JP2019021698A - Light emitting device and lighting device - Google Patents

Abstract

To provide a light emitting device which can easily mount a light emitting element at high density.SOLUTION: A light emitting device 10 includes a substrate 11 including a base material 11a and a wiring layer 11b disposed on the base material 11a, red LED chips 21 and 22 having an anode and a cathode facing each other, a blue LED chip 23 including a surface 23s connected to the base material 11 and an anode 23a and a cathode 23k arranged on the side opposite to the connection surface 23s, and a bonding wire 17. The anode 21a included in the red LED chip 21 and the cathode 22k of the red LED chip 22 are electrically connected to a metal film 16e included in the wiring layer 11b.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a light emitting device and a lighting device using the light emitting device.

  Conventionally, a light emitting device that emits white light by sealing a light emitting element such as an LED (Light Emitting Diode) chip with a sealing member containing a phosphor is known. As an example of such a light-emitting device, Patent Document 1 discloses a light-emitting module that can improve the light-emitting efficiency and prevent a reduction in the lifetime.

JP 2011-134934 A

  By the way, among LED chips, there are LED chips having a double-sided electrode structure having electrodes on the upper surface and the lower surface, and LED chips having a single-sided electrode structure having two electrodes on the upper surface. In a light emitting device using an LED chip (light emitting element) having a double-sided electrode structure, it is difficult to mount the light emitting elements at a high density.

  The present invention provides a light-emitting device and a lighting device in which light-emitting elements can be easily mounted at high density.

  A light-emitting device according to one embodiment of the present invention includes a first light-emitting element and a second light-emitting element having anodes and cathodes facing each other, a connection surface connected to the substrate, and a surface opposite to the connection surface. A third light-emitting element having an anode and a cathode disposed on each other, and a wire, and the anode included in the first light-emitting element and the cathode included in the second light-emitting element are formed on a metal film included in the wiring layer. The wire is electrically connected, and (a) the cathode of the first light emitting element and the anode of the third light emitting element are electrically connected, or (b) the second light emitting element is electrically connected. The anode having and the cathode of the third light emitting element are electrically connected.

  An illumination device according to one embodiment of the present invention includes the light-emitting device and a lighting device that supplies power to the light-emitting device to light the light-emitting device.

  The present invention can realize a light-emitting device and a lighting device in which light-emitting elements can be easily mounted at high density.

FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the light emitting device according to the first embodiment. 3 is a schematic cross-sectional view of the light emitting device taken along line III-III in FIG. FIG. 4 is a schematic cross-sectional view showing a connection relationship between a plurality of LED chips in a light emitting device according to a comparative example. FIG. 5 is a diagram illustrating a difference in temperature characteristics between the blue LED chip and the red LED chip. FIG. 6 is a schematic cross-sectional view of a light emitting device according to Modification 1. FIG. 7 is a schematic cross-sectional view of a light emitting device according to Modification 2. FIG. 8 is an external perspective view of a light emitting device according to Modification 3. FIG. 9 is an external perspective view of a light emitting device including a plurality of linear light emitting units. FIG. 10 is a cross-sectional view of the lighting apparatus according to Embodiment 2. FIG. 11 is an external perspective view of the lighting device and its peripheral members according to Embodiment 2. FIG.

  Hereinafter, embodiments will be described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

  In the drawings used for explanation in the following embodiments, coordinate axes may be shown. The Z-axis direction in the coordinate axes is, for example, the vertical direction, the Z-axis + side is expressed as the upper side (upper), and the Z-axis-side is expressed as the lower side (lower). In other words, the Z-axis direction is a direction perpendicular to the substrate included in the light emitting device. The X-axis direction and the Y-axis direction are directions orthogonal to each other on a plane (horizontal plane) perpendicular to the Z-axis direction. The XY plane is a plane parallel to the main surface of the substrate included in the light emitting device. For example, in the following embodiments, “plan view” means viewing from the Z-axis direction.

(Embodiment 1)
[Configuration of light emitting device]
First, the structure of the light-emitting device according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the light emitting device according to the first embodiment. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG.

  As shown in FIGS. 1 to 3, the light emitting device 10 according to the first embodiment mainly includes a substrate 11, a red LED chip 21, a red LED chip 22, a plurality of blue LED chips 23, and a sealing. A member 13, a surrounding member 15, a first terminal 16 a, a second terminal 16 b, a first wiring 16 c, a second wiring 16 d, and a plurality of bonding wires 17 are provided. The red LED chip 21, the red LED chip 22, and the plurality of blue LED chips 23 constitute the light emitting element array 12.

  The light emitting device 10 is an LED module having a COB (Chip On Board) structure in which a plurality of LED chips are directly mounted on a substrate 11, and emits white light. Hereinafter, each component of the light emitting device 10 will be described.

