CN208460334U - A kind of LED display unit group and display panel - Google Patents
A kind of LED display unit group and display panel Download PDFInfo
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- CN208460334U CN208460334U CN201820998196.1U CN201820998196U CN208460334U CN 208460334 U CN208460334 U CN 208460334U CN 201820998196 U CN201820998196 U CN 201820998196U CN 208460334 U CN208460334 U CN 208460334U
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Abstract
The utility model provides a kind of LED display unit group and display panel, wherein, LED display unit group includes the pixel unit array of n row, m column pixel unit composition, in each pixel unit, at least one LED luminescence chip is flip LED luminescence chip, and the pole A and the pole B of flip LED luminescence chip are respectively positioned on the shady face of LED luminescence chip；The pole A of flip LED luminescence chip is fixed on the pad of the total pole A by conducting resinl material, and the pole B of flip LED luminescence chip is fixed on the pole B pad corresponding with the LED luminescence chip by conductive material.The utility model embodiment can be improved pin welding can manipulation type and fixing, improve the sealing performance of LED display unit group, and can satisfy demand of the user to small size display module.
Description
Technical field
The utility model embodiment is related to LED display technique more particularly to a kind of LED display unit group and display panel.
Background technique
LED display due to high gray scale, the advantages such as visible angle is big, small power consumption and customized screen shape,
It is widely used in the every field such as industry, traffic, commercial advertisement, information publication.
LED display is made of multiple independent LED luminescence units of array arrangement, and Fig. 1 is existing luminescence unit
Front wiring figure, Fig. 2 are the back wiring figures of luminescence unit in Fig. 1, and with reference to Fig. 1 and Fig. 2, luminescence unit includes three LED hairs
Optical chip 10 is separately fixed on three die bond pads 11, and die bond pad 11 is mounted on the front of an insulating substrate 12, and three
The anode of LED luminescence chip 10 is connected to common-anode pad 13, and is drawn by metallic vias and the anode at 12 back side of insulating substrate
Foot P1 connection, cathode are respectively connected to corresponding cathode pad 14, and corresponding with 12 back side of insulating substrate by metallic vias
Negative electrode pin N1, N2 are connected with N3, and three LED luminescence chips and pad are covered by transparent encapsulating material.Mould is shown being formed
When group, the pin by multiple independent LED luminescence units is needed to be welded on pcb board.
As LED display is fast-developing towards small spacing, corresponding luminescence unit size also constantly reduces, and adopts at present
This independent luminescence unit has that welding difficulty and not prison welding are easy to be touched down, and encapsulates in luminescence unit
Material volume is small, causes the binding force of encapsulating material and insulating substrate on the weak side, and sealing performance is bad, and humidity resistance is weak.In addition, making
The display module size formed with independent luminescence unit is big, is unable to satisfy demand of the user to small size display module.
Utility model content
The utility model provides a kind of LED display unit group and display panel, with improve pin welding can manipulation type and
Fixing, improves the sealing performance of LED display unit group, and can satisfy demand of the user to small size display module.
In a first aspect, the utility model embodiment provides a kind of LED display unit group, including n row, m column pixel unit
The pixel unit array of composition, n and m are the positive integer more than or equal to 2；
Wherein, each pixel unit includes a first LED luminescence chip, a 2nd LED luminescence chip, one
3rd LED luminescence chip, the total pole an A pad, the first pole a B pad, the 2nd pole a B pad and the 3rd pole a B weldering
Disk；The total pole the A pad, the first pole B pad, the 2nd pole B pad and the 3rd pole B pad are formed in the front of an insulating substrate
On；
The LED luminescence chip includes the pole A and the pole B, and the polarity of the pole A and the pole B is opposite；
The A of the pole A of the first LED luminescence chip, the pole A of the 2nd LED luminescence chip and the 3rd LED luminescence chip is extremely equal
It is electrically connected with the total pole the A pad；The pole B of the first LED luminescence chip, the pole B of the 2nd LED luminescence chip and the 3rd LED
The pole B of luminescence chip is electrically connected with the first pole B pad, the 2nd pole B pad and the 3rd pole B pad respectively；
In each pixel unit, at least one LED luminescence chip is flip LED luminescence chip, and the flip LED shines
The pole A and the pole B of chip are respectively positioned on the shady face of the LED luminescence chip；The pole A of the flip LED luminescence chip passes through conduction
Material is fixed on the total pole the A pad, and the pole B of the flip LED luminescence chip is fixed on by conductive material to be sent out with the LED
On the corresponding pole the B pad of optical chip.
