CN107146542A - A kind of LED display module - Google Patents
A kind of LED display module Download PDFInfo
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- CN107146542A CN107146542A CN201710543781.2A CN201710543781A CN107146542A CN 107146542 A CN107146542 A CN 107146542A CN 201710543781 A CN201710543781 A CN 201710543781A CN 107146542 A CN107146542 A CN 107146542A
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- 239000002184 metal Substances 0.000 claims abstract description 77
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000011888 foil Substances 0.000 claims abstract description 69
- 239000000178 monomer Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims description 31
- 239000011810 insulating material Substances 0.000 claims description 27
- 238000004020 luminiscence type Methods 0.000 claims description 24
- 238000009826 distribution Methods 0.000 claims description 12
- 239000007769 metal material Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 13
- 238000003466 welding Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 235000003392 Curcuma domestica Nutrition 0.000 description 4
- 244000008991 Curcuma longa Species 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 235000003373 curcuma longa Nutrition 0.000 description 4
- 235000013976 turmeric Nutrition 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
A kind of LED display module, is related to LED encapsulation and LED display technical field, solves the problem of traditional LED display has heat dispersion difference and needs LED support.Upper circuit pack including the LED component containing LED monomers, containing layer of reaching the standard grade and the multiple connection sheets arranged in the lateral direction, the main terminal pads of multiple LED that the top surface of connection sheet is provided with, LED monomers are fixed in the corresponding main terminal pads of LED, upper circuit pack is provided with multiple LED putting holes, LED monomers include three kinds of color LED chips, LED chip is fixed in the main terminal pads of LED, and LED chip is electrically connected with by connecting metal foil with layer of reaching the standard grade.The cost of LED and display screen without LED support, can be greatly reduced in the display screen production of the present invention, LED display luminous point spacing is small, perfect heat-dissipating and performance are stable.
Description
Technical field
Encapsulated the present invention relates to LED and the LED display technical field including LED television, LED encapsulation belongs to half
Conductor technology.
Background technology
LED is the light emitting diode of LED chip encapsulation.LED television refers to that LED chip is directly luminous and forms image
Television set.LED display is to be installed in the circuit board and directly lighted by LED by multiple LED to form the display screen of image
（There is other control LED electronic component on wiring board）.Particularly (LED is the three-in-one full color display of RGB
One luminous point a, LED is a pixel, is placed on by 1 red 1 green 1 blue three LED chips in a LED bowl by envelope
Dress forms a LED)；LED display includes outdoor LED display screen, indoor LED display and LED television display screen etc.,
LED display is referred to as light-emitting diode display.Existing LED display uses PCB, in the upper surface of PCB
Multiple LED are installed, multiple control LED integrated package is installed in the lower surface of PCB, PCB does not radiate
Structure, the thermal diffusivity of PCB is very poor, then existing LED and LED display weak heat-dissipating, and poor quality, stability is poor；It is existing
LED support is needed in the LED production processes of some LED displays, LED support includes straight cutting LED support and paster LED branch
Frame, LED support cost is high, and LED support cuts unnecessary part after die bond, solder bonds metal wire and sealing（That is cutting
Technique）, LED production costs are high, and LED costs are high, LED stability, and LED display cost is high, and stability is poor.
The content of the invention
There is the problem of needing straight cutting LED support or paster LED bracket in the LED of existing LED display, existing LED is shown
The problem of there is cost high and poor stability in screen, and to there is wiring board in existing LED display do not have radiator structure and weak heat-dissipating
The problem of, the present invention proposes a kind of LED display module, the technical side that the present invention is used to solve above-mentioned problem
Case is：
A kind of LED display module, includes luminescence component；Described luminescence component includes LED component and upper component；It is described
Upper component include multiple connection sheets in left-right situs, the connection sheet is in metal material, each described connection sheet
Provided with the main terminal pads of multiple LED in tandem；Described upper component also includes horizontally disposed upper circuit pack, it is described on
Circuit pack includes the upper substrate of reach the standard grade layer and insulating materials, and described layer of reaching the standard grade is fixedly connected with upper substrate；The upper base
Plate is located at the lower section for layer of reaching the standard grade, and the connection sheet is located at the lower section of upper substrate, and the top surface bonding of the upper substrate and connection sheet connects
Connect；Described upper component is provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is to that should have 1
The main terminal pads of described LED；Described LED component includes multiple LED monomers of array distribution, each described LED monomer
It is fixed in the main terminal pads of corresponding 1 LED；The layer of reaching the standard grade includes a plurality of first control metal foil in tandem, institute
State layer of reaching the standard grade and also include a plurality of second control metal foil in tandem, the layer of reaching the standard grade also includes in tandem a plurality of
3rd control metal foil, the first control metal foil and the second control metal foil are respectively equipped with LED terminal pad, the described 3rd
Metal foil is controlled to be provided with LED times described terminal pad；Position of the position of the main terminal pads of LED less than LED terminal pad.
Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes and bottom
Electrode；The bottom electrode of the LED chip is fixedly connected and is electrically connected with the main terminal pads of LED；The connecting elements includes
The articulamentum of metal foil and insulating materials is connected, the connection metal foil is metal material, and the articulamentum is with being connected metal foil
It is fixedly connected；The connection metal foil surface is provided with the top electricity of the 1st pad and the 2nd pad, the 1st pad and LED chip
Pole is fixedly connected and is electrically connected with；2nd pad is fixedly connected and is electrically connected with LED terminal pad；The LED chip
Top electrodes are located at the one of the 2nd pad of the connection metal foil connected close to the LED chip on the LED chip length direction
Side；Each described LED monomer includes 3 LED chips, is the first color LED chip, the second color LED core respectively
Piece and the 3rd color LED chip；First color LED chip of the multiple LED monomers being arranged in a row in left and right and 1 first control
Metal foil is electrically connected with；Second color LED chip of the multiple LED monomers being arranged in a row in left and right and 1 second control metal
Paper tinsel is electrically connected with；3rd color LED chip of the multiple LED monomers being arranged in a row in left and right and 1 article of the 3rd control metal foil electricity
Property connection.
The luminescence component also includes lower circuit pack, radiator and control integrated package, and the radiator is located at offline
The lower section of road component, the radiator is fixedly connected with lower circuit pack；Described lower circuit pack include lower wiring layer and
The lower circuit base plate of insulating materials, the lower wiring layer is fixedly connected with lower circuit base plate；The control integrated package is arranged on down
The lower surface of wiring layer；The lower circuit base plate is located at the lower section of connection sheet, and the lower wiring layer is located under lower circuit base plate
Side, the lower circuit base plate is connected with the bonding of connection sheet lower surface；The lower circuit pack is provided with multiple heat conduction grooves, described to lead
Downwards, the bottom land of the heat conduction groove is the lower surface of connection sheet to hot slot opening；The radiator, which includes, is welded on heat conduction
Multiple radiating pins of the metal material of groove；Each described connection sheet is to that should have 1 heat conduction groove described above；It is each
1 radiating pin described above of the individual connection sheet correspondence；The rear and front end distance of the heat conduction groove is H3, and the heat conduction is recessed
The left and right ends distance of groove is H4, and H3 is more than H4.
The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on
The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet.
Described luminescence component also includes top layer；The top layer includes the top line base board of the black of insulating materials；
The top layer is provided with top layer hole；The top layer hole is more than LED putting holes in the surface of LED putting holes, the top layer hole.
The upper circuit pack is provided with the interstitial hole being located at directly over LED putting holes, the horizontal cross-section face of the interstitial hole
Horizontal section area of the product more than LED putting holes；Position is placed in the bottom of the interstitial hole provided with chip, and chip places the position of position
Higher than the position of the main terminal pads of LED, LED chip is fixed on chip and placed on position；The upper circuit pack also includes and upper base
The middle line layer of plate upper surface bonding connection；The middle line layer places position provided with described chip.
The top surface of the connection sheet includes multiple bonding pads in tandem, and bonding pad is located at front and rear two adjacent LEDs
Between main terminal pad, the lower surface bonding connection of bonding pad and upper substrate.
The upper circuit pack is provided with multiple blind holes, and partly or entirely LED times described terminal pad is located in blind hole respectively
Bottom.
Distance between the main terminal pad left ends of LED and connection sheet left surface in left and right is H1, the main terminal pads of LED
Left end is located at the right of connection sheet left surface, and the distance between the main terminal pad right-hand members of LED and connection sheet right flank in left and right is H2,
The main terminal pad right-hand members of LED are located at the left side of connection sheet right flank, and H1 is more than 0, H2 and is more than 0.
Described lower wiring layer includes between the multiple lower line layers being distributed up and down, two neighboring lower line layer provided with exhausted
The underlying substrate of edge material；Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, two neighboring upper wiring layer it
Between be provided with insulating materials top substrate layer.
The radiator also includes multiple fin of metal material, and each described fin draws with corresponding radiating
Pin integrally connected；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin.
