CN110350073A - One kind 4 closes 1 full-color SMD LED - Google Patents
One kind 4 closes 1 full-color SMD LED Download PDFInfo
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- CN110350073A CN110350073A CN201910650521.4A CN201910650521A CN110350073A CN 110350073 A CN110350073 A CN 110350073A CN 201910650521 A CN201910650521 A CN 201910650521A CN 110350073 A CN110350073 A CN 110350073A
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- 239000000758 substrate Substances 0.000 claims abstract description 104
- 238000004020 luminiscence type Methods 0.000 claims abstract description 79
- 239000011324 bead Substances 0.000 abstract description 16
- 238000012423 maintenance Methods 0.000 abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses one kind 4 to close 1 full-color SMD LED.It includes bracket, the bracket includes substrate, the substrate front side upper left corner is equipped with the first pixel unit, the substrate front side lower left corner is equipped with the second pixel unit, the substrate front side upper right corner is equipped with third pixel unit, the substrate front side lower right corner is equipped with the 4th pixel unit, and each pixel unit includes emitting red light chip, blue luminescence chip and green emitting chip.The present invention is integrated with four pixels, and primary attachment movement is equivalent to traditional devices 4 times, and improved efficiency is obvious, lamp bead is bigger after device is integrated, easily identifies, it is low to hit lamp risk, and big device can be with manual maintenance, yield is promoted, in addition its pin is more, and the gross area being bonded with PCB pad is big, in attachment after tin, thrust improves, and secured performance is greatly improved, Improving The Quality of Products.
Description
Technical field
The present invention relates to LED technology fields, more particularly to one kind 4 to close 1 full-color SMD LED.
Background technique
LED display corresponds to certain point spacing splicing by the LED lamp bead of many single pixels and forms.Current display
Shield in manufacturing process, each lamp bead requires to be attached on display screen pcb board by SMT process, and a LED lamp bead will carry out one
Secondary attachment process, comparatively efficiency is not very high, mounts higher cost.When to develop to small spacing P1.875 below for display screen
In the epoch, SMT difficulty is very big, with chip0808 lamp bead, for P1.25 display screen, in attachment to PCB after, lamp bead and lamp bead
Gap there was only 0.45mm, during SMT, the risk for hitting lamp is high, and patch deviation once occurs, lamp bead failure, maintenance
Cost it is very high, and can not be repaired manually.Therefore the yield for producing the small following display screen of spacing P1.875 is not high.
Existing full-color SMD LED lamp bead is the packaged type of single independent pixel structure, and SMT is inefficient, does small
Not high away from P1.875 or less display screen yield, maintenance cost is high.In addition, existing SMD LED lamp bead only has 4 pins, pin
The gross area being bonded with PCB pad is small, and after attachment, the thrust on pcb board is not high, is easy to touch off in production, handling process
Material causes very big influence to the quality of screen body, and there are hidden danger for quality.
Summary of the invention
In order to solve the above technical problems, The present invention provides one kind 4 to close 1 full-color SMD LED, is integrated with four pixels
Point, primary attachment movement are equivalent to traditional devices 4 times, and improved efficiency is obvious, and lamp bead is bigger after device is integrated, are easily identified,
It is low to hit lamp risk, and big device can promote yield, in addition its pin is more, the gross area being bonded with PCB pad with manual maintenance
Greatly, in attachment after tin, thrust is improved, and secured performance is greatly improved, Improving The Quality of Products.
To solve the above-mentioned problems, the present invention is achieved by the following scheme:
One kind 4 of the invention closes 1 full-color SMD LED, including bracket, the bracket include substrate, the substrate front side upper left corner
Equipped with the first pixel unit, the substrate front side lower left corner is equipped with the second pixel unit, and the substrate front side upper right corner is equipped with the
Three pixel units, the substrate front side lower right corner be equipped with the 4th pixel unit, each pixel unit include emitting red light chip,
Blue luminescence chip and green emitting chip, the substrate front side be equipped with the first public positive terminal pad, the second public positive terminal pad,
First negative terminal pad, the second negative terminal pad, the first public positive terminal pad are located at the first pixel unit and third pixel unit
Between, the first public positive terminal pad and the anode of all chips in first pixel unit and third pixel unit are electrically connected
It connects, the second public positive terminal pad is between the second pixel unit and the 4th pixel unit, the second public anode weldering
Disk is electrically connected with the anode of all chips in second pixel unit and the 4th pixel unit, and first negative terminal pad is located at
Between first pixel unit and the second pixel unit, in first negative terminal pad and the first pixel unit and the second pixel unit
Green emitting chip cathode electrical connection, second negative terminal pad be located at third pixel unit and the 4th pixel unit it
Between, second negative terminal pad is electrically connected with the cathode of the green emitting chip in third pixel unit and the 4th pixel unit,
It is additionally provided on the substrate with the one-to-one four third negative terminal pads of four emitting red light chips and is sent out with four blues
One-to-one four the 4th negative terminal pads of optical chip, the cathode of each emitting red light chip are electric with corresponding third negative terminal pad
Connection, the cathode of each blue luminescence chip are electrically connected with corresponding 4th negative terminal pad.
