CN209515665U - A kind of the four-in-one LED display module and its display screen of Optimization-type - Google Patents
A kind of the four-in-one LED display module and its display screen of Optimization-type Download PDFInfo
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- CN209515665U CN209515665U CN201920172919.7U CN201920172919U CN209515665U CN 209515665 U CN209515665 U CN 209515665U CN 201920172919 U CN201920172919 U CN 201920172919U CN 209515665 U CN209515665 U CN 209515665U
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Abstract
The utility model provides the four-in-one LED display module and its display screen of a kind of Optimization-type, including substrate, the substrate front side is equipped with patterned line layer, the patterned line layer includes several functional areas, the substrate back is equipped with several lower pads, the corresponding lower pad in each functional areas, is connected by the conductive hole through substrate；Four luminescence units, four luminescence units are arranged in square array and are located at substrate front side, and each luminescence unit includes A chip, B chip and C chip；Four luminescence units are wrapped on substrate by light transmission glue-line, the light transmission glue-line.The substrate of the utility model is in addition to Pin locations, no via hole, reduces technical difficulty, the structural strength for increasing substrate, reduces costs；Base plate bottom can not need solder mask；In the case of lead copper foil and via hole orifice ring, solder mask can be accomplished to be lower than pin pad height；Improve the reliability of welding yield and welding.
Description
Technical field
The utility model relates to arrive SMD LED(Surface Mounted Devices, surface mount device) encapsulation skill
Art, more particularly to the four-in-one LED display module and its display screen of a kind of Optimization-type.
Background technique
LED display is used with its high brightness, weatherability in advertisement, stage, public information display, sport means of transportation etc.
It is widely applied in field.LED display is divided into monochromatic screen, double-colored screen and full-color screen by display color.Full-color LED display screen
Most critical component be LED component.It is the key that usage quantity at most device in full-color panel type display that reason, which has three: the first, LED,
Part, every square metre can all use thousands of to tens of thousands of LED；Second, LED are the main body for determining whole screen optics display performance, direct shadow
Ring evaluation of the spectators to display screen；Third, LED proportion in display screen overall cost is maximum, and from 30% to 70% etc..
With the progress of LED core chip technology and LED encapsulation technology, the brightness of SMD and degree of protection have been able to meet outdoor application
Demand, and SMD is used for outdoor full color SMD display screen, has extra small pixel spacing, high production efficiency, horizontal vertical angle
Greatly, the advantages that color blending effect is good, contrast is high, therefore obtain quick application.
Although LED display haves many advantages, such as, there is also many areas for improvement to restrict LED display
Development, one of them is the low problem of single packaging efficiency.In existing SMD LED manufacture, product generally uses PLCC4
Structure (such as 3528,2121,1010 equal-specifications), but above structure is all individually to exist, it in actual production, can only be one one
A patch, production efficiency is low, and maintenance difficulty is big, and especially when LED display produces, the quantity of the LED used is usually
The order of magnitude up to ten thousand or even up to a million, when producing small sized product, such as the specification and following specification of 1.0mm*1.0mm
When, the production difficulty of product is multiplied, and the mechanical strength of product also can be very low, is easy to damage under external force, produces
Efficiency also can be very low, and the requirement to mounting device also can be very high.
In order to solve this problem, the Chinese patent of notification number CN106847801A, CN106847800A uses Encapsulation Moulds
The form of group, as shown in Figure 1, encapsulating multiple groups RGB-LED chip in i.e. same mould group.But when using this kind of encapsulation module,
The number of pads at the mould group back side will be very more, such as tetrad RGB-LED encapsulation module, place in encapsulation module as shown in Fig. 2, working as
When 4 groups of RGB-LED chips, the quantity of backside pads just up to 16, under small spacer conditions, this considerably increases pcb boards to set
The difficulty and welding difficulty of meter.
In order to solve the problem of the more complex circuit designs of modularity packaging pin quantity, notification number CN108511431A
Chinese patent provide a kind of LED display unit group and display panel, by encapsulating n × m pixel unit together, formed
One display unit group increases the volume of single display unit group, and welding is facilitated to operate；In addition, in single display unit group,
Pin number increases, and the solder joint contacted with pcb board increases, and then improves the fastness of welding.
But the program equally there is also some problems.First is that as shown in figure 3, its substrate front side pad and pin on back surface it
Between need to be electrically connected by via hole and metal routing；Device substrate central bore increases technical difficulty, reduces base
The structural strength of plate increases cost；Second is that as shown in figure 4, its back side via hole orifice ring and metal routing and bottom legs spacing
It is limited, it is easy to be connected to form short circuit by scolding tin in welding, it is therefore desirable in bottom print solder mask or there is insulation performance
Material, and require via hole and lead are effectively covered；Increase process difficulty and cost；If solder mask covering is improper, can lead
Cause short circuit.On the other hand, back side via hole orifice ring and metal routing have certain altitude, and after printing solder mask, whole height can be high
In pad height of pin；Carrying out SMT(Surface Mount Technology, i.e. surface mount) welding when, due to bottom
Solder mask is higher by pin, is easy to cause scolding tin poor contact, forms rosin joint.In addition, even if having printed solder mask, in practical application
In, solder mask is also easy to fall off, and directly affects the reliability of product.
