objectives and uses, such as the number of the wires W, it can select suitably.

  Here, as shown in FIGS. 1 and 2, a part of the wiring portions 3b and 4b is covered with a light reflecting resin 6 described later. Therefore, even when the wiring portions 3b and 4b are formed of Au that easily absorbs light as described above, the light emitted from the light emitting element 2 does not reach the wiring portions 3b and 4b and is reflected by light. Reflected by the resin 6. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 101 can be improved.

  Furthermore, by covering a part of the wiring portions 3b and 4b with the light reflecting resin 6, the wire W can be protected from dust, moisture, external force and the like. Here, as shown in FIG. 2, the part of the wiring portions 3b and 4b is formed around the mounting region 1a and along the side of the mounting region 1a in the wiring portions 3b and 4b. It means the part that was made.

<Relay wiring section>
The relay wiring part 8 is for relaying the wiring between the positive electrode 3 and the negative electrode 4. That is, the relay wiring portion 8 is connected to at least one of the plurality of light emitting elements 2 and the p electrode of the light emitting element 2, and is connected to at least one of the plurality of light emitting elements 2 and the n electrode of the light emitting element 2. Thus, the wiring between the positive electrode 3 and the negative electrode 4 is relayed. As shown in FIG. 2, the relay wiring portion 8 is composed of a metal member on the substrate 1. As shown in FIG. 2, the relay wiring portion 8 is formed in a straight line around one side of the mounting area 1a, that is, the right side, around the mounting area 1a.

  As shown in FIG. 2, the relay wiring portion 8 is covered with a light reflecting resin 6 described later. Therefore, as will be described later, even when Au that easily absorbs light is used as the metal film constituting the relay wiring portion 8, the light emitted from the light emitting element 2 does not reach the relay wiring portion 8. Reflected by the light reflecting resin 6. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 101 can be improved. Furthermore, by covering the relay wiring part 8 with the light reflecting resin 6, the relay wiring part 8 can be protected from dust, moisture, external force and the like.

  As with the positive electrode 3 and the negative electrode 4, it is preferable to use Au as the material for the metal film constituting the relay wiring portion 8. This is because, as will be described later, when Au having excellent thermal conductivity is used as the material of the wire W, the wire W that is the same material can be firmly bonded.

  As a method for forming the metal film constituting the relay wiring portion 8, it is preferable to form the metal film by electrolytic plating or electroless plating similarly to the positive electrode 3 and the negative electrode 4. In addition, the thickness of the metal film which comprises the relay wiring part 8 is not specifically limited, It can select suitably according to the objectives and uses, such as the number of the wires W.

  In the light emitting device 101 according to the embodiment, the relay wiring portion 8 is formed along the periphery of the mounting region 1a as described above, and the light emitting element 2 is arranged so that the direction is reversed with the relay wiring portion 8 as a boundary. Thus, the number of light emitting elements connected in series can be increased within a limited area of the mounting region 1a. Furthermore, within a limited area of the mounting area, a plurality of light emitting elements can be densely arranged, and a light emitting device with improved power consumption with respect to constant luminance or light emission with respect to constant power consumption. A light-emitting device with improved efficiency can be obtained.

  As shown in FIG. 2, in the light emitting device according to the embodiment, between the light emitting element 2 and the wiring part 3 b of the positive electrode 3 and the relay wiring part 8, the p electrodes 2 </ b> A of the plurality of light emitting elements 2 are mounted in the mounting region 1 a. The n electrodes 2B of the plurality of light emitting elements 2 are arranged so as to face the right side, which is the other direction of the mounting region 1a.

  In addition, as shown in FIG. 2, the light emitting element 2 has a right side in which the p electrodes 2A of the plurality of light emitting elements 2 are in the other direction of the mounting region 1a between the wiring part 4b of the negative electrode 4 and the relay wiring part 8. The n electrodes 2B of the plurality of light emitting elements 2 are arranged so as to face the left side, which is one direction of the mounting region 1a. That is, the light emitting element 2 is arranged so that the direction is reversed with the relay wiring portion 8 as a boundary when FIG. 2 is viewed in plan.