Optionally, in the i-th row, the total pole the A pad electrical connection of m pixel unit, and the with the LED display unit group
The total pole the A pin electrical connection of i；
In jth column, the first pole B pad of n pixel unit is electrically connected, and with j-th of the LED display unit group the
The electrical connection of one pole B pin；The 2nd pole the B pad electrical connection of n pixel unit, and with j-th of the LED display unit group the
The electrical connection of two pole B pins；The 3rd pole the B pad electrical connection of n pixel unit, and with j-th of the LED display unit group the
The electrical connection of three pole B pins；
The n total pole A pins and the 3m pole B pin are located on the back side of the insulating substrate；
Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
Optionally, the n=2, m=2.
Optionally, the total pole the A pad, the first pole B pad, the 2nd pole B pad and the 3rd pole B pad pass through metallic vias
Pin corresponding with the insulating substrate back side is located at is electrically connected, or by metallic vias and is located at the insulating substrate front
And/or the metal routing at the back side is electrically connected with the total pole the A pin or the pole B pin for being located at the insulating substrate.
Optionally, in each pixel unit, the total pole the A pad, the first pole B pad, the 2nd pole B pad and the 3rd B
Pole pad is set on four apex angles of the pixel unit；
In adjacent two column pixel unit, corresponding pad is symmetrically set about the column bisector of the adjacent two column pixel unit
It sets；
In adjacent rows pixel unit, corresponding pad is symmetrically set about the row bisector of the adjacent rows pixel unit
It sets.
Optionally, in every row pixel unit:
The total pole the A pad of two pixel units is the different piece of same metal pad, which passes through metal mistake
Hole pin connection in the total pole A directly corresponding with the row pixel unit；
In same row pixel unit:
Positioned at the first pole B pad of the first row pixel unit, by metallic vias, directly to arrange the first pole B pad corresponding with this
The connection of the first pole B pin, the first pole the B pad positioned at the second row pixel unit extends to the insulation base by metallic vias
The back side of plate, and to arrange the first pole B pad corresponding with this for the first back metal cabling by being located at the insulating substrate back side
The connection of first pole B pin；
Two the 2nd pole B pads are the different piece of same metal pad, the metal pad by metallic vias directly with
Corresponding 2nd pole the B pin connection of 2nd pole B pad；
Two the 3rd pole B pads are the different piece of same metal pad, the metal pad by metallic vias directly with
Corresponding 3rd pole the B pin connection of 3rd pole B pad.
Optionally, in each pixel unit:
At least one LED luminescence chip is single electrode LED luminescence chip or is bipolar electrode LED luminescence chip；
The single electrode LED luminescence chip has the pole A and the pole B, is located at going out for the LED luminescence chip
Smooth surface and shady face, the pole A of the single electrode LED luminescence chip are connected on the total pole the A pad, the single electrode LED hair
The pole B of optical chip is fixed on the pole B pad corresponding with the LED luminescence chip by conductive material；
The bipolar electrode LED luminescence chip has the pole A and the pole B, and be respectively positioned on the LED luminescence chip goes out light
Face, the pole A of the bipolar electrode LED luminescence chip are connected on the total pole the A pad, the pole B of the bipolar electrode LED luminescence chip
It is connected on the pole B pad corresponding with the LED luminescence chip.
Optionally, the first LED luminescence chip, the 2nd LED luminescence chip and the 3rd LED luminescence chip are equal
For flip LED luminescence chip；
The luminous core of the pole A of the first LED luminescence chip, the pole A of the 2nd LED luminescence chip and the 3rd LED
The A of piece is extremely fixed on the total pole the A pad by conductive material；
The pole B of the first LED luminescence chip is fixed on the pad of the first pole B by conductive material, and described second
The pole B of LED luminescence chip is fixed on the pad of the 2nd pole B by conductive material, the pole B of the 3rd LED luminescence chip
It is fixed on the pad of the 3rd pole B by conductive material.
Optionally, the first LED luminescence chip and the 2nd LED luminescence chip are flip LED luminescence chip, institute
Stating the 3rd LED luminescence chip is single electrode LED luminescence chip；
The luminous core of the pole A of the first LED luminescence chip, the pole A of the 2nd LED luminescence chip and the 3rd LED
The A of piece is extremely fixed on the total pole the A pad by conductive material；
The pole B of the first LED luminescence chip is fixed on the pad of the first pole B by conductive material, and described second
The pole B of LED luminescence chip is fixed on the pad of the 2nd pole B by conductive material, the pole B of the 3rd LED luminescence chip
It is connected on the pad of the 3rd pole B.
Optionally, the first LED luminescence chip, the 2nd LED luminescence chip and the 3rd LED luminescence chip are three differences
The LED luminescence chip of luminescent color, the LED luminescence chip of described three different luminescent colors are red LED chip, green
LED luminescence chip and BLUE LED emissions chip.
Optionally, the pin includes the two total pole A pins and six pole B pins, and the two total pole A pins are located at institute
Two sides opposite on the column direction of the insulating substrate back side are stated, two pole B pins are located at the inside at the insulating substrate back side, four B
Pole pin is located at the edge at the insulating substrate back side.