The beneficial effects of the invention are as follows：Luminescence component includes LED component and upper component, and upper component includes metal material
Multiple connection sheets, upper component also includes the main terminal pads of multiple LED of array distribution, and the main terminal pads of LED are arranged on connection sheet
On top surface, upper component is provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is to that should have described in one
The main terminal pads of LED, LED component includes multiple LED monomers of array distribution, the bottom electrode of the LED chip of LED monomers with
The main terminal pads of LED are fixedly connected and are electrically connected with, in LED chip heat transfer to connection sheet, and luminescence component also includes offline
Road component and radiator, lower circuit pack include the lower circuit base plate of insulating materials, lower circuit base plate and connection sheet lower surface
Bonding connection, lower circuit pack is provided with heat conduction groove, and the bottom land of heat conduction groove is the lower surface of connection sheet, and radiator includes weldering
The heat being connected in the radiating pin of heat conduction groove, connection sheet is delivered to radiator by the pin that radiates, then LED display
Perfect heat-dissipating, quality better, performance is stable.Connecting elements includes the articulamentum of connection metal foil and insulating materials, connection
Layer is fixedly connected with being connected metal foil, and connecting elements is just stablized, and connection metal foil surface is provided with the 1st pad and the 2nd pad, the 1st
Pad is fixedly connected and is electrically connected with the top electrodes of LED chip, and the 2nd pad is fixedly connected and electrically with LED terminal pad
Connection, the top electrodes of LED chip are located at the connection metal connected close to the LED chip on the LED chip length direction
The side of 2nd pad of paper tinsel, connection metal foil would not block the luminous of the non-electrode place of LED chip, then LED display
LED requires no solder bonds metal wire, and the tie point of LED chip and the main connection positions of LED is firm, and LED chip is with being connected metal
Firmly, the tie point of connection metal foil and LED terminal pad is firm for the tie point of paper tinsel, each LED monomer be broken it is replaceable, no
Traditional LED support is needed, reduction LED chip volume is also helped, then the technique of LED display is simple, yield is high, easy
Maintenance and stability are good, and LED packaging costs are greatly reduced, and LED costs are greatly reduced, LED display cost is greatly reduced,
Make LED display luminous point spacing small, solving the LED of traditional LED display needs solder bonds metal wire and traditional LED
Support and have that complex process, yield are low, bond wire line is not shockproof, bond wire line tie point easily disconnects, luminous point spacing
Greatly, cost is high and the problem of poor stability.
Brief description of the drawings
Fig. 1 is the main structure diagram of the luminescence component for not drawing radiator of inventive embodiments 1；
Fig. 2 is the overlooking the structure diagram of the luminescence component for not drawing LED component of inventive embodiments 1；
Fig. 3 is the right side structural representation of the luminescence component for not drawing radiator of inventive embodiments 1；
Fig. 4 is the right side structural representation of the connection sheet of inventive embodiments 1；
Fig. 5 is that the right side of wherein 1 LED chip, connecting elements and the control metal foil of inventive embodiments 1 regards structure schematic diagram；
Fig. 6 be Fig. 5 in LED chip overlooking the structure diagram；
Fig. 7 is 1 structure enlarged diagram push up in the range of through hole and that position is placed without chip in Fig. 2；
Fig. 8 has additional the schematic diagram that chip places position not have to push up substrate in Fig. 7；
Fig. 9 be Fig. 8 in have additional the V-V ' after LED monomers to diagrammatic cross-section；
Figure 10 be Fig. 8 in have additional the schematic diagram after LED chip；
Figure 11 is that the schematic diagram after connection metal foil is had additional in Figure 10；
Figure 12 is the overlooking the structure diagram of the connection sheet of inventive embodiments 1；
Figure 13 is the present invention looks up structural representation of the heat conduction groove of the embodiment of the present invention 1；
Figure 14 is the main structure diagram of the radiator of inventive embodiments 1；
Figure 15 is the overlooking the structure diagram of the weld assembly of the embodiment of the present invention 2；
Figure 16 is the overlooking the structure diagram of the connection sheet of inventive embodiments 3；
Figure 17 is the overlooking the structure diagram of the LED chip of inventive embodiments 4.
Embodiment
The present embodiment be invention preferred embodiment, other every its principle and basic structure it is identical with the present embodiment or
Person is approximate, within invention protection domain.
Embodiment 1
Shown in reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, Figure 11, Figure 12, Figure 13 and Figure 14,
A kind of LED display module, includes luminescence component；Described luminescence component includes LED component and upper component；Described is upper
Component includes multiple connection sheets 21 in left-right situs, and the connection sheet 21 is metal material, the two neighboring electricity of connection sheet 21
Sexual isolation；Described upper component also includes horizontally disposed upper circuit pack 5, and the upper circuit pack 5 includes layer of reaching the standard grade
With the upper substrate 4 of insulating materials, described layer of reaching the standard grade is fixedly connected with upper substrate 4；The upper substrate 4, which is located at, reaches the standard grade under layer
Side, the connection sheet 21 is located at the lower section of upper substrate 4, and the lower surface of the upper substrate 4 is connected with the top surface bonding of connection sheet 21；
Described upper component also includes the main terminal pads 22 of multiple LED of array distribution, and the main terminal pads 22 of LED are arranged on connection sheet
On 21 top surfaces, the main terminal pads 22 of LED are fixedly connected and are electrically connected with connection sheet 21；Described upper component is provided with array point
Multiple LED putting holes 6 of cloth, the bottom of each LED putting hole 6 is correspondingly provided with the main terminal pads 22 of LED described in one；
Described LED component includes multiple LED monomers of array distribution, and multiple LED monomers are separately fixed at the described main connections of LED
On disk 22, described LED monomers are corresponded with the main terminal pads of LED 22；The layer of reaching the standard grade includes a plurality of in tandem
One control metal foil 71, the layer of reaching the standard grade also includes a plurality of second control metal foil 72 in tandem, described to reach the standard grade layer also
Include a plurality of 3rd control metal foil in tandem, the first control control of metal foil 71 and second metal foil 72 is distinguished
Provided with LED terminal pad 8, the 3rd control metal foil is provided with described LED terminal pad 8；The main terminal pads 22 of LED
Position of the position less than LED terminal pad 8.