[substrate]
The substrate 11 is a substrate on which a plurality of LED chips are arranged. The wiring layer 11b arrange | positioned on the base material 11a and the base material 11a is included. The substrate 11 is, for example, a metal base substrate or a ceramic substrate. The substrate 11 may be a resin substrate having a resin as a base material 11a.

  As the ceramic substrate, an alumina substrate using aluminum oxide (alumina) as the base material 11a, an aluminum nitride substrate using aluminum nitride as the base material 11a, or the like is employed. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on the surface is employed. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin is employed.

  As the substrate 11, for example, a substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be employed. By adopting a substrate having a high light reflectance as the substrate 11, the light emitted from the LED chip can be reflected on the surface of the substrate 11. As a result, the light extraction efficiency of the light emitting device 10 is improved. An example of such a substrate is a white ceramic substrate based on alumina.

  Further, as the substrate 11, a translucent substrate having a high light transmittance may be adopted. Examples of such a substrate include a light-transmitting ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin substrate made of a transparent resin material. Illustrated.

  In the plan view, the substrate 11 is rectangular (quadrangle), but may be other shapes such as a circle.

[LED chip]
Red LED chips 21 and 22 are arranged on the wiring layer 11 b of the substrate 11. The red LED chip 21 is an example of a first light emitting element, and the red LED chip 22 is an example of a second light emitting element.

  The red LED chips 21 and 22 are LED chips that emit red light. The red LED chips 21 and 22 are made of, for example, an AlGaInP-based material. The emission peak wavelength of the red LED chips 21 and 22 is, for example, not less than 600 nm and not more than 640 nm.

  The red LED chips 21 and 22 have a double-sided electrode structure. As shown in FIG. 3, the red LED chip 21 has an anode 21a and a cathode 21k facing each other, and is connected to a p-type semiconductor layer (not shown) connected to the anode 21a and the cathode 21k. A light emitting layer (not shown) is provided between the n-type semiconductor layer (not shown). The red LED chip 22 has an anode 22a and a cathode 22k facing each other, and a p-type semiconductor layer (not shown) connected to the anode 22a and an n-type semiconductor layer (not shown) connected to the cathode 22k. And a light emitting layer (not shown).

  In other words, the anodes 21a and 22a are p-electrodes and are formed of a metal material such as gold (Au), silver (Ag), or copper (Cu). In other words, the cathodes 21k and 22k are n-electrodes and are formed of a metal material such as gold, silver, or copper.

  In the red LED chip 21, the anode 21a is bonded to the metal film 16e included in the wiring layer 11b by a conductive adhesive such as silver paste. In the red LED chip 22, the cathode 22k is bonded to the metal film 16e with a conductive adhesive.

  A plurality of blue LED chips 23 are disposed on the base material 11 a of the substrate 11. The blue LED chip 23 is an example of a third light emitting element, and is an LED chip that emits blue light. The blue LED chip 23 is made of, for example, an InGaN-based material. The emission peak wavelength of the blue LED chip 23 is, for example, not less than 430 nm and not more than 470 nm. The emission peak wavelength of the blue LED chip 23 is shorter than the emission peak wavelengths of the red LED chips 21 and 22.

  The blue LED chip 23 has a single-sided electrode structure. As shown in FIG. 3, the blue LED chip 23 includes a base substrate 23b including a connection surface 23s connected to the substrate 11, and an anode 23a and a cathode 23k disposed on the surface opposite to the connection surface 23s. . A light emitting layer (not shown) is provided between a p-type semiconductor layer (not shown) connected to the anode 23a and an n-type semiconductor layer (not shown) connected to the cathode 23k. In other words, the anode 23a is a p-electrode, and is formed of a metal material such as gold, silver, or copper. In other words, the cathode 23k is an n-electrode, and is formed of a metal material such as gold, silver, or copper. The base substrate 23b is an insulating substrate such as a sapphire substrate.

  The blue LED chip 23 is bonded to the surface of the base material 11a with an insulating adhesive such as a die bond material. In other words, the connection surface 23s of the blue LED chip 23 is connected to the substrate 11 (base material 11a) via an adhesive such as a die bond material.

  The light emitting device 10 includes a light emitting element array 12 configured by a plurality of LED chips each including at least one red LED chip 21, a red LED chip 22, and a blue LED chip 23. The light emitting element array 12 is configured by arranging a plurality of LED chips in a straight line along the X axis, but may be configured by arranging a plurality of LED chips along a curve. The plurality of LED chips constituting the light emitting element array 12 are electrically connected in series.

  The ratio of the total number of red LED chips and the total number of blue LED chips 23 included in one light emitting element row 12 is, for example, 1: k (1 ≦ k ≦ 2). That is, in one light emitting element row 12, the total number of red LED chips is equal to or less than the total number of blue LED chips 23.

  Although not shown in detail, the light emitting device 10 includes a plurality of such light emitting element arrays 12. The plurality of light emitting element arrays 12 are electrically connected in parallel. Note that the light emitting device 10 may include at least one light emitting element array 12.

