CN206282882U - LED package assemblings - Google Patents
LED package assemblings Download PDFInfo
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- CN206282882U CN206282882U CN201621155517.9U CN201621155517U CN206282882U CN 206282882 U CN206282882 U CN 206282882U CN 201621155517 U CN201621155517 U CN 201621155517U CN 206282882 U CN206282882 U CN 206282882U
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- led element
- led
- pin
- bearing pads
- lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
This application discloses LED package assemblings.The LED package assemblings include：Lead frame, with bearing pads, the multiple pins being spaced apart and multiple external pads；First LED element, the second LED element and the 3rd LED element, are fixed on the bearing pads of the lead frame jointly, and are electrically connected with the bearing pads and the multiple pin；And encapsulating compound, for covering the lead frame and allowing light to appear, the multiple pin is used to provide interconnecting area, the multiple pin is electrically connected with the multiple external pads respectively, wherein, the bearing pads are spaced apart with the multiple pin, and provide interconnecting area for being electrically connected with the multiple pin.The LED package assemblings improve contrast by reducing the exposed surface of lead frame.
Description
Technical field
The utility model is related to LED encapsulation technologies, more particularly, to the LED package assemblings for LED display.
Background technology
LED display has the superiority of following aspect：Gray scale high, visible angle wide, abundant color and customizable
Screen shape.Therefore, LED display is widely used in industry, traffic, commercial advertisement, information issue, sports tournament etc. respectively
Individual field.
The pixel element used in LED display is LED.Pixel element is, for example, surface mount device (Surface
Mounted Devices, i.e. SMD) packaged type LED package assemblings.Each LED package assembling can include lead frame, peace
Three kinds of the three of color LED elements of red, green, blue and covering lead frame and permission light are shown respectively on lead frame
The resin encapsulant for appearing.Three respective light emission sides of LED element are the side of packed material covering.In display image, often
The brightness of three LED elements of individual LED package assemblings is controlled, such that it is able to realize colour light-emitting using blend of colors.
In above-mentioned LED package assemblings, LED is arranged on lead frame.The lead frame is for example manufactured by PCB manufacture crafts
Form, layer on surface of metal therein can wait noble metal to improve electric conductivity with silver-plated.After the package has been finalized, the metal of lead frame
Layer surface is also exposed to the encapsulating compound bottom of encapsulated moulding.When LED package assemblings are used to illuminate, metal level table in lead frame
The reflex in face can improve the brightness of illumination, it might even be possible to which additional reflection coating is improving brightness.However, being sealed by LED
When arrangement constitutes LED display as pixel cell, due to the exposed surface reflection environment light of leadframe metal layer, therefore
The contrast of LED display will be deteriorated.With the raising of LED display resolution ratio, the size of LED element and LED package assemblings
Also reduce.In the SMD LED package assemblings of small spacing, the exposed surface of leadframe metal layer is to the contrast of LED display
Influence it is especially notable.
Therefore, it is desirable to further reduce contrast of the leadframe metal layer surface in LED package assemblings to LED display
Adverse effect.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of improved LED package assemblings, by reducing lead
The exposed surface of frame metal level is improving contrast.
According to the utility model, there is provided a kind of LED package assemblings, including：Lead frame, with bearing pads, is spaced apart
Multiple pins and multiple external pads；First LED element, the second LED element and the 3rd LED element, are fixed on described jointly
On the bearing pads of lead frame, and electrically connected with the bearing pads and the multiple pin；And encapsulating compound, it is described for covering
Lead frame simultaneously allows light to appear, and the multiple pin is used to provide interconnecting area, and the multiple pin is outer with the multiple respectively
Portion's pad electrical connection, wherein, the bearing pads are spaced apart with the multiple pin, and provide interconnecting area for many with described
Individual pin electrical connection, first LED element, second LED element and the 3rd LED element include anode electrode respectively
And cathode electrode, also, first LED element, the anode electrode of second LED element and the 3rd LED element and
One of cathode electrode is commonly connected to the same pin in the multiple pin.