The main terminal pads 22 of LED are turmeric pad, and the main terminal pads 22 of LED are arranged on the top surface of connection sheet 21,
The main terminal pads 22 of LED are not belonging to connection sheet 21.The top surface of the connection sheet 21 includes multiple bonding pads in tandem
212, bonding pad 212 is located between the main terminal pad 22 of front and rear two adjacent LEDs, and bonding pad 212 and the lower surface of upper substrate 4 are bonded
Connection.
1 LED monomer is the LED of 1 pixel, 0.1-5 millimeters of LED monomer spacing, i.e., pel spacing 0.1-5 millimeters.
Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes 51, chip
Main body 52 and bottom electrode 53；The bottom electrode 53 of the LED chip is fixedly connected and is electrically connected with the main terminal pads of LED 22；
The connecting elements includes the articulamentum 502 of connection metal foil 50 and insulating materials, and the articulamentum 502 is with being connected metal foil
50 are fixedly connected；Connection metal foil 50 surface is provided with the top of the 1st pad and the 2nd pad, the 1st pad and LED chip
Portion's electrode 51 is fixedly connected and is electrically connected with；2nd pad is fixedly connected and is electrically connected with LED terminal pad 8；It is described
The top electrodes 51 of LED chip are located at the connection metal foil 50 connected close to the LED chip on the LED chip length direction
The 2nd pad side；Each described LED monomer includes 3 LED chips, be respectively the first color LED chip,
Second color LED chip and the 3rd color LED chip；First color LED chip of the multiple LED monomers being arranged in a row in left and right
It is electrically connected with 1 first control metal foil 71；The the second color LED chip and 1 for the multiple LED monomers being arranged in a row in left and right
The control of bar second metal foil 72 is electrically connected with；3rd color LED chip of the multiple LED monomers being arranged in a row in left and right with 1 article
3rd control metal foil is electrically connected with.
The luminescence component also includes lower circuit pack 35, radiator and control integrated package 34, and the radiator is located at
The lower section of lower circuit pack 35, the radiator is fixedly connected with lower circuit pack 35；Described lower circuit pack 35 includes
The lower circuit base plate 30 of lower wiring layer 36 and insulating materials, the lower wiring layer 36 is fixedly connected with lower circuit base plate 30；It is described
Integrated package 34 is controlled to be arranged on the lower surface of lower wiring layer 36；The lower circuit base plate 30 is located at the lower section of connection sheet 21, described
Lower wiring layer 36 is located at the lower section of lower circuit base plate 30, and the lower circuit base plate 30 is connected with the bonding of the lower surface of connection sheet 21；Institute
Lower circuit pack 35 is stated provided with multiple heat conduction grooves 78, Open Side Down for the heat conduction groove 78, the bottom land of the heat conduction groove 78
For the lower surface of connection sheet 21；The radiator includes the multiple radiating pins for the metal material being welded at heat conduction groove 78
701；Each described 21 pairs of connection sheet should have 1 heat conduction groove 78 described above；Each described connection sheet 21 correspondence 1 with
The upper radiating pin 701；The rear and front end distance of the heat conduction groove 78 is H3, the left and right ends of the heat conduction groove 78 away from
It is more than H4 from for H4, H3.The luminescence component also includes the main control integrated package for being separately mounted to the lower lower surface of wiring layer 36
28 and lead socket 58, the control integrated package 34, which passes through, is arranged on leading in the middle of the main terminal pads 22 of four LED that two rows two are arranged
Electric hole is electrically connected with LED terminal pad 8, and main control integrated package 28 is electrically connected with connection sheet 21.
The radiator also includes multiple fin 702 of metal material, each described fin 702 with it is corresponding
Radiate the integrally connected of pin 701；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin 702
703。
The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on
The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet 21.
Described luminescence component also includes top layer 10；The top layer 10 includes the top line roadbed of the black of insulating materials
Plate；The top layer 10 is provided with top layer hole 62；The top layer hole 62 is more than in the surface of LED putting holes 6, the top layer hole 62
LED putting holes 6；The top layer hole 62 makes LED terminal pad 8 not blocked by top layer 10.