  The plurality of light emitting element rows 12 are sealed by a sealing member 13 to form a substantially circular light emitting region (hereinafter also referred to as a light emitting portion) as a whole. In each of the plurality of light emitting element arrays 12, for example, the LED chip located at the end on the X axis − side is electrically connected to the first wiring 16c by the bonding wire 17 and located at the end on the X axis + side. The LED chip is electrically connected to the second wiring 16d by the bonding wire 17. In the example of FIG. 3, in the light emitting device 10, the LED chip located at the end on the X-axis side is the blue LED chip 23, but may be a red LED chip. The same applies to the LED chip located at the end on the X axis + side.

[Sealing member]
Next, the sealing member 13 will be described. The sealing member 13 collectively seals the plurality of light emitting element arrays 12 (the red LED chip 21, the red LED chip 22, the blue LED chip 23, and the plurality of bonding wires 17) arranged on the substrate 11. Stop. The sealing member 13 has a function of protecting the plurality of light emitting element arrays 12 and the plurality of bonding wires 17 from dust, moisture, external force, and the like.

  The sealing member 13 is made of a translucent resin material (base material) containing a phosphor. The base material of the sealing member 13 is, for example, a methyl silicone resin, but may be an epoxy resin or a urea resin.

The sealing member 13 includes, for example, a green phosphor 14. Specifically, the green phosphor 14 is, for example, an yttrium aluminum garnet (YAG) phosphor having an emission peak wavelength of 550 nm or more and 570 nm or less, or Lu ₃ Al having an emission peak wavelength of 540 nm or more and 550 nm or less. ₅ O ₁₂ : Ce ³⁺ phosphor.

  The phosphor included in the sealing member 13 is not particularly limited. The sealing member 13 may include a phosphor that emits light when excited by light emitted from the LED chip. Further, the sealing member 13 may contain a filler. The filler is, for example, silica having a particle size of about 10 nm. By including the filler, the filler becomes a resistance and the phosphor hardly settles. For this reason, the phosphors can be uniformly dispersed in the sealing member 13.

  When the blue LED chip 23 included in the light emitting element array 12 emits blue light, a part of the emitted blue light is wavelength-converted to green light by the green phosphor 14 included in the sealing member 13. Blue light that has not been absorbed by the green phosphor 14, green light that has been wavelength-converted by the green phosphor 14, and red light that has been emitted by the red LED chips 21 and 22 are diffused and mixed in the sealing member 13. The Thereby, white light is emitted from the sealing member 13. That is, the sealing member 13 emits white light when the light emitting element rows 12 emit light.

  In addition, in order for the light-emitting device 10 to emit white light, red light emitted by the red LED chips 21 and 22 is not essential, but the color rendering property of the light-emitting device 10 is enhanced by white light including a red light component. .

[Terminal, wiring, and metal film]
Next, terminals, wirings, and metal films included in the wiring layer 11b of the substrate 11 will be described. A first terminal 16 a and a second terminal 16 b are arranged on the substrate 11 as power supply terminals for supplying power to the light emitting device 10 from the outside. The 1st terminal 16a and the 2nd terminal 16b are arrange | positioned at two places located on the diagonal among the four corners of the board | substrate 11, for example.

  The first terminal 16 a and the second terminal 16 b are terminals for supplying power to the plurality of light emitting element arrays from the outside of the light emitting device 10. In the light emitting device 10, the first terminal 16a is an anode terminal, and the second terminal 16b is a cathode terminal. When DC power is supplied between the first terminal 16a and the second terminal 16b, the plurality of light emitting element arrays 12 emit light.

  On the substrate 11, a first wiring 16c that is electrically connected to the first terminal 16a is disposed. The first wiring 16 c is a power supply wiring for electrically connecting the first terminal 16 a and the plurality of light emitting element arrays 12. On the substrate 11, a second wiring 16d that is electrically connected to the second terminal 16b is disposed. The second wiring 16d is a power supply wiring for electrically connecting the second terminal 16b and the plurality of light emitting element arrays 12, and is insulated from the first wiring 16c.

  The metal film 16e is a pad for electrically connecting the red LED chips 21 and 22. Specifically, the anode 21a included in the red LED chip 21 and the cathode 21k included in the red LED chip 22 are electrically connected to the metal film 16e by a conductive adhesive such as silver paste.

  The first terminal 16a, the second terminal 16b, the first wiring 16c, the second wiring 16d, and the metal film 16e described above are patterned on the substrate 11, for example. The first terminal 16a, the second terminal 16b, the first wiring 16c, the second wiring 16d, and the metal film 16e are formed of a metal material such as gold, silver, or copper, for example. The first terminal 16a, the second terminal 16b, the first wiring 16c, the second wiring 16d, and the metal film 16e may be formed, for example, by performing gold plating on a metal member such as silver or copper. Thus, corrosion or the like of a metal member such as copper or silver is suppressed.

