CN207009478U - It is exclusively used in the paster LED and its pad structure of large scale transparency carrier - Google Patents
It is exclusively used in the paster LED and its pad structure of large scale transparency carrier Download PDFInfo
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- CN207009478U CN207009478U CN201720426555.1U CN201720426555U CN207009478U CN 207009478 U CN207009478 U CN 207009478U CN 201720426555 U CN201720426555 U CN 201720426555U CN 207009478 U CN207009478 U CN 207009478U
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Abstract
It the utility model is related to a kind of paster LED pad structure, including meeting the pad VDD of power supply and the pad GND of ground connection, also include 4 signal pads, respectively pulse signal input pad CKI, output of pulse signal pad CKO, address code signal input pad SDI and address code signal o pads SDO, pad VDD and pad GND is located at the centre position of paster LED substrate, 4 signal pads are distributed in pad VDD and pad GND lines both sides, and two signal input pads are located at homonymy, two signal output pads are located at homonymy；The also corresponding paster LED for being exclusively used in large scale transparency carrier provided using above-mentioned pad structure of the utility model, its internal implantation IC chip, so that driving and control are internally carried out, connected between element by lead, it is overall only to need to draw two power lines, greatly reduce so that connecting up quantity in transparent circuit substrate, ensure the translucency of transparent circuit substrate.
Description
Technical field
It the utility model is related to a kind of paster LED, and in particular to paster LED and its pad structure, belong to LED technology neck
Domain.
Background technology
Conventional patch LED typically only two pads, are respectively used to connect power supply and ground connection, for full-color paster LED, then have
Four pads, such as Chinese utility model patent " the full-color patch light-emitting diode pad structures of CN201020505894- and full-color patch
Piece light emitting diode ", pad include common-anode pad, red cathode pad, blue cathode pad and green cathode pad.
Existing chip mounter is used to carry out the patch of above-mentioned paster LED on small-sized circuit board (full-size is 45~60cm)
Piece process, it is ensured that higher yields, but to prepare large scale circuit board, then yields is relatively low, no more than 50%,
Trace it to its cause and be that existing paster LED pad distributed architecture is unreasonable and the wire structures of paster LED are intricate, existing patch
Size of piece LED itself is smaller, mostly 2mm*2mm or 3mm*3mm, it is desirable to the minimum 0.2mm of paster LED spacing, when circuit board foot
After very little increase, the accumulated error of chip mounter sharply increases, and more than 0.2mm, therefore causes yields low.
It is luminous that LED needs driving chip to be driven, to save cost, typically using external IC chip, then and each LED
Lamp is required to draw 2-4 bar leads, and for large-scale point matrix LED, wire structures are intricate, short-circuit conditions easily occur, are
This, works out in the industry a kind of built-in IC LED, " LED of build-in IC chip and WWA chips is produced such as Chinese utility model patent
Product and its LED support ", IC chip is implanted into LED and encapsulated by support, the LED has 4PIN conductive feets, is respectively
For connecing the first conductive feet, the second conductive feet for signal input, the 3rd conductive feet and use for signal output of power supply
In the 4th conductive feet of ground connection, the LED can greatly reduce circuit board wiring quantity, it can be difficult to being applied to pasting circuit board.
The content of the invention
Content of the present utility model is overcome the deficiencies in the prior art, and provides one kind and be exclusively used in large scale transparency carrier
Paster LED and its pad structure, the pad distributed architecture is reasonable, and can greatly reduce the wiring quantity of paster LED.
Technical scheme is used by realizing the utility model purpose, a kind of paster LED pad structure, including at least for
The pad VDD of power supply and the pad GND for ground connection, in addition to 4 signal pads are connect, respectively for pulse signal input
Pad CKI, the pad CKO for output of pulse signal, for address code signal input pad SDI and for address code signal
The pad SDO of output, pad VDD and pad GND are located at the centre position of paster LED substrate, and 4 signal pads are distributed in pad
VDD and pad GND lines both sides, and two the pad CKI and SDI for being used for signal input are located on the side of the line,
Two the pad CKO and SDO for being used for signal output are located on the opposite side of the line, and the spacing of two neighboring pad is described two
1/8~1/2 times of the side length of side where individual pad.
6 pads are rectangular, and its length direction is parallel, and 4 signal pads are distributed in paster LED substrate
Corner.
Spacing between signal pad and pad VDD or pad GND adjacent thereto is the 1/6~1/ of the place side length of side
4 times.
The substrate of the paster LED is square, and pad VDD and pad GND are distributed in wherein one of paster LED substrate
On symmetry axis.