Preferably, the LED package assemblings also include the 4th LED element, are fixed on the bearing pads of the lead frame, institute
Stating the 4th LED element includes anode electrode and cathode electrode, and the 4th LED element is electrically connected with the multiple pin, wherein,
One of anode electrode and cathode electrode of 4th LED element connect the same pin.
Preferably, first LED element, second LED element and the 3rd LED element send red respectively
Light, green light and blue light, and put in order and do not limit.
Preferably, described LED package assemblings also include：A plurality of bonding wire, first LED element, described second
LED element, the 3rd LED element are connected to the multiple via the corresponding bonding wire in a plurality of bonding wire respectively
Pin.
Preferably, the bearing pads and first LED element, second LED element and the 3rd LED element it
One anode electrode or cathode electrode is connected.
Preferably, the bearing pads are connected to the multiple drawing via the corresponding bonding wire in a plurality of bonding wire
Respective pins in pin.
Preferably, first LED element, second LED element and the respective light emission side of the 3rd LED element are
The side covered by the encapsulating compound.
Preferably, first LED element is fixed on the bearing pads using conducting resinl.
Preferably, the lead frame be double-layered circuit board, the lead frame include PCB substrate, the bearing pads with it is described
Multiple pins are located at the first surface of the PCB substrate, and the multiple external pads are located at the second surface of the PCB substrate,
The multiple pin realizes electricity by the via between the first surface and second surface with the multiple external pads respectively
Connection.
Preferably, first LED element is fixed on the bearing pads using conducting resinl.
Preferably, at least one of the multiple pin pin be shaped as only retain the unfilled corner water chestnut at complete angle
The bearing pads are pointed at shape, the complete angle, and the interconnecting area is located at the top at the complete angle.
LED package assemblings according to the utility model embodiment, the bearing pads in lead frame need not serve as pin, therefore
Bearing pads can save the extension of PCB substrate corner in extending to lead frame below LED element, so as to reduce carrying
Pad the exposed surface area of encapsulating compound lower surface in encapsulated moulding.
In preferred embodiment, at least one of the multiple pin pin be shaped as only retain a complete angle
Unfilled corner rhombus, so as to do not increase it is described bonding line length while reduce encapsulation of at least one pin in encapsulated moulding
The material exposed surface area of lower surface.
The change of above-mentioned lead frame shape and its change with LED element connected mode so that the metal surface of lead frame
The ratio shared by encapsulating compound lower surface in encapsulated moulding is substantially reduced.When LED element does not light, the metal watch of lead frame
Face also also can accordingly reduce to the reflection of ambient light, so as to improve the contrast of LED display.
Further, because the area of lead frame bearing pads reduces, and regular shape, therefore after encapsulation can be with
Reduce the stress between encapsulating compound and lead frame so that stress distribution is uniform, yielding so as to not allow.
Brief description of the drawings
By description referring to the drawings to the utility model embodiment, of the present utility model above-mentioned and other mesh
, feature and advantage will be apparent from.
Fig. 1 shows the decomposition diagram of the LED package assemblings according to prior art.
Fig. 2 shows the decomposition diagram of the LED package assemblings according to the utility model embodiment.
Fig. 3 shows the decomposition diagram of the LED package assemblings according to the alternate embodiment of the utility model embodiment.
Specific embodiment
Various embodiments of the present utility model are more fully described hereinafter with reference to accompanying drawing.In various figures, identical
Element is represented using same or similar reference.For the sake of clarity, the various pieces in accompanying drawing are not drawn to paint
System.
The utility model can be presented in a variety of manners, some of them example explained below.
Fig. 1 shows the decomposition diagram of the LED package assemblings according to prior art.LED package assemblings 100 include lead frame
110th, LED element 120 to 140 and encapsulating compound 150, wherein, LED element 120 to 140 is arranged on lead frame 110, encapsulation
Material 150 is light transmissive material, is covered in the surface of lead frame 110.In figure, for the sake of clarity, by the encapsulation of package assembling 100
Separated between material 150 and other parts and shown.
