CN108630114A - A kind of LED display unit group and display panel - Google Patents
A kind of LED display unit group and display panel Download PDFInfo
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- CN108630114A CN108630114A CN201810667929.8A CN201810667929A CN108630114A CN 108630114 A CN108630114 A CN 108630114A CN 201810667929 A CN201810667929 A CN 201810667929A CN 108630114 A CN108630114 A CN 108630114A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The present invention provides a kind of LED display unit group and display panels, wherein, LED display unit group includes the pixel unit array of n rows, m row pixel units composition, in each pixel unit, at least one LED luminescence chips are flip LED luminescence chip, and the poles A and the poles B of flip LED luminescence chip are respectively positioned on the shady face of LED luminescence chips；The poles A of flip LED luminescence chip are fixed on by conducting resinl material on the pad of the total poles A, and the poles B of flip LED luminescence chip are fixed on by conductive material on the poles B pad corresponding with the LED luminescence chips.The embodiment of the present invention can improve the operable type and fixing of pin welding, improve the sealing performance of LED display unit group, and can meet the needs of user is to small size display module.
Description
Technical field
The present embodiments relate to LED display technique more particularly to a kind of LED display unit group and display panels.
Background technology
LED display due to high gray scale, the advantages such as visible angle is big, small power consumption and customized screen shape,
It is widely used in the every field such as industry, traffic, commercial advertisement, information publication.
LED display is made of multiple independent LED luminescence units of array arrangement, and Fig. 1 is existing luminescence unit
Front wiring figure, Fig. 2 are the back wiring figures of luminescence unit in Fig. 1, and with reference to figure 1 and Fig. 2, luminescence unit includes that three LED are sent out
Optical chip 10 is separately fixed on three die bond pads 11, die bond pad 11 be mounted on an insulating substrate 12 front, three
The anode of LED luminescence chips 10 is connected to common-anode pad 13, and is drawn by metallic vias and the anode at 12 back side of insulating substrate
Foot P1 connections, cathode are respectively connected to corresponding cathode pad 14, and corresponding with 12 back side of insulating substrate by metallic vias
Negative electrode pin N1, N2 are connected with N3, and three LED luminescence chips and pad are covered by transparent encapsulating material.Mould is shown being formed
When group, the pin by multiple independent LED luminescence units is needed to be welded on pcb board.
As LED display is towards the fast development of small spacing, corresponding luminescence unit size also constantly reduces, and adopts at present
This independent luminescence unit has that welding difficulty and not prison welding are easy to be touched down, and is encapsulated in luminescence unit
Material volume is small, causes the binding force of encapsulating material and insulating substrate on the weak side, and sealing performance is bad, and humidity resistance is weak.In addition, making
The display module size formed with independent luminescence unit is big, cannot be satisfied demand of the user to small size display module.
Invention content
The present invention provides a kind of LED display unit group and display panel, to improve the operable type of pin welding and firm
Property, the sealing performance of LED display unit group is improved, and can meet the needs of user is to small size display module.
In a first aspect, an embodiment of the present invention provides a kind of LED display unit group, including n rows, m row pixel units composition
Pixel unit array, n and m are the positive integer more than or equal to 2；
Wherein, each pixel unit include a first LED luminescence chip, a 2nd LED luminescence chip, one
3rd LED luminescence chips, the total poles an A pad, the first poles a B pad, the 2nd poles a B pad and the 3rd poles a B weldering
Disk；The total poles the A pad, the first poles B pad, the 2nd poles B pad and the 3rd poles B pad are formed in the front of an insulating substrate
On；
The LED luminescence chips include the poles A and the poles B, and the polarity of the poles A and the poles B is opposite；
The A of the poles A of the first LED luminescence chips, the poles A of the 2nd LED luminescence chips and the 3rd LED luminescence chips is extremely equal
It is electrically connected with the total poles the A pad；The poles B of the first LED luminescence chips, the poles B of the 2nd LED luminescence chips and the 3rd LED
The poles B of luminescence chip are electrically connected with the first poles B pad, the 2nd poles B pad and the 3rd poles B pad respectively；
In each pixel unit, at least one LED luminescence chips are flip LED luminescence chip, and the flip LED shines
The poles A and the poles B of chip are respectively positioned on the shady face of the LED luminescence chips；The poles A of the flip LED luminescence chip pass through conduction
Material is fixed on the total poles the A pad, and the poles B of the flip LED luminescence chip are fixed on by conductive material to be sent out with the LED
On the corresponding poles the B pad of optical chip.
Optionally, in the i-th row, the total poles the A pad electrical connection of m pixel unit, and with the of the LED display unit group
The total poles the A pin electrical connections of i；
In jth row, the first poles B pad of n pixel unit is electrically connected, and with j-th of the LED display unit group the
One poles B pin electrical connection；2nd poles B pad electrical connection of n pixel unit, and with j-th of the LED display unit group the
Two poles B pin electrical connections；3rd poles B pad electrical connection of n pixel unit, and with j-th of the LED display unit group the
Three poles B pin electrical connections；
The n total poles A pins and the 3m poles B pin are located on the back side of the insulating substrate；
Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
Optionally, the n=2, m=2.