  In the light emitting device 101 according to the embodiment, the relay wiring portion 8 is formed along the periphery of the mounting region 1a as described above, and the light emitting element 2 is arranged so that the direction is reversed with the relay wiring portion 8 as a boundary. Thus, the number of light-emitting elements connected in series can be increased without complicating the wiring for connecting the light-emitting elements within the limited area of the mounting region 1a. Furthermore, within a limited area of the mounting area, a plurality of light emitting elements can be densely arranged, and a light emitting device with improved power consumption with respect to constant luminance or light emission with respect to constant power consumption. A light-emitting device with improved efficiency can be obtained. In the light emitting device 101 according to the embodiment, as shown in FIG. 2, ten light emitting elements 2 are connected in series, and the series connection is formed for four rows.

  As shown in FIG. 2, one end of the wiring part 3b and one end of the wiring part 4b are formed adjacent to each other around the mounting region 1a. In this way, the wiring portions 3b and 4b of the positive electrode 3 and the negative electrode 4 are formed along the periphery of the mounting region 1a, and one end portions thereof are formed adjacent to each other, so that a plurality of light emitting elements like the light emitting device 101 are formed. Even when 2 is disposed on the substrate 1, a protective element 5 described later can be disposed at an appropriate position. Therefore, it is possible to prevent the voltage between the positive and negative electrodes from becoming equal to or higher than the zener voltage, and to appropriately prevent element destruction and performance deterioration of the light emitting element 2 due to application of an excessive voltage. .

  More specifically, the wiring portions 3b and 4b are preferably formed such that one end portions thereof are adjacent to each other within the range of one side of the substantially rectangular mounting region 1a shown in FIG. In this manner, the wiring portions 3b and 4b are formed so as to be adjacent to each other within the range of one side of the mounting region 1a, thereby installing the wires W for electrically connecting the wiring portions 3b and 4b and the light emitting element 2. An area can be secured. Therefore, the number of the light emitting elements 2 connected to the wiring portions 3b and 4b, that is, the number of the light emitting elements 2 serving as the start point and the end point of the series connection can be increased, and the number of the series connection columns of the light emitting elements 2 on the mounting region 1a. Can be increased without complicating the wiring connecting the light emitting elements. And by increasing the number of columns connected in series in this way, a plurality of light emitting elements can be densely arranged within a limited area of the mounting area, and power consumption is improved for a certain luminance. A light-emitting device or a light-emitting device with improved light emission efficiency with respect to constant power consumption can be obtained.

  Further, as a form in which one end portion of the wiring portion 3b and one end portion of the wiring portion 4b are adjacent to each other around the mounting region 1a, the light emitting device 102 shown in FIG. 5 may be used. As shown in FIG. 5, one end portions of the wiring portions 3b and 4b are formed adjacent to each other at the corners of the substantially rectangular mounting region 1a. That is, the wiring part 3b is formed in a substantially L shape so as to extend from the pad part 3a to the corner part of the mounting region 1a. The wiring part 4b is formed in a straight line so as to extend from the pad part 4a to the corner of the mounting region 1a. Note that in the light-emitting device 102 illustrated in FIG. 5, the same components as those of the light-emitting device 101 are denoted by the same reference numerals and description thereof is omitted.

<Light reflecting resin>
The light reflecting resin 6 is for reflecting the light emitted from the light emitting element 2. As shown in FIG. 2, the light reflecting resin 6 is formed so as to cover a part of the wiring portions 3b and 4b, the relay wiring portion 8, the protective element 5 described later, and the wire W connected thereto. Therefore, even when the wiring portions 3b and 4b, the relay wiring portion 8 and the wire W are formed of Au that easily absorbs light as described above or later, light emitted from the light emitting element 2 is transmitted to the wiring portion 3b. , 4b, the relay wiring portion 8 and the wire W are not reflected and are reflected by the light reflecting resin 6. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 101 can be improved. Further, by covering a part of the wiring parts 3b and 4b, the relay wiring part 8, the protection element 5 and the wire W connected thereto with the light reflecting resin 6, these members are protected from dust, moisture, external force and the like. be able to.

  As shown in FIGS. 1 and 2, the light reflecting resin 6 is preferably formed in a square frame shape so as to surround the mounting region 1 a where the light emitting unit 20 is formed on the substrate 1. By forming the light reflecting resin 6 so as to surround the periphery of the mounting region 1a in this way, the mounting region 1a of the substrate 1 is, for example, light emitted from the light emitting elements 2 arranged on the left and right sides in FIG. The light directed to the surroundings can also be reflected by the light reflecting resin 6. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 101 can be improved.