Optionally, the back side of the insulating substrate is equipped with insulating materials, insulating materials covering by metal routing with
The metallic vias of pin electrical connection.
Optionally, the insulating materials also covers the first back metal cabling positioned at the insulating substrate back side.
Second aspect, the utility model embodiment additionally provide a kind of display panel, including the utility model is arbitrarily implemented
The LED display unit group that example provides.
The utility model embodiment is by being arranged the pixel list that LED display unit group includes n row, m column pixel unit composition
Element array can encapsulate together n × m pixel unit, form a display unit group, make the body of single led display unit group
Product increases, and the pin number of single led display unit group increases, i.e., the solder joint that LED display unit group is contacted with pcb board increases,
And the volume of encapsulating material increases；By being arranged in each pixel unit, at least one LED luminescence chip is flip LED hair
The size of LED display unit group can be made small by optical chip, and LED luminescence chip does not need to make with the connection of corresponding pad
With lead, so the utility model provide LED display unit group improve pin welding can manipulation type and fixing, improve
The sealing performance of LED display unit group reduces the size of LED display unit group, can satisfy the need of display module small size
It asks, and enhances the reliability of LED display unit group, save manufacture craft.
Detailed description of the invention
Fig. 1 is the front wiring figure of existing luminescence unit；
Fig. 2 is the back wiring figure of luminescence unit in Fig. 1；
Fig. 3 is the front wiring figure for the LED display unit group that the utility model embodiment one provides；
Fig. 4 is the back wiring figure of LED display unit group in Fig. 3；
Fig. 5 is the electrical block diagram of the LED display unit group in Fig. 3
Fig. 6 is the front wiring figure for the LED display unit group that the utility model embodiment two provides；
Fig. 7 is the back wiring figure of LED display unit group in Fig. 6；
Fig. 8 is the front wiring figure for the LED display unit group that the utility model embodiment three provides；
Fig. 9 is the back wiring figure of LED display unit group in Fig. 8.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for
It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.
Embodiment one
Fig. 3 is the front wiring figure for the LED display unit group that the utility model embodiment one provides, and Fig. 4 is LED in Fig. 3
The back wiring figure of display unit group, referring to Fig. 3 and Fig. 4, which includes the picture of n row, m column pixel unit composition
Plain cell array, n and m are the positive integer more than or equal to 2, in Fig. 3, illustratively, n=2, m=2.
Wherein, each pixel unit 100 includes 101, the 2nd LED luminescence chips of a first LED luminescence chip
102, the 2nd pole B of the first pole the B pad 231, one of the total pole A pad 220, one of the 3rd LED luminescence chip 103, one weldering
Disk 232 and the 3rd pole a B pad 233；The total pole A pad 220, the first pole B pad 231, the 2nd pole B pad 232 and the 3rd pole B
Pad 233 is formed on the front of an insulating substrate 200；LED luminescence chip includes the pole A and the pole B, the polarity phase of the pole A and the pole B
Instead.
The pole A of first LED luminescence chip 101, the pole A of the 2nd LED luminescence chip 102 and the 3rd LED luminescence chip 103
Extremely the pole A pad 220 is electrically connected A together；The pole B of first LED luminescence chip 101, the pole B of the 2nd LED luminescence chip 102 and
The pole B of three LED luminescence chips 103 is electrically connected with the first pole B pad 231, the 2nd pole B pad 232 and the 3rd pole B pad 233 respectively
It connects.
In the present embodiment, n row, m column pixel unit form a display unit group, compared to existing single pixel list
The display unit of member composition, volume increases, and then improves operability when welding；One display unit group includes multiple pictures
Plain unit 100, compared to the luminescence unit that existing single pixel unit is formed, number of pins increases, and then shows forming LED
When mould group, the solder joint contacted with pcb board increases, and improves the fastness of welding；Meanwhile when packaged, the volume of sealing material
Also increase compared to existing luminescence unit, that is, improve the contact area of sealing material Yu insulating substrate 200, encapsulating material and
The combination of insulating substrate 200 is stronger, and then improves sealing performance.
In each pixel unit 100, at least one LED luminescence chip is flip LED luminescence chip, and flip LED shines
The pole A and the pole B of chip are respectively positioned on the shady face of LED luminescence chip；The pole A of flip LED luminescence chip is fixed by conductive material
On the total pole A pad 220, the pole B of flip LED luminescence chip is fixed on B corresponding with the LED luminescence chip by conductive material
On the pad of pole.
In Fig. 3, illustratively, the luminous core of the first LED luminescence chip 101, the 2nd LED luminescence chip 102 and the 3rd LED
Piece 103 is flip LED luminescence chip, the pole A of the first LED luminescence chip 101, the pole A of the 2nd LED luminescence chip 102 and
The A of three LED luminescence chips 103 is extremely fixed on the total pole A pad 220 by conductive material；The B of first LED luminescence chip 101
Pole is fixed on the first pole B pad 231 by conductive material, and the pole B of the 2nd LED luminescence chip 102 is fixed by conductive material
On the 2nd pole B pad 232, the pole B of the 3rd LED luminescence chip 103 is fixed on the 3rd pole B pad 233 by conductive material.