This programme designs for common-anode, and emitting red light chip uses reversed polarity red chip.Bracket is tied for no bowl chip
The BT plate of structure.BT plate is black, grey or white.Emitting red light chip in pixel unit, blue luminescence chip, green
Luminescence chip constitutes RGB three primary colours chip.Packaged type is molding, and encapsulation glue material includes the ring of solid-state or liquid
The traditional materials such as oxygen resin, silicone resin, epoxy-modified material.
41 full-color SMD LED of conjunction are packaged with 4 pixel units, in 2 row * 2 column arrangement, shining in each pixel unit
Electric loop is connected with gold thread or alloy wire or copper wire welding between chip and pad.There are 2 public anodes on bracket
Pad, each pixel unit of each public positive terminal pad and left and right form conducting loop relationship.
Once attachment movement is equivalent to traditional devices 4 times 41 full-color SMD LED of conjunction, and improved efficiency is obvious.Another aspect energy
Promote the yield of display screen, 4 close 1 full-color SMD LED it is integrated after lamp bead it is bigger, easily identify, it is low to hit lamp risk, and big device
Part can promote yield with manual maintenance.
Preferably, the spacing between adjacent pixel unit is equal.
Preferably, third negative terminal pad corresponding with the emitting red light chip in the first pixel unit and with the second pixel
The corresponding third negative terminal pad of emitting red light chip in unit is connected by the conducting wire of substrate back, in third pixel unit
The corresponding third negative terminal pad of emitting red light chip and third corresponding with the emitting red light chip in the 4th pixel unit it is negative
Pole pad is connected by the conducting wire of substrate back；
The 4th negative terminal pad corresponding with the blue luminescence chip in the first pixel unit and with the blue in the second pixel unit
Corresponding 4th negative terminal pad of luminescence chip is connected by the conducting wire of substrate back, with the blue-light-emitting core in third pixel unit
Corresponding 4th negative terminal pad of piece and the 4th negative terminal pad corresponding with the blue luminescence chip in the 4th pixel unit pass through base
The conducting wire of back connects.
Preferably, blue luminescence chip, green emitting chip, emitting red light chip in the pixel unit successively from
Arrangement is in straight line along the vertical direction under.
Preferably, the bracket further includes eight pins that substrate back is arranged in, the blue in the first pixel unit
Corresponding 4th negative terminal pad of luminescence chip is located at the substrate front side upper left corner, and the blue luminescence chip in third pixel unit is corresponding
The 4th negative terminal pad be located at the substrate front side upper right corner, the corresponding third cathode weldering of the emitting red light chip in the second pixel unit
Disk is located at the substrate front side lower left corner, and the corresponding third negative terminal pad of emitting red light chip in the 4th pixel unit is being located at substrate just
The face lower right corner, eight pins of substrate back are welded with the first public positive terminal pad, the second public positive terminal pad, the first cathode respectively
Disk, the second negative terminal pad, corresponding 4th negative terminal pad of blue luminescence chip in the first pixel unit, in third pixel unit
Corresponding 4th negative terminal pad of blue luminescence chip, the corresponding third cathode weldering of the emitting red light chip in the second pixel unit
The corresponding third negative terminal pad of emitting red light chip in disk, the 4th pixel unit corresponds, each pin and corresponding weldering
Disk electrical connection.
41 full-color SMD LED of conjunction have 8 pins, and the gross area that pin is bonded with PCB pad is big, in attachment after tin, thrust
It improves, secured performance is greatly improved, Improving The Quality of Products.