  Further, as shown in FIG. 2, the light reflecting resin 6 is preferably formed so as to cover a part of the periphery of the mounting region 1a. Thus, by forming the light reflecting resin 6 so as to cover a part of the periphery of the mounting region 1a, a region where the substrate 1 is exposed between the wiring portions 3b and 4b and the metal film on the mounting region 1a is formed. It will not be formed. Therefore, since all the light emitted from the light emitting element 2 can be reflected in the inner region where the light reflecting resin 6 is formed, the loss of the emitted light can be reduced to the maximum, and the light emitted from the light emitting device 101 can be reduced. The taking-out efficiency can be further improved.

As a material of the light reflecting resin 6, an insulating material is preferably used. Moreover, in order to ensure a certain amount of strength, for example, a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, an epoxy resin, a BT resin, PPA, a silicon resin, etc. are mentioned. In addition, a reflective member (for example, TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO) or the like that hardly absorbs light from the light-emitting element 2 and has a large refractive index difference with respect to the base resin is used in the base resin. By dispersing this powder, light can be reflected efficiently. The size of the light reflecting resin 6 is not particularly limited, and can be appropriately selected according to the purpose and application. In addition, a light reflecting member made of a material different from the resin can be formed at the position of the light reflecting resin 6.

<Sealing member>
The sealing member 7 is a member for protecting the light emitting element 2, the protective element 5, the wire W, and the like disposed on the substrate 1 from dust, moisture, external force, and the like. As shown in FIGS. 1, 2, and 4, the sealing member 7 is formed by filling a resin in the mounting region 1 a surrounded by the light reflecting resin 6 on the substrate 1.

  As the material of the sealing member 7, a material having translucency capable of transmitting light from the light emitting element 2 is preferable. Specific examples of the material include silicon resin, epoxy resin, and urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, a fluorescent member, and the like can be contained as desired.

  The sealing member 7 can be formed as a single member, or can be formed as a plurality of layers of two or more layers. The filling amount of the sealing member 7 may be an amount that covers the light emitting element 2, the protective element 5, the wire W, and the like disposed in the mounting region 1 a surrounded by the light reflecting resin 6. Further, when the sealing member 7 has a lens function, the surface of the sealing member 7 may be raised so as to have a bullet shape or a convex lens shape.

<Fluorescent member>
The sealing member 7 may include a fluorescent member that emits light having a different wavelength by absorbing at least a part of the light from the light emitting element 2 as a wavelength conversion member. As the fluorescent member, one that converts light from the light emitting element 2 into a longer wavelength is preferable. In addition, the fluorescent member may be formed as a single layer of one type of fluorescent material or may be formed as a single layer by mixing two or more types of fluorescent materials. Alternatively, two or more single layers containing one kind of fluorescent substance or the like may be laminated, or two or more single layers each containing two or more kinds of fluorescent substances may be laminated.

  As the material of the fluorescent member, for example, a YAG phosphor mixed with yttrium, aluminum and garnet, a nitride phosphor or an oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is used. be able to.

<Wire>
The wire W is a conductive wiring for electrically connecting electronic components such as the light emitting element 2 and a protective element 5 described later to the positive electrode 3, the negative electrode 4, the relay wiring portion 8, and the like. Examples of the material of the wire W include those using metals such as Au, Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof, and in particular, excellent in thermal conductivity and the like. It is preferable to use Au. In addition, the diameter of the wire W is not specifically limited, It can select suitably according to the objective and a use.

  Here, the connection portion between the wire W and the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 is covered with the light reflecting resin 6, as shown in FIG. Therefore, as described above, even when Au that easily absorbs light is used as the material constituting the wire W, the light emitted from the light emitting element 2 is not absorbed by the wire W and is reflected by the light reflecting resin 6. Is reflected by. Accordingly, loss of emitted light can be reduced, and light extraction efficiency of the light emitting device 101 can be improved. Further, by covering the connecting portion between the wire W and the positive electrode 3, the negative electrode 4 and the relay wiring portion 8 with the light reflecting resin 6, the wire W can be protected from dust, moisture, external force and the like.

<Protective element>
The protection element 5 is formed as an element for protecting the light emitting unit 20 composed of the plurality of light emitting elements 2 from element destruction and performance deterioration due to excessive voltage application. As shown in FIG. 2, the protective element 5 is disposed at one end of the wiring portion 3 b of the positive electrode 3 and is connected to one end of the wiring portion 4 b of the negative electrode 4 by a wire. However, the protective element 5 may be disposed at one end of the wiring portion 4b of the negative electrode 4 and connected to one end of the wiring portion 3b of the positive electrode 3 by a wire.