Distance between the main left ends of terminal pad 22 of LED and the left surface of connection sheet 21 in left and right is H1, the main companies of LED
The right that the left end of disk 22 is located at the left surface of connection sheet 21 is connect, on a left side between the main right-hand members of terminal pad 22 of LED and the right flank of connection sheet 21
Right distance is H2, and the main right-hand members of terminal pad 22 of LED are located at the left side of the right flank of connection sheet 21, and H1 is more than 0, H2 and is more than 0.
The height of the connection sheet 21 is 10 microns to 3 millimeters.The LED monomers, which also include, encases LED chip, connection
The Protection glue of metal foil 50 and LED terminal pad 8, Protection glue belongs to more than one of silica gel and epoxy resin.
The upper circuit pack 5 is provided with the interstitial hole 63 being located at directly over LED putting holes 6, interstitial hole 63 be square opening or
Circular port, the horizontal section area of interstitial hole 63 is more than the horizontal section area of LED putting holes 6；The bottom of interstitial hole 63 is provided with
Chip places position 42, and chip places position of the position higher than the main terminal pads 22 of LED of position 42, and chip places position 42 and blocked LED
Chip makes LED chip not contacted with the main terminal pads of LED 22, and LED chip is placed on chip and placed on position 42.
The upper circuit pack 5 also includes the upper circuit base plate 2 of wiring layer 1, middle wiring layer 3 and insulating materials；Institute
The lower surface for stating wiring layer 1 is connected with the bonding of upper circuit base plate 2, and lower surface and the middle wiring layer 3 of the upper circuit base plate 2 glue
Close connection；Described upper circuit pack 5 also includes the tertiary circuit substrate 40 of the 3rd wiring layer 41 and insulating materials, described
Chip is placed position 42 and is arranged on the 3rd wiring layer 41；The lower surface of the middle wiring layer 3 glues with tertiary circuit substrate 40
Close connection, the lower surface of the tertiary circuit substrate 40 and the 3rd wiring layer 41 are bonded and be connected, the 3rd wiring layer 41 with it is upper
The upper surface bonding connection of substrate 4.The upper wiring layer 1 includes a plurality of first control metal foil 71, and the middle wiring layer 3 is wrapped
A plurality of second control metal foil 72 and a plurality of 3rd control metal foil are included.
Described layer of reaching the standard grade includes between the multiple upper wiring layers being distributed up and down, two neighboring upper wiring layer provided with insulation
The top substrate layer of material, the upper wiring layer 1 and middle wiring layer 3 belong to described upper wiring layer, and upper circuit base plate 2 belongs to described
Top substrate layer.
Described upper component also includes control metal foil 7, the first described control control metal foil of metal foil 71, second
72 and the 3rd control metal foil to belong to described control metal foil 7.
Described upper circuit pack 5 also includes the top substrate 9 of insulating materials, pushes up the lower surface and upper wiring layer 1 of substrate 9
Upper surface be fixedly connected.The LED monomers also include electric conductor, and the connection metal foil 50 passes through electric conductor and LED times
Terminal pad 8 is connected.For the influence of the difference in height that eliminates the corresponding 3 LED terminal pads 8 of 3 LED chips, and in order to limit
Blind hole, each LED terminal pad 8 are respectively equipped with the scope of conductive body, the corresponding each LED terminal pad 8 of each LED monomer
Place is located at the inner bottom part of blind hole respectively, and blind hole has spacing not connect with LED putting holes 6.The electric conductor is located in blind hole,
Blind hole is divided into the first hole 91, the second hole 92 and the 3rd hole 93.It can not also set or set blind hole less, blind hole can also be placed with LED
Hole 6 is connected.For the ease of laser boring, there is rounding 90 at the 3rd 93 4 jiaos of hole（Other various holes can also have rounding）.
The main terminal pads 22 of LED, LED terminal pad 8, the 1st pad and the 2nd pad are turmeric pad, gold plated pads, plating silver soldering
One or more among disk, alloy pad, five kinds of spray soldering disk,
Connecting elements is obtained by circuit board technique, and the connection metal foil 50 of connecting elements is copper foil layer, the articulamentum of insulating materials
502 use FPC sheet material, and the articulamentum 502 is conducive to connecting metal foil 50 with being connected the bonding connection of metal foil 50
It is easy to operate in process of production and connection metal foil 50 is stablized indeformable.
LED chip uses the LED chip of vertical stratification, LED chip rectangle, and the top electrodes 51 of LED chip, which are located at, to be leaned on
The side of nearly LED terminal pad 8, connecting elements would not block the luminous of the non-electrode place of LED chip.Top electrodes 51 pass through altogether
Brilliant technique or soldering tin technique are fixedly connected with connecting elements, or top electrodes 51 pass through ultrasonic welding process and connecting elements
It is fixedly connected, requires no solder bonds wire, the area of required top electrodes 51 is smaller, is easy to reduce the body of LED chip
Product, beneficial to the cost of reduction LED chip.