Optionally, the total poles the A pad, the first poles B pad, the 2nd poles B pad and the 3rd poles B pad pass through metallic vias
It is electrically connected with positioned at the corresponding pin in the insulating substrate back side, or by metallic vias and positioned at insulating substrate front
And/or the metal routing at the back side is electrically connected with the total poles the A pin or the poles B pin for being located at the insulating substrate.
Optionally, in each pixel unit, the total poles the A pad, the first poles B pad, the 2nd poles B pad and the 3rd B
Pole pad is set on four apex angles of the pixel unit；
In adjacent two row pixel unit, corresponding pad is symmetrically set about the row bisector of the adjacent two row pixel unit
It sets；
In adjacent rows pixel unit, corresponding pad is symmetrically set about the row bisector of the adjacent rows pixel unit
It sets.
Optionally, often in row pixel unit：
The total poles the A pad of two pixel units is the different piece of same metal pad, which passes through metal mistake
Hole pin connection in the total poles A directly corresponding with the row pixel unit；
In same row pixel unit：
Positioned at the first poles B pad of the first row pixel unit, by metallic vias, directly to arrange the first poles B pad corresponding with this
The first poles B pins connection, the first poles the B pad positioned at the second row pixel unit extends to the insulation base by metallic vias
The back side of plate, and to arrange the first poles B pad corresponding with this by the first back metal cabling positioned at the insulating substrate back side
First poles B pin connection；
Two the 2nd poles B pads are the different piece of same metal pad, the metal pad by metallic vias directly with
Corresponding 2nd poles the B pin connection of 2nd poles B pad；
Two the 3rd poles B pads are the different piece of same metal pad, the metal pad by metallic vias directly with
Corresponding 3rd poles the B pin connection of 3rd poles B pad.
Optionally, in each pixel unit：
At least one LED luminescence chips are single electrode LED luminescence chips or are bipolar electrode LED luminescence chips；
There are one the poles A and the poles B for the single electrode LED luminescence chips tool, are located at going out for the LED luminescence chips
The poles A of smooth surface and shady face, the single electrode LED luminescence chips are connected on the total poles the A pad, the single electrode LED hairs
The poles B of optical chip are fixed on by conductive material on the poles B pad corresponding with the LED luminescence chips；
There are one the poles A and the poles B for the bipolar electrode LED luminescence chips tool, are respectively positioned on the light extraction of the LED luminescence chips
The poles A in face, the bipolar electrode LED luminescence chips are connected on the total poles the A pad, the poles B of the bipolar electrode LED luminescence chips
It is connected on the poles B pad corresponding with the LED luminescence chips.
Optionally, the first LED luminescence chips, the 2nd LED luminescence chips and the 3rd LED luminescence chips
It is flip LED luminescence chip；
The luminous core of the poles A of the first LED luminescence chips, the poles A of the 2nd LED luminescence chips and the 3rd LED
The A of piece is extremely fixed on by conductive material on the total poles the A pad；
The poles B of the first LED luminescence chips are fixed on by conductive material on the pad of the first poles B, and described second
The poles B of LED luminescence chips are fixed on by conductive material on the pad of the 2nd poles B, the poles B of the 3rd LED luminescence chips
It is fixed on the pad of the 3rd poles B by conductive material.
Optionally, the first LED luminescence chips and the 2nd LED luminescence chips are flip LED luminescence chip, institute
It is single electrode LED luminescence chips to state the 3rd LED luminescence chips；
The luminous core of the poles A of the first LED luminescence chips, the poles A of the 2nd LED luminescence chips and the 3rd LED
The A of piece is extremely fixed on by conductive material on the total poles the A pad；
The poles B of the first LED luminescence chips are fixed on by conductive material on the pad of the first poles B, and described second
The poles B of LED luminescence chips are fixed on by conductive material on the pad of the 2nd poles B, the poles B of the 3rd LED luminescence chips
It is connected on the pad of the 3rd poles B.
Optionally, the first LED luminescence chips, the 2nd LED luminescence chips and the 3rd LED luminescence chips are three differences
The LED luminescence chips of the LED luminescence chips of luminescent color, described three different luminescent colors are red LED chip, green
LED luminescence chips and BLUE LED emissions chip.
Optionally, the pin includes the two total poles A pins and six poles B pins, and the two total poles A pins are located at institute
Both sides opposite on the column direction of the insulating substrate back side are stated, two poles B pins are located at the inside at the insulating substrate back side, four B
Pole pin is located at the edge at the insulating substrate back side.
Optionally, the back side of the insulating substrate is equipped with insulating materials, insulating materials covering by metal routing with
The metallic vias of pin electrical connection.