  Specifically, the protection element 5 is configured by a Zener diode that is energized when a voltage equal to or higher than a specified voltage is applied. Although not shown, the protective element 5 is a semiconductor element having a p-electrode and an n-electrode like the light-emitting element 2 described above, and is antiparallel to the p-electrode 2A and the n-electrode 2B of the light-emitting element 2. Thus, the wire W is electrically connected to the wiring portion 4 b of the negative electrode 4. In addition, the light emitting element 2 cannot be disposed in the vicinity of the place where the protective element 5 is embedded. Therefore, the light emitting element 2 in the fourth row and the first column closest to the protection element 5 is connected by a wire W to a place away from the area where the protection element 5 is embedded, as shown in FIG.

  Thereby, even if an excessive voltage is applied between the positive electrode 3 and the negative electrode 4 and the voltage exceeds the Zener voltage of the Zener diode, the Zener voltage is held between the positive and negative electrodes of the light emitting element 2. Never exceed the voltage. Therefore, by providing the protective element 5, it is possible to prevent the voltage between the positive and negative electrodes from becoming a Zener voltage or higher, and the occurrence of element destruction or performance deterioration of the light emitting element 2 due to application of an excessive voltage. Can be prevented appropriately.

  The protection element 5 is covered with a light reflecting resin 6 as shown in FIG. Therefore, the protection element 5 and the wire W connected to the protection element 5 are protected from dust, moisture, external force, and the like. In addition, the size of the protective element 5 is not particularly limited, and can be appropriately selected according to the purpose and application.

[Operation of light emitting device]
According to the light emitting device 101 described above, when the light emitting device 101 is driven, out of the light traveling in all directions from the light emitting element 2, the light traveling upward is extracted outside the light emitting device 101. Further, the light traveling downward or laterally is reflected by the bottom surface or the side surface of the mounting region 1 a of the substrate 1 and extracted above the light emitting device 101. At this time, the bottom surface of the substrate 1, that is, the mounting region 1a is preferably coated with a metal film, and the light reflecting resin 6 is formed around the mounting region 1a, so that light absorption by this portion is suppressed. At the same time, the light is reflected by the metal film or the light reflecting resin 6. Thereby, the light from the light emitting element 2 is extracted efficiently.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 100 according to the first embodiment of the present invention will be briefly described. The manufacturing method of the light emitting device 101 includes a substrate manufacturing process, a plating process, a die bonding process, a wire bonding process, and a light reflecting resin forming process. Moreover, you may include the sealing member filling process after the light reflection resin formation process. Furthermore, a protection element joining process is included here. Hereinafter, each step will be described. Note that since the configuration of the light emitting device 101 is as described above, the description thereof will be omitted as appropriate.

<Substrate manufacturing process>
A board | substrate preparation process is a process of producing the board | substrate 1 with which the wiring for plating was formed. In the substrate manufacturing process, the mounting region 1a on the substrate 1 and the portions to be the positive electrode 3 and the negative electrode 4 are formed by patterning into a predetermined shape. Further, in the substrate manufacturing process, a plating wiring for forming a metal film on the mounting region 1a on the substrate 1 is formed by electrolytic plating.

<Plating process>
The plating step is a step of forming at least the positive electrode 3, the negative electrode 4 and the relay wiring portion 8 on the substrate 1 on which the plated wiring is formed, and preferably the positive electrode 3 and the negative electrode 4 by electroless plating. And forming a metal film on the mounting region 1a on the substrate 1 by electrolytic plating.

As a specific method of plating, a method of performing Au plating on both the positive electrode 3, the negative electrode 4 and the relay wiring portion 8 and the metal film on the mounting region 1 a, an Au plating only on the positive electrode 3, the negative electrode 4 and the relay wiring portion 8. And a method in which a metal film on the mounting region 1a is not formed, a method in which Au plating is performed on the positive electrode 3, the negative electrode 4, and the relay wiring portion 8 and Ag plating is performed on the mounting region 1a. Further, on the mounting region 1a, it is preferable to further form a TiO ₂ film on the surface of Au or Ag when performing Au plating or Ag plating, or directly on the substrate surface when not performing plating.