One kind 4 of the invention closes 1 full-color SMD LED, including bracket, the bracket include substrate, and the substrate front side is left
Upper angle is equipped with the first pixel unit, and the substrate front side lower left corner is equipped with the second pixel unit, and the substrate front side upper right corner is set
There is third pixel unit, the substrate front side lower right corner is equipped with the 4th pixel unit, and each pixel unit includes emitting red light
Chip, blue luminescence chip and green emitting chip, the substrate front side are equipped with the first public negative terminal pad, the second public cathode
Pad, the first positive terminal pad, the second positive terminal pad, the first public negative terminal pad are located at the first pixel unit and third pixel
Between unit, the cathode of the first public negative terminal pad and first pixel unit and all chips in third pixel unit
Electrical connection, for the second public negative terminal pad between the second pixel unit and the 4th pixel unit, described second is public negative
Pole pad is electrically connected with the cathode of all chips in second pixel unit and the 4th pixel unit, first positive terminal pad
Between the first pixel unit and the second pixel unit, first positive terminal pad and the first pixel unit and the second pixel list
The anode electrical connection of green emitting chip in member, second positive terminal pad are located at third pixel unit and the 4th pixel unit
Between, second positive terminal pad and the anode of the green emitting chip in third pixel unit and the 4th pixel unit are electrically connected
Connect, be additionally provided on the substrate with the one-to-one four third positive terminal pads of four emitting red light chips and with four blues
One-to-one four the 4th positive terminal pads of luminescence chip, the positive and corresponding third positive terminal pad of each emitting red light chip
The anode of electrical connection, each blue luminescence chip is electrically connected with corresponding 4th positive terminal pad.
This programme designs for common cathode, and emitting red light chip uses positive polarity red chip.Bracket is tied for no bowl chip
The BT plate of structure.BT plate is black, grey or white.Emitting red light chip in pixel unit, blue luminescence chip, green
Luminescence chip constitutes RGB three primary colours chip.Packaged type is molding, and encapsulation glue material includes the ring of solid-state or liquid
The traditional materials such as oxygen resin, silicone resin, epoxy-modified material.
41 full-color SMD LED of conjunction are packaged with 4 pixel units, in 2 row * 2 column arrangement, shining in each pixel unit
Electric loop is connected with gold thread or alloy wire or copper wire welding between chip and pad.There are 2 public anodes on bracket
Pad, each pixel unit of each public positive terminal pad and left and right form conducting loop relationship.
Once attachment movement is equivalent to traditional devices 4 times 41 full-color SMD LED of conjunction, and improved efficiency is obvious.Another aspect energy
Promote the yield of display screen, 4 close 1 full-color SMD LED it is integrated after lamp bead it is bigger, easily identify, it is low to hit lamp risk, and big device
Part can promote yield with manual maintenance.
Preferably, the spacing between adjacent pixel unit is equal.
Preferably, third positive terminal pad corresponding with the emitting red light chip in the first pixel unit and with the second pixel
The corresponding third positive terminal pad of emitting red light chip in unit is connected by the conducting wire of substrate back, in third pixel unit
The corresponding third positive terminal pad of emitting red light chip and third corresponding with the emitting red light chip in the 4th pixel unit just
Pole pad is connected by the conducting wire of substrate back；
The 4th positive terminal pad corresponding with the blue luminescence chip in the first pixel unit and with the blue in the second pixel unit
Corresponding 4th positive terminal pad of luminescence chip is connected by the conducting wire of substrate back, with the blue-light-emitting core in third pixel unit
Corresponding 4th positive terminal pad of piece and the 4th positive terminal pad corresponding with the blue luminescence chip in the 4th pixel unit pass through base
The conducting wire of back connects.
Preferably, blue luminescence chip, green emitting chip, emitting red light chip in the pixel unit successively from
Arrangement is in straight line along the vertical direction under.
Preferably, the bracket further includes eight pins that substrate back is arranged in, the blue in the first pixel unit
Corresponding 4th positive terminal pad of luminescence chip is located at the substrate front side upper left corner, and the blue luminescence chip in third pixel unit is corresponding
The 4th positive terminal pad be located at the substrate front side upper right corner, the corresponding third anode weldering of the emitting red light chip in the second pixel unit
Disk is located at the substrate front side lower left corner, and the corresponding third positive terminal pad of emitting red light chip in the 4th pixel unit is being located at substrate just
The face lower right corner, eight pins of substrate back are welded with the first public negative terminal pad, the second public negative terminal pad, the first anode respectively
Disk, the second positive terminal pad, corresponding 4th positive terminal pad of blue luminescence chip in the first pixel unit, in third pixel unit
Corresponding 4th positive terminal pad of blue luminescence chip, the corresponding third anode weldering of the emitting red light chip in the second pixel unit
The corresponding third positive terminal pad of emitting red light chip in disk, the 4th pixel unit corresponds, each pin and corresponding weldering
Disk electrical connection.