Lead frame 110 is the double-layered circuit board manufactured by PCB technology, including PCB substrate 117, multiple external pads 116,
Bearing pads 111 (or being " crystal bonding area ") and multiple pins 112.Multiple pins 112 are located at PCB substrate 117 with bearing pads 111
The same side, and relative with the multiple external pads 116 positioned at the opposite side of PCB substrate 117 respectively, multiple pins 112 with carry
Pad 111 realizes electrical connection with corresponding multiple external pads 116 by the via in PCB substrate 117 respectively.Bearing pads 111 are used
In be LED element 120 to 140 provide mechanical support.Because bearing pads 111 itself are also conductive, therefore bearing pads 111 are also simultaneous
As pin, for being electrically connected with LED element 120, and extend to the edge of PCB substrate, for corresponding PCB substrate
The external pads 116 of opposite side are realized electrically connecting by via, so as to provide being electrically connected between LED element 120 and external circuit
Connect.The multiple pin 112 is spaced apart, and for being electrically connected with LED element 120 to 140, and extends respectively to PCB substrate
Edge, be respectively used to realize electrically connecting by via with the external pads 116 of corresponding PCB substrate opposite side, to provide
Electrical connection between LED element 120 to 140 and external circuit.Additionally, at least one of the multiple pin 112 pin is same
When be connected to LED element 120 to 140, to provide the electrical connection between the LED element 120 to 140.
Lead frame 110 can be manufactured by PCB manufacture crafts, and for example the method such as the transfer of application pattern and etching is limited and carried
The shape of pad and pin.Wherein, bearing pads and multiple pins can also include additional coating to improve electric conductivity, for example, by
Selected from the conductive coating that the material of the noble metals such as gold, silver is formed to bearing pads 111 and multiple pins 112.Further, lead frame
110 can include internal pads 114, for accommodating solder to be electrically connected between LED element.
LED element 120 to 140 is respectively the light-emitting component of one of redgreenblue.LED element 120 to 140 includes respectively
Anode electrode and cathode electrode, and it is internal including PN junction.Apply between the anode electrode and cathode electrode of LED element positive
During voltage, LED element conducting, electronics enters N areas from injection P areas of N areas, hole from P areas, so that using minority carrier and majority
The recombination luminescence of carrier.LED element 120 to 140 can be fixed on the supporting region of lead frame 110 using bonding agent.
According to the characteristics of internal structure, the anode electrode and cathode electrode of LED element 120 to 140 can be formed in LED units
On the same surface or opposite surface of part.For example, being the red LED unit of vertical stratification figure 1 illustrates LED element 120
Part, anode electrode 121 and cathode electrode (not shown) are respectively formed on relative surface.In the prior art, LED element
120 anode electrode 121 is arranged at the upper surface of LED element 120.LED element 130 and 140 is respectively the blueness of planar structure
LED element and green LED elements.For example, the anode electrode 131 and cathode electrode 132 of LED element 130 are respectively arranged at LED units
The upper surface of part 130 and it is spaced apart.
LED element 120 is fixed on the bearing pads of lead frame 110 using conducting resinl (such as elargol), while realizing LED
Electrical connection between the cathode electrode and bearing pads 111 of element 120.Using bonding wire 115, by LED element 130 and 140
Cathode electrode is respectively connecting to the corresponding pin in multiple pins 112, and by the anode electrode of LED element 120 to 140
It is connected to a common pin in multiple pins 112.
Encapsulating compound 150 allows the light that LED element 120 to 140 is produced to appear, and the material of encapsulating compound 150 is, for example, epoxy
Resin.
External pads 116 are used to be electrically connected with external circuit.For example, the external pads 116 of LED package assemblings can be adopted
Fixed on a printed circuit with solder, and further via printed circuit board (PCB) be connected to display driver circuit.
The display driver circuit provides to the LED element 120 to 140 of LED package assemblings 150 drive letter at work
Number, by controlling the brightness of each LED element, so as to produce the luminous and desired brightness of desired color.By LED package assemblings
After as pixel cell composition LED display, the LED display i.e. can be in display image under the control of drive circuit
Hold.