Optionally, the insulating materials also covers the first back metal cabling positioned at the insulating substrate back side.
Second aspect, the embodiment of the present invention additionally provide a kind of display panel, including any embodiment of the present invention provides
LED display unit group.
The embodiment of the present invention is by being arranged the pixel unit battle array that LED display unit group includes n rows, m row pixel units composition
Row, can encapsulate n × m pixel unit together, form a display unit group, the volume of single led display unit group is made to increase
Greatly, the pin number of single led display unit group increases, i.e., the solder joint that LED display unit group is contacted with pcb board increases, and seals
The volume of package material increases；By being arranged in each pixel unit, at least one LED luminescence chips are the luminous core of flip LED
The size of LED display unit group can be made small by piece, and the connection of LED luminescence chips and corresponding pad need not use draw
Line, and then the present invention provides the operable type and fixing that LED display unit group improves pin welding, improves LED and shows
The sealing performance of unit group reduces the size of LED display unit group, can meet the needs of display module small size, and increase
The strong reliability of LED display unit group, saves manufacture craft.
Description of the drawings
Fig. 1 is the front wiring figure of existing luminescence unit；
Fig. 2 is the back wiring figure of luminescence unit in Fig. 1；
Fig. 3 is the front wiring figure for the LED display unit group that the embodiment of the present invention one provides；
Fig. 4 is the back wiring figure of LED display unit group in Fig. 3；
Fig. 5 is the electrical block diagram of the LED display unit group in Fig. 3
Fig. 6 is the front wiring figure of LED display unit group provided by Embodiment 2 of the present invention；
Fig. 7 is the back wiring figure of LED display unit group in Fig. 6；
Fig. 8 is the front wiring figure for the LED display unit group that the embodiment of the present invention three provides；
Fig. 9 is the back wiring figure of LED display unit group in Fig. 8.
Specific implementation mode
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limitation of the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Fig. 3 is the front wiring figure for the LED display unit group that the embodiment of the present invention one provides, and Fig. 4 is that LED is shown in Fig. 3
The back wiring figure of unit group, referring to Fig. 3 and Fig. 4, which includes the pixel list of n rows, m row pixel units composition
Element array, n and m are the positive integer more than or equal to 2, in figure 3, illustratively, n=2, m=2.
Wherein, each pixel unit 100 includes 101, the 2nd LED luminescence chips of a first LED luminescence chip
102, the 2nd poles B of the first poles the B pad 231, one of the total poles A pad 220, one of the 3rd LED luminescence chips 103, one weldering
Disk 232 and the 3rd poles a B pad 233；The total poles A pad 220, the first poles B pad 231, the 2nd poles B pad 232 and the 3rd poles B
Pad 233 is formed on the front of an insulating substrate 200；LED luminescence chips include the poles A and the poles B, the polarity phase of the poles A and the poles B
Instead.
The poles A of first LED luminescence chips 101, the poles A of the 2nd LED luminescence chips 102 and the 3rd LED luminescence chips 103
A extremely together the poles A pad 220 be electrically connected；The poles B of first LED luminescence chips 101, the poles B of the 2nd LED luminescence chips 102
With the poles B of the 3rd LED luminescence chips 103 respectively with the first poles B pad 231, the 2nd poles B pad 232 and the 3rd poles B pad 233
Electrical connection.
In the present embodiment, n rows, m row pixel units form a display unit group, compared to existing single pixel list
The display unit of member composition, volume increases, and then improves operability when welding；One display unit group includes multiple pictures
Plain unit 100, compared to the luminescence unit that existing single pixel unit is formed, number of pins increases, and then is shown forming LED
When module, the solder joint contacted with pcb board increases, and improves the fastness of welding；Meanwhile when packaged, the volume of sealing material
Also increase compared to existing luminescence unit, that is, improve the contact area of sealing material and insulating substrate 200, encapsulating material and
200 combination of insulating substrate is more secured, and then improves sealing performance.
In each pixel unit 100, at least one LED luminescence chips are flip LED luminescence chip, and flip LED shines
The poles A and the poles B of chip are respectively positioned on the shady face of LED luminescence chips；The poles A of flip LED luminescence chip are fixed by conductive material
On the total poles A pad 220, the poles B of flip LED luminescence chip are fixed on B corresponding with the LED luminescence chips by conductive material
On the pad of pole.
In figure 3, illustratively, the luminous core of the first LED luminescence chips 101, the 2nd LED luminescence chips 102 and the 3rd LED
Piece 103 is flip LED luminescence chip, the poles A of the first LED luminescence chips 101, the poles A of the 2nd LED luminescence chips 102 and
The A of three LED luminescence chips 103 is extremely fixed on by conductive material on the total poles A pad 220；The B of first LED luminescence chips 101
Pole is fixed on by conductive material on the first poles B pad 231, and the poles B of the 2nd LED luminescence chips 102 are fixed by conductive material
On the 2nd poles B pad 232, the poles B of the 3rd LED luminescence chips 103 are fixed on the 3rd poles B pad 233 by conductive material
On.Wherein, conductive material is chosen as conducting resinl, tin cream etc..