41 full-color SMD LED of conjunction have 8 pins, and the gross area that pin is bonded with PCB pad is big, in attachment after tin, thrust
It improves, secured performance is greatly improved, Improving The Quality of Products.
The beneficial effects of the present invention are: (1) device is integrated with four pixels, primary attachment movement is equivalent to tradition
Device 4 times, improved efficiency is obvious.(2) lamp bead is bigger after device is integrated, easily identifies, and it is low to hit lamp risk, and big device can
With manual maintenance, yield is promoted.(3) device has 8 pins, and the gross area being bonded with PCB pad is big, in attachment after tin, thrust
It improves, secured performance is greatly improved, Improving The Quality of Products.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of embodiment 1；
Fig. 2 is the rearview of Fig. 1；
Fig. 3 is the side view of Fig. 1；
Fig. 4 is the circuit diagram of embodiment 1；
Fig. 5 is the structural schematic diagram of embodiment 2；
Fig. 6 is the rearview of Fig. 2；
Fig. 7 is the side view of Fig. 2；
Fig. 8 is the circuit diagram of embodiment 2.
In figure: 1, substrate, the 2, first pixel unit, the 3, second pixel unit, 4, third pixel unit, the 5, the 4th pixel list
Member, 6, emitting red light chip, 7, blue luminescence chip, 8, green emitting chip, the 9, first public positive terminal pad, 10, second is public
Positive terminal pad altogether, the 11, first negative terminal pad, the 12, second negative terminal pad, 13, third negative terminal pad, the 14, the 4th negative terminal pad,
15, pin, the 16, first public negative terminal pad, the 17, second public negative terminal pad, the 18, first positive terminal pad, the 19, second anode weldering
Disk, 20, third positive terminal pad, the 21, the 4th positive terminal pad.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.
Embodiment 1: one kind 4 of the present embodiment closes 1 full-color SMD LED, as shown in Figure 1, Figure 2, Figure 3, Figure 4, including bracket,
Bracket includes substrate 1, and the positive upper left corner of substrate 1 is equipped with the first pixel unit 2, and the positive lower left corner of substrate 1 is equipped with the second pixel list
Member 3, the positive upper right corner of substrate 1 are equipped with third pixel unit 4, and the positive lower right corner of substrate 1 is equipped with the 4th pixel unit 5, adjacent picture
Spacing between plain unit is equal, and each pixel unit includes emitting red light chip 6, blue luminescence chip 7 and green emitting
Chip 8, it is negative that 1 front of substrate is equipped with the first public positive terminal pad 9, the second public positive terminal pad 10, the first negative terminal pad 11, second
Pole pad 12, the first public positive terminal pad 9 is between the first pixel unit 2 and third pixel unit 3, the first public anode weldering
Disk 9 is electrically connected with the anode of all chips in first pixel unit 2 and third pixel unit 3, the second public positive terminal pad
10 between the second pixel unit 3 and the 4th pixel unit 5, the second public positive terminal pad 10 and second pixel unit 3 and
The anode electrical connection of all chips in 4th pixel unit 5, the first negative terminal pad 11 are located at the first pixel unit 2 and the second picture
Between plain unit 3, the first negative terminal pad 11 and the first pixel unit 2 and the green emitting chip 8 in the second pixel unit 3 it is negative
Pole electrical connection, the second negative terminal pad 11 positioned at third pixel unit 4 and the 4th pixel unit 5 between, the second negative terminal pad 12 and
The cathode of third pixel unit 4 and the green emitting chip 8 in the 4th pixel unit 5 is electrically connected, and is additionally provided with and four on substrate 1
6 one-to-one four third negative terminal pads 13 of emitting red light chip and with four blue luminescence chips 7 one-to-one four
A 4th negative terminal pad 14, the cathode of each emitting red light chip 6 are electrically connected with corresponding third negative terminal pad 13, each blue
The cathode of luminescence chip 7 is electrically connected with corresponding 4th negative terminal pad 14.