In the LED package assemblings of above-mentioned prior art, bearing pads 111 are applied not only to be provided for LED element 120 to 140
Mechanical support, and itself also serve as a pin, extends to the corner of PCB substrate 117 from below LED element, and with it is right
The external pads 116 of the opposite side of PCB substrate 117 answered are realized electrically connecting by via.
Additionally, multiple pins 112 include the Part I for being electrically connected with LED element 120 to 140 and outside respectively
Part II that pad 116 is electrically connected by via and the center section for extending between the first and second.Institute
Stating the Part I of multiple pins 112 is used to provide interconnecting area, is electrically connected with bonding wire 115.In the example shown in Fig. 1,
The Part I of the multiple pin 112 is ribbon.
The shape of above-mentioned lead frame 110 and its connected mode with LED element so that the metal surface of lead frame 110 exists
Ratio shared by the lower surface of encapsulating compound 150 of encapsulated moulding is too high.Even if when LED element does not light, the gold of lead frame 110
Metal surface also can reflection environment light, so as to the contrast for causing LED display is deteriorated.
Fig. 2 shows the decomposition diagram of the LED package assemblings according to the utility model embodiment.LED package assemblings 200 are wrapped
Lead frame 210, LED element 220 to 240 and encapsulating compound 250 are included, wherein, LED element 220 to 240 is arranged on lead frame 210
On, encapsulating compound 250 is light transmissive material, is covered in the surface of lead frame 210.In figure, for the sake of clarity, by package assembling
Separated between 200 encapsulating compound 250 and other parts and shown.
Compared with the LED package assemblings 100 in the prior art shown in Fig. 1, the LED encapsulation according to the utility model embodiment
The LED element 220 to 240 and encapsulating compound 250 of component are same as the prior art, difference be lead frame 210 structure and
Its connected mode.Hereinafter difference is only described, its detailed description is then omitted to something in common.
Lead frame 210 is the double-layered circuit board manufactured by PCB technology, including PCB substrate 217, multiple external pads 216,
Bearing pads 211 (or being " crystal bonding area ") and multiple pins 212.Multiple pins 212 are located at PCB substrate 217 with bearing pads 211
The same side, and relative with the multiple external pads 216 positioned at the opposite side of PCB substrate 217 respectively, multiple pins 212 with carry
Pad 211 is electrically connected with corresponding multiple external pads 216 by the via in PCB substrate 217 respectively.Bearing pads 211 are used for
LED element 220 to 240 provides mechanical support.Bearing pads 211 itself are also conductive, in this embodiment for providing inside
Electrical connection, to provide the electrical connection between LED element 220 and the corresponding pin in multiple pins 212.The multiple pin
212 are spaced apart, and for being electrically connected with LED element 220 to 240, and the outside of encapsulating compound are extended to, to provide LED element
Electrical connection between 220 to 240 and external circuit.Additionally, at least one of the multiple pin 212 pin is connected to simultaneously
LED element 220 to 240, to provide the electrical connection between the LED element 220 to 240.
Lead frame 210 can limit the shape of bearing pads and pin with PCB manufacture crafts.Wherein, the carrying in lead frame 210
Pad and multiple pins can also include additional coating to improve electric conductivity, for example, by the material pair selected from noble metals such as gold, silver
The conductive coating that bearing pads 211 and multiple pins 212 are formed.Further, lead frame 210 can include internal pads 214, use
In receiving solder to be electrically connected between LED element.
LED element 220 to 240 is respectively the light-emitting component of one of redgreenblue, and puts in order and do not limit.For example,
It is the red LED element of vertical stratification, anode electrode 221 and cathode electrode (not shown) point figure 2 illustrates LED element 220
It is not formed on relative surface.In the utility model embodiment, the anode electrode 221 of LED element 220 is arranged at LED
The upper surface of element 220.LED element 230 and 240 is respectively the blue-led element and green LED elements of planar structure.For example,
The anode electrode 231 and cathode electrode 232 of LED element 230 are respectively arranged at the upper surface of LED element 230 and are spaced apart.