[Enclosure]
The surrounding member 15 is a member provided on the substrate 11 and functioning as a dam material for blocking the sealing member 13. The surrounding member 15 also has a function of protecting the first wiring 16c and the second wiring 16d by covering at least a part of the first wiring 16c and at least a part of the second wiring 16d.

  The surrounding member 15 has an annular shape surrounding the light emitting element rows 12 and the sealing member 13 from the side. Under the surrounding member 15, most of the first wiring 16c and the second wiring 16d are located. In addition, the surrounding member 15 should just be cyclic | annular, a rectangular cyclic | annular form may be sufficient and a race track shape may be sufficient.

  For the surrounding member 15, for example, an insulating thermosetting resin or thermoplastic resin is used. More specifically, a silicone resin, a phenol resin, an epoxy resin, a bismaleimide triazine resin, a polyphthalamide (PPA) resin, or the like is used for the surrounding member 15.

The surrounding member 15 desirably has light reflectivity in order to increase the light extraction efficiency of the light emitting device 10. Therefore, in the first embodiment, white resin is used for the surrounding member 15. In order to improve the light reflectivity of the surrounding member 15, the surrounding member 15 may include particles such as TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO.

[Connection of multiple LED chips]
The effect obtained by such a configuration will be described with reference to a comparative example. FIG. 4 is a schematic cross-sectional view showing a connection relationship between a plurality of LED chips in a light emitting device according to a comparative example.

  In the light emitting device 10a shown in FIG. 4, the cathode 21k included in the red LED chip 21 is electrically connected to the metal film 16f by a conductive adhesive, and the cathode 22k included in the red LED chip 22 is electrically conductive. It is electrically connected to a metal film 16g different from the metal film 16f by the adhesive material. Then, in order to electrically connect the red LED chips 21 and 22, it is necessary to connect the metal film 16 g and the cathode 21 k of the red LED chip 21 by the bonding wire 17. Thus, when the bonding wire 17 is used for the electrical connection of the red LED chips 21 and 22 having the double-sided electrode structure, a space for connecting the bonding wire 17 to the metal film 16g is required. For this reason, the distance between the red LED chips 21 and 22 is increased.

  Further, in the light emitting device 10a, in order to electrically connect the red LED chip 21 and the blue LED chip 23 adjacent to the red LED chip 21, the metal film 16f and the anode 23a of the blue LED chip 23 are bonded. It is necessary to connect by the wire 17. Thus, when the bonding wire 17 is used for electrical connection of the red LED chip 21 having the double-sided electrode structure and the blue LED chip 23 having the single-sided electrode structure, the metal film 16f is enlarged to connect the bonding wire 17 It is necessary to provide a space. For this reason, the space | interval of the red LED chip 21 and the blue LED chip 23 will be vacant.

  As described above, in the light emitting device 10a, since the intervals between the plurality of LED chips are spaced, it is difficult to mount the plurality of LED chips at a high density.

  On the other hand, in the light emitting device 10, the red LED chips 21 and 22 are arranged adjacent to each other and are electrically connected via the metal film 16e. Specifically, each of the anode 21a included in the red LED chip 21 and the cathode 22k included in the red LED chip 22 is electrically connected to the metal film 16e included in the wiring layer 11b by a conductive adhesive such as silver paste. Connected. In the light emitting device 10, it is not necessary to provide a space for connecting the bonding wire 17 to the metal film 16 e in order to electrically connect the red LED chips 21 and 22. For this reason, the space | interval of the red LED chips 21 and 22 can be narrowed.

  In the light emitting device 10, the red LED chip 21 and the blue LED chip 23 adjacent to the red LED chip 21 are electrically connected by the bonding wire 17. Specifically, one end of the bonding wire 17 is connected to the anode 23 a of the blue LED chip 23, and the other end of the bonding wire 17 is connected to the cathode 21 k of the red LED chip 21. That is, the electrodes of the red LED chip 21 and the blue LED chip 23 adjacent to the red LED chip 21 are directly connected to each other by the bonding wire 17 without using the metal film disposed on the wiring layer 11b. For this reason, the space | interval of the red LED chip 21 and the blue LED chip 23 can be narrowed.

  As described above, in the light emitting device 10, since the intervals between the plurality of LED chips can be reduced, it is easy to mount the plurality of LED chips at high density.

  In the light emitting device 10, high-density mounting may be realized by chip-to-chip connection using bonding wires 17 using red LED chips having a single-sided electrode structure instead of red LED chips 21 and 22 having a double-sided electrode structure. Conceivable. Here, since the red LED chip having a single-sided electrode structure has a larger decrease in light emission intensity with a rise in temperature than the red LED chip having a double-sided electrode structure, it is a problem to suppress the decrease in light emission intensity.