Third negative terminal pad 13 corresponding with the emitting red light chip 6 in the first pixel unit 2 and with the second pixel unit 3
The interior corresponding third negative terminal pad 13 of emitting red light chip 6 is connected by the conducting wire at 1 back side of substrate, with third pixel unit 4
The interior corresponding third negative terminal pad 13 of emitting red light chip 6 and corresponding with the emitting red light chip 6 in the 4th pixel unit 5
Third negative terminal pad 13 is connected by the conducting wire at 1 back side of substrate；
The 4th negative terminal pad 14 corresponding with the blue luminescence chip 7 in the first pixel unit 2 and in the second pixel unit 3
Corresponding 4th negative terminal pad 14 of blue luminescence chip 7 is connected by the conducting wire at 1 back side of substrate, in third pixel unit 4
Corresponding 4th negative terminal pad 14 of blue luminescence chip 7 and with the blue luminescence chip 7 the corresponding 4th in the 4th pixel unit 5
Negative terminal pad 14 is connected by the conducting wire at 1 back side of substrate.
Blue luminescence chip 7, green emitting chip 8, emitting red light chip 6 in pixel unit are successively from top to bottom along perpendicular
Histogram is to arrangement in straight line.
Bracket further includes eight pins 15 that 1 back side of substrate is arranged in, the blue luminescence chip 7 in the first pixel unit 2
Corresponding 4th negative terminal pad 14 is located at the positive upper left corner of substrate 1, and the blue luminescence chip 7 in third pixel unit 4 is corresponding
4th cathode welds 14 disks and is located at the positive upper right corner of substrate 1, and the corresponding third of emitting red light chip 6 in the second pixel unit 3 is negative
Pole pad 13 is located at the positive lower left corner of substrate 1, the corresponding third negative terminal pad of emitting red light chip 6 in the 4th pixel unit 5
13 are located at the positive lower right corner of substrate 1, and eight pins 15 at 1 back side of substrate are public just with the first public positive terminal pad 9, second respectively
Pole pad 10, the first negative terminal pad 11, the second negative terminal pad 12, the blue luminescence chip 7 corresponding in the first pixel unit 2
Corresponding 4th negative terminal pad 14 of blue luminescence chip 7 in four negative terminal pads 14, third pixel unit 4, the second pixel unit 3
Emitting red light chip 6 corresponding in the interior corresponding third negative terminal pad 13 of emitting red light chip 6, the 4th pixel unit 5
Three negative terminal pads 13 correspond, and each pin 15 is electrically connected with corresponding pad.
This programme designs for common-anode, and emitting red light chip uses reversed polarity red chip.Bracket is tied for no bowl chip
The BT plate of structure.BT plate is that perhaps white pin and pad are gold-plated or silver-plated for black, grey.Red in pixel unit
Luminescence chip, blue luminescence chip, green emitting chip constitute RGB three primary colours chip.Packaged type is molding, packaging plastic
Water material includes the traditional materials such as the epoxy resin, silicone resin, epoxy-modified material of solid-state or liquid.
41 full-color SMD LED of conjunction are packaged with 4 pixel units, in 2 row * 2 column arrangement, shining in each pixel unit
Electric loop is connected with gold thread or alloy wire or copper wire welding between chip and pad.There are 2 public anodes on bracket
Pad and its corresponding pin, each pixel unit of each public positive terminal pad and left and right form conducting loop relationship, pad
It is connect with pin by via hole.
Once attachment movement is equivalent to traditional devices 4 times 41 full-color SMD LED of conjunction, and improved efficiency is obvious.Another aspect energy
Promote the yield of display screen, 4 close 1 full-color SMD LED it is integrated after lamp bead it is bigger, easily identify, it is low to hit lamp risk, and big device
Part can promote yield with manual maintenance.
41 full-color SMD LED of conjunction have 8 pins, and the gross area that pin is bonded with PCB pad is big, in attachment after tin, thrust
It improves, secured performance is greatly improved, Improving The Quality of Products.