Described upper component also includes the insulator 271 or collets being arranged between two neighboring connection sheet 21.
Using four kinds of the soldering tin technique containing Reflow Soldering, eutectic welding procedure, ultrasonic welding process and dispensing die bond technique
Among more than a kind of technique, connection metal foil 50 is fixedly connected with corresponding LED top electrodes 51 and secondary terminal pad 8,
LED bottom electrodes 53 are made to be fixedly connected with the main terminal pads of LED 22.
Described upper circuit group, connection sheet 21 and lower circuit pack 35 and the connection between them all mainly use circuit
Plate technique is obtained（Containing printed circuit technology and printed substrate technique）, the copper foil of wiring board can be with turmeric, gold-plated, silver-plated and spray
Tin etc. is surface-treated.Described connection sheet 21 is copper foil layer, and the upper circuit pack 5, connection sheet 21 and lower circuit pack 35 are viscous
After conjunction, laser gets the hole LED putting holes 6 at circuit pack 5 on described, then in the corresponding company of bottom hole of LED putting holes 6
The top surface turmeric of contact pin 21 obtains the main terminal pads 22 of LED.
In actual use, when LED display, which is erect, to be set, now it is defined as this in front of the light-emitting area of LED display
The upper direction of text, the bonnet direction of LED display is defined as being defined as this paper's in front of this paper lower direction, i.e. LED display
Top, LED display rear is defined as the length direction rule of the connection sheet 21 of luminescence component in this paper lower section, LED display
The orientation for being set to the connection sheet 21 in 1 upper component of luminescence component in this paper fore-and-aft direction, LED display is defined as
This paper left and right directions, now the light-emitting area of LED display be defined as this paper horizontal plane or the horizontal plane close to this paper.
Because the luminescence component includes LED component and upper component, upper component includes multiple connections of metal material
Piece 21, upper component also includes the main terminal pads 22 of multiple LED of array distribution, and the main terminal pads 22 of LED are arranged on connection sheet 21 and pushed up
On face, upper component is provided with multiple LED putting holes 6 of array distribution, and the bottom of each LED putting hole 6 is to that should have described in one
The main terminal pads 22 of LED, LED component includes multiple LED monomers of array distribution, the bottom electrode of the LED chip of LED monomers
53 are fixedly connected and are electrically connected with the main terminal pads of LED 22, and in LED chip heat transfer to connection sheet 21, luminescence component is also wrapped
Lower circuit pack 35 and radiator are included, lower circuit pack 35 includes the lower circuit base plate 30 of insulating materials, lower circuit base plate
30 are connected with the bonding of the lower surface of connection sheet 21, and lower circuit pack 35 is provided with heat conduction groove 78, and the bottom land of heat conduction groove 78 is connection
The lower surface of piece 21, the heat that radiator includes in the radiating pin 701 being welded at heat conduction groove 78, connection sheet 21 passes through
Radiating pin 701 is delivered to radiator, then the perfect heat-dissipating of LED display, and quality better, performance is stable.
Because the connecting elements includes the articulamentum 502 of connection metal foil 50 and insulating materials, articulamentum 502 is with connecting
Connect metal foil 50 to be fixedly connected, connecting elements is just stablized, connection metal foil 50 surface is provided with the 1st pad and the 2nd pad, the 1st weldering
Disk is fixedly connected and is electrically connected with the top electrodes 51 of LED chip, and the 2nd pad is fixedly connected and electrically with LED terminal pad 8
Connection, the top electrodes 51 of LED chip are located at the connection gold connected close to the LED chip on the LED chip length direction
Belong to the side of the 2nd pad of paper tinsel 50, connection metal foil 50 would not block the luminous of the non-electrode place of LED chip, and then LED is shown
The LED of screen requires no solder bonds metal wire, and the tie point of LED chip and the main connection positions of LED is firm, and LED chip is with being connected
Firmly, the tie point of connection metal foil 50 and LED terminal pad 8 is firm, and each LED monomer is broken for the tie point of metal foil 50
It is replaceable, it is not necessary to traditional LED support, reduction LED chip volume is also helped, then the technique of LED display is simple, good
Rate is high, easily repair and stability is good, and LED packaging costs are greatly reduced, and LED costs are greatly reduced, LED is greatly reduced and shows
Display screen cost, solving the LED of traditional LED display needs solder bonds metal wire and traditional LED support and there is technique
It is complicated, yield is low, bond wire line is not shockproof, bond wire line tie point easily disconnects, luminous point spacing is big, cost is high and stably
Property difference the problem of.
Embodiment 2
Embodiment 2 is similar to Example 1, shown in reference picture 15, for the ease of production, using weld assembly, weld assembly bag
Welding matrix 503 and multiple connecting elements are included, is connected between welding matrix 503 and connecting elements provided with the 1st connector the 505 or the 2nd
The 1st connector 505 and the 2nd connector 506 are provided between junctor 506, or welding matrix 503 and connecting elements, matrix is welded
503 are fixedly connected by the 1st connector 505 and the one of both of the 2nd connector 506 or both with multiple connecting elements respectively.Weldering
Connected components are provided with matrix hole 504, and matrix hole 504 is easy to the movement and positioning of weld assembly in production.
Weld assembly is obtained by circuit board technique, and connection metal foil 50 is copper foil layer, and the articulamentum 502 of insulating materials is used
FPC sheet material, the 1st connector 505, the 2nd connector 506 and welding matrix 503 use the FPC of insulating materials
Sheet material.
Embodiment 3
Embodiment 3 is similar to Example 1, shown in reference picture 16, and main difference is one of left side or right side of connection sheet 21
Or the left and right sides is provided with multiple breach 215, breach 215 is located between front and rear two neighboring main terminal pad 22, and left and right is two neighboring
The breach 215 of connection sheet 21 is oppositely arranged.
Embodiment 4
Embodiment 4 is similar to Example 1, shown in reference picture 17, and huge is not that the position of LED chip top electrodes 51 is different.
In order to not have the electric conductor of spilling after the welding of top electrodes 51 and connecting elements（The electric conductor of spilling easily makes LED core
Piece short circuit or electric leakage）, top electrodes 51 four in outer rim four less than the LED chip top surface outer rim.
Embodiment 4 and embodiment 1 it is other it is huge be not that the upper circuit pack 5 does not set chip and places position 42, the LED chip
It is fixed on by glue in main terminal pad 22.Described lower wiring layer includes the multiple lower line layers being distributed up and down；It is described offline
Road component 35 also includes the underlying substrate of the insulating materials between two neighboring lower line layer, i.e., described lower circuit pack
35 be multilayer circuit board.
Embodiment 5
Embodiment 5 is similar to Example 1, and mainly huge is not that the main terminal pad 22 belongs to the connection sheet 21, the connection sheet
The bonding pad 212 of 21 top surface and main terminal pad 22 are all electrodeposited coatings.The bottom correspondence of each LED putting hole 6 sets one
The individual described main terminal pads 22 of LED, the main terminal pads 22 of described LED belong to the bottom of LED putting holes 6.Connection sheet described in production
21 are first electroplated, and then connection sheet 21 is bonded with the upper circuit pack 5 and lower circuit pack 35 again.
Claims (10)
1. a kind of LED display module, includes luminescence component；It is characterized in that：Described luminescence component include LED component and
Upper component；Described upper component includes multiple connection sheets of left-right situs, and the connection sheet is metal material, described in each
Connection sheet is provided with the main terminal pads of multiple LED in tandem；Described upper component also includes horizontally disposed upper circuit group
Part, the upper circuit pack includes the upper substrate of reach the standard grade layer and insulating materials, and described layer of reaching the standard grade is fixedly connected with upper substrate；
The upper substrate is located at the lower section for layer of reaching the standard grade, and the connection sheet is located at the top of the lower section of upper substrate, the upper substrate and connection sheet
Face bonding connection；Described upper component is provided with multiple LED putting holes of array distribution, the bottom of each LED putting hole
To that should have the main terminal pads of LED described in 1；Described LED component includes multiple LED monomers of array distribution, each institute
LED monomers are stated to be fixed in the main terminal pads of corresponding 1 LED；The layer of reaching the standard grade includes a plurality of first control in tandem
Metal foil, the layer of reaching the standard grade also includes a plurality of second control metal foil in tandem, before and after the layer of reaching the standard grade also includes
The a plurality of 3rd control metal foil of arrangement, the first control metal foil and the second control metal foil are respectively equipped with LED connection
Disk, the 3rd control metal foil is provided with LED times described terminal pad；Less than the LED times connection in the position of the main terminal pads of LED
The position of disk；Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes and bottom
Portion's electrode；The bottom electrode of the LED chip is fixedly connected and is electrically connected with the main terminal pads of LED；The connecting elements includes
There is the articulamentum of connection metal foil and insulating materials, the articulamentum is fixedly connected with being connected metal foil；The connection metal foil
Surface is provided with the 1st pad and the 2nd pad, and the 1st pad is fixedly connected and is electrically connected with the top electrodes of LED chip；Institute
The 2nd pad is stated to be fixedly connected and be electrically connected with LED terminal pad.