Therefore, the existing technology needs to be improved and developed.
Utility model content
The purpose of this utility model is to provide the four-in-one LED display modules and its display screen of a kind of Optimization-type, can also
To be referred to as the 1 LED encapsulation module of tetrad, mini COB or 4 in of Optimization-type, existing LED encapsulation is aimed to solve the problem that
The problems such as mould group and LED display punching are more, and substrate bottom surface is easy to cause short circuit, rosin joint, high solder mask there are metal routing, with
And the problem of high production cost.
To solve the above problems, the technical solution of the utility model is as follows:
A kind of four-in-one LED display module of Optimization-type, comprising:
Substrate, the substrate front side are equipped with patterned line layer, and the patterned line layer includes several functional areas, institute
Substrate back is stated equipped with several lower pads, the corresponding lower pad in each functional areas is connected by the conductive hole through substrate；
Four luminescence units, four luminescence units are arranged in square array and are located at substrate front side, each described luminous
Unit includes A chip, B chip and C chip, and the A chip, B chip and C chip are uniformly in row arrangement or column row
Column, positioned at the middle position of the luminescence unit region, are fixed on the functional areas by conducting resinl or insulating cement；
Four luminescence units are wrapped on substrate by light transmission glue-line, the light transmission glue-line；
Wherein, the functional areas include copolar area and chip bonding pad, and the chip bonding pad includes A chip bonding pad, B
Chip bonding pad and C chip bonding pad, each chip of the luminescence unit is equipped with first electrode and second electrode, described
Second electrode and first electrode polarity are on the contrary, in four luminescence units, and the first of all chips of the first row luminescence unit
Electrode is electrically connected with the first copolar area, and the first electrode of all chips of the second row luminescence unit is electrically connected with the second copolar area,
The second electrode of the A chip of first row luminescence unit is electrically connected with the first A chip bonding pad, the A chip of secondary series luminescence unit
Second electrode be electrically connected with the 2nd A chip bonding pad, the second electrode of the B chip of first row luminescence unit and the first B chip
Bonding pad electrical connection, the second electrode of the B chip of secondary series luminescence unit are connect with the 2nd B chip bonding pad, first row C chip
Second electrode be electrically connected with the first C chip bonding pad, the second electrode of secondary series C chip is electrically connected with the 2nd C chip bonding pad
It connects；
The copolar area is distributed in two sides opposite on substrate column direction, and the route of the chip bonding pad is along substrate column side
To setting, the route of a chip bonding pad is at most arranged in the region between the chip and substrate edges of the luminescence unit.
The four-in-one LED display module of the Optimization-type, wherein the A chip of each luminescence unit, B chip with
And the quantity of C chip is at least one, the A chip is blue chip, and B chip is green light chip, and C chip is feux rouges core
Piece.
The four-in-one LED display module of the Optimization-type, wherein the A chip, B chip, C chip are bipolar electrode core
Piece or single electric grade chip pass through lead or conducting resinl and the function through insulating cement or conducting resinl die bond on the functional areas
It can area's realization electrical connection.
The four-in-one LED display module of the Optimization-type, wherein the A chip, B chip and C chip are arranged along substrate
The angle of direction arrangement, the long axis direction and substrate line direction of the A chip and/or C chip is greater than zero.
The four-in-one LED display module of the Optimization-type, wherein the first electrode is anode, and second electrode is yin
Pole, the A chip and B chip are bipolar electrode chip, and the C chip is single electric grade chip of the cathode in chip bottom, described two
A B chip bonding pad is distributed in two sides opposite on substrate line direction, and two C chip bonding pads are distributed in phase on substrate line direction
Extend to opposite sides of the B chip bonding pad on the inside of the substrate and along substrate column direction, two A chip bonding pads are distributed in substrate
Opposite two sides and extend to place vacant on the inside of substrate on line direction；The A chip and B of luminescence unit in the first row first row
Chip die bond is on the first A chip bonding pad, and C chip die bond is on the first C chip bonding pad；Hair in the first row secondary series
The A chip and B chip die bond of light unit are on the 2nd A chip bonding pad, and C chip die bond is on the 2nd C chip bonding pad；It is in
All chip die bonds of the luminescence unit of second row first row are on the first C chip bonding pad；Hair in the second row secondary series
All chip die bonds of light unit are on the 2nd C chip bonding pad.