The also corresponding paster for being exclusively used in large scale transparency carrier provided using above-mentioned pad structure of the utility model
LED, paster LED are the internal paster LED for being implanted into IC chip.
Compared with prior art, the paster LED and its pad provided by the utility model for being exclusively used in large scale transparency carrier
Structure has the following advantages that：
(1) the utility model is designed to be exclusively used in the paster LED of transparent circuit substrate, and transparent circuit substrate is different from
Common PCB, common PCB are packaged in machine, require nothing more than thereon wiring in order, short circuit does not occur, and
Transparent circuit substrate is for place that is outdoor, being required to daylighting, if wiring is excessively intensive, necessarily causes transparent circuitry
The translucency of substrate is had a greatly reduced quality, therefore it is required that the surface mount elements lead for being exclusively used in transparent circuit substrate is as far as possible few, this practicality is new
Implantation IC chip inside the paster LED that type provides, it is driven and control is internally carried out, and is connected between paster LED by lead
Connect, it is overall only to need to draw two power lines, greatly reduce so that connecting up quantity in transparent circuit substrate, ensure transparent
The translucency of circuit substrate.
(2) the utility model is designed to be exclusively used in the paster LED of large-size substrate, it is contemplated that chip mounter is in large scale
Cumulative errors on substrate during paster are larger, and the utility model uses 6 pad structures, 4 signal pads be distributed in pad VDD with
The both sides of pad GND lines, the spacing between signal pad and pad VDD or pad GND adjacent thereto are place side side
Long 1/6~1/4 times, spacing is larger, meets the paster requirement of large-size substrate, it is ensured that more than 90% yields, highest
Up to 96%.
(3) the utility model is designed to be exclusively used in the paster LED of clear glass base circuit board, to fully ensure that glass
The permeability of base circuit board, the circuit board should avoid wires cross as far as possible, otherwise need to use resistance cross-line, not only increased
Paster workload, the light transmission of glass base circuit board is had an effect on, two are used for the pad CKI that signal inputs in the utility model
Pad VDD and pad GND side are located on SDI, two the pad CKO and SDO for being used for signal output are located on pad VDD
With pad GND opposite side, this distributed architecture can avoid the signal pad connecting wire between two neighboring paster LED from ring occur
Shape structure and cause power lead need by resistance cross-line, using pad structure of the present utility model, power lead and signal
Wire connects up along vertical and horizontal respectively, ensures that power lead does not conflict with signal conductor wiring.
(4) paster LED pad direction of the present utility model is identical, is longitudinal direction or is transverse direction so that using the pad
The paster LED of structure is easier to make, and is easy to connect up during paster.
Brief description of the drawings
Fig. 1 is the structure chart of paster LED pad structure provided by the utility model.
Fig. 2 is the structure chart of the paster LED provided by the utility model for being exclusively used in large scale transparency carrier.
Wherein, 100- paster LEDs, 1- pads VDD, 2- pad GND, 3- pad CKI, 4- pad CKO, 5- pad SDI, 6-
Pad SDO, 7- substrate, 8-IC chips, the color chips of 9-RGB tri-, 10- vias.
Embodiment
The utility model is illustrated in detail with reference to the accompanying drawings and examples, content of the present utility model not office
It is limited to following examples.
Referring to Fig. 1, paster LED pad structure provided by the utility model, including 2 energy supply pads and 4 signal pads,
6 pads altogether, 6 pads are rectangular, and its length direction is parallel, and in the present embodiment, 6 pads are in vertical point
Cloth, 2 energy supply pads include being used for the pad VDD1 for connecing power supply and the pad GND2 for ground connection, and 4 signal pads are respectively
For the pad CKI3 of pulse signal input, the pad CKO4 for output of pulse signal, the weldering for address code signal input
The disk SDI5 and pad SDO6 for address code signal output, in the present embodiment, the substrate 7 of paster LED 100 is square, side
Long 2mm, pad VDD1 and pad GND2 are located at the centre position of paster LED substrate 7, wherein on a symmetry axis of substrate 7, and two
Person's spacing is 0.4mm, and 4 signal pads are distributed in the corner of paster LED substrate 7, and are distributed in pad VDD1 and pad
The both sides of GND2 lines, two the pad CKI3 and SDI5 for being used for signal input are located on the side of this symmetry axis, between the two
Away from for 0.8mm, pad CKI3 and SDI5 and the spacing of corresponding energy supply pad are 0.4mm, two welderings for being used for signal output
Disk CKO4 and SDO6 are located on the opposite side of this symmetry axis, and the two spacing is 0.8mm, pad CKO4 and SDO6 and corresponding confession
The spacing of energy pad is 0.4mm.