<Die bonding process>
The die bonding step is a step of placing the light emitting element 2 on the metal film. In the die bonding step, the light emitting element placement step for placing the light emitting element 2 on the metal film on the substrate 1 via the joining member, and after the light emitting element 2 is placed, the joining member is heated, A heating step of bonding 2 to a metal film on the substrate 1.

<Protective element bonding process>
When providing the protective element, the protective element joining step is a step of placing the protective element 5 on the wiring portion 3b of the positive electrode 3 and joining them. Since the method for mounting and bonding the protective element 5 is the same as that in the die bonding step, description thereof is omitted here.

<Wire bonding process>
The wire bonding step is a step of electrically connecting the wiring portion 3b of the positive electrode 3 of the metal member and the p pad electrode 2Aa above the light emitting element 2 with the wire W after the die bonding step. Similarly, this is a step of electrically connecting the n pad electrode 2Ba above the light emitting element 2 and the wiring portion 4b of the negative electrode 4 of the metal member with a wire W. Further, in this step, the plurality of light emitting elements 2 are connected through the p pad electrode 2Aa and the n pad electrode 2Ba, respectively. Further, the electrical connection between the protective element 5 and the negative electrode 4 may be performed in this step. That is, the n electrode of the protection element 5 and the wiring part 4 b of the negative electrode 4 are connected by the wire W. In addition, the connection method of the wire W is not specifically limited, What is necessary is just to perform by the method used normally.

<Light reflecting resin formation process>
The light reflecting resin forming step is a step of forming the light reflecting resin 6 so as to cover at least a part of the wiring portions 3b and 4b and the relay wiring portion 8 along the peripheral edge of the mounting region 1a after the wire bonding step. It is. The light reflecting resin 6 can be formed by using, for example, a resin discharge device that can move (movable) in the vertical direction or the horizontal direction with respect to the substrate 1 above the fixed substrate 1 (see FIG. JP, 2009-182307, A).

<Sealing member filling process>
The sealing member filling step is a step of filling a light-transmitting sealing member 7 covering the light emitting element 2 and the metal film inside the light reflecting resin 6. That is, the sealing member 7 that covers the light emitting element 2, the protective element 5, the metal film on the mounting region 1 a, the wire W, and the like is formed inside the wall portion made of the light reflecting resin 6 formed on the substrate 1. Is then cured by heating, light irradiation, or the like.

[Second Embodiment]
The light emitting device 103 according to the second embodiment will be described in detail with reference to FIG. As shown in FIG. 6, the light emitting device 103 is provided with two relay wiring portions 8a and 8b, and the light emitting device 101 according to the first embodiment described above except that the light emitting element 2 is appropriately arranged in the mounting region 1a. It has the same configuration as Therefore, the same components as those of the light emitting device 101 described above are denoted by the same reference numerals and description thereof is omitted. The light emitting device 103 has the same overall configuration (FIG. 1) and light emitting element configuration (FIG. 3) as the above-described light emitting device 101, and thus description thereof is also omitted.

  The light emitting device 103 is provided with two relay wiring portions, and a part of the plurality of light emitting elements 2 is arranged between two relay wiring portions 8a and 8b. Specifically, in the space between the wiring portion 3b of the positive electrode 3 and the relay wiring portion 8a (hereinafter sometimes referred to as the first relay wiring portion 8a) (the region indicated by 11 in FIG. 6), a plurality of The p-electrode 2A of the light emitting element 2 is arranged so as to face the left side which is one direction of the mounting region 1a, and the relay wiring portion (first relay wiring portion) 8a and the relay wiring portion 8a are different from the relay wiring portion. 8b (hereinafter, sometimes referred to as second relay wiring portion 8b) (the region indicated by 12 in FIG. 6), the p-electrodes 2A of the plurality of light-emitting elements 2 are in the other direction of the mounting region 1a. A plurality of light emitting elements are arranged between the relay wiring part (second relay wiring part) 8b and the wiring part 4b of the negative electrode 4 (region shown by 13 in FIG. 6). 2 p-electrodes 2A are directed to the left, which is one direction of the mounting region 1a. It is column.