Embodiment 2: one kind 4 of the present embodiment closes 1 full-color SMD LED, shown in Fig. 5, Fig. 6, Fig. 7, Fig. 8, including bracket, branch
Frame includes substrate 1, and the positive upper left corner of substrate 1 is equipped with the first pixel unit 2, and the positive lower left corner of substrate 1 is equipped with the second pixel unit
3, the positive upper right corner of substrate 1 is equipped with third pixel unit 4, and the positive lower right corner of substrate 1 is equipped with the 4th pixel unit 5, adjacent pixel
Spacing between unit is equal, and each pixel unit includes emitting red light chip 6, blue luminescence chip 7 and green emitting core
Piece 8,1 front of substrate are being equipped with the first public negative terminal pad 16, the second public negative terminal pad 17, the first positive terminal pad 18, second just
Pole pad 19, the first public negative terminal pad 16 is between the first pixel unit 2 and third pixel unit 4, the first public cathode
Pad 16 is electrically connected with the cathode of all chips in first pixel unit 2 and third pixel unit 4, the second public cathode weldering
Disk 17 is between the second pixel unit 3 and the 4th pixel unit 5, the second public negative terminal pad 17 and second pixel unit 3
It is electrically connected with the cathode of all chips in the 4th pixel unit 5, the first positive terminal pad 18 is located at the first pixel unit 2 and second
Between pixel unit 3, the first positive terminal pad 18 and the first pixel unit 2 and the green emitting chip 8 in the second pixel unit 3
Anode electrical connection, the second positive terminal pad 18 is between third pixel unit 4 and the 4th pixel unit 5, the second positive terminal pad 19
It is electrically connected, is additionally provided on substrate 1 and four with the anode of the green emitting chip 8 in third pixel unit 4 and the 4th pixel unit 5
6 one-to-one four third positive terminal pads 20 of a emitting red light chip and one-to-one with four blue luminescence chips 6
The anode of four the 4th positive terminal pads 21, each emitting red light chip 6 is electrically connected with corresponding third positive terminal pad 20, Mei Gelan
The anode of color luminescence chip 7 is electrically connected with corresponding 4th positive terminal pad 21.
Third positive terminal pad 20 corresponding with the emitting red light chip 6 in the first pixel unit 2 and with the second pixel unit 3
The interior corresponding third positive terminal pad 20 of emitting red light chip 6 is connected by the conducting wire at 1 back side of substrate, with third pixel unit 4
The interior corresponding third positive terminal pad 20 of emitting red light chip 6 and corresponding with the emitting red light chip 6 in the 4th pixel unit 5
Third positive terminal pad 20 is connected by the conducting wire at 1 back side of substrate；
The 4th positive terminal pad 21 corresponding with the blue luminescence chip 7 in the first pixel unit 2 and in the second pixel unit 3
Corresponding 4th positive terminal pad 21 of blue luminescence chip 7 is connected by the conducting wire at 1 back side of substrate, in third pixel unit 4
Corresponding 4th positive terminal pad 21 of blue luminescence chip 7 and with the blue luminescence chip 7 the corresponding 4th in the 4th pixel unit 5
Positive terminal pad 21 is connected by the conducting wire at 1 back side of substrate.
Blue luminescence chip 7, green emitting chip 8, emitting red light chip 6 in pixel unit are successively from top to bottom along perpendicular
Histogram is to arrangement in straight line.
Bracket further includes eight pins 15 that 1 back side of substrate is arranged in, the blue luminescence chip 7 in the first pixel unit 2
Corresponding 4th positive terminal pad 21 is located at the positive upper left corner of substrate 1, and the blue luminescence chip 7 in third pixel unit 4 is corresponding
4th positive terminal pad 21 is located at the positive upper right corner of substrate 1, and the corresponding third of emitting red light chip 6 in the second pixel unit 3 is just
Pole pad 20 is located at the positive lower left corner of substrate 1, the corresponding third positive terminal pad of emitting red light chip 6 in the 4th pixel unit 5
20 are located at the positive lower right corner of substrate 1, and eight pins 15 at 1 back side of substrate are public with the first public negative terminal pad 16, second respectively
Negative terminal pad 17, the first positive terminal pad 18, the second positive terminal pad 19, the blue luminescence chip 7 in the first pixel unit 2 are corresponding
Corresponding 4th positive terminal pad 21 of blue luminescence chip 7 in 4th positive terminal pad 21, third pixel unit 4, the second pixel list
The corresponding third positive terminal pad 20 of emitting red light chip 6 in member 3, the emitting red light chip 6 in the 4th pixel unit 5 are corresponding
Third positive terminal pad 20 corresponds, and each pin 15 is electrically connected with corresponding pad.
This programme designs for common cathode, and emitting red light chip uses positive polarity red chip.Bracket is tied for no bowl chip
The BT plate of structure.BT plate is that perhaps white pin and pad are gold-plated or silver-plated for black, grey.Red in pixel unit
Luminescence chip, blue luminescence chip, green emitting chip constitute RGB three primary colours chip.Packaged type is molding, packaging plastic
Water material includes the traditional materials such as the epoxy resin, silicone resin, epoxy-modified material of solid-state or liquid.
41 full-color SMD LED of conjunction are packaged with 4 pixel units, in 2 row * 2 column arrangement, shining in each pixel unit
Electric loop is connected with gold thread or alloy wire or copper wire welding between chip and pad.There are 2 public anodes on bracket
Pad and its corresponding pin, each pixel unit of each public positive terminal pad and left and right form conducting loop relationship, pad
It is connect with pin by via hole.