  In general, the red LED chip has a larger reduction rate of the light emission intensity when the temperature rises than the blue LED chip. FIG. 5 is a diagram illustrating a difference in temperature characteristics between the blue LED chip and the red LED chip. In addition, the vertical axis | shaft in FIG. 5 has shown the relative light emission intensity when the light emission intensity in predetermined temperature (for example, 25 degreeC) is set to 1 about each of a blue LED chip and a red LED chip.

  As shown in FIG. 5, the emission intensity of both the blue LED chip and the red LED chip decreases as the junction temperature (Tj) increases. When the emission intensity of the red LED chip decreases with a decrease rate Dr as the temperature increases, the emission intensity of the blue LED chip decreases with a decrease rate Db smaller than the decrease rate Dr as the temperature increases. That is, the problem with the red LED chip is that the decrease rate Dr of the light emission intensity when the temperature decreases is larger than that of the blue LED chip.

  In particular, when a red LED chip having a single-sided electrode structure is disposed on the substrate 11, a base substrate (a substrate corresponding to the base substrate 23 b of the blue LED chip 23) is interposed between the light emitting layer and the substrate 11. Heat dissipation deteriorates. For this reason, the red LED chip having a single-sided electrode structure is greatly reduced in light emission intensity when the temperature rises more than the red LED chip having a double-sided electrode structure. In addition, the red LED chip having a single-sided electrode structure has a demerit that the cost is higher than that of the red LED chip having a double-sided electrode structure.

  On the other hand, in the light emitting device 10, it is possible to realize high-density mounting of a plurality of LED chips by using red LED chips (red LED chips 21 and 22) having a double-sided electrode structure instead of red LED chips having a single-sided electrode structure. . That is, in the light emitting device 10, it is possible to suppress a decrease in the light emission intensity of the red LED chip when the temperature rises, and to realize high-density mounting of a plurality of LED chips including the red LED chip at a low cost.

[Modification 1]
In the light emitting device 10, the metal material disposed in the wiring layer 11b such as the first terminal 16a, the second terminal 16b, the first wiring 16c, the second wiring 16d, and the metal film 16e is an insulating layer such as a cover resist. The wiring layer 11b (a metal material disposed on the wiring layer 11b) may be covered with an insulating layer except for a portion that needs to be exposed. FIG. 6 is a schematic cross-sectional view of the light emitting device according to the first modification.

  As shown in FIG. 6, the substrate 11d included in the light emitting device 10b includes an insulating layer 11c in addition to the base material 11a and the wiring layer 11b. Specifically, the insulating layer 11c is, for example, a cover resist layer.

  The insulating layer 11c covers a part of the wiring layer 11b. The insulating layer 11c covers, for example, a part of the metal film 16e. The anode 21a included in the red LED chip 21 and the cathode 22k included in the red LED chip 22 are electrically connected to a portion of the metal film 16e that is not covered with the insulating layer 11c. The connection surface 23s of the blue LED chip 23 is connected to the insulating layer 11c of the substrate 11d.

  As described above, the wiring layer 11b may be covered with the insulating layer 11c except for a portion that needs to be exposed. If the wiring layer 11b is covered with the insulating layer 11c, corrosion of the wiring layer 11b can be suppressed.

[Modification 2]
In the light emitting device 10, the red LED chips 21 and 22 may be electrically connected to the first wiring 16c instead of the metal film 16e. FIG. 7 is a schematic cross-sectional view of the light emitting device 10c according to the first modification.

  If the LED chips located at both ends in the X-axis direction of the light emitting element array 12 are LED chips 24 having a double-sided electrode structure as in the light-emitting device 10c shown in FIG. 24a (or the cathode 24k) can be directly connected to the first wiring 16c (or the second wiring 16d). Thereby, the bonding wire 17 (bonding wire 17 which performs chip-to-lead connection) which electrically connects the metal material arrange | positioned at the wiring layer 11b and the electrode of a LED chip can be reduced.

  Generally, when the bonding wire 17 is connected to a metal material arranged on the wiring layer 11b, the metal material is subjected to gold plating. If the number of bonding wires 17 for chip-to-lead connection is reduced, the gold plating process on the metal material can be reduced, and the cost of the light emitting device 10c can be reduced. If the LED chip 24 having a double-sided electrode structure is used at the end of the light emitting element array 12, it is possible to realize the light emitting device 10c that does not include any bonding wire 17 for chip-to-lead connection. The LED chip 24 is, for example, a red LED chip, but may be a blue LED chip.

[Modification 3]
In addition, although the light emitting device 10, the light emitting device 10b, and the light emitting device 10c have a substantially circular light emitting portion, the present invention may be implemented as a light emitting device having a shape other than a circular light emitting portion. For example, this invention may be implement | achieved as a light-emitting device with which a light-emitting part is a rectangular light-emitting device, or a linear (line-shaped) light-emitting part. FIG. 8 is an external perspective view of such a light emitting device according to the second modification.