The four-in-one LED display module of the Optimization-type, wherein the first electrode is cathode, and second electrode is sun
Pole, the A chip and B chip are bipolar electrode chip, and the C chip is single electric grade chip of the cathode in chip bottom, described two
A B chip bonding pad is distributed in two sides opposite on substrate line direction, and two C chip bonding pads are distributed in phase on substrate line direction
To opposite sides of the B chip bonding pad on the inside of substrate, two A chip bonding pads are distributed in two sides opposite on substrate line direction
And extend to vacant place on the inside of substrate；The A chip and B chip die bond of luminescence unit in the first row first row are in the first A core
On piece bonding pad, C chip die bond is in the first copolar area；The A chip and B chip of luminescence unit in the first row secondary series are solid
Crystalline substance is on A chip bonding pad, and C chip die bond is in the first copolar area；The A chip of luminescence unit in the second row first row
With B chip die bond on the first C chip bonding pad, C chip die bond is in the second copolar area；Shining in the second row secondary series
The A chip and B chip die bond of unit are on the 2nd C chip bonding pad, and C chip die bond is in the second copolar area.
The four-in-one LED display module of the Optimization-type, wherein the conductive hole is located on the inside of substrate or substrate side
Edge, if the conductive hole is located on the inside of substrate, the aperture of the conductive hole is less than 0.2mm；If the conductive hole is located at substrate side
Edge, the conductive hole are the semicircle orifice or 1/4 circular hole of large aperture.
The four-in-one LED display module of the Optimization-type, wherein be provided between the adjacent luminescence unit virtual
Isolated area, the virtual isolated area include the dark light-absorption layer being disposed on the substrate.
The four-in-one LED display module of the Optimization-type, wherein the substrate back is additionally provided with male and female face, described
Male and female face has two different colors, for identification the direction of the display module.
A kind of four-in-one LED display of Optimization-type, wherein the four-in-one LED including Optimization-type as described above is shown
Mould group.
The beneficial effects of the utility model include: that a kind of four-in-one LED of Optimization-type provided by the utility model shows mould
Group and its display screen, device substrate is in addition to Pin locations, no via hole；Reduce technical difficulty, the structure that increases substrate it is strong
It spends, reduce costs；Device substrate bottom is in addition to pin pad, without other lead copper foils and via hole orifice ring；Therefore bottom can
Not need solder mask；In the case of lead copper foil and via hole orifice ring, solder mask can be accomplished to be lower than pin pad height；It improves
The reliability of welding yield and welding, the region between the chip and substrate edges of the luminescence unit is at most arranged one
The route of chip bonding pad can be adapted for the manufacture of the display module of smaller spacing.
Detailed description of the invention
Fig. 1 is a kind of existing Facad structure schematic diagram of the encapsulation module of the surface-adhered type of four-in-one.
Fig. 2 is a kind of existing backside structure schematic diagram of the encapsulation module of the surface-adhered type of four-in-one.
Fig. 3 is a kind of existing Facad structure schematic diagram of LED display unit.
Fig. 4 is a kind of existing backside structure schematic diagram of LED display unit.
Fig. 5 is a kind of positive structure schematic of the four-in-one LED display module of Optimization-type provided by the utility model.
Fig. 6 is a kind of structure schematic diagram of the four-in-one LED display module of Optimization-type provided by the utility model.
Fig. 7 is the circuit connection diagram of the four-in-one LED display module of Optimization-type provided by the utility model.
Fig. 8 is the positive structure schematic of the four-in-one LED display module of another Optimization-type provided by the utility model.
Fig. 9 is the structure schematic diagram of the four-in-one LED display module of another Optimization-type provided by the utility model.
Figure 10 is the Facad structure signal of the four-in-one LED display module of another Optimization-type provided by the utility model
Figure.
Figure 11 is the backside structure signal of the four-in-one LED display module of another Optimization-type provided by the utility model
Figure.
Figure 12 is the backside structure signal of the four-in-one LED display module of another Optimization-type provided by the utility model
Figure.
Figure 13 is the backside structure signal of the four-in-one LED display module of another Optimization-type provided by the utility model
Figure.
Figure 14 is that the Facad structure of the four-in-one LED display module of another common cathode Optimization-type provided by the utility model shows
It is intended to.
Figure 15 is that the backside structure of the four-in-one LED display module of another common cathode Optimization-type provided by the utility model is shown
It is intended to.
Figure 16 is that the Facad structure of the four-in-one LED display module of another common cathode Optimization-type provided by the utility model shows
It is intended to.
Figure 17 is that the backside structure of the four-in-one LED display module of another common cathode Optimization-type provided by the utility model is shown
It is intended to.
Figure 18 is the circuit connection diagram of the four-in-one LED display module of common cathode Optimization-type provided by the utility model.
Description of symbols: 100, substrate；200, patterned line layer；201, the first copolar area；202, the second copolar area；
203, the first A chip bonding pad；204, the 2nd A chip bonding pad；205, the first B chip bonding pad；206, the 2nd B chip connects
Area；207, the first C chip bonding pad；208, the 2nd C chip bonding pad；300, luminescence unit；301, A chip；302, B chip；
303, C chip；3011, first electrode；3012, second electrode；400, lower pad；500, conductive hole；600, dark light-absorption layer；
700, male and female face.