Once attachment movement is equivalent to traditional devices 4 times 41 full-color SMD LED of conjunction, and improved efficiency is obvious.Another aspect energy
Promote the yield of display screen, 4 close 1 full-color SMD LED it is integrated after lamp bead it is bigger, easily identify, it is low to hit lamp risk, and big device
Part can promote yield with manual maintenance.
41 full-color SMD LED of conjunction have 8 pins, and the gross area that pin is bonded with PCB pad is big, in attachment after tin, thrust
It improves, secured performance is greatly improved, Improving The Quality of Products.
Claims (10)
1. one kind 4 closes 1 full-color SMD LED, which is characterized in that including bracket, the bracket includes substrate, and the substrate front side is left
Upper angle is equipped with the first pixel unit, and the substrate front side lower left corner is equipped with the second pixel unit, and the substrate front side upper right corner is set
There is third pixel unit, the substrate front side lower right corner is equipped with the 4th pixel unit, and each pixel unit includes emitting red light
Chip, blue luminescence chip and green emitting chip, the substrate front side are equipped with the first public positive terminal pad, the second public anode
Pad, the first negative terminal pad, the second negative terminal pad, the first public positive terminal pad are located at the first pixel unit and third pixel
Between unit, the anode of the first public positive terminal pad and first pixel unit and all chips in third pixel unit
Electrical connection, the second public positive terminal pad between the second pixel unit and the 4th pixel unit, described second it is public just
Pole pad is electrically connected with the anode of all chips in second pixel unit and the 4th pixel unit, first negative terminal pad
Between the first pixel unit and the second pixel unit, first negative terminal pad and the first pixel unit and the second pixel list
The cathode of green emitting chip in member is electrically connected, and second negative terminal pad is located at third pixel unit and the 4th pixel unit
Between, second negative terminal pad and the cathode of the green emitting chip in third pixel unit and the 4th pixel unit are electrically connected
Connect, be additionally provided on the substrate with the one-to-one four third negative terminal pads of four emitting red light chips and with four blues
One-to-one four the 4th negative terminal pads of luminescence chip, the cathode of each emitting red light chip and corresponding third negative terminal pad
Electrical connection, the cathode of each blue luminescence chip are electrically connected with corresponding 4th negative terminal pad.
2. according to claim 1 a kind of 4 close 1 full-color SMD LED, which is characterized in that between adjacent pixel unit
Away from equal.
3. it is according to claim 1 it is a kind of 4 close 1 full-color SMD LED, which is characterized in that with it is red in the first pixel unit
The corresponding third negative terminal pad of color luminescence chip and third cathode corresponding with the emitting red light chip in the second pixel unit weldering
Disk is connected by the conducting wire of substrate back, third negative terminal pad corresponding with the emitting red light chip in third pixel unit and with
The corresponding third negative terminal pad of emitting red light chip in 4th pixel unit is connected by the conducting wire of substrate back；
The 4th negative terminal pad corresponding with the blue luminescence chip in the first pixel unit and with the blue in the second pixel unit
Corresponding 4th negative terminal pad of luminescence chip is connected by the conducting wire of substrate back, with the blue-light-emitting core in third pixel unit
Corresponding 4th negative terminal pad of piece and the 4th negative terminal pad corresponding with the blue luminescence chip in the 4th pixel unit pass through base
The conducting wire of back connects.
4. according to claim 1 a kind of 4 close 1 full-color SMD LED, which is characterized in that the blue in the pixel unit
Successively arrangement is in straight line along the vertical direction from top to bottom for luminescence chip, green emitting chip, emitting red light chip.
5. according to claim 4 a kind of 4 close 1 full-color SMD LED, which is characterized in that the bracket further includes that setting exists
Eight pins of substrate back, corresponding 4th negative terminal pad of blue luminescence chip in the first pixel unit are located at substrate front side
The upper left corner, corresponding 4th negative terminal pad of blue luminescence chip in third pixel unit are located at the substrate front side upper right corner, and second
The corresponding third negative terminal pad of emitting red light chip in pixel unit is located at the substrate front side lower left corner, in the 4th pixel unit
The corresponding third negative terminal pad of emitting red light chip is located at the substrate front side lower right corner, and eight pins of substrate back are respectively with first
Public positive terminal pad, the second public positive terminal pad, the first negative terminal pad, the second negative terminal pad, the blue in the first pixel unit
Corresponding 4th negative terminal pad of blue luminescence chip in corresponding 4th negative terminal pad of luminescence chip, third pixel unit,
Emitting red light chip in the corresponding third negative terminal pad of emitting red light chip, the 4th pixel unit in two pixel units is corresponding
Third negative terminal pad correspond, each pin is electrically connected with corresponding pad.