  A light emitting device 10d shown in FIG. 8 includes a long substrate 11e, a linear light emitting element array 12 arranged on the substrate 11e, and a linear sealing member 13a for sealing the light emitting element array 12. Is provided. The connection relationship of the plurality of LED chips constituting the light emitting element array 12 is as described above. Further, the sealing member 13 a is formed of a translucent resin material containing a phosphor similarly to the sealing member 13.

  Also in such a light emitting device 10c, high-density mounting of a plurality of LED chips can be realized by using red LED chips (red LED chips 21 and 22) having a double-sided electrode structure.

  As illustrated in FIG. 9, the light emitting device 10 d may include a plurality of linear light emitting units. FIG. 9 is an external perspective view of a light emitting device 10d including a plurality of linear light emitting units.

  Each of the plurality of linear light emitting units provided in the light emitting device 10d is formed by the light emitting element array 12 sealed by the sealing member 13a. The two light emitting units run side by side with a space.

  Here, the two light emitting units may emit white light having the same color temperature, but the color temperature of the white light emitted from one linear light emitting unit emitted by the two light emitting units and the other linear light If the color temperature of the white light emitted from the light emitting unit is different, the light emitting device 10c capable of color adjustment is realized. In order to change the color temperature of the two light emitting portions, the number of red LED chips included in the two light emitting element rows 12, the content of the phosphor included in the two sealing members 13a, and the two sealing members What is necessary is just to change the kind of fluorescent substance contained in 13a.

[Modification 4]
In the light emitting device 10, it is not essential that the light emitting element rows 12 are collectively sealed with one type of sealing member 13. For example, the red LED chips 21 and 22 included in the light emitting element array 12 are sealed with a transparent resin material that does not contain a phosphor, and the blue LED chip 23 is sealed with a sealing member 13 that contains a phosphor. May be.

  Thereby, it is suppressed that the red light emitted from the red LED chips 21 and 22 is scattered and attenuated by the phosphor. That is, in the light emitting device 10, the light extraction efficiency of red light can be improved. The same applies to the light emitting device 10b, the light emitting device 10c, and the light emitting device 10d.

  The light emitting element array 12 included in the light emitting device 10 includes the blue LED chip 23 having a single-sided electrode structure and the red LED chips 21 and 22 having a double-sided electrode structure. The light emitting element array 12 includes a single-sided electrode structure. LED chips and LED chips having a double-sided electrode structure may be included. For example, the single-sided electrode structure LED chip included in the light-emitting element array 12 may be a red LED chip, and the double-sided electrode structure LED chip included in the light-emitting element array 12 may be a blue LED chip. Each of the LED chip having a double-sided electrode structure and the LED chip having a single-sided electrode structure may be a blue LED chip. The same applies to the light emitting device 10b, the light emitting device 10c, and the light emitting device 10d.

[Effects]
As described above, the light emitting device 10 includes the base 11a and the substrate 11 including the wiring layer 11b disposed on the base 11a, and the first light emitting element (for example, red LED) having the anode and the cathode facing each other. Chip 21) and a second light emitting element (for example, red LED chip 22), a connection surface (for example, connection surface 23s) connected to the substrate 11, and an anode (for example, a surface opposite to the connection surface) , An anode 23a) and a cathode (for example, cathode 23k), a third light emitting element (for example, blue LED chip 23), and a bonding wire 17.

  The anode (for example, the anode 21a) included in the first light emitting element and the cathode (for example, the cathode 22k) included in the second light emitting element are electrically connected to the metal film 16e included in the wiring layer 11b. The bonding wire 17 (a) electrically connects the cathode (for example, the cathode 21k) included in the first light emitting element and the anode (for example, the anode 23a) included in the third light emitting element, or (b) An anode (for example, anode 22a) included in the two light emitting elements and a cathode (for example, cathode 23k) included in the third light emitting element are electrically connected.

  Thereby, it is not necessary to provide a space for connecting the bonding wire 17 to the metal film 16e in order to electrically connect the first light emitting element and the second light emitting element. The interval can be reduced. Therefore, in the light emitting device 10, high-density mounting of a plurality of light emitting elements is facilitated.

  Further, each of the emission peak wavelength of the first light emitting element and the emission peak wavelength of the second light emitting element may be different from the emission peak wavelength of the third light emitting element.

  Thereby, in the light-emitting device 10, a plurality of first light-emitting elements and second light-emitting elements, and a plurality of third light-emitting elements including the first light-emitting elements and the second light-emitting elements and the third light-emitting elements having different emission peak wavelengths (different emission colors). High-density mounting of light emitting elements is facilitated.

  Each of the first light emitting element and the second light emitting element may emit red light, and the third light emitting element may emit blue light.

  Thereby, in the light-emitting device 10, high-density mounting of a plurality of light-emitting elements including the first light-emitting element and the second light-emitting element that emit red light and the third light-emitting element that emits blue light is facilitated.