In the present embodiment, the first LED luminescence chips 101, the 2nd LED luminescence chips 102 and the 3rd LED luminescence chips
103 be flip LED luminescence chip, i.e. the poles A and the poles B of the first LED luminescence chips 101, the poles A of the 2nd LED luminescence chips 102
Extremely it can be connected by the directly corresponding pad of conductive material with the poles A and B of the poles B and the 3rd LED luminescence chips 103
It connects, small-sized due to LED luminescence chips, in the front of insulating substrate 200, the total poles A pad 220 and the first poles B are welded
The very little that spacing between disk 231, the 2nd poles B pad 232 and the 3rd poles B pad 233 can be arranged, to LED display unit
The size of group can be made small, when forming the display module of multiple pixel units, due to single led display unit group
It is small-sized, therefore can meet the needs of display module small size.In addition, the poles A and the poles B of the first LED luminescence chips 101,
The poles A of 2nd LED luminescence chips 102 and the poles A and B of the poles B and the 3rd LED luminescence chips 103 are extremely directly corresponding
Pad is connected without using lead, therefore fault caused by can falling off to avoid lead, enhances LED display unit group
Reliability, and save manufacture craft.
In the present embodiment, optionally, the cathode of A extremely LED chips, the anode of B extremely LED chips, in other implementations
Can also be the anode of A extremely LED chips, the cathode of B extremely LED chips in mode.
The embodiment of the present invention is by being arranged the pixel unit battle array that LED display unit group includes n rows, m row pixel units composition
Row, can encapsulate n × m pixel unit together, form a display unit group, the volume of single led display unit group is made to increase
Greatly, the pin number of single led display unit group increases, i.e., the solder joint that LED display unit group is contacted with pcb board increases, and seals
The volume of package material increases；By being arranged in each pixel unit, at least one LED luminescence chips are the luminous core of flip LED
The size of LED display unit group can be made small by piece, and the connection of LED luminescence chips and corresponding pad need not use draw
Line, and then the present invention provides the operable type and fixing that LED display unit group improves pin welding, improves LED and shows
The sealing performance of unit group reduces the size of LED display unit group, can meet the needs of display module small size, and increase
The strong reliability of LED display unit group, saves manufacture craft.
Fig. 5 is the electrical block diagram of the LED display unit group in Fig. 3, optional with continued reference to Fig. 3, Fig. 4 and Fig. 5
, which is：
In i-th row, the total poles the A pad 220 of m pixel unit 100 is electrically connected, and with the i-th total A of LED display unit group
Pole pin Ni is electrically connected；
In jth row, the first poles B pad 231 of n pixel unit 100 is electrically connected, and with j-th of LED display unit group
First poles B pin P1j is electrically connected；The 2nd poles B pad 232 electrical connection of n pixel unit 100, and with LED display unit group
J-th of the 2nd poles B pin P2j electrical connection；The 3rd poles B pad 233 electrical connection of n pixel unit 100, and shown with LED
J-th of the 3rd poles B pin P3j of unit group are electrically connected；The n total poles A pins and the 3m poles B pin are located at the back side of insulating substrate
On；Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
In Fig. 4, illustratively, LED display unit group includes 2 rows, 2 row pixel units, i.e. n=2, m=2, the LED
Display unit group includes the 2 total poles A pins (N1 and N2) and 6 poles B pins (P11, P21, P31, P12, P22 and P32), this
Only it is the specific example of the present invention, the concrete numerical value of n and m can be configured according to actual conditions.
In the present embodiment, the total poles the A pad 220 of m pixel unit 100 is electrically connected, and with the of LED display unit group
The i total poles A pin Ni electrical connections, that is, the A for being located at same row pixel unit extremely share the poles an A pin, n pixel unit 100
First poles B pad 231 is electrically connected, and is electrically connected with j-th of the oneth poles B pin P1j of LED display unit group；N pixel unit
100 the 2nd poles B pad 232 electrical connection, and be electrically connected with j-th of the 2nd poles B pin P2j of LED display unit group；N picture
3rd poles B pad 233 of plain unit 100 is electrically connected, and is electrically connected with j-th of the 3rd poles B pin P3j of LED display unit group
It connects, that is, the B for being located at the same type LED luminescence chips of same row pixel unit extremely shares the poles a B pin.With shown in Fig. 3
For LED display unit group, includes the LED display modules of 4 pixel units to formation, needs 1 LED display unit group,
Including 8 pins, therefore when forming LED display modules, the quantity of solder joint needs 8 on pcb board, if being shone using existing
Unit formation includes the LED display modules of 4 pixel units, then 4 luminescence units, each luminescence unit is needed to draw including 4
Foot includes 16 pins, therefore when forming LED display modules, the quantity of solder joint needs 16 on pcb board.Therefore, exist
When forming the LED display modules of onesize area, using LED display units group provided in this embodiment, PCB can be reduced
The quantity of solder joint on plate, and then the metal routing on pcb board is greatlyd save, simplify preparation process.