Wherein, conductive material is chosen as conducting resinl, tin cream etc..
In the present embodiment, the first LED luminescence chip 101, the 2nd LED luminescence chip 102 and the 3rd LED luminescence chip
103 be flip LED luminescence chip, i.e. the pole A and the pole B of the first LED luminescence chip 101, the pole A of the 2nd LED luminescence chip 102
It extremely can be connected by the directly corresponding pad of conductive material with the pole B and the pole A of the 3rd LED luminescence chip 103 with B,
It is small-sized due to LED luminescence chip, in the front of insulating substrate 200, the total pole A pad 220 and the first pole B pad
231, the very little that the spacing between the 2nd pole B pad 232 and the 3rd pole B pad 233 can be set, thus LED display unit group
Size can be made small, when forming the display module of multiple pixel units, due to the size of single led display unit group
Very little, therefore can satisfy the demand of display module small size.In addition, the pole A and the pole B of the first LED luminescence chip 101, second
The extremely direct corresponding pad in the pole A of LED luminescence chip 102 and the pole A and B of the pole B and the 3rd LED luminescence chip 103
Connection is without using lead, therefore fault caused by can falling off to avoid lead, enhancing LED display unit group can
By property, and save manufacture craft.
In the present embodiment, optionally, the cathode of A extremely LED chip, the anode of B extremely LED chip, in other implementations
It can also be the anode of A extremely LED chip, the cathode of B extremely LED chip in mode.
The utility model embodiment is by being arranged the pixel list that LED display unit group includes n row, m column pixel unit composition
Element array can encapsulate together n × m pixel unit, form a display unit group, make the body of single led display unit group
Product increases, and the pin number of single led display unit group increases, i.e., the solder joint that LED display unit group is contacted with pcb board increases,
And the volume of encapsulating material increases；By being arranged in each pixel unit, at least one LED luminescence chip is flip LED hair
The size of LED display unit group can be made small by optical chip, and LED luminescence chip does not need to make with the connection of corresponding pad
With lead, so the utility model provide LED display unit group improve pin welding can manipulation type and fixing, improve
The sealing performance of LED display unit group reduces the size of LED display unit group, can satisfy the need of display module small size
It asks, and enhances the reliability of LED display unit group, save manufacture craft.
Fig. 5 is the electrical block diagram of the LED display unit group in Fig. 3, optional with continued reference to Fig. 3, Fig. 4 and Fig. 5
, the LED display unit group are as follows:
In i-th row, the total pole the A pad 220 of m pixel unit 100 is electrically connected, and the i-th total A with LED display unit group
Pole pin Ni electrical connection；
In jth column, the first pole B pad 231 electrical connection of n pixel unit 100, and j-th with LED display unit group
First pole B pin P1j electrical connection；The 2nd pole B pad 232 electrical connection of n pixel unit 100, and with LED display unit group
J-th of the 2nd pole B pin P2j electrical connections；The 3rd pole B pad 233 electrical connection of n pixel unit 100, and list is shown with LED
J-th of the 3rd pole B pin P3j of tuple are electrically connected；The n total pole A pins and the 3m pole B pin are located at the back side of insulating substrate
On；Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
In Fig. 4, illustratively, LED display unit group includes 2 rows, 2 column pixel units, i.e. n=2, m=2, and the LED is aobvious
Show that unit group includes the 2 total pole A pins (N1 and N2) and 6 pole B pins (P11, P21, P31, P12, P22 and P32), this is only
The specific value of one specific example of the utility model, n and m can be configured according to the actual situation.
In the present embodiment, the total pole the A pad 220 of m pixel unit 100 is electrically connected, and the with LED display unit group
The i total pole A pin Ni electrical connection extremely shares the pole an A pin positioned at the A of same row pixel unit, n pixel unit 100
The electrical connection of first pole B pad 231, and be electrically connected with j-th of the oneth pole B pin P1j of LED display unit group；N pixel unit
100 the 2nd pole B pad 232 electrical connection, and be electrically connected with j-th of the 2nd pole B pin P2j of LED display unit group；N picture
3rd pole B pad 233 of plain unit 100 is electrically connected, and is electrically connected with j-th of the 3rd pole B pin P3j of LED display unit group,
The pole a B pin is extremely shared positioned at the B of the same type LED luminescence chip of same row pixel unit.With LED shown in Fig. 3
For display unit group, includes the LED display module of 4 pixel units to formation, need 1 LED display unit group, including
8 pins, therefore when forming LED display module, the quantity of solder joint needs 8 on pcb board, if using existing luminescence unit
The LED display module including 4 pixel units is formed, then needs 4 luminescence units, each luminescence unit includes 4 pins, i.e.,
Including 16 pins, therefore when forming LED display module, the quantity of solder joint needs 16 on pcb board.Therefore, it is being formed together
When the LED display module of sample area, using LED display unit group provided in this embodiment, solder joint on pcb board can reduce
Quantity, and then greatly save the metal routing on pcb board, simplify preparation process.
Continuing with referring to Fig. 3 and Fig. 4, the total pole A pad 220, the first pole B pad 231, the 2nd pole B pad 232 and the 3rd B
Pole pad 233 is electrically connected by metallic vias pin corresponding with 200 back side of insulating substrate is located at, or passes through metallic vias and position
In the metal routing at the front of insulating substrate 200 and/or the back side and the total pole the A pin or the pole B pin that are located at 200 back side of insulating substrate
Electrical connection, setting in this way can make the wire laying mode of LED display unit group more flexible, save wiring space.
In figs. 3 and 4, illustratively, in the first pixel unit row, the total pole the A pad 220 of two pixel units is
The different piece of same metal pad, the metal pad pass through the metallic vias total pole A directly corresponding with the first row pixel unit
Pin N1 connection；In the first pixel unit column, the first pole the B pad 231 positioned at the first row pixel unit passes through metallic vias
Corresponding first pole the B pin P11 connection of the first pole B pad 231 directly is arranged with this, positioned at the first pole B of the second row pixel unit
Pad 231 extends to the back side of insulating substrate 200, and the by being located at 200 back side of insulating substrate first back by metallic vias
Face metal routing 010 arranges corresponding first pole the B pin P11 connection of the first pole B pad 231 with this；Two the 2nd pole B pads 232
For the different piece of same metal pad, which passes through metallic vias directly corresponding with the 2nd pole B pad 232 the
Two pole B pin P21 connections；Two the 3rd pole B pads 233 are the different piece of same metal pad, which passes through gold
Belong to via hole the 3rd pole B pin P31 connection directly corresponding with the 3rd pole B pad 233.Second pixel unit row and the first pixel
The wire laying mode of cell row is identical, and the second pixel unit column are identical as the wire laying mode that the first pixel unit arranges, no longer superfluous herein
It states.
Continuing with referring to Fig. 3, on the basis of above scheme, optionally, and in each pixel unit 100, the total pole A pad
220, the first pole B pad 231, the 2nd pole B pad 232 and the 3rd pole B pad 233 are set to four tops of the pixel unit 100
On angle；In adjacent two column pixel unit, corresponding pad is symmetrical arranged about the column bisector of adjacent two column pixel unit；It is adjacent
In two row pixel units, corresponding pad is symmetrical arranged about the row bisector of adjacent rows pixel unit.
Wherein, the pole A of flip LED luminescence chip is connected to the total pole A pad 220 by conductive material, and the pole B passes through conduction material
Material is connected on its corresponding pole B pad, therefore the spacing of the total pole A pad 220 and three pole B pads is the luminous core of flip LED
The distance of the pole piece A and B.In LED display unit group, multiple pixel units are arranged in array, by setting the total pole A pad 220,
First pole B pad 231, the 2nd pole B pad 232 and the 3rd pole B pad 233 are set on four apex angles of the pixel unit 100,
Spacing of the LED display unit group on pixel unit line direction and column direction can be made minimum, make the size of LED display unit group
It is minimum.
In adjacent two column pixel unit, corresponding pad is symmetrical arranged about the column bisector of adjacent two column pixel unit,
In adjacent rows pixel unit, corresponding pad is symmetrical arranged about the row bisector of adjacent rows pixel unit, i.e., and adjacent two
The total pole the A pad 231 of column pixel unit can share the same metal pad, close row bisector in adjacent rows pixel unit
The pole B pad can share the same metal pad, exemplary in Fig. 3,220 He of the total pole A pad of first row pixel unit
The total pole the A pad 220 of secondary series pixel unit shares the same metal pad, the 2nd pole B pad 232 of the first row pixel unit
The same metal pad, the 3rd pole the B weldering of the first row pixel unit are shared with the 2nd pole B pad 232 of the second row pixel unit
3rd pole B pad 233 of disk 233 and the second row pixel unit shares the same metal pad, and setting in this way can subtract
The use number of small pad, further decreases the size of LED display unit group, and reduces cost, simplifies preparation process.
Optionally, the first LED luminescence chip, the 2nd LED luminescence chip and the 3rd LED luminescence chip are three kinds of different colours
Luminescence chip, the luminescence chips of three kinds of different colours is red LED chip, green LEDs chip and blue led hair
Optical chip.When forming LED display module, to adapt to cabling demand different on pcb board, the first LED luminescence chip, second
LED luminescence chip and the 3rd LED luminescence chip can be red, green and blue LED luminescence chip respectively；Can also be respectively
Blue, green and red LED chip；It is also possible to other arrangement modes, the utility model is it is not limited here.
Embodiment two
Fig. 6 is the front wiring figure for the LED display unit group that the utility model embodiment two provides, and Fig. 7 is LED in Fig. 6
The back wiring figure of display unit group, referring to Fig. 6 and Fig. 7, on the basis of example 1, optionally, in each pixel unit
In, at least one LED luminescence chip is single electrode LED luminescence chip or is bipolar electrode LED luminescence chip, in the present embodiment,
It is illustrated so that each pixel unit 100 includes at least one single electrode LED luminescence chip as an example.
Single electrode LED luminescence chip has the pole A and the pole B, is located at the light-emitting surface and back of LED luminescence chip
Smooth surface, the pole A of single electrode LED luminescence chip are connected on the pad of the total pole A, and the pole B of single electrode LED luminescence chip passes through conduction material
Material is fixed on the pole B pad corresponding with the LED luminescence chip.
In Fig. 6, illustratively, the first LED luminescence chip 101 and the 2nd LED luminescence chip 102 are flip LED hair
Optical chip, the 3rd LED luminescence chip 103 are single electrode LED luminescence chip；The pole A of first LED luminescence chip 101, the 2nd LED
The pole A of luminescence chip 102 and the A of the 3rd LED luminescence chip 103 are extremely fixed on the total pole A pad 231 by conductive material；
The pole B of first LED luminescence chip is fixed on the first pole B pad by conductive material, and the pole B of the 2nd LED luminescence chip passes through
Conductive material is fixed on the 2nd pole B pad, and the pole B of the 3rd LED luminescence chip is connected on the 3rd pole B pad by lead.
It should be noted that the LED that the wire laying mode of LED display unit group provided in this embodiment and embodiment one provide
The wire laying mode of display unit group is identical, then this is repeated no more.
Continuing with referring to Fig. 7, on the basis of above scheme, optionally, the back side of insulating substrate 200 is equipped with insulating materials
240, insulating materials 240 covers the metallic vias being electrically connected with the pin and is by metal routing.
In the present embodiment, insulating substrate 200 is extended to by metallic vias positioned at the first pole B pad 231 of the second row
The back side, then by being located at the first back metal cabling 010 at 200 back side of insulating substrate, to arrange the first pole B pad 231 right with this
The first pole the B pin P11 connection answered, when welding with pcb board, which is not have effective, that is, is not needed and pcb board
There is the risk of short circuit, cause fault in connection if there are cablings for position opposite with the metallic vias on pcb board.Cause
This, the utility model embodiment covers the metallic vias being electrically connected with the pin and is by metal routing by setting insulating materials 240,
It can play the role of insulation and protect.
Optionally, insulating materials 240 is white oil, resin or green oil etc..
It should be noted that the LED display unit group in the present embodiment, illustratively, in each pixel unit, at least
One LED luminescence chip is single electrode LED luminescence chip, this is only a specific example of the utility model, in other implementations
It, can also be in each pixel unit, at least one LED luminescence chip be bipolar electrode LED luminescence chip in mode.
Embodiment three
Fig. 8 is the front wiring figure for the LED display unit group that the utility model embodiment three provides, and Fig. 9 is LED in Fig. 8
The back wiring figure of display unit group, referring to Fig. 8 and Fig. 9, on the basis of example 1, optionally, in each pixel unit
In 100, at least one LED luminescence chip is bipolar electrode LED luminescence chip, and bipolar electrode LED luminescence chip has the pole A and one
A pole B is respectively positioned on the light-emitting surface of LED luminescence chip, and the pole A of bipolar electrode LED luminescence chip is connected on the total pole A pad 220, double
The pole B of electrode LED luminescence chip is connected on the pole B pad corresponding with the LED luminescence chip.
In fig. 8, illustratively, the first LED luminescence chip 101 and the 2nd LED luminescence chip 102 are flip LED hair
Optical chip, the 3rd LED luminescence chip 103 are bipolar electrode LED luminescence chip.The pole A of first LED luminescence chip 101 and the 2nd LED
The pole A of luminescence chip 102 is fixed on the total pole A pad 220 by conductive material；The pole B of first LED luminescence chip passes through conduction
Material is fixed on the first pole B pad, and the pole B of the 2nd LED luminescence chip is fixed on the 2nd pole B pad by conductive material,
The pole A of 3rd LED luminescence chip 103 is connected on the total pole A pad 231 by lead, and the B of the 3rd LED luminescence chip 103 is extremely logical
Lead is crossed to be connected on the 3rd pole B pad 233.
It should be noted that the 3rd LED luminescence chip 103 be bipolar electrode LED luminescence chip, therefore the 3rd LED shine core
Piece 103 is fixed on pad by insulating cement, wherein the pad for fixing the 3rd LED luminescence chip 103 can be the total pole A pad
220, any one in the first pole B pad 231, the 2nd pole B pad 232 or the 3rd pole B pad 233, in fig. 8, optionally,
3rd LED luminescence chip 103 is fixed on the total pole A pad 220 by insulating cement.
In the present embodiment, the cloth for the LED display unit group that the wire laying mode of LED display unit group and embodiment one provide
Line mode is identical, then this is repeated no more.
Continuing with referring to Fig. 9, optionally, pin include the two total pole A pins (N1 and N2) and six pole B pins (P11,
P21, P31, P12, P22 and P32), the two total pole A pins are located at two sides opposite on 200 back side column direction of insulating substrate,
Two pole B pins are located at the inside at 200 back side of insulating substrate, and four pole B pins are located at the edge at 200 back side of insulating substrate, two
A total pole A pin (N1 and N2) is respectively arranged at the two sides up and down at 200 back side of insulating substrate, two the first pole B pins (P11 and
P21) and two the 2nd poles B pin (P12, P22) are set to the edge at 200 back side of insulating substrate, two the 3rd pole B pin (P13
And P24) it is set to the inside at 200 back side of insulating substrate, setting in this way can be such that pin is located at and hair connected to it
The close position of optical chip facilitates wiring, saves wiring space, saves preparation process.
Optionally, the back side of insulating substrate 200 is equipped with insulating materials 240, and insulating materials 240 not only covers to walk by metal
The first back metal cabling 010 that the metallic vias that line is electrically connected with the pin and is, also covering are located at 200 back side of insulating substrate, passes through
Such setting can insulate and protect the metallic vias and back metal cabling on insulating substrate 200.
Example IV
This illustrates that example IV provides a kind of display panel, shows including the LED that above embodiments one to three provide single
Tuple.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments
The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from
It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended
Scope of the claims determine.
Claims (14)
1. a kind of LED display unit group, which is characterized in that including the pixel unit array that n row, m column pixel unit form, n and m
It is the positive integer more than or equal to 2；
Wherein, each pixel unit includes a first LED luminescence chip, the 2nd LED luminescence chip, a third
LED luminescence chip, the total pole an A pad, the first pole a B pad, the 2nd pole a B pad and the 3rd pole a B pad；Institute
The total pole A pad, the first pole B pad, the 2nd pole B pad and the 3rd pole B pad is stated to be formed on the front of an insulating substrate；
The LED luminescence chip includes the pole A and the pole B, and the polarity of the pole A and the pole B is opposite；
The A of the pole A of the first LED luminescence chip, the pole A of the 2nd LED luminescence chip and the 3rd LED luminescence chip is extremely and institute
State the electrical connection of the total pole A pad；The pole B of the first LED luminescence chip, the pole B of the 2nd LED luminescence chip and the 3rd LED shine
The pole B of chip is electrically connected with the first pole B pad, the 2nd pole B pad and the 3rd pole B pad respectively；
In each pixel unit, at least one LED luminescence chip is flip LED luminescence chip, the flip LED luminescence chip
The pole A and the pole B be respectively positioned on the shady face of the LED luminescence chip；The pole A of the flip LED luminescence chip passes through conductive material
It is fixed on the total pole the A pad, the pole B of the flip LED luminescence chip is fixed on and the luminous core of the LED by conductive material
On the corresponding pole the B pad of piece.
2. LED display unit group according to claim 1, which is characterized in that in the i-th row, the total pole A of m pixel unit
Pad electrical connection, and be electrically connected with the i-th total pole A pin of the LED display unit group；
In jth column, the first pole the B pad electrical connection of n pixel unit, and j-th of the oneth B with the LED display unit group
The electrical connection of pole pin；The 2nd pole the B pad electrical connection of n pixel unit, and j-th of the 2nd B with the LED display unit group
The electrical connection of pole pin；The 3rd pole the B pad electrical connection of n pixel unit, and j-th of the 3rd B with the LED display unit group
The electrical connection of pole pin；
The n total pole A pins and the 3m pole B pin are located on the back side of the insulating substrate；
Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
3. LED display unit group according to claim 2, which is characterized in that the n=2, m=2.
4. LED display unit group according to claim 1, which is characterized in that the total pole the A pad, the first pole B pad,
2nd pole B pad and the 3rd pole B pad are electrically connected by metallic vias pin corresponding with the insulating substrate back side is located at, or
By metallic vias and positioned at the metal routing at insulating substrate front and/or the back side and the total A that is located at the insulating substrate
Pole pin or the electrical connection of the pole B pin.