  Further, the first light-emitting element has a lower emission intensity at a first decrease rate when the temperature rises, the second light-emitting element has a lower emission intensity at a second decrease rate when the temperature is increased, and the third light-emitting element is When the temperature rises, the emission intensity may decrease at a third decrease rate that is smaller than either the first decrease rate or the second decrease rate. The first reduction rate and the second reduction rate may be the same or different.

  As described above, if the electrodes of the first light emitting element and the second light emitting element, which have a relatively large decrease rate of the light emission intensity with respect to the temperature rise, are directly connected to the metal film 16e, the heat dissipation of the first light emitting element and the second light emitting element. Can be enhanced. For this reason, the fall of the emitted light intensity with respect to the temperature rise of a 1st light emitting element and a 2nd light emitting element can be suppressed.

  In the light emitting device 10b, the substrate 11d further includes an insulating layer 11c that covers a part of the wiring layer 11b, and the connection surface 23s is connected to the insulating layer 11c.

  Thereby, the wiring layer 11b can be protected by the insulating layer 11c.

  In the light emitting device 10b, the insulating layer 11c covers a part of the metal film 16e, and the anode of the first light emitting element and the cathode of the second light emitting element are covered by the insulating layer 11c of the metal film 16e. It is electrically connected to the uninsulated part.

  Thereby, a portion of the metal film 16e that does not need to be exposed can be protected by the insulating layer 11c.

  In addition, the light emitting device 10 may include a plurality of light emitting element arrays 12 including a first light emitting element, a second light emitting element, and a third light emitting element. The plurality of light emitting element arrays 12 may be connected in parallel.

  Thereby, in the light-emitting device 10, the several light emitting element which comprises the several light emitting element row | line | column connected in parallel can be mounted with high density.

  Moreover, the light-emitting device 10 may further include a sealing member 13 that collectively seals the first light-emitting element, the second light-emitting element, and the third light-emitting element.

  Thereby, the first light emitting element, the second light emitting element, and the third light emitting element can be protected by the sealing member 13.

  The light emitting device 10 may further include an enclosing member 15 that surrounds the sealing member 13.

  Thereby, a plurality of light emitting elements can be mounted with high density in the region surrounded by the surrounding member 15.

(Embodiment 2)
Next, the lighting device according to Embodiment 2 will be described with reference to FIGS. FIG. 10 is a cross-sectional view of the lighting apparatus according to Embodiment 2. FIG. 11 is an external perspective view of the lighting device and its peripheral members according to Embodiment 2. FIG.

  As shown in FIGS. 10 and 11, the lighting device 200 according to Embodiment 2 irradiates light in a lower space (such as a corridor or a wall) by being embedded in a ceiling of a house, for example. It is an embedded illumination device such as a downlight.

  The lighting device 200 includes the light emitting device 10. The lighting device 200 further includes a substantially bottomed tubular instrument body configured by coupling the base 210 and the frame body part 220, and a reflector 230 and a translucent panel 240 disposed in the instrument body. Is provided.

  The base 210 is a mounting base to which the light emitting device 10 is attached and a heat sink that dissipates heat generated in the light emitting device 10. Base 210 is formed in a substantially cylindrical shape using a metal material, and is made of aluminum die casting in the second embodiment.

  A plurality of radiating fins 211 projecting upward are provided on the upper portion (ceiling side portion) of the base portion 210 at regular intervals along one direction. Thereby, the heat generated in the light emitting device 10 can be radiated efficiently.

  The frame body part 220 has a substantially cylindrical cone part 221 having a reflection surface on the inner surface, and a frame body part 222 to which the cone part 221 is attached. The cone portion 221 is formed using a metal material, and can be manufactured by drawing or press-molding an aluminum alloy or the like, for example. The frame main body 222 is formed of a hard resin material or a metal material. The frame body part 220 is fixed by attaching the frame body body part 222 to the base part 210.

  The reflection plate 230 is an annular frame-shaped (funnel-shaped) reflection member having an internal reflection function. The reflector 230 can be formed using a metal material such as aluminum. The reflector 230 may be formed of a hard white resin material instead of a metal material.

  The translucent panel 240 is a translucent member having light diffusibility and translucency. The translucent panel 240 is a flat plate disposed between the reflection plate 230 and the frame body portion 220, and is attached to the reflection plate 230. The translucent panel 240 can be formed in a disk shape with a transparent resin material such as acrylic or polycarbonate.

  Note that the lighting device 200 may not include the translucent panel 240. By not providing the translucent panel 240, the luminous flux of the light emitted from the lighting device 200 can be improved.

  As shown in FIG. 11, the lighting device 200 includes a lighting device 250 that supplies power to the light emitting device 10 to light the light emitting device 10, and AC power from a commercial power source to the lighting device 250. A relay terminal block 260 is connected. Specifically, the lighting device 250 converts AC power relayed from the terminal block 260 into DC power and outputs the DC power to the light emitting device 10.