LED element 220 is fixed on the bearing pads of lead frame 210 using conducting resinl (such as elargol), while realizing LED
Electrical connection between the cathode electrode and bearing pads 211 of element 220.Using bonding wire 215, by bearing pads 211, LED element
230 and 240 cathode electrode is respectively connecting to the corresponding pin in multiple pins 212, and by LED element 220 to 240
Anode electrode be connected to a common pin in multiple pins 212.
Encapsulating compound 250 allows the light that LED element 220 to 240 is produced to appear, and the material of encapsulating compound 250 is, for example, epoxy
Resin.The thickness for encapsulating the LED package assemblings for completing is about 0.5mm to 1.5mm, and length is about 0.5mm to 2mm, and width is about
0.5mm to 2mm.
External pads 216 are used to be electrically connected with external circuit.For example, the external pads 216 of LED package assemblings can be adopted
Fixed on a printed circuit with solder, and further via printed circuit board (PCB) be connected to display driver circuit.
The display driver circuit provides to the LED element 220 to 240 of LED package assemblings 250 drive letter at work
Number, by controlling the brightness of each LED element, so as to produce the luminous and desired brightness of desired color.By LED package assemblings
After as pixel cell composition LED display, the LED display i.e. can be in display image under the control of drive circuit
Hold.
In the LED package assemblings of the embodiment, bearing pads 211 are used to provide mechanical support for LED element 220 to 240,
And for providing internal electrical connection for LED element 220.Bearing pads 211 can only include for supporting LED element 220 to 240
Part I, and for bonding wire 215 connection Part II.Compared with the LED package assemblings 100 of prior art,
In the LED package assemblings 200 of the embodiment, bearing pads 211 need not serve as pin, thus bearing pads 211 can save from
The lower section of LED element 220 to 240 extends to the extension of PCB substrate corner, so as to reduce bearing pads 211 in encapsulated moulding
The exposed surface area of lower surface of encapsulating compound 250.
Additionally, multiple pins 212 include the Part I for being electrically connected with LED element 220 to 240 and outside respectively
Part II that pad 216 is connected by via and the center section for extending between the first and second.It is described
The Part I of multiple pins 212 is used to provide interconnecting area, is electrically connected with bonding wire 215.In the example shown in figure 2, institute
The Part I of only one pin in multiple pins 212 is stated for ribbon, the Part I of its excess-three pin be triangle (i.e.
One angle part of band, i.e. right angled triangle).Encapsulating compound 250 lower surface exposed gold of the lead frame 210 in encapsulated moulding
Metal surface includes the Part I of the multiple pin 212.However, due to the alteration of form of at least one pin so that first
Partial is shaped as triangle, and pad is arranged on the top of triangle, sudden and violent on the surface of PCB substrate 217 so as to reduce pin 212
The surface area of dew.
The shape of above-mentioned lead frame 210 and its connected mode with LED element so that the metal surface of lead frame 210 exists
Ratio shared by the lower surface of encapsulating compound 250 of encapsulated moulding is substantially reduced.When LED element does not light, the gold of lead frame 210
Metal surface also also can accordingly reduce to the reflection of ambient light, so as to improve the contrast of LED display.
In the embodiment shown in above-mentioned Fig. 2, the LED element 220 to 240 in LED package assemblings 200 is with the side of common-anode
Formula is connected.As a kind of alternative embodiment, as shown in figure 3, the LED element 220 to 240 in LED package assemblings 300 is with common cathode
The mode of pole is connected, for example, being the red LED element of vertical stratification, the He of anode electrode 221 figure 3 illustrates LED element 220
Cathode electrode (not shown) is respectively formed on relative surface, and the anode electrode 221 of LED element 220 is arranged at LED element
220 upper surface, the cathode electrode of LED element 220 is electrically connected with bearing pads 211 and the cathode electrode 232 with LED element 230,
The cathode electrode 242 of LED element 240 is commonly connected to the same pin in multiple pins 212, realizes LED element 220 to 240
Common cathode connection.
According to embodiment of the present utility model as described above, these embodiments do not have all of details of detailed descriptionthe,
Also it is only described specific embodiment not limit the utility model.Obviously, as described above, many modifications and change can be made
Change.This specification is chosen and specifically describes these embodiments, is to preferably explain that principle of the present utility model and reality should
With so that skilled artisan can repairing using the utility model and on the basis of the utility model well
Change and use.The scope that protection domain of the present utility model should be defined by the utility model claim is defined.