That is, the light emitting element 2 is arranged so that the direction is reversed with the first relay wiring portion 8a as a boundary and the second relay wiring portion 8b as a boundary when FIG. 6 is viewed in plan.
That is, on the mounting area 1a, by providing one each of the areas 11 and 13 where the wiring parts 3b and 4b and the relay wiring part face each other and increasing the number of areas 12 where the relay wiring parts face each other, In addition, the number of light emitting elements connected in series and the number of series connected columns can be increased.

  Thus, by providing not only one relay wiring portion but also a plurality along the periphery of the mounting region 1a, the number of light emitting elements connected in series can be increased within the limited area of the mounting region 1a. it can. Furthermore, within a limited area of the mounting area, a plurality of light emitting elements can be densely arranged, and a light emitting device with improved power consumption with respect to constant luminance or light emission with respect to constant power consumption. A light-emitting device with improved efficiency can be obtained.

  For example, in the case of the mounting region 1a in which six light emitting elements 2 are connected in series between the wiring portion 3b and the first relay wiring portion 8a, the first relay wiring portion 8a and the second relay wiring The six light emitting elements 2 are also connected in series with the portion 8b, and the six light emitting elements 2 are also connected in series between the second relay wiring portion 8b and the wiring portion 4b. In the whole light emitting device, 18 light emitting elements 2 are connected in series. That is, when the mounting region 1a is such that X light emitting elements 2 are connected in series when viewed in one direction of the mounting region 1a, the number Y of relay wiring portions (having at least one relay wiring portion, where Y is positive) ) And the number Z of series connections in the entire light emitting device is expressed as Z = X (Y + 1), and the number Z of series connections in the entire light emitting device increases as the number Y of relay wiring portions increases. Can be bigger. This makes it possible to increase the number of light emitting elements that are easily connected in series within a certain area of the mounting region.

[Third Embodiment]
The light emitting device 104 according to the third embodiment will be described in detail with reference to FIG. As shown in FIG. 7, the light emitting device 104 includes a protective element wiring portion 9 for connecting the protective element 5 and the protective element, and other than the arrangement state of the light emitting elements 2 and the connection state of the wires W connected to the light emitting elements 2. Has the same configuration as the light emitting device 103 according to the second embodiment described above. Therefore, the same components as those of the light emitting device 101 and the light emitting device 103 described above are denoted by the same reference numerals and description thereof is omitted. The light-emitting device 104 has the same overall configuration (FIG. 1) and light-emitting element configuration (FIG. 2B) as the above-described light-emitting device 101, and thus description thereof is also omitted.

  The light emitting device 104 is obtained by providing the protective element 5 to the light emitting device 103 according to the second embodiment. A protective element 5 made of a Zener diode is formed on the wiring part 3b of the positive electrode 3, and is used to electrically connect the protective element 5 to the negative electrode 4 around the mounting region 1a and further outside the relay wiring part 8a. The protection element wiring part 9 is provided, the protection element 5 and the protection element wiring part 9 are connected by a wire, and the protection element wiring part 9 and the wiring part 4b of the negative electrode 4 are connected by a wire, respectively. By providing the protective element wiring portion in this way, it is possible to easily provide the protective element in the light emitting device in which the positive electrode 3 and the negative electrode 4 are separated on the substrate.

  Furthermore, it is preferable that the protective element 5, the protective element wiring portion 9, and the wire W connected thereto are covered with the light reflective resin 6. These members can also be protected from dust, moisture, external force and the like by covering them with the light-reflective resin 6 that covers the wiring portions 3b and 4b and the relay wiring portions 8a and 8b.

  The protective element wiring portion 9 is formed of the same metal material as the positive electrode 3, the negative electrode 4, and the relay wiring portions 8a and 8b, and may be formed of the same metal material or provided in the same process in the manufacturing method. Good.

  The protective element 5 is provided in the wiring part 4b of the negative electrode 4, the protective element 5 and the protective element wiring part 9 are connected by a wire, and the protective element wiring part 9 and the wiring part 3b of the positive electrode 3 are connected by a wire. Also good. Furthermore, the protection element 5 is provided on the protection element wiring part 9, and either one of the wiring parts 3 b and 4 b of the positive electrode 3 and the negative electrode 4 is connected to the protection element 5, and the other is connected to the protection element wiring part 9. It may be connected.

  Further, the protection element wiring portion 9 may be exposed only in a region connected to any one of the wiring portions 4 a and 4 b and the protection element 5 with a wire, and the other may be wired inside the substrate 1. In the case of FIG. 7, the protection element wiring portion 9 of the protection element 5 provided on the wiring portion 3b of the positive electrode 3 and a region 9a connected by a wire and the wiring portion 4b of the negative electrode 4 and a region 9b connected by a wire are provided. It only needs to be exposed.