Continuing with referring to Fig. 3 and Fig. 4, the total poles A pad 220, the first poles B pad 231, the 2nd poles B pad 232 and the 3rd B
Pole pad 233 is electrically connected by metallic vias pin corresponding with 200 back side of insulating substrate is located at, or passes through metallic vias and position
In the metal routing at the front of insulating substrate 200 and/or the back side with positioned at the total poles the A pin or the poles B pin at 200 back side of insulating substrate
Electrical connection, setting in this way can make the wire laying mode of LED display unit group more flexible, save wiring space.
In figs. 3 and 4, illustratively, in the first pixel unit row, the total poles the A pad 220 of two pixel units
For the different piece of same metal pad, which passes through metallic vias total A directly corresponding with the first row pixel unit
Pole pin N1 connections；In the first pixel unit row, the first poles the B pad 231 for being located at the first row pixel unit passes through metal mistake
Hole directly arranges corresponding first poles the B pin P11 connections of the first poles B pad 231 with this, is located at the first B of the second row pixel unit
Pole pad 231 extends to the back side of insulating substrate 200 by metallic vias, and by positioned at the first of 200 back side of insulating substrate
Back metal cabling 010 arranges corresponding first poles the B pin P11 connections of the first poles B pad 231 with this；Two the 2nd poles B pads
232 be the different piece of same metal pad, and the metal pad is directly corresponding with the 2nd poles B pad 232 by metallic vias
The 2nd poles B pin P21 connections；Two the 3rd poles B pads 233 are the different piece of same metal pad, and the metal pad is logical
Cross metallic vias the 3rd poles B pin P31 connections directly corresponding with the 3rd poles B pad 233.Second pixel unit row and first
The wire laying mode of pixel unit row is identical, and the second pixel unit row are identical as the wire laying mode that the first pixel unit arranges, herein not
It repeats again.
Continuing with referring to Fig. 3, on the basis of said program, optionally, in each pixel unit 100, the total poles A are welded
Disk 220, the first poles B pad 231, the 2nd poles B pad 232 and the 3rd poles B pad 233 are set to four of the pixel unit 100
On apex angle；In adjacent two row pixel unit, corresponding pad is symmetrical arranged about the row bisector of adjacent two row pixel unit；Phase
In adjacent two row pixel units, corresponding pad is symmetrical arranged about the row bisector of adjacent rows pixel unit.
Wherein, the poles A of flip LED luminescence chip are connected to the total poles A pad 220 by conductive material, and the poles B pass through conduction material
Material is connected on its corresponding poles B pad, therefore the spacing of the total poles A pad 220 and three poles B pads is the luminous core of flip LED
The distance of the poles piece A and B.In LED display unit group, multiple pixel units are arranged in array, by be arranged the total poles A pad 220,
First poles B pad 231, the 2nd poles B pad 232 and the 3rd poles B pad 233 are set on four apex angles of the pixel unit 100,
Spacing of the LED display units group on pixel unit line direction and column direction can be made minimum, make the ruler of LED display unit group
Very little minimum.
In adjacent two row pixel unit, corresponding pad is symmetrical arranged about the row bisector of adjacent two row pixel unit,
In adjacent rows pixel unit, corresponding pad is symmetrical arranged about the row bisector of adjacent rows pixel unit, i.e., and adjacent two
The total poles the A pad 231 of row pixel unit can share the same metal pad, close to row bisector in adjacent rows pixel unit
The poles B pad can share the same metal pad, exemplary in Fig. 3, the total poles the A pad 220 of first row pixel unit
The same metal pad, the 2nd poles B pad of the first row pixel unit are shared with the total poles the A pad 220 of secondary series pixel unit
232 and second the 2nd poles B pad 232 of row pixel unit share the same metal pad, the 3rd poles B of the first row pixel unit
3rd poles B pad 233 of pad 233 and the second row pixel unit shares the same metal pad, and setting in this way can be with
The use number for reducing pad, further decreases the size of LED display unit group, and reduce cost, simplifies preparation process.
Optionally, the first LED luminescence chips, the 2nd LED luminescence chips and the 3rd LED luminescence chips are three kinds of different colours
Luminescence chip, the luminescence chips of three kinds of different colours is red LED chip, green LEDs chip and blue led
Luminescence chip.When forming LED display modules, for the cabling demand for adapting to different on pcb board, the first LED luminescence chips, second
LED luminescence chips and the 3rd LED luminescence chips can be red, green and blue LED luminescence chips respectively；Can also be respectively
Blue, green and red LED chip；Can also be other arrangement modes, the present invention does not limit herein.
Embodiment two
Fig. 6 is the front wiring figure of LED display unit group provided by Embodiment 2 of the present invention, and Fig. 7 is that LED is shown in Fig. 6
The back wiring figure of unit group, referring to Fig. 6 and Fig. 7, on the basis of embodiment one, optionally, in each pixel unit, until
A few LED luminescence chip is single electrode LED luminescence chips or is bipolar electrode LED luminescence chips, in the present embodiment, with each
Pixel unit 100 at least one single electrode LED luminescence chips including illustrating.
There are one the poles A and the poles B for single electrode LED luminescence chips tool, are located at the light-emitting surface and the back of the body of LED luminescence chips
The poles A of smooth surface, single electrode LED luminescence chips are connected on the pad of the total poles A, and the poles B of single electrode LED luminescence chips pass through conduction
Material is fixed on the poles B pad corresponding with the LED luminescence chips.
In figure 6, illustratively, the first LED luminescence chips 101 and the 2nd LED luminescence chips 102 are flip LED hair
Optical chip, the 3rd LED luminescence chips 103 are single electrode LED luminescence chips；The poles A of first LED luminescence chips 101, the 2nd LED
The poles A of luminescence chip 102 and the A of the 3rd LED luminescence chips 103 are extremely fixed on by conductive material on the total poles A pad 231；
The poles B of first LED luminescence chips are fixed on by conductive material on the first poles B pad, and the poles B of the 2nd LED luminescence chips pass through
Conductive material is fixed on the 2nd poles B pad, and the poles B of the 3rd LED luminescence chips are connected to by lead on the 3rd poles B pad.
It should be noted that the LED that the wire laying mode of LED display unit group provided in this embodiment is provided with embodiment one
The wire laying mode of display unit group is identical, then this is repeated no more.
Continuing with referring to Fig. 7, on the basis of said program, optionally, the back side of insulating substrate 200 is equipped with insulating materials
240, insulating materials 240 covers the metallic vias being electrically connected with the pin and is by metal routing.
In the present embodiment, insulating substrate 200 is extended to by metallic vias positioned at the first poles B pad 231 of the second row
The back side, then by the first back metal cabling 010 positioned at 200 back side of insulating substrate, to arrange the first poles B pad 231 right with this
The first poles the B pin P11 connections answered, when being welded with pcb board, which is not have effective, that is, is not needed and pcb board
There is the risk of short circuit, cause fault in connection if there are cablings for position opposite with the metallic vias on pcb board.Cause
This, the embodiment of the present invention covers the metallic vias that is electrically connected with the pin and is by metal routing by the way that insulating materials 240 is arranged, can be with
Play the role of insulation and protection.
Optionally, insulating materials 240 is white oil, resin or green oil etc..
It should be noted that the LED display unit group in the present embodiment, illustratively, in each pixel unit, at least
One LED luminescence chip is single electrode LED luminescence chips, this is only the specific example of the present invention, in other embodiment
In, can also be in each pixel unit, at least one LED luminescence chips are bipolar electrode LED luminescence chips.
Embodiment three
Fig. 8 is the front wiring figure for the LED display unit group that the embodiment of the present invention three provides, and Fig. 9 is that LED is shown in Fig. 8
The back wiring figure of unit group, referring to Fig. 8 and Fig. 9, on the basis of embodiment one, optionally, in each pixel unit 100
In, at least one LED luminescence chips are bipolar electrode LED luminescence chips, and there are one the poles A and a B for bipolar electrode LED luminescence chips tool
Pole is respectively positioned on the light-emitting surface of LED luminescence chips, and the poles A of bipolar electrode LED luminescence chips are connected on the total poles A pad 220, double electricity
The poles B of pole LED luminescence chips are connected on the poles B pad corresponding with the LED luminescence chips.
In fig. 8, illustratively, the first LED luminescence chips 101 and the 2nd LED luminescence chips 102 are flip LED hair
Optical chip, the 3rd LED luminescence chips 103 are bipolar electrode LED luminescence chips.The poles A and second of first LED luminescence chips 101
The poles A of LED luminescence chips 102 are fixed on by conductive material on the total poles A pad 220；The poles B of first LED luminescence chips pass through
Conductive material is fixed on the first poles B pad, and the poles B of the 2nd LED luminescence chips are fixed on the 2nd poles B pad by conductive material
On, the poles A of the 3rd LED luminescence chips 103 are connected to by lead on the total poles A pad 231, the B of the 3rd LED luminescence chips 103
Pole is connected to by lead on the 3rd poles B pad 233.
It should be noted that the 3rd LED luminescence chips 103 are bipolar electrode LED luminescence chips, therefore the luminous cores of the 3rd LED
Piece 103 is fixed on by insulating cement on pad, wherein the pad for fixing the 3rd LED luminescence chips 103 can be the total poles A pad
220, any one in the first poles B pad 231, the 2nd poles B pad 232 or the 3rd poles B pad 233, it is in fig. 8, optional
, the 3rd LED luminescence chips 103 are fixed on by insulating cement on the total poles A pad 220.
In the present embodiment, the cloth for the LED display unit group that the wire laying mode of LED display unit group is provided with embodiment one
Line mode is identical, then this is repeated no more.
Continuing with referring to Fig. 9, optionally, pin include the two total poles A pins (N1 and N2) and six poles B pins (P11,
P21, P31, P12, P22 and P32), the two total poles A pins are located at both sides opposite on 200 back side column direction of insulating substrate,
Two poles B pins are located at the inside at 200 back side of insulating substrate, and four poles B pins are located at the edge at 200 back side of insulating substrate, two
A total poles A pin (N1 and N2) is respectively arranged at the both sides up and down at 200 back side of insulating substrate, two the first poles B pins (P11 and
P21) and two the 2nd poles B pin (P12, P22) are set to the edge at 200 back side of insulating substrate, two the 3rd poles B pins
(P13 and P24) is set to the inside at 200 back side of insulating substrate, and setting in this way can make pin be located at and be connected thereto
The close position of luminescence chip, facilitate wiring, save wiring space, save preparation process.
Optionally, the back side of insulating substrate 200 is equipped with insulating materials 240, and insulating materials 240 not only covers to walk by metal
The metallic vias that line is electrically connected with the pin and is, also covering pass through positioned at the first back metal cabling 010 at 200 back side of insulating substrate
Such setting can insulate and protect the metallic vias and back metal cabling on insulating substrate 200.
Example IV
This illustrates that example IV provides a kind of display panel, including the LED display lists that above example one to three provides
Tuple.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out to the present invention by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
May include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (14)
1. a kind of LED display unit group, which is characterized in that including the pixel unit array that n rows, m row pixel units form, n and m
It is the positive integer more than or equal to 2；
Wherein, each pixel unit includes a first LED luminescence chip, the 2nd LED luminescence chips, a third
LED luminescence chips, the total poles an A pad, the first poles a B pad, the 2nd poles a B pad and the 3rd poles a B pad；Institute
The total poles A pad, the first poles B pad, the 2nd poles B pad and the 3rd poles B pad is stated to be formed on the front of an insulating substrate；
The LED luminescence chips include the poles A and the poles B, and the polarity of the poles A and the poles B is opposite；
The A of the poles A of the first LED luminescence chips, the poles A of the 2nd LED luminescence chips and the 3rd LED luminescence chips is extremely and institute
State the pad electrical connection of the total poles A；The poles B of the first LED luminescence chips, the poles B of the 2nd LED luminescence chips and the 3rd LED shine
The poles B of chip are electrically connected with the first poles B pad, the 2nd poles B pad and the 3rd poles B pad respectively；
In each pixel unit, at least one LED luminescence chips are flip LED luminescence chip, the flip LED luminescence chip
The poles A and the poles B be respectively positioned on the shady faces of the LED luminescence chips；The poles A of the flip LED luminescence chip pass through conductive material
It is fixed on the total poles the A pad, the poles B of the flip LED luminescence chip are fixed on and the luminous cores of the LED by conductive material
On the corresponding poles the B pad of piece.
2. LED display unit group according to claim 1, which is characterized in that in the i-th row, the total poles A of m pixel unit
Pad is electrically connected, and is electrically connected with the i-th total poles A pin of the LED display unit group；
In jth row, the first poles B pad of n pixel unit is electrically connected, and with j-th of the oneth B of the LED display unit group
Pole pin electrical connection；2nd poles B pad electrical connection of n pixel unit, and with j-th of the 2nd B of the LED display unit group
Pole pin electrical connection；3rd poles B pad electrical connection of n pixel unit, and with j-th of the 3rd B of the LED display unit group
Pole pin electrical connection；
The n total poles A pins and the 3m poles B pin are located on the back side of the insulating substrate；
Wherein, 1≤i≤n, 1≤j≤m, i, j are integer.
3. LED display unit group according to claim 2, which is characterized in that the n=2, m=2.
4. LED display unit group according to claim 1, which is characterized in that the total poles the A pad, the first poles B pad,
2nd poles B pad and the 3rd poles B pad are electrically connected by metallic vias pin corresponding with the insulating substrate back side is located at, or
By metallic vias and positioned at the insulating substrate front and/or the back side metal routing with positioned at the insulating substrate total A
Pole pin or the electrical connection of the poles B pin.
5. LED display unit group according to claim 1, which is characterized in that in each pixel unit, the total poles A
Pad, the first poles B pad, the 2nd poles B pad and the 3rd poles B pad are set on four apex angles of the pixel unit；
In adjacent two row pixel unit, corresponding pad is symmetrical arranged about the row bisector of the adjacent two row pixel unit；
In adjacent rows pixel unit, corresponding pad is symmetrical arranged about the row bisector of the adjacent rows pixel unit.
6. LED display unit group according to claim 5, which is characterized in that
Often in row pixel unit：
The total poles the A pad of two pixel units is the different piece of same metal pad, and the metal pad is straight by metallic vias
Connect the total poles A pin connection corresponding with the row pixel unit；
In same row pixel unit：
The first poles the B pad positioned at the first row pixel unit directly arranges the first poles B pad corresponding by metallic vias with this
One poles B pin connection, the first poles the B pad positioned at the second row pixel unit extend to the insulating substrate by metallic vias
The back side, and corresponding first B of the first poles B pad is arranged with this by the first back metal cabling positioned at the insulating substrate back side
Pole pin connection；
Two the 2nd poles B pads are the different piece of same metal pad, the metal pad by metallic vias directly with this
Corresponding 2nd poles the B pin connection of two poles B pads；
Two the 3rd poles B pads are the different piece of same metal pad, the metal pad by metallic vias directly with this
Corresponding 3rd poles the B pin connection of three poles B pads.
7. LED display unit group according to claim 1, which is characterized in that in each pixel unit：
At least one LED luminescence chips are single electrode LED luminescence chips or are bipolar electrode LED luminescence chips；
There are one the poles A and the poles B for the single electrode LED luminescence chips tool, are located at the light-emitting surface of the LED luminescence chips
And shady face, the poles A of the single electrode LED luminescence chips are connected on the total poles the A pad, the single electrode LED shines core
The poles B of piece are fixed on by conductive material on the poles B pad corresponding with the LED luminescence chips；
There are one the poles A and the poles B for the bipolar electrode LED luminescence chips tool, are respectively positioned on the light-emitting surface of the LED luminescence chips,
The poles A of the bipolar electrode LED luminescence chips are connected on the total poles the A pad, and the poles B of the bipolar electrode LED luminescence chips connect
It is connected on the poles B pad corresponding with the LED luminescence chips.
8. LED display unit group according to claim 1, which is characterized in that the first LED luminescence chips, described
Two LED luminescence chips and the 3rd LED luminescence chips are flip LED luminescence chip；
The A of the poles A of the first LED luminescence chips, the poles A and the 3rd LED luminescence chips of the 2nd LED luminescence chips
Extremely it is fixed on the total poles the A pad by conductive material；
The poles B of the first LED luminescence chips are fixed on by conductive material on the pad of the first poles B, the 2nd LED hairs
The poles B of optical chip are fixed on by conductive material on the pad of the 2nd poles B, and the poles B of the 3rd LED luminescence chips are by leading
Electric material is fixed on the pad of the 3rd poles B.
9. LED display unit group according to claim 7, which is characterized in that the first LED luminescence chips and described
Two LED luminescence chips are flip LED luminescence chip, and the 3rd LED luminescence chips are single electrode LED luminescence chips；
The A of the poles A of the first LED luminescence chips, the poles A and the 3rd LED luminescence chips of the 2nd LED luminescence chips
Extremely it is fixed on the total poles the A pad by conductive material；
The poles B of the first LED luminescence chips are fixed on by conductive material on the pad of the first poles B, the 2nd LED hairs
The poles B of optical chip are fixed on by conductive material on the pad of the 2nd poles B, and the poles B of the 3rd LED luminescence chips are connected to
On the pad of 3rd poles B.
10. LED display unit group according to claim 1, which is characterized in that the first LED luminescence chips, second
LED luminescence chips and the 3rd LED luminescence chips are the LED luminescence chips of three different luminescent colors, and three differences shine
The LED luminescence chips of color are red LED chip, green LEDs chip and BLUE LED emissions chip.
11. LED display unit group according to claim 3, which is characterized in that the pin includes the two total poles A pins
With six poles B pins, the two total poles A pins are located at both sides opposite on the column direction of the insulating substrate back side, two poles B
Pin is located at the inside at the insulating substrate back side, and four poles B pins are located at the edge at the insulating substrate back side.
12. LED display unit group according to claim 4, which is characterized in that the back side of the insulating substrate is equipped with insulation
Material, the insulating materials cover the metallic vias being electrically connected with the pin and is by metal routing.
13. LED display unit group according to claim 12, which is characterized in that the insulating materials, which also covers, is located at institute
State the first back metal cabling at the insulating substrate back side.
14. a kind of display panel, which is characterized in that include by any LED display unit groups of claim 1-13.
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| CN201810667929.8A CN108630114A (en) | 2018-06-26 | 2018-06-26 | A kind of LED display unit group and display panel |
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| CN201810667929.8A CN108630114A (en) | 2018-06-26 | 2018-06-26 | A kind of LED display unit group and display panel |
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| CN113593428A (en) * | 2021-07-20 | 2021-11-02 | Tcl华星光电技术有限公司 | Display panel and electronic device |
| CN114582252A (en) * | 2022-02-28 | 2022-06-03 | 深圳市思坦科技有限公司 | Display module, display panel and display |
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