The also corresponding paster for being exclusively used in large scale transparency carrier 7 provided using above-mentioned pad structure of the present embodiment
LED100, referring to Fig. 2, the inside of paster LED 100 implantation IC chip 8, its front sets six pads, respectively with its back side
Six pads are turned on by via 10, and the color chips 9 of RGB tri- of paster LED 100 are attached to the front pad turned on pad VDD1
On, IC chip 8 is attached on the front pad turned on pad GND2, on the front pad draw 4 wire jumpers, be respectively connected to
On 4 front pads of 4 signal pads CKI3, CKO4, SDI5 and SDO6 conducting, pulse signal and address code signal are realized
After input and output, the pulse signal and address code signal are handled by IC chip, driving paster LED 100 is luminous and controls it
Luminous moment and luminous duration.
Claims (5)
1. a kind of paster LED pad structure, including at least for meeting the pad VDD of power supply and pad GND for ground connection, it is special
Sign is：Also include 4 signal pads, respectively the pad CKI for pulse signal input, the weldering for output of pulse signal
Disk CKO, the pad SDI for address code signal input and the pad SDO for address code signal output, pad VDD and pad
GND is located at the centre position of paster LED substrate, and 4 signal pads are distributed in pad VDD and pad GND lines both sides, and
Two the pad CKI and SDI for being used for signal input are located on the side of the line, two pad CKO for being used for signal output and
SDO is located on the opposite side of the line, and the spacing of two neighboring pad is the 1/8~1/ of described two pads place side length of side
2 times.
2. paster LED pad structure according to claim 1, it is characterised in that：The pad VDD, pad GND and 4
Signal pad is rectangular, and its length direction is parallel, and 4 signal pads are distributed in the corner of paster LED substrate.
3. paster LED pad structure according to claim 1, it is characterised in that：Signal pad and pad adjacent thereto
Spacing between VDD or pad GND is 1/6~1/4 times of the place side length of side.
4. paster LED pad structure according to claim 1, it is characterised in that：The substrate of the paster LED is pros
Shape, pad VDD and pad GND are distributed in wherein on a symmetry axis of paster LED substrate.
5. a kind of paster LED for being exclusively used in large scale transparency carrier based on paster LED pad structure described in claim 1, its
It is characterised by：The paster LED is the internal paster LED for being implanted into IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720426555.1U CN207009478U (en) | 2017-04-21 | 2017-04-21 | It is exclusively used in the paster LED and its pad structure of large scale transparency carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720426555.1U CN207009478U (en) | 2017-04-21 | 2017-04-21 | It is exclusively used in the paster LED and its pad structure of large scale transparency carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207009478U true CN207009478U (en) | 2018-02-13 |
Family
ID=61443139
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720426555.1U Active CN207009478U (en) | 2017-04-21 | 2017-04-21 | It is exclusively used in the paster LED and its pad structure of large scale transparency carrier |
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| CN (1) | CN207009478U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110410699A (en) * | 2019-08-23 | 2019-11-05 | 上犹县嘉亿灯饰制品有限公司 | Copper wire lamp and copper wire lamp control method |
| CN112242385A (en) * | 2020-10-28 | 2021-01-19 | 长春希龙显示技术有限公司 | Mirco-LED passive driving display unit based on glass substrate |
-
2017
- 2017-04-21 CN CN201720426555.1U patent/CN207009478U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110410699A (en) * | 2019-08-23 | 2019-11-05 | 上犹县嘉亿灯饰制品有限公司 | Copper wire lamp and copper wire lamp control method |
| CN110410699B (en) * | 2019-08-23 | 2024-05-14 | 上犹县嘉亿灯饰制品有限公司 | Copper wire lamp and copper wire lamp control method |
| CN112242385A (en) * | 2020-10-28 | 2021-01-19 | 长春希龙显示技术有限公司 | Mirco-LED passive driving display unit based on glass substrate |
| CN112242385B (en) * | 2020-10-28 | 2022-08-23 | 长春希龙显示技术有限公司 | Mirco-LED passive driving display unit based on glass substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220921 Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee after: Huashang Optoelectronics Technology Co.,Ltd. Address before: Room 4901, Minsheng Bank Building, No. 396, Qushui Building, Xinhua Road, Jianghan District, Wuhan City, Hubei Province 430000 Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230828 Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee before: Huashang Optoelectronics Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |