CN207852672U - A kind of tetrad RGB-LED encapsulation modules and its display screen - Google Patents
A kind of tetrad RGB-LED encapsulation modules and its display screen Download PDFInfo
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- CN207852672U CN207852672U CN201820271614.7U CN201820271614U CN207852672U CN 207852672 U CN207852672 U CN 207852672U CN 201820271614 U CN201820271614 U CN 201820271614U CN 207852672 U CN207852672 U CN 207852672U
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Abstract
The utility model provides a kind of tetrad RGB LED encapsulation modules and its display screen, including substrate and four luminescence units being disposed on the substrate, each luminescence unit includes one group of red light chips, green light chip and blue chip, and each chip is equipped with first electrode and second electrode for power supply；Four luminescence units, form two pairs of luminescence units pair, all red light chips of each pair of luminescence unit pair, green light chip and blue chip one end share a first electrode, the red light chips of the other end and another pair luminescence unit pair, green light chip and blue chip correspond, a second electrode is shared respectively, the substrate back is provided with lower pad, the first electrode and second electrode are drawn by lower pad, it is connect with external circuit, by changing the electrical connection between luminescence unit, so that the number of electrodes and lower number of pads of encapsulation module entirety are reduced at double, subsequent conditioning circuit is set to design simpler convenience.
Description
Technical field
The utility model is related to arrive SMD LED（Surface Mounted Devices, surface mount device）Encapsulate skill
Art, more particularly to a kind of tetrad RGB-LED encapsulation modules and its display screen.
Background technology
The encapsulation of LED component has 40 years history, in recent years with the rapid development of LED industry, the application neck of LED
Domain constantly expands, and then proposes higher to the packing forms of LED component and performance, more particularly requires.
For LED display, LED display is with its high brightness, weatherability in advertisement, stage, public information display, body
Means of transportation etc. are educated to be widely applied using field.LED display is divided into monochromatic screen, double-colored screen and full-color by display color
Screen.The most critical component of full-color LED display screen is LED component.Reason has three：First, LED are that number is used in full-color panel type display
Most Primary Components is measured, every square metre can all use thousands of to tens of thousands of LED；Second, LED are to determine whole screen optics display performance
Main body, directly affect evaluation of the spectators to display screen；Third, LED proportions in display screen overall cost are maximum, from
30% to 70% etc..In the past, since the brightness of patch SMD is relatively low, and outdoor evil is not achieved in waterproof, moisture-proof, anti-ultraviolet function
The requirement of bad environment, therefore outdoor full color display screen is the world of direct insertion LED component.As LED core chip technology and LED encapsulate skill
The progress of art, the brightness of SMD and degree of protection have been able to meet the needs of outdoor application, and SMD is used for outdoor full color SMD
Display screen, it is excellent to have that extra small pixel spacing, production efficiency are high, horizontal vertical angle is big, color blending effect is good, contrast is high etc.
Point, therefore obtain quick application.
Existing small interval S MD RGB LED displays mainly use the models wrapper such as 2121,1515,1010,0808
Part is 4 pin devices, the main form for using three chip portfolio of red, green, blue.Wherein, a sun of red, green, blue optical chip
Pole or cathode, together by common-anode or the parallel connection of common cathode mode, another pin is individually drawn.Due to red, green, blue core
The characteristic requirements of piece, red light chips driving voltage are 2V or so, and the driving voltage of bluish-green optical chip is 3V or so, and for current
Small spacing product in the market, application end generally use 5V voltages drive, RGB optical chip connect respectively different resistance values point
Piezoresistance.The program is although simple and practicable, but has two big defects：First, divider resistance produces a large amount of useless power consumption, significantly
Increase the overall power of application end product；Second is that the heat that divider resistance generates, increases the heat dissipation burden of application end product, shadow
The reliability and service life of product are rung.
Secondly, in existing SMD LED manufactures, product generally uses PLCC4 structures（Such as 3528,2121,1010 isotactics
Lattice）, but above structure is all individually to exist, and in actual production, can only be pasted one by one, low production efficiency, and repair hardly possible
Degree is big, and especially when LED display produces, the quantity of the LED used is typically the order of magnitude up to ten thousand or even up to a million, works as life
When producing small sized product, as 1.0mm*1.0mm specification and following specification when, the production difficulty of product is multiplied,
The mechanical strength of product also can be very low, is easy to damage under external force, and production efficiency also can be very low, and to mounting device
Requirement also can be very high.The problem of being mounted for single, applicant once used the form of encapsulation module, i.e., were encapsulated on same module
Multigroup RGB-LED chips, such as the Chinese patent that notification number is CN106847801A, CN106847800A.But this kind is used to seal
At die-filling group, the number of pads at the module back side will be very more, such as tetrad RGB-LED encapsulation modules, when being put in encapsulation module
When setting 4 groups of RGB-LED chips, the quantity of backside pads just up to 16, under small spacer conditions, this considerably increases pcb boards
The difficulty and welding difficulty of design.
Therefore, the existing technology needs to be improved and developed.
Utility model content
The purpose of this utility model is to provide a kind of tetrad RGB-LED encapsulation modules and its display screens, it is intended to solve
Existing RGB-LED encapsulation modules and LED display, which generate a large amount of useless power consumptions, influence product reliability and pin is numerous leads
The problems such as cause welding trouble, complex circuit designs.
To solve the above problems, the technical solution of the utility model is as follows：
A kind of tetrad RGB-LED encapsulation modules, including substrate and four luminescence units being disposed on the substrate, each
The luminescence unit includes one group of red light chips, green light chip and blue chip, and each chip is equipped with for power supply
First electrode and second electrode, the first electrode are positive or negative pole, and the second electrode is opposite with first electrode polarity；Institute
Four luminescence units are stated, in pairs, form two pairs of luminescence units pair, all red light chips, the green light of each pair of luminescence unit pair
Chip and blue chip one end share a first electrode, red light chips, the green light of the other end and another pair luminescence unit pair
Chip and blue chip correspond, and share a second electrode respectively, and the substrate back is provided with lower pad, and described the
One electrode and second electrode are drawn by lower pad, are connect with external circuit.
The tetrad RGB-LED encapsulation modules, wherein the quantity of the lower pad is 8.
The tetrad RGB-LED encapsulation modules, wherein the first electrode of the red light chips is individually drawn.
The tetrad RGB-LED encapsulation modules, wherein the red light chips of each pair of luminescence unit pair share one
First electrode, the green light chip and blue chip of each pair of luminescence unit pair share a first electrode.
The tetrad RGB-LED encapsulation modules, wherein the driving voltage of the red light chips is 2-3V；It is described green
The driving voltage of optical chip and blue chip is 3-4V.
The tetrad RGB-LED encapsulation modules, wherein the quantity of the lower pad is 10.
The tetrad RGB-LED encapsulation modules, wherein the lower pad is located on the side of substrate back or substrate
The position that the back side is not kept to the side.
The tetrad RGB-LED encapsulation modules, wherein the luminescence unit is arranged in linear type or the row of being square
Row.
The tetrad RGB-LED encapsulation modules, wherein be provided through the through-hole of substrate on the substrate, make base
The front of plate is realized with the back side to be electrically connected.
A kind of tetrad RGB-LED display screens, wherein with the tetrad RGB-LED encapsulation described in any one as above
Module.
The beneficial effects of the utility model include：Tetrad RGB-LED encapsulation modules provided by the utility model and its aobvious
Display screen, on the one hand, integrate 4 luminescence units in encapsulation module, the production efficiency that LED is produced in subsequent applications is made to obtain greatly
It improves, significantly reduces production cost, on the other hand, including luminescence unit is less, can effectively avoid because of different batches chip
Central value difference or substrate ink difference lead to colour development difference, the problem of whole screen consistency difference；Meanwhile the utility model is by changing
Become the electrical connection between luminescence unit so that the number of electrodes and lower number of pads of encapsulation module entirety are reduced at double, side
Continue the test to encapsulation module after an action of the bowels, further reduce the PCB circuit numbers of plies, subsequent conditioning circuit is made to design simpler convenience, side
Continue after an action of the bowels and mounts encapsulation module onto LED display, the product particularly suitable for micro- spacing；In addition, the utility model changes
Red light chips and blue, green light chip driving circuit are separated, are provided individually for red light chips by traditional chip drives mode
Power drives reduce driving voltage, to significantly reduce power consumption.
Description of the drawings
Fig. 1 is the electric connection figure of existing RGB-LED.
Fig. 2 is a kind of electric connection figure of tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 3 is a kind of Facad structure schematic diagram of tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 4 is a kind of backside structure schematic diagram of tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 5 is the Facad structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 6 is the backside structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 7 is the Facad structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 8 is the backside structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Fig. 9 is the Facad structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Figure 10 is the backside structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Figure 11 is the electric connection figure of another tetrad RGB-LED encapsulation modules provided by the utility model.
Figure 12 is the backside structure schematic diagram of another tetrad RGB-LED encapsulation modules provided by the utility model.
Figure 13 is a kind of Facad structure schematic diagram of tetrad RGB-LED display screens provided by the utility model.
Reference sign：1, the first luminescence unit pair；11, the first luminescence unit；1101, the first red light chips；1102、
First green light chip；1103, the first blue chip；12, the second luminescence unit；1201, the second red light chips；1202, second is green
Optical chip；1203, the second blue chip；2, the second luminescence unit pair；21, third luminescence unit；2101, third red light chips；
2102, third green light chip；2103, third blue chip；22, the 4th luminescence unit；2201, the 4th red light chips；2202,
Four green light chips；2203, the 4th blue chip；3, substrate；301, functional areas；4, lower pad；5, through-hole；6, tetrad RGB-
LED encapsulation modules；7, tetrad RGB-LED display screens；8, first electrode；9, second electrode.
Specific implementation mode
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as to this practicality
Novel limitation.
In the description of the present invention, it should be understood that term "center", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, does not indicate or imply the indicated device or element must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.In the description of the present invention, it should be noted that
Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixed
Connection, may be a detachable connection, or be integrally connected；Can be mechanical connection, can also be electrical connection or can be mutual
Communication；It can be directly connected, can also can be indirectly connected through an intermediary the connection inside two elements or two
The interaction relationship of element.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features are in direct contact, and can also not be to be in direct contact but lead to including the first and second features
Cross the other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only
Indicate that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example for the various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
It is a kind of existing electric connection figure of RGB-LED referring to Fig. 1, wherein tri- chips of RGB-LED are in parallel, common anode
The other end of pole, three chips is individually drawn, and four pins are consequently formed, with the increase of RGB-LED quantity, pin
Quantity will sharply increase.
To solve the problems, such as this, referring to Fig. 2 to Fig. 4, the utility model provides a kind of tetrad RGB-LED encapsulation modules,
Include substrate 3 and setting four luminescence units on the substrate 3, in this embodiment, four luminescence units respectively marked as
First luminescence unit 11, the second luminescence unit 12, third luminescence unit 21, the 4th luminescence unit 22；Each luminescence unit wraps
One group of red light chips, green light chip and blue chip are included, as shown, the first luminescence unit 11 includes the first red light chips
1101, the first green light chip 1102 and the first blue chip 1103；Second luminescence unit 12 include the second red light chips 1201,
Second green light chip 1202 and the second blue chip 1303；Third luminescence unit 21 includes third red light chips 2101, third
Green light chip 2102 and third blue chip 2103；4th luminescence unit 22 includes the 4th red light chips 2201, the 4th green light
Chip 2202 and the 4th blue chip 2203.Each chip is equipped with first electrode 8 and second electrode 9 for power supply, the
One electrode 8 can be positive or negative pole, i.e. first electrode is common-anode or common cathode.Second electrode 9 and 8 polarity phase of first electrode
Instead, as shown in Fig. 2, in the present embodiment, first electrode 8 is anode, second electrode 9 is cathode.Four luminescence units, two
Two in pairs, two pairs of luminescence units pair is formed, as shown in Fig. 2, being divided into the first luminescence unit pair 1 and the second luminescence unit pair 2.Such as figure
Shown in 2, all red light chips, green light chip and blue chip one end of each pair of luminescence unit pair share a first electrode 8,
The red light chips, green light chip and blue chip of the other end and another pair luminescence unit pair correspond, and share one respectively
Second electrode 9, at this point, as shown in Fig. 2, after using this kind of electric connection mode, the quantity of first electrode 8 is 2, second electrode
9 quantity is 6, i.e. the quantity of aggregated electrode only has 8, and the number of electrodes compared to existing connection type shown in FIG. 1 subtracts
Whole one times is lacked.As shown in figure 4,3 back side of substrate is provided with lower pad 4, first electrode 8 and second electrode 9 pass through lower pad 4
It draws, is connect with external circuit.By using this kind of electric connection mode provided by the utility model, the quantity of lower pad 4 is than existing
The number of pads of some tetrad modules reduces one times, greatly facilitates welding procedure and subsequent circuit design.
A kind of production procedure of tetrad RGB-LEFD encapsulation modules provided by the utility model is as follows：
In 3 front and back of substrate according to designed layout, etching is used on chip placement and realizes electric connection
Functional areas 301 and lower pad 4；It drills on 3 designated position of substrate, runs through 3 positive and negative of substrate, realize and be electrically connected, in substrate 3
Front chip placement, die bond bonding wire can also cover layer protective layer on chip, and substrate 3 is cut, this practicality is obtained
The novel tetrad RGB-LED encapsulation modules.
In practical applications, it is very a variety of to realize that the form of expression of above-mentioned connection scheme has, below the utility model will
Several specific embodiments are lifted to be described in detail.To avoid causing ambiguity, the device appeared below such as with the device that occurs above
The reference numeral of part is identical, is considered as the device with same or like function, will not be specifically noted below.
Embodiment 1：
It is the structure diagram of the front and back of embodiment 1 provided by the utility model referring to Fig. 5 to Fig. 6.In substrate 3
Front is provided with 4 luminescence units, and each luminescence unit includes one group of red, green, blue chip.In the present embodiment, substrate 3
For copper-clad plate, tow sides cover copper.Go out different functional areas 301 in front-side etch, for placing RGB-LED chips or forming electricity
Property connection.By taking the first luminescence unit 11 as an example, as shown in figure 5, luminescence unit 11 possesses 4 functional areas 301, one of function
The first red light chips 1101, the first green light chip 1102 and the first blue chip 1103, the first red light chips are placed in area 301
1101, the first green light chip 1102 and the first blue chip 1103 are distinguished by bonding line and other 3 functional areas 301 respectively
It is electrically connected, one of functional areas 301 are electrically connected as copolar area with three chips.In embodiment 1, such as
Shown in Fig. 5 and Fig. 6, the through-hole 5 of substrate 3 is provided through on substrate 3, through-hole 5 is metal aperture, keeps 3 obverse and reverse of substrate real
Now it is electrically connected.In embodiment 1, functional areas 301 are realized by through-hole 5 and the lower pad 4 at 3 back side of substrate and are electrically connected, together
When electric connection also by through-hole 5 between 3 front and back place function area 301 of substrate, as in the first luminescence unit 11
Functional areas 301 as copolar area will pass through through-hole 5 in substrate 3 with third luminescence unit 21 as the functional areas 301 in copolar area
The back side, which is realized, to be electrically connected.Scheme in conjunction with electric connection shown in Fig. 2, in embodiment 1, the first luminescence unit 11 and third shine
Chip one end of unit 21 shares the same lower pad 4 by the functional areas 301 for being used as copolar area of interconnection, as one end
Electrode draw, the other end of the chip of the first luminescence unit 11 passes through remaining three functional areas 301 and second and shines singly respectively
The other end of the corresponding chip of member 12, which is realized, to be electrically connected, the functional areas that such as the first red light chips 1101 pass through chip placement
301 and second red light chips 1201 realize be electrically connected, and share a lower pad 4.
As described above, in embodiment 1, by the layout of functional areas 301, electrical connection as described in Figure 2 is realized,
The quantity of lower pad 4 is set to be reduced to 8.As shown in fig. 6, in the present embodiment, lower pad 4 is distributed in the both sides at 3 back side of substrate,
Facilitate arrangement and cutting.
Embodiment 2：
It is the structure diagram of the front and back of embodiment 2 provided by the utility model referring to Fig. 7 to Fig. 8.In substrate 3
Front is provided with 4 luminescence units, and each luminescence unit includes one group of red, green, blue chip.Setting in embodiment 2 with
Embodiment 1 is similar, different functional areas 301 equally is arranged in 3 front of substrate, as shown in fig. 7, the first luminescence unit 11 is as altogether
Functional areas 301 of the functional areas 301 of polar region with the second luminescence unit 12 as copolar area are connect in 3 front of substrate, and third shines
Unit 21 connects as the functional areas 301 in copolar area in 3 front of substrate as the functional areas 301 in copolar area and the 4th luminescence unit 22
It connects, functional areas 301 are connect by the through-hole 5 positioned at 3 side of substrate with the lower pad 4 at 3 back side of substrate.
As shown in Figure 7 and Figure 8, embodiment 2 difference from example 1 is that, the through-hole 5 in embodiment 2 is located at base
The edge of plate 3, and size is more much greater than in embodiment 1, lower pad 4 is also respectively positioned on the position of corresponding through-hole 5, in substrate
3 edges.Embodiment 2 with adjacent encapsulation module by 3 edge of substrate, sharing, reducing through-hole 5 and the setting of lower pad 4
The quantity of punching, simplifies production technology, further saves production cost.Through-hole 5 in embodiment 1 is located at substrate 3 and does not lean on
The position on side, diameter can only be less than normal, and drilling is difficult, and 5 diameter of through-hole of embodiment 2 can be done greatly, greatly simplifie drilling
Technique.
Embodiment 3：
It is the structure diagram of the front and back of embodiment 3 provided by the utility model referring to Fig. 9 and Figure 10.In substrate 3
Front is provided with 4 luminescence units, and each luminescence unit includes one group of red, green, blue chip.Setting in embodiment 3 with
Embodiment 1 is similar with embodiment 2, different functional areas 301 equally is arranged in 3 front of substrate, as shown in figure 9, first is luminous single
Member 11 connects as the functional areas 301 in copolar area in 3 front of substrate as the functional areas 301 in copolar area and the second luminescence unit 12
It connects, third luminescence unit 21 exists as the functional areas 301 in copolar area and the 4th luminescence unit 22 as the functional areas 301 in copolar area
3 front connection of substrate, functional areas 301 are connect by the through-hole 5 positioned at substrate 3 with the lower pad 4 at 3 back side of substrate.
In embodiment 3, the position of lower pad 4 is inside 3 back side of substrate, not close to 3 edge of substrate, by embodiment 3
It is found that the utility model is not restricted the concrete shape of connection line, connect shape and mode can by it is a variety of not
Same improvement or transformation, on the other hand, the position of lower pad 4 are not also restricted, both can be among substrate 3, can also
It is arranged in the edge of substrate 3, above-mentioned transformation should all also fall into the utility model range claimed.
In practical applications, existing RGB-LED is 4 pin devices, mainly using three chip portfolio of red, green, blue
Form.As shown in Figure 1, wherein an anode or cathode of red, green, blue optical chip, it is in parallel by common-anode or common cathode mode
Together, another pin is individually drawn.Due to the characteristic requirements of red, green, blue optical chip, red light chips driving voltage is 2V left
The driving voltage on the right side, bluish-green optical chip is 3V or so, and for small spacing product currently on the market, application end generally uses 5V
Voltage drives, and RGB optical chip is connected the divider resistances of different resistance values respectively.Divider resistance produces a large amount of useless power consumption,
Considerably increase the overall power of application end product；Second is that the heat that divider resistance generates, the heat dissipation for increasing application end product is negative
Load, affects the reliability and service life of product.
It is a kind of tetrad RGB- of 10 pin-type provided by the utility model referring to Figure 11-Figure 12 to solve the problems, such as this
The electric connection figure and backside structure schematic diagram of LED encapsulation modules.In this embodiment, equally including substrate 3 and setting in base
Four luminescence units on plate 3, each same above-described embodiment of luminescence unit label.As shown in figure 11, in the present embodiment, the first electricity
Pole 8 is anode, and second electrode 9 is cathode.Four luminescence units form two pairs of luminescence units pair, such as Figure 11 in pairs
It is shown, it is divided into the first luminescence unit pair 1 and the second luminescence unit pair 2.All green light chips and blue light of each pair of luminescence unit pair
Chip one end shares a first electrode 8, and the green light chip and blue chip one of the other end and another pair luminescence unit pair are a pair of
Answer, respectively share a second electrode 9, and the red light chips of each pair of luminescence unit pair share a first electrode, the other end with
The red light chips of another pair correspond, and share a second electrode 9 respectively.At this point, as shown in figure 11, electrically being connected using this kind
After connecing mode, the quantity of first electrode 8 is 4, and the quantity of second electrode 9 is 6, i.e., the quantity of aggregated electrode is 10.Such as
Shown in Figure 12,3 back side of substrate is provided with lower pad 4, first electrode 8 and second electrode 9 and is drawn by lower pad 4, with external electrical
Road connects.The utility model changes traditional chip drives mode, by red light chips and blue, green light chip driving circuit point
It opens, provides individual power drives for red light chips, reduce driving voltage, to significantly reduce power consumption.
Referring to Figure 13, the utility model additionally provides a kind of energy-saving RGB-LED display screens, has as described above four to connect
Body RGB-LED encapsulation modules.With the development of small space distance LED display screen, pel spacing is smaller and smaller, the encapsulation on unit area
Number of devices is more and more, and the power consumption saved on single packaging body is embodied on LED display, and the power consumption reduced will be quantity
The growth of grade.Energy-saving RGB-LED display screens provided by the utility model are encapsulated using tetrad RGB-LED as described above
Module will greatly reduce the power consumption of display screen, and reduce the complexity of circuit design.
It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
It says, it can be modified or changed according to the above description, and all these modifications and variations should all belong to the appended power of the utility model
The protection domain that profit requires.
Claims (10)
1. a kind of tetrad RGB-LED encapsulation modules, which is characterized in that shine including substrate and be disposed on the substrate four
Unit, each luminescence unit include one group of red light chips, green light chip and blue chip, and each chip is all provided with useful
In the first electrode and second electrode of power supply, the first electrode is common-anode or common cathode, and the second electrode is electric with first
Pole polarity is opposite；Four luminescence units form two pairs of luminescence units pair, each pair of luminescence unit is to owning in pairs
Red light chips, green light chip and blue chip one end share a first electrode, the other end and another pair luminescence unit pair
Red light chips, green light chip and blue chip correspond, and share a second electrode respectively, and the substrate back is provided with
Lower pad, the first electrode and second electrode are drawn by lower pad, are connect with external circuit.
2. tetrad RGB-LED encapsulation modules according to claim 1, which is characterized in that the quantity of the lower pad is 8
It is a.
3. tetrad RGB-LED encapsulation modules according to claim 1, which is characterized in that the first of the red light chips
Electrode is individually drawn.
4. tetrad RGB-LED encapsulation modules according to claim 1, which is characterized in that each pair of luminescence unit pair
Red light chips share a first electrode, the green light chip and blue chip of each pair of luminescence unit pair share one first
Electrode.
5. tetrad RGB-LED encapsulation modules according to claim 4, which is characterized in that the driving of the red light chips
Voltage is 2-3V；The driving voltage of the green light chip and blue chip is 3-4V.
6. tetrad RGB-LED encapsulation modules according to claim 4, which is characterized in that the quantity of the lower pad is
10.
7. tetrad RGB-LED encapsulation modules according to claim 1, which is characterized in that the lower pad is located at substrate
On the side at the back side or position that substrate back does not keep to the side.
8. tetrad RGB-LED encapsulation modules according to claim 1, which is characterized in that the luminescence unit is in " one "
Font arranges or the arrangement that is square.
9. tetrad RGB-LED encapsulation modules according to claim 1, which is characterized in that be provided with and pass through on the substrate
The through-hole for wearing substrate makes the front of substrate be realized with the back side and is electrically connected.
10. a kind of tetrad RGB-LED display screens, which is characterized in that have as described in any one of claims 1-9 four to connect
Body RGB-LED encapsulation modules.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820271614.7U CN207852672U (en) | 2018-02-26 | 2018-02-26 | A kind of tetrad RGB-LED encapsulation modules and its display screen |
| JP2019030219A JP6799627B2 (en) | 2018-02-26 | 2019-02-22 | RGB-LED package module and its display |
| EP19159052.0A EP3531451B1 (en) | 2018-02-26 | 2019-02-25 | Rgb-led packaging modules and display screen formed thereof |
| US16/285,159 US10756240B2 (en) | 2018-02-26 | 2019-02-25 | RGB-LED packaging modules and display screen formed thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820271614.7U CN207852672U (en) | 2018-02-26 | 2018-02-26 | A kind of tetrad RGB-LED encapsulation modules and its display screen |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411457A (en) * | 2018-10-26 | 2019-03-01 | 吉安市木林森光电有限公司 | RGB LED integrating packaging module |
| CN110350073A (en) * | 2019-07-18 | 2019-10-18 | 浙江英特来光电科技有限公司 | One kind 4 closes 1 full-color SMD LED |
| CN110556468A (en) * | 2019-08-20 | 2019-12-10 | 深圳市艾比森光电股份有限公司 | LED packaging module applying TOP packaging and display screen |
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