Specific embodiment
The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this
Novel limitation.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.In the description of the present invention, it should be noted that
Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixed
Connection, may be a detachable connection, or be integrally connected；Can be mechanical connection, be also possible to electrical connection or can be mutual
Communication；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary
The interaction relationship of element.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special
Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only
Indicate that first feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
It referring to figs. 5 and 6, is a kind of embodiment of the four-in-one LED display module of Optimization-type provided by the utility model.
In this embodiment, the display module specific structure includes:
One substrate 100, for substrate 100 for carrying luminescence unit and being electrically connected, 100 front of substrate is equipped with pattern
Change line layer 200, patterned line layer 200 includes several functional areas, and 100 back side of substrate is equipped with several lower pads 400, often
The corresponding lower pad 400 in a functional areas, is connected by the conductive hole 500 through substrate.In actual production, substrate 100 can
To select pcb board, copper-clad plate, FR-4 plate or other kinds of printed circuit board, it is preferable that substrate 100 can select middle layer
For insulating materials, the substrate of double-sided copper-clad forms patterned circuit in substrate front side by techniques such as etchings in actual production
Layer 200, forms lower pad 400 in substrate back.In actual production, the position of conductive hole 500 can be located at 100 side of substrate
Edge can not also be located at the edge of substrate 100, and in the present embodiment, conductive hole 500 is corresponding not at the edge of substrate 100
Lower pad 400 is not also at the edge of substrate 100.The aperture of conductive hole 500 is less than 0.2mm in this embodiment.Conductive hole 500
Not in substrate frontside edge, then the edge of Metal Cutting is not present in mould group edge, ensure that the air-tightness and reliability of mould group.It closes
In position the utility model and without limitation of lower pad 400, can be on the inside of 100 back side four edges edge of substrate, often
Side is distributed two lower pads 400；It is also possible to there are two sides to be respectively distributed three lower pads 400, two other side as shown in Figure 9
Respectively one lower pad 400 of distribution；It can also be that each edge as shown in figure 11 is respectively distributed a lower pad 400, the boundary of each edge
Locate one lower pad 400 of each distribution.
As shown in figure 5, in 100 front setting of substrate, there are four luminescence unit 300, four luminescence units 300 arrangements
Squarely array is located at 100 front of substrate, and each luminescence unit includes A chip 301, B chip 302 and C chip
303.In practical applications, the quantity of the A chip 301 of each luminescence unit 300, B chip 302 and C chip 303 is at least
One, in the present embodiment, the quantity of the A chip 301 of each luminescence unit, B chip 302 and C chip 303 is one.
In practical applications, A chip 301, B chip 302 and C chip 303 can be red light chips, green light chip and blue chip
Combination, in the present embodiment, A chip 301 be blue chip, B chip 302 be green light chip, C chip 303 be red light chips.
In practical applications, A chip 301, B chip 302 and C chip 303 can be single electric grade chip, bipolar electrode chip or upside-down mounting core
In piece any one and combinations thereof.In the present embodiment, A chip 301 and B chip 302 are bipolar electrode chip, i.e., positive assembling structure
Chip, the first electrode 3011 and second electrode 3012 of chip are respectively positioned on chip top surface, and C chip 303 is single electric grade chip, that is, hang down
Straight fabric chip, in this embodiment, the first electrode 3011 of C chip 303 is in chip top surface, and second electrode 3012 is at chip bottom
Portion.Then two electrodes of A chip 301 and B chip 302 can be realized with corresponding functional areas by lead and are electrically connected, C chip 303
First electrode 3011 can realize by lead with corresponding functional areas and be electrically connected that second electrode 3012 can be directly solid by conducting resinl
Crystalline substance realizes electrical connection on functional areas, and A chip 301 and B chip 302 are then by insulating cement die bond on functional areas.
It is also covered with one layer of light transmission glue-line (not shown) on four luminescence units 300, the light transmission glue-line is by four
A package of luminescence unit 300 is on the substrate 100.In actual production, the light transmission glue-line can be molded into base by mould pressing process
On plate, four luminescence units 300 are covered.The presence of one side light transmission glue-line can form luminescence unit 300 and protect, and reinforce
On the other hand the mechanical strength of display module can carry out light mixing to the light that three kinds of chips issue in luminescence unit 300, ensure that
The illumination effect of luminescence unit.
As shown in figure 5, the functional areas include two A chip bonding pads, two B chip bonding pads, two C chip connections
Area and Liang Ge copolar area, i.e. the first copolar area 201, the second copolar area 202, the first A chip bonding pad 203, the 2nd A chip connect
Connect area 204, the first B chip bonding pad 205, the 2nd B chip bonding pad 206, the first C chip bonding pad 207 and the 2nd C chip
Bonding pad 208.Each chip of the luminescence unit 300 is equipped with first electrode 3011 and second electrode 3012, and described second
On the contrary, in the present embodiment, first electrode 3011 is anode, second electrode 3012 is for electrode 3012 and 3011 polarity of first electrode
Cathode.In four luminescence units 300, the first electrode 3011 of all chips of the first row luminescence unit 300 and first is total to
Polar region 201 is electrically connected, and the first electrode 3011 of all chips of the second row luminescence unit 300 is electrically connected with the second copolar area 201,
The second electrode 3012 of the A chip 301 of first row luminescence unit 300 is electrically connected with the first A chip bonding pad 203, secondary series hair
The second electrode 3012 of the A chip 301 of light unit 300 is electrically connected with the 2nd A chip bonding pad 204, first row luminescence unit 300
The second electrode 3012 of B chip 302 be electrically connected with the first B chip bonding pad 205, the B chip of secondary series luminescence unit 300
302 second electrode 3012 is connect with the 2nd B chip bonding pad 206, the second electricity of the C chip 303 of first row luminescence unit 300
Pole 3012 is electrically connected with the first C chip bonding pad 207, the second electrode 3012 of the C chip 303 of secondary series luminescence unit 300 with
The electrical connection of 2nd C chip bonding pad 208；
Described two copolar areas are distributed in two sides opposite on 100 column direction of substrate, in the present embodiment, the first copolar area
201 are distributed in the positive top of substrate 100, and the second copolar area 202 is then distributed in the positive lower part of substrate 100.Two B chips connect
It meets area and is distributed in two sides opposite on 100 line direction of substrate, in the present embodiment, the first B chip bonding pad is distributed in substrate 100
Positive left part, the 2nd B chip bonding pad are distributed in the positive right part of substrate 100.Two C chip bonding pads are distributed in substrate
Opposite sides on 100 line directions with respect to B chip bonding pad on the inside of the substrate simultaneously extends along substrate column direction, as shown in figure 4,
In the present embodiment, the first C chip bonding pad, close to the inside of substrate 100, and upwardly extends, with respect to the first B chip bonding pad
Two C chip bonding pads, close to the inside of substrate 100, and are upwardly extended with respect to the 2nd B chip bonding pad.Two A chip bonding pads
It is distributed in two sides opposite on substrate line direction and extends to vacant place on the inside of substrate.
The A chip 301 of luminescence unit 300 in the first row first row is connected with 302 die bond of B chip in the first A chip
In area 203,303 die bond of C chip is on the first C chip bonding pad 207；The A core of luminescence unit 300 in the first row secondary series
Piece 301 and 302 die bond of B chip are on the 2nd A chip bonding pad 204, and 303 die bond of C chip is on the 2nd C chip bonding pad 208；
All chip die bonds of luminescence unit 300 in the second row first row are on the first C chip bonding pad 207；In the second row
All chip die bonds of the luminescence unit 300 of secondary series are on the 2nd C chip bonding pad 208.First copolar area 201 and
The corresponding lower pad 400 in two copolar area 202 is located at 100 back side column direction opposite sides of substrate, the first A chip bonding pad
203 corresponding lower pads 400 are located at the upper left corner at 100 back side of substrate, the corresponding lower pad in the first A chip bonding pad 204
400 be located at 100 back side of substrate the upper right corner, the first B chip bonding pad 205 and the 2nd B chip bonding pad 206 it is corresponding under
Pad 400 is located at 100 back side line direction opposite sides of substrate, the corresponding lower pad 400 in the first C chip bonding pad 207
In the lower left corner at 100 back side of substrate, the corresponding lower pad 400 in the 2nd C chip bonding pad 208 is located at the bottom right at 100 back side of substrate
Angle.
It should be noted that the description as described in ranks orientation in above-described embodiment, can also be adjusted in practical applications
It changes, this is the simple transformation that those of ordinary skill in the art can carry out according to foregoing description, still falls within the guarantor of the utility model
Protect range.
By the ingenious arrangement above to basic 100 positive patterned line layers 200 and luminescence unit 300, so that aobvious
Showing that the connection of each functional areas of mould group is respectively positioned on the front of substrate 100,100 back side of substrate does not have any metal routing, and one
Aspect the problems such as there is no the short circuits as caused by back metal cabling, on the other hand because the utility model is not necessarily in substrate 100
Metal routing is arranged in the back side, and also just not extra conductive hole on substrate, punching quantity is opposite to be reduced, and substrate back is without painting
Solder mask is covered, the technological process of production is further reduced, to reduce production cost.
In addition, four luminescence units 300 are arranged in square array, each luminescence unit 300 have two cutting edges and
Two common edges are all unified independent pixels, ensure that the consistency of its illumination effect.Since luminescence unit 300 is as only
Standing statue element, the position in mould group be all it is unified, chip should be respectively positioned on pixel center position, for patterned line layer
For 200, the chip of luminescence unit 300 to the space of substrate frontside edge it is opposite be it is fixed, available space is also opposite
Fixed.With the diminution of display module size, this segment space further compresses, and the space of energy cabling also will further subtract
It is small.In order to adapt to small spacing display module production, as shown in figure 5, the utility model is arrived in the chip of luminescence unit 300
One piece of bonding pad is only arranged in substrate frontside edge position, for example, first row luminescence unit 300 chip to 100 left edge of substrate
Between, it is provided only with the first B chip bonding pad 205, and by the first A chip bonding pad 201 then pass through 100 opposite chip of substrate
Inside be routed.The positive space of substrate 100 can be efficiently used by being designed in this way, so that the utility model be made to be suitable for more
The product of small spacing.
It is the circuit structure diagram of Fig. 5-embodiment shown in fig. 6 referring to Fig. 6 ,+1 and+2 be the anode of the power supplys of connection,
B1, G1, R1, B2, G2, R2 connect the cathode of power supply, 8 lower pads 400 of corresponding above-described embodiment.
It is another implementation of the four-in-one LED display module of Optimization-type provided by the utility model referring to Fig. 8 and Fig. 9
Example.In this embodiment, basic structure is identical as Fig. 5-embodiment shown in fig. 6.The difference is that the embodiment is led
Electric hole 500 is located at the edge of substrate 100, semicircular in shape.In actual production, adjacent display module can share conductive hole 500,
In production, cutting substrate 100, formation mould group can effectively reduce the quantity of conductive hole 500, simplify technique again.Preferably, in reality
In the production of border can in conductive hole fill insulant, such as ink, resin, can avoid it is subsequent when being molded light transmission glue-line,
The glue of light transmission glue-line enters in conductive hole 500, and light transmission glue is avoided to spill into the lower pad 400 at 100 back side of substrate from conductive hole 500
On, the processes such as test, welding are influenced, or mould group is caused to fail.
It is another reality of the four-in-one LED display module of Optimization-type provided by the utility model referring to Figure 10 and Figure 11
Apply example.In this embodiment, basic structure is identical as Fig. 5-embodiment shown in Fig. 9.The difference is that the embodiment
Conductive hole 500 be semicircle orifice or a quarter circular hole, further reduce total punching quantity.In this embodiment, A chip
301 long axis direction and the angle of 100 line direction of substrate are greater than zero.In practical applications, A chip 301 and/or B chip 302
The angle of long axis direction and 100 line direction of substrate is greater than zero.On the one hand the purpose being designed in this way is that can reduce chip die bond position
The width set is conducive to the area for further reducing substrate 100, another to be adapted to the production of the display module of smaller spacing
Aspect can be such that the chip of each luminescence unit 300 is consistent, and can disposably complete die bond when carrying out die bond process.About this
One problem, in embodiment as shown in Figure 10, B chip 302 is bipolar electrode chip, first electrode 3011 and second electrode
It is fixed that 3012 position is opposite, and bonding wire for convenience, the B chip 302 of first row and the B chip 302 of secondary series are flat
Direction on face be it is opposite, need the B chip 302 of first die bond first row in actual production, then 302 plane of B chip is revolved
Turnback is again in die bond to secondary series.If not such die bond, secondary series B chip 302 will be such that lead covers in bonding wire
On chip, light efficiency is influenced, also inconvenient bonding wire.And in this embodiment, A chip 301 using inclination put by the way of so that
The problem of all 301 directions of A chip are consistent, and can disposably complete die bond, and B chip 302 is not present.C chip 303 is then adopted
With single electric grade chip, the problem of electrode direction is also just not present.In practical applications, A chip 301 and B chip can also be used
302 be the mode that inclination is put.
Above embodiments are the embodiment of no virtual isolated area.As shown in Figure 10, in this embodiment, adjacent to shine
Virtual isolated area is provided between unit 300, the virtual isolated area includes the dark light-absorption layer 600 of setting on the substrate 100.
The color of the dark color light-absorption layer 600 is black, Dark grey, darkviolet, blackish green, navy blue, the one of which in dark brown,
The dark color light-absorption layer may include that carbon black, graphite, carbon nanotube, melanin, iron oxide black, graphene or other same type dark colors are inhaled
One of luminescent material or a variety of combinations.The setting of virtual isolated area can effectively absorb the interference between adjacent light-emitting units
Light, on the other hand, virtual isolated area are disposed on the substrate, the main light for absorbing adjacent area bottom, in practical application,
Deep Canvas can be formed, its display effect is further strengthened.
As shown in figure 11,100 back side of substrate is provided with male and female face 700, the male and female face 700 has two different face
Color, for identifying the direction of the display module in production.In the present embodiment, male and female face 700 is the group of white and black
It closes, in actual production, male and female face can be obtained by coating printing ink, can coat the ink for the color that two kinds are easily distinguished, such as black
Color ink and white ink, wherein black ink may be the ink of the colors such as dark, blackish green, or directly half coating
White ink layer, the other half is not coated by, and is distinguish by means of the color of substrate itself.
Referring to Figure 12 and Figure 13, the arrangement mode of the lower pad 400 at 100 back side of the utility model substrate is in addition to above-mentioned implementation
Outside the arrangement mode of example, two lower pads 400 can also be set in the every side of substrate 100, accordingly as shown in Figure 12 or 13
Only the punch position of conductive hole 500 need to be adjusted and positive patterned line layer is adaptively adjusted.Wherein Figure 12
Illustrated embodiment using half pass conductive hole 500, embodiment shown in Figure 13 using pinhole type conductive hole
500。
It is a kind of four-in-one LED display module of common cathode Optimization-type provided by the utility model referring to Figure 14-Figure 15.?
In the embodiment, first electrode 3011 is cathode, and second electrode 3012 is anode, and A chip 301 uses the blue light core of bipolar electrode
Piece, B chip 302 use the green light chip of bipolar electrode, and C chip uses single electric grade chip of the cathode under.This kind of chipset
Conjunction mode is combination current currently on the market, and opposite cost is relatively low.Certainly, the utility model can also use it
His chip portfolio mode, such as C chip also use the red light chips of bipolar electrode chip, only need to do adaptability to patterned line layer
Adjustment, these combinations should also fall into the protection scope of the utility model.
In this embodiment, the first copolar area 201 is divided into three parts, participates in Figure 14, and a portion is located at substrate
100 the first row central regions, in addition two parts carry two C chips of two luminescence units of the first row respectively, the two first
201 region of copolar area passes through lead respectively and connect with the first copolar area 201 for being located at central region.Preferably, in order to reinforce connecting
Intensity is connect, avoids failing, two leads can be welded simultaneously.First B chip bonding pad 205 and the 2nd B chip bonding pad 206 difference
It is distributed in the opposite sides of 100 line direction of substrate.First C chip bonding pad 207 and the 2nd C chip bonding pad 208 are distributed in base
Opposite sides on 100 line direction of plate with respect to B chip bonding pad on the inside of substrate, the first A chip bonding pad 203 and the 2nd A core
Piece bonding pad 204 is distributed in two sides opposite on 100 line direction of substrate and extends to the 100 vacant place in inside of substrate；In first
The A chip 301 and 302 die bond of B chip of the luminescence unit of row first row are on the first A chip bonding pad 203,303 die bond of C chip
In the first copolar area 201；The A chip 301 and 302 die bond of B chip of luminescence unit in the first row secondary series are in the 2nd A core
On piece bonding pad 204,303 die bond of C chip is in the first copolar area 201；The A chip of luminescence unit in the second row first row
301 and B chip, 302 die bond is on the first C chip bonding pad 207, and 303 die bond of C chip is in the second copolar area 202；In
For the A chip 301 and 302 die bond of B chip of the luminescence unit of two row secondary series on the 2nd C chip bonding pad 208, C chip 303 is solid
Crystalline substance is in the second copolar area 202.
Embodiment basic structure shown in Figure 16-Figure 17 is identical as Figure 14-embodiment shown in figure 15, and difference is figure
Embodiment shown in 16- Figure 17 using half bore conductive hole 500 mode.
It is Figure 14-embodiment illustrated in fig. 17 circuit connection diagram, using altogether in the two embodiments referring to Figure 18
The mode of yin is attached, and used in the examples shown in Fig. 5-Figure 11 is that the mode of common anode is attached, and should be infused
Meaning, no matter the protection scope of the utility model should all be fallen into using common cathode or the connection type of common anode.
It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
It says, it can be modified or changed according to the above description, and all these modifications and variations all should belong to the appended power of the utility model
The protection scope that benefit requires.
Claims (10)
1. a kind of four-in-one LED display module of Optimization-type characterized by comprising
Substrate, the substrate front side are equipped with patterned line layer, and the patterned line layer includes several functional areas, the base
Back is equipped with several lower pads, and the corresponding lower pad in each functional areas is connected by the conductive hole through substrate；
Four luminescence units, four luminescence units are arranged in square array and are located at substrate front side, each luminescence unit
It include A chip, B chip and C chip, the A chip, B chip and C chip are uniformly in row arrangement or column arrangement, position
In the middle position of the luminescence unit region, it is fixed on the functional areas by conducting resinl or insulating cement；
Four luminescence units are wrapped on substrate by light transmission glue-line, the light transmission glue-line；
Wherein, the functional areas include copolar area and chip bonding pad, and the chip bonding pad includes A chip bonding pad, B chip
Bonding pad and C chip bonding pad, each chip of the luminescence unit are equipped with first electrode and second electrode, and described second
Electrode and first electrode polarity are on the contrary, in four luminescence units, the first electrode of all chips of the first row luminescence unit
It being electrically connected with the first copolar area, the first electrode of all chips of the second row luminescence unit is electrically connected with the second copolar area, and first
The second electrode of the A chip of column luminescence unit is electrically connected with the first A chip bonding pad, and the of the A chip of secondary series luminescence unit
Two electrodes are electrically connected with the 2nd A chip bonding pad, and the second electrode of the B chip of first row luminescence unit is connect with the first B chip
Area's electrical connection, the second electrode of the B chip of secondary series luminescence unit connect with the 2nd B chip bonding pad, and the of first row C chip
Two electrodes are electrically connected with the first C chip bonding pad, and the second electrode of secondary series C chip is electrically connected with the 2nd C chip bonding pad；
The copolar area is distributed in two sides opposite on substrate column direction, and the route of the chip bonding pad is set along substrate column direction
It sets, the route of a chip bonding pad is at most arranged in the region between the chip and substrate edges of the luminescence unit.
2. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that each luminous list
The A chip of member, the quantity of B chip and C chip are at least one, and the A chip is blue chip, and B chip is green light core
Piece, C chip are red light chips.
3. the four-in-one LED display module of Optimization-type according to claim 2, which is characterized in that the A chip, B core
Piece, C chip are bipolar electrode chip or single electric grade chip, through insulating cement or conducting resinl die bond on the functional areas, by drawing
Line or conducting resinl are realized with the functional areas to be electrically connected.
4. the four-in-one LED display module of Optimization-type according to claim 3, which is characterized in that the A chip, B chip
And C chip is arranged along substrate column direction, the angle of the long axis direction and substrate line direction of the A chip and/or C chip is greater than
Zero.
5. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the first electrode is
Anode, second electrode are cathode, and the A chip and B chip are bipolar electrode chip, and the C chip is cathode in chip bottom
Single electricity grade chip, described two B chips bonding pad are distributed in two sides opposite on substrate line direction, and two C chip connections are distinguished
Cloth leans on the opposite sides on the inside of substrate with respect to B chip bonding pad on substrate line direction and along the extension of substrate column direction, two A core
Piece bonding pad is distributed in two sides opposite on substrate line direction and extends to vacant place on the inside of substrate；In the first row first row
The A chip and B chip die bond of luminescence unit are on the first A chip bonding pad, and C chip die bond is on the first C chip bonding pad；Place
In the luminescence unit of the first row secondary series A chip and B chip die bond on the 2nd A chip bonding pad, C chip die bond is second
On C chip bonding pad；All chip die bonds of luminescence unit in the second row first row are on the first C chip bonding pad；Place
In the second row secondary series luminescence unit all chip die bonds on the 2nd C chip bonding pad.
6. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the first electrode is
Cathode, second electrode are anode, and the A chip and B chip are bipolar electrode chip, and the C chip is cathode in chip bottom
Single electricity grade chip, described two B chips bonding pad are distributed in two sides opposite on substrate line direction, and two C chip connections are distinguished
Opposite sides of the cloth on substrate line direction with respect to B chip bonding pad on the inside of substrate, two A chip bonding pads are distributed in substrate
Opposite two sides and extend to place vacant on the inside of substrate on line direction；The A chip and B of luminescence unit in the first row first row
Chip die bond is on the first A chip bonding pad, and C chip die bond is in the first copolar area；Luminous list in the first row secondary series
The A chip and B chip die bond of member are on the 2nd A chip bonding pad, and C chip die bond is in the first copolar area；In the second row
The A chip and B chip die bond of the luminescence unit of one column are on the first C chip bonding pad, and C chip die bond is in the second copolar area；
The A chip and B chip die bond of luminescence unit in the second row secondary series are on the 2nd C chip bonding pad, and C chip die bond is
In two copolar areas.
7. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the conductive hole is located at
Substrate inside or substrate edges, if the conductive hole is located on the inside of substrate, the aperture of the conductive hole is less than 0.2mm；If described
Conductive hole is located at substrate edges, and the conductive hole is the semicircle orifice or 1/4 circular hole of large aperture.
8. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that adjacent is described luminous
Virtual isolated area is provided between unit, the virtual isolated area includes the dark light-absorption layer being disposed on the substrate.
9. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the substrate back is also
It is provided with male and female face, the male and female face has two different colors, for identification the direction of the display module.
10. a kind of four-in-one LED display of Optimization-type, which is characterized in that including as described in any one of claims 1-9
The four-in-one LED display module of Optimization-type.
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|---|---|---|---|
| CN201920172919.7U CN209515665U (en) | 2019-01-31 | 2019-01-31 | A kind of the four-in-one LED display module and its display screen of Optimization-type |
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| CN201920172919.7U CN209515665U (en) | 2019-01-31 | 2019-01-31 | A kind of the four-in-one LED display module and its display screen of Optimization-type |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755232A (en) * | 2019-01-31 | 2019-05-14 | 山东晶泰星光电科技有限公司 | A kind of the four-in-one LED display module and its display screen of Optimization-type |
| CN115360186A (en) * | 2022-08-23 | 2022-11-18 | 深圳市天成照明有限公司 | CHIP LED packaging structure and processing technology |
-
2019
- 2019-01-31 CN CN201920172919.7U patent/CN209515665U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755232A (en) * | 2019-01-31 | 2019-05-14 | 山东晶泰星光电科技有限公司 | A kind of the four-in-one LED display module and its display screen of Optimization-type |
| CN109755232B (en) * | 2019-01-31 | 2024-04-19 | 山东捷润弘光电科技有限公司 | Four unification LED display module assembly of optimization type and display screen thereof |
| CN115360186A (en) * | 2022-08-23 | 2022-11-18 | 深圳市天成照明有限公司 | CHIP LED packaging structure and processing technology |
| CN115360186B (en) * | 2022-08-23 | 2024-01-26 | 深圳市天成照明有限公司 | CHIP LED packaging structure and processing technology |
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