6. one kind 4 closes 1 full-color SMD LED, which is characterized in that including bracket, the bracket includes substrate, and the substrate front side is left
Upper angle is equipped with the first pixel unit, and the substrate front side lower left corner is equipped with the second pixel unit, and the substrate front side upper right corner is set
There is third pixel unit, the substrate front side lower right corner is equipped with the 4th pixel unit, and each pixel unit includes emitting red light
Chip, blue luminescence chip and green emitting chip, the substrate front side are equipped with the first public negative terminal pad, the second public cathode
Pad, the first positive terminal pad, the second positive terminal pad, the first public negative terminal pad are located at the first pixel unit and third pixel
Between unit, the cathode of the first public negative terminal pad and first pixel unit and all chips in third pixel unit
Electrical connection, for the second public negative terminal pad between the second pixel unit and the 4th pixel unit, described second is public negative
Pole pad is electrically connected with the cathode of all chips in second pixel unit and the 4th pixel unit, first positive terminal pad
Between the first pixel unit and the second pixel unit, first positive terminal pad and the first pixel unit and the second pixel list
The anode electrical connection of green emitting chip in member, second positive terminal pad are located at third pixel unit and the 4th pixel unit
Between, second positive terminal pad and the anode of the green emitting chip in third pixel unit and the 4th pixel unit are electrically connected
Connect, be additionally provided on the substrate with the one-to-one four third positive terminal pads of four emitting red light chips and with four blues
One-to-one four the 4th positive terminal pads of luminescence chip, the positive and corresponding third positive terminal pad of each emitting red light chip
The anode of electrical connection, each blue luminescence chip is electrically connected with corresponding 4th positive terminal pad.
7. according to claim 6 a kind of 4 close 1 full-color SMD LED, which is characterized in that between adjacent pixel unit
Away from equal.
8. it is according to claim 6 it is a kind of 4 close 1 full-color SMD LED, which is characterized in that with it is red in the first pixel unit
The corresponding third positive terminal pad of color luminescence chip and third anode corresponding with the emitting red light chip in the second pixel unit weldering
Disk is connected by the conducting wire of substrate back, third positive terminal pad corresponding with the emitting red light chip in third pixel unit and with
The corresponding third positive terminal pad of emitting red light chip in 4th pixel unit is connected by the conducting wire of substrate back；
The 4th positive terminal pad corresponding with the blue luminescence chip in the first pixel unit and with the blue in the second pixel unit
Corresponding 4th positive terminal pad of luminescence chip is connected by the conducting wire of substrate back, with the blue-light-emitting core in third pixel unit
Corresponding 4th positive terminal pad of piece and the 4th positive terminal pad corresponding with the blue luminescence chip in the 4th pixel unit pass through base
The conducting wire of back connects.
9. according to claim 6 a kind of 4 close 1 full-color SMD LED, which is characterized in that the blue in the pixel unit
Successively arrangement is in straight line along the vertical direction from top to bottom for luminescence chip, green emitting chip, emitting red light chip.
10. according to claim 9 a kind of 4 close 1 full-color SMD LED, which is characterized in that the bracket further includes that setting exists
Eight pins of substrate back, corresponding 4th positive terminal pad of blue luminescence chip in the first pixel unit are located at substrate front side
The upper left corner, corresponding 4th positive terminal pad of blue luminescence chip in third pixel unit are located at the substrate front side upper right corner, and second
The corresponding third positive terminal pad of emitting red light chip in pixel unit is located at the substrate front side lower left corner, in the 4th pixel unit
The corresponding third positive terminal pad of emitting red light chip is located at the substrate front side lower right corner, and eight pins of substrate back are respectively with first
Public negative terminal pad, the second public negative terminal pad, the first positive terminal pad, the second positive terminal pad, the blue in the first pixel unit
Corresponding 4th positive terminal pad of blue luminescence chip in corresponding 4th positive terminal pad of luminescence chip, third pixel unit,
Emitting red light chip in the corresponding third positive terminal pad of emitting red light chip, the 4th pixel unit in two pixel units is corresponding
Third positive terminal pad correspond, each pin is electrically connected with corresponding pad.
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| CN201910650521.4A CN110350073A (en) | 2019-07-18 | 2019-07-18 | One kind 4 closes 1 full-color SMD LED |
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