  As shown in FIG. 7, the plurality of light emitting elements 2 are arranged such that all the light emitting elements 2 face the upper side where the p-electrode 2A is one direction of the mounting region 1a, or the n-electrode 2B is other than the mounting region 1a. It is arranged so as to face the lower side which is the direction. In the light emitting device 104 of the third embodiment, the regions 11 and 13 are arranged so that the p electrode 2A of the light emitting element faces the right side of the mounting region 1a, and the p electrode 2A of the light emitting element faces the left side of the mounting region 1a. With respect to the arrangement of the light emitting elements 2 in the light emitting device 103 according to the second embodiment, which is provided so as to be mixed with the arranged regions 12, each light emitting element 2 is rotated 90 degrees on the mounting region 1a. Arranged in a state. When the plurality of light emitting elements 2 are connected not only in series but also in parallel, the light emitting elements 2 are preferably arranged as in the light emitting device 103 of the second embodiment and the light emitting device 101 of the first embodiment. When the two are not connected in parallel, the light emitting elements 2 can be arranged as in the third embodiment. However, among the 16 light emitting elements 2, eight light emitting elements 2 are connected in series in two rows between the wiring portions 3b and 4b and the relay wiring portions 8a and 8b. Are connected in parallel.

  Regarding the light emitting devices of the first to third embodiments described above, the arrangement of the light emitting elements 2 in the third embodiment can be applied to the light emitting devices in the first or second embodiments, and the light emitting elements 2 in the first or second embodiments. It is also possible to apply this arrangement to the light emitting device of Embodiment 3. Further, the protective element wiring portion 9 in the third embodiment can be applied to the light emitting device in the second embodiment. The light emitting device according to the present invention has been specifically described with reference to the embodiments for carrying out the invention. However, the gist of the present invention is not limited to these descriptions, and is widely interpreted based on the description of the claims. It must be. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a Mounting area | region 2 Light emitting element 2A P electrode 2Aa p pad electrode 2Ab Extending conductive part 2B n electrode 2Ba n pad electrode 2Bb Extending conductive part 3 Positive electrode 3a Pad part 3b Wiring part 4 Negative electrode 4a Pad part 4b Wiring part 5 Protection element 6 Light reflecting resin 7 Sealing member 8 Relay wiring part 9 Protection element wiring part 20 Light emitting part 101, 102, 103, 104 Light emitting device CM Cathode mark V _f Forward voltage drop W Wire

Claims (8)

A substrate,
A light-emitting portion composed of a plurality of light-emitting elements disposed in a mounting region on the substrate;
Each having a pad portion and a wiring portion, and a positive electrode and a negative electrode for applying a voltage to the light emitting portion through the wiring portion;
A light reflecting device formed on the substrate so as to cover at least the wiring portion,
A relay wiring portion is formed along the periphery of the mounting area,
The light emitting device, wherein the relay wiring portion is covered with the light reflecting resin. Each of the plurality of light emitting elements includes a p-electrode formed on one side and an n-electrode formed on the other side,
2. The light emitting device according to claim 1, wherein the plurality of light emitting elements include a light emitting element connected to the p electrode and a light emitting element connected to the n electrode with respect to the relay wiring portion. Between the positive wiring portion and the relay wiring portion, the p electrode is arranged to face one direction with respect to the mounting region,
3. The light emitting device according to claim 1, wherein the p-electrode is arranged between the negative wiring portion and the relay wiring portion so as to face in the other direction with respect to the mounting region. apparatus.   3. The light emitting device according to claim 1, wherein the light emitting device includes a plurality of the relay wiring portions, and a part of the plurality of light emitting elements is sandwiched between the two relay wiring portions.   The light emitting device according to claim 1, wherein the plurality of light emitting elements are electrically connected to each other in series and in parallel by wires.   The light emitting device according to claim 1, wherein the reflective resin is formed so as to surround the periphery of the mounting region.   7. The light emitting device according to claim 1, wherein a metal film is formed on the mounting region, and the plurality of light emitting elements are arranged through the metal film.   The light emitting device according to claim 7, wherein the light reflecting resin is formed so as to cover a part of a peripheral edge of the mounting region.

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