2. a kind of LED according to claim 1 display module, it is characterized in that：The luminescence component also includes offline
Road component, radiator and control integrated package, the radiator are located at the lower section of lower circuit pack, the radiator and lower circuit group
Part is fixedly connected；Described lower circuit pack includes the lower circuit base plate of lower wiring layer and insulating materials, the lower wiring layer
It is fixedly connected with lower circuit base plate；The control integrated package is arranged on the lower surface of lower wiring layer；The lower circuit base plate is located at
The lower section of connection sheet, the lower wiring layer is located at the lower section of lower circuit base plate, and the lower circuit base plate glues with connection sheet lower surface
Close connection；The lower circuit pack is provided with multiple heat conduction grooves, and the heat conduction slot opening is downward, the bottom land of the heat conduction groove
For the lower surface of connection sheet；The radiator includes the multiple radiating pins for the metal material for being welded on heat conduction groove；Often
One connection sheet is to that should have 1 heat conduction groove described above；Each described radiating described above of connection sheet correspondence 1 is drawn
Pin.
3. a kind of LED according to claim 2 display module, it is characterized in that：The rear and front end of the heat conduction groove away from
It is more than H4 apart from for H4, H3 from the left and right ends for H3, the heat conduction groove.
4. a kind of LED according to claim 1 display module, it is characterized in that：Described luminescence component also includes top
Layer；The top layer includes the top line base board of the black of insulating materials；The top layer is provided with top layer hole；The top layer hole exists
The surface of LED putting holes, the top layer hole is more than LED putting holes.
5. a kind of LED according to claim 1 display module, it is characterized in that：The upper circuit pack, which is provided with, is located at LED
Interstitial hole directly over putting hole, the horizontal section area of the interstitial hole is more than the horizontal section area of LED putting holes；It is described
Position is placed in the bottom of interstitial hole provided with chip, and chip places position of the position higher than the main terminal pads of LED of position, and LED chip is fixed
Placed in chip on position；The upper circuit pack also includes bonds the middle line layer being connected with upper substrate upper surface；In described
Line layer places position provided with described chip.
6. a kind of LED according to claim 1 display module, it is characterized in that：The upper circuit pack is provided with multiple blind
Hole, partly or entirely LED times described terminal pad is respectively positioned at blind hole inner bottom part.
7. a kind of LED according to claim 1 display module, it is characterized in that：The top electrodes of the LED chip are located at
The side of 2nd pad of the connection metal foil connected close to the LED chip on the LED chip length direction.
8. a kind of LED according to claim 1 display module, it is characterized in that：Before the top surface of the connection sheet includes
The multiple bonding pads arranged afterwards, bonding pad is located between the main terminal pad of front and rear two adjacent LEDs, the following table of bonding pad and upper substrate
Face bonding connection.
9. a kind of LED according to claim 2 display module, it is characterized in that：The radiator also includes metal material
Multiple fin of matter, each described fin and corresponding radiating pin integrally connected；The radiator also includes use
In the radiating piece of the insulating materials of fixed multiple fin.
10. a kind of LED according to claim 1 display module, it is characterized in that：Each described LED monomer includes 3
The individual LED chip, is the first color LED chip, the second color LED chip and the 3rd color LED chip respectively；Line up left and right
First color LED chip of multiple LED monomers of one row is electrically connected with 1 first control metal foil；What left and right was arranged in a row
Second color LED chip of multiple LED monomers is electrically connected with 1 second control metal foil；Multiple LED that left and right is arranged in a row
3rd color LED chip of monomer is electrically connected with 1 article of the 3rd control metal foil.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610521388 | 2016-07-05 | ||
| CN2016105213889 | 2016-07-05 |
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| CN107146542A true CN107146542A (en) | 2017-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710543781.2A Pending CN107146542A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module |
| CN201710543811.XA Pending CN107578711A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module |
| CN201710543783.1A Pending CN107146543A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module |
| CN201710544259.6A Pending CN107578712A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module and production method |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710543811.XA Pending CN107578711A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module |
| CN201710543783.1A Pending CN107146543A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module |
| CN201710544259.6A Pending CN107578712A (en) | 2016-07-05 | 2017-07-05 | A kind of LED display module and production method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108899407B (en) * | 2018-07-09 | 2019-08-09 | 安徽触威电子科技有限公司 | The packaging method of integrated LED display module |
| CN108806525A (en) * | 2018-07-11 | 2018-11-13 | 深圳明智超精密科技有限公司 | A kind of LED display mask |
| CN111029396B (en) * | 2019-12-26 | 2022-08-19 | 维沃移动通信有限公司 | Display module and electronic equipment |
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2017
- 2017-07-05 CN CN201710543781.2A patent/CN107146542A/en active Pending
- 2017-07-05 CN CN201710543811.XA patent/CN107578711A/en active Pending
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Also Published As
| Publication number | Publication date |
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| CN107146543A (en) | 2017-09-08 |
| CN107578711A (en) | 2018-01-12 |
| CN107578712A (en) | 2018-01-12 |
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Application publication date: 20170908 |