Claims (11)
1. a kind of LED package assemblings, including：
Lead frame, with bearing pads, the multiple pins being spaced apart and multiple external pads；
First LED element, the second LED element and the 3rd LED element, are fixed on the bearing pads of the lead frame jointly, and
Electrically connected with the bearing pads and the multiple pin；And
Encapsulating compound, for covering the lead frame and allowing light to appear, the multiple pin is used to provide interconnecting area, described many
Individual pin is electrically connected with the multiple external pads respectively,
Wherein, the bearing pads are spaced apart with the multiple pin, and provide interconnecting area for electric with the multiple pin
Connection,
First LED element, second LED element and the 3rd LED element include anode electrode and negative electrode electricity respectively
Pole, also, first LED element, second LED element and the 3rd LED element anode electrode and cathode electrode
One of be commonly connected in the multiple pin same pin.
2. LED package assemblings according to claim 1, also include：
4th LED element, is fixed on the bearing pads of the lead frame, and the 4th LED element includes anode electrode and negative electrode
Electrode, the 4th LED element is electrically connected with the multiple pin, wherein, the anode electrode and negative electrode of the 4th LED element
One of electrode connects the same pin.
3. LED package assemblings according to claim 1, wherein, first LED element, second LED element and institute
State the 3rd LED element and send red light, green light and blue light respectively, and put in order and do not limit.
4. LED package assemblings according to claim 1, also include：A plurality of bonding wire, it is first LED element, described
Second LED element, the 3rd LED element are connected to described via the corresponding bonding wire in a plurality of bonding wire respectively
Multiple pins.
5. LED package assemblings according to claim 1, wherein, the bearing pads and first LED element, described
Two LED elements are connected with the anode electrode or cathode electrode of one of the 3rd LED element.
6. LED package assemblings according to claim 4, wherein, the bearing pads are via in a plurality of bonding wire
Corresponding bonding wire is connected to the respective pins in the multiple pin.
7. LED package assemblings according to claim 1, wherein, first LED element, second LED element and institute
It is the side covered by the encapsulating compound to state the 3rd respective light emission side of LED element.
8. LED package assemblings according to claim 1, wherein, first LED element is fixed on described using conducting resinl
On bearing pads.
9. LED package assemblings according to claim 1, wherein, the lead frame is double-layered circuit board, the lead frame bag
PCB substrate is included, the bearing pads are located at the first surface of the PCB substrate, the multiple external pads with the multiple pin
Positioned at the second surface of the PCB substrate, the multiple pin is respectively by the mistake between the first surface and second surface
Realize electrically connecting with the multiple external pads in hole.
10. LED package assemblings according to claim 1, wherein, first LED element is fixed on institute using conducting resinl
State on bearing pads.
11. LED package assemblings according to claim 1, wherein, the shape of at least one of the multiple pin pin
Only to retain the unfilled corner rhombus at complete angle, the bearing pads, and the interconnecting area are pointed to positioned at described in the complete angle
The top at complete angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621155517.9U CN206282882U (en) | 2016-10-31 | 2016-10-31 | LED package assemblings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621155517.9U CN206282882U (en) | 2016-10-31 | 2016-10-31 | LED package assemblings |
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| Publication Number | Publication Date |
|---|---|
| CN206282882U true CN206282882U (en) | 2017-06-27 |
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ID=59084818
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| CN201621155517.9U Active CN206282882U (en) | 2016-10-31 | 2016-10-31 | LED package assemblings |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531730A (en) * | 2016-10-31 | 2017-03-22 | 杭州美卡乐光电有限公司 | LED packaging assembly and manufacturing method thereof |
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2016
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531730A (en) * | 2016-10-31 | 2017-03-22 | 杭州美卡乐光电有限公司 | LED packaging assembly and manufacturing method thereof |
| CN106531730B (en) * | 2016-10-31 | 2019-06-11 | 杭州美卡乐光电有限公司 | LED package assembling and its manufacturing method |
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