5. LED display unit group according to claim 1, which is characterized in that in each pixel unit, the total pole A
Pad, the first pole B pad, the 2nd pole B pad and the 3rd pole B pad are set on four apex angles of the pixel unit；
In adjacent two column pixel unit, corresponding pad is symmetrical arranged about the column bisector of the adjacent two column pixel unit；
In adjacent rows pixel unit, corresponding pad is symmetrical arranged about the row bisector of the adjacent rows pixel unit.
6. LED display unit group according to claim 5, which is characterized in that
In every row pixel unit:
The total pole the A pad of two pixel units is the different piece of same metal pad, and the metal pad is straight by metallic vias
Connect the total pole A pin connection corresponding with the row pixel unit；
In same row pixel unit:
The first pole the B pad positioned at the first row pixel unit directly arranges the first pole B pad corresponding the with this by metallic vias
The connection of one pole B pin, the first pole the B pad positioned at the second row pixel unit extend to the insulating substrate by metallic vias
The back side, and the first back metal cabling by being located at the insulating substrate back side arranges corresponding first B of the first pole B pad with this
The connection of pole pin；
Two the 2nd pole B pads are the different piece of same metal pad, the metal pad by metallic vias directly with this
Corresponding 2nd pole the B pin connection of two pole B pads；
Two the 3rd pole B pads are the different piece of same metal pad, the metal pad by metallic vias directly with this
Corresponding 3rd pole the B pin connection of three pole B pads.
7. LED display unit group according to claim 1, which is characterized in that in each pixel unit:
At least one LED luminescence chip is single electrode LED luminescence chip or is bipolar electrode LED luminescence chip；
The single electrode LED luminescence chip has the pole A and the pole B, is located at the light-emitting surface of the LED luminescence chip
And shady face, the pole A of the single electrode LED luminescence chip are connected on the total pole the A pad, the single electrode LED shines core
The pole B of piece is fixed on the pole B pad corresponding with the LED luminescence chip by conductive material；
The bipolar electrode LED luminescence chip has the pole A and the pole B, is respectively positioned on the light-emitting surface of the LED luminescence chip,
The pole A of the bipolar electrode LED luminescence chip is connected on the total pole the A pad, and the pole B of the bipolar electrode LED luminescence chip connects
It is connected on the pole B pad corresponding with the LED luminescence chip.
8. LED display unit group according to claim 1, which is characterized in that the first LED luminescence chip, described
Two LED luminescence chips and the 3rd LED luminescence chip are flip LED luminescence chip；
The pole A, the pole A of the 2nd LED luminescence chip and the A of the 3rd LED luminescence chip of the first LED luminescence chip
Extremely it is fixed on the total pole the A pad by conductive material；
The pole B of the first LED luminescence chip is fixed on the pad of the first pole B by conductive material, the 2nd LED hair
The pole B of optical chip is fixed on the pad of the 2nd pole B by conductive material, and the pole B of the 3rd LED luminescence chip is by leading
Electric material is fixed on the pad of the 3rd pole B.
9. LED display unit group according to claim 7, which is characterized in that the first LED luminescence chip and described
Two LED luminescence chips are flip LED luminescence chip, and the 3rd LED luminescence chip is single electrode LED luminescence chip；
The pole A, the pole A of the 2nd LED luminescence chip and the A of the 3rd LED luminescence chip of the first LED luminescence chip
Extremely it is fixed on the total pole the A pad by conductive material；
The pole B of the first LED luminescence chip is fixed on the pad of the first pole B by conductive material, the 2nd LED hair
The pole B of optical chip is fixed on the pad of the 2nd pole B by conductive material, and the pole B of the 3rd LED luminescence chip is connected to
On the pad of 3rd pole B.
10. LED display unit group according to claim 1, which is characterized in that the first LED luminescence chip, second
LED luminescence chip and the 3rd LED luminescence chip are the LED luminescence chip of three different luminescent colors, and three differences shine
The LED luminescence chip of color is red LED chip, green LEDs chip and BLUE LED emissions chip.
11. LED display unit group according to claim 3, which is characterized in that the pin includes the two total pole A pins
With six pole B pins, the two total pole A pins are located at two sides opposite on the column direction of the insulating substrate back side, two poles B
Pin is located at the inside at the insulating substrate back side, and four pole B pins are located at the edge at the insulating substrate back side.
12. LED display unit group according to claim 4, which is characterized in that the back side of the insulating substrate is equipped with insulation
Material, the insulating materials cover the metallic vias being electrically connected with the pin and is by metal routing.
13. LED display unit group according to claim 12, which is characterized in that the insulating materials, which also covers, is located at institute
State the first back metal cabling at the insulating substrate back side.
14. a kind of display panel, which is characterized in that including by any LED display unit group of claim 1-13.
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| CN201820998196.1U CN208460334U (en) | 2018-06-26 | 2018-06-26 | A kind of LED display unit group and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108630114A (en) * | 2018-06-26 | 2018-10-09 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108630114A (en) * | 2018-06-26 | 2018-10-09 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
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