  The lighting device 250 and the terminal block 260 are fixed to a mounting plate 270 provided separately from the instrument body. The mounting plate 270 is formed by bending a rectangular plate member made of a metal material. The lighting device 250 is fixed to the lower surface of one end portion in the longitudinal direction, and the terminal block 260 is mounted on the lower surface of the other end portion. Fixed. The mounting plate 270 is connected to a top plate 280 fixed to the upper part of the base 210 of the instrument body.

  As described above, the lighting device 200 includes the light emitting device 10 and the lighting device 250 that supplies the light emitting device 10 with power for lighting the light emitting device 10. Thereby, the illuminating device in which high-density mounting of a plurality of LED chips is easy is realized. Note that the lighting device 200 may include a light emitting device 10b, a light emitting device 10c, or a light emitting device 10d instead of the light emitting device 10.

  In the second embodiment, the downlight is exemplified as the lighting device, but the present invention may be realized as another lighting device such as a spotlight.

(Other embodiments)
Although the light-emitting device and the lighting device according to the embodiment have been described above, the present invention is not limited to the above-described embodiment.

  In the above embodiment, the light emitting device emits white light by a combination of a blue LED chip, a red LED chip, and a green phosphor, but the configuration for emitting white light is not limited thereto. For example, a blue LED chip, a red LED chip, a green phosphor, and a red phosphor may be combined. That is, the sealing member may include a green phosphor and a red phosphor. Further, a yellow phosphor may be combined in place of the green phosphor or in addition to the green phosphor.

  Alternatively, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than blue light, and a blue phosphor, a green phosphor that emits blue light, red light, and green light by being mainly excited by ultraviolet light, and A red phosphor may be combined. That is, the LED chip emits ultraviolet light, and the sealing member may include a blue phosphor, a green phosphor, and a red phosphor.

  The light emitting device may emit light of a color other than white. In this case, the sealing member may not include the phosphor.

  Moreover, in the said embodiment, the LED chip was illustrated as a light emitting element used for a light-emitting device. However, a semiconductor light emitting element such as a semiconductor laser, or a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be adopted as the light emitting element.

  In addition, it is realized by variously conceiving various modifications conceived by those skilled in the art for each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention. For example, the present invention may be realized as a method for manufacturing a light emitting device (an LED chip arrangement method).

10, 10b, 10c, 10d Light emitting device 11, 11d, 11e Substrate 11a Base material 11b Wiring layer 11c Insulating layer 12 Light emitting element array 13, 13a Sealing member 15 Enclosing member 16e Metal film 17 Bonding wire 21 Red LED chip (first (Light emitting element)
21a, 22a, 23a Anode 21k, 22k, 23k Cathode 22 Red LED chip (second light emitting element)
23 Blue LED chip (third light emitting device)
23s connection surface 200 lighting device 250 lighting device

Claims (10)

A substrate including a base material and a wiring layer disposed on the base material;
A first light-emitting element and a second light-emitting element having an anode and a cathode facing each other;
A third light emitting element having a connection surface connected to the substrate, and an anode and a cathode disposed on a surface opposite to the connection surface;
With wires,
The anode of the first light emitting element and the cathode of the second light emitting element are electrically connected to the metal film included in the wiring layer,
The wire is (a) electrically connecting a cathode of the first light emitting element and an anode of the third light emitting element, or (b) an anode of the second light emitting element, and A light emitting device for electrically connecting a cathode of a third light emitting element. The light emitting device according to claim 1, wherein each of an emission peak wavelength of the first light emitting element and an emission peak wavelength of the second light emitting element is different from an emission peak wavelength of the third light emitting element. Each of the first light emitting element and the second light emitting element emits red light,
The light emitting device according to claim 2, wherein the third light emitting element emits blue light. When the temperature rises, the first light-emitting element has a light emission intensity reduced at a first reduction rate,
The second light emitting element, when the temperature rises, the light emission intensity decreases at a second decrease rate,
The light-emitting device according to claim 1, wherein the third light-emitting element has a light emission intensity that decreases at a third decrease rate that is smaller than both the first decrease rate and the second decrease rate when the temperature increases. The substrate further includes an insulating layer covering a part of the wiring layer,
The light emitting device according to claim 1, wherein the connection surface is connected to the insulating layer. The insulating layer covers a part of the metal film,
The light emitting device according to claim 5, wherein an anode included in the first light emitting element and a cathode included in the second light emitting element are electrically connected to a portion of the metal film that is not covered with the insulating layer. . The light emitting device includes a plurality of light emitting element rows including the first light emitting element, the second light emitting element, and the third light emitting element,
The light emitting device according to claim 1, wherein the plurality of light emitting element arrays are connected in parallel. further,
The light emitting device according to claim 1, further comprising a sealing member that collectively seals the first light emitting element, the second light emitting element, and the third light emitting element. The light emitting device according to claim 8, further comprising an enclosing member surrounding the sealing member. The light emitting device according to any one of claims 1 to 9,
A lighting device comprising: a lighting device that supplies power for lighting the light emitting device to the light emitting device.

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