CN107578711A - L ED display assembly - Google Patents
L ED display assembly Download PDFInfo
- Publication number
- CN107578711A CN107578711A CN201710543811.XA CN201710543811A CN107578711A CN 107578711 A CN107578711 A CN 107578711A CN 201710543811 A CN201710543811 A CN 201710543811A CN 107578711 A CN107578711 A CN 107578711A
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- Prior art keywords
- led
- connection sheet
- chip
- layer
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 239000011888 foil Substances 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 33
- 239000000178 monomer Substances 0.000 claims description 32
- 239000011810 insulating material Substances 0.000 claims description 25
- 238000004020 luminiscence type Methods 0.000 claims description 25
- 238000009826 distribution Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000012774 insulation material Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- 239000011159 matrix material Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 235000003392 Curcuma domestica Nutrition 0.000 description 4
- 244000008991 Curcuma longa Species 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 235000003373 curcuma longa Nutrition 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 235000013976 turmeric Nutrition 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000013517 stratification Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
A L ED display assembly relates to the technical field of L ED packaging and L ED display screens and solves the problems that a traditional L ED display screen is poor in heat dissipation performance and needs a L ED support, and the L ED component comprises a L ED single body, an upper circuit assembly comprising an upper wire layer, a plurality of connecting sheets arranged in the left-right direction, a plurality of L ED main connecting discs are arranged on the top surfaces of the connecting sheets, a L ED single body is fixed on a corresponding L ED main connecting disc, the upper circuit assembly is provided with a plurality of L ED placing holes, a L ED chip is fixed on the L ED main connecting disc, the lower circuit assembly comprises a plurality of heat conduction grooves, and a heat radiator is connected with the connecting sheets through heat dissipation pins at the heat conduction grooves.
Description
Technical field
The present invention relates to LED encapsulation and the LED display technical field including LED television, LED encapsulation belong to half
Conductor technology.
Background technology
LED is the light emitting diode that LED chip encapsulation forms.LED television refers to that LED chip is directly luminous and forms image
Television set.LED display is in the circuit board and by the directly luminous display screens for forming image of LED by multiple LED installations
（There is other control LED electronic component on wiring board）.Particularly (LED is the three-in-one full color display of RGB
One luminous point, a LED are a pixel, are placed on by 1 red 1 green 1 blue three LED chips in a LED bowl by envelope
Dress forms a LED)；LED display includes outdoor LED display screen, indoor LED display and LED television display screen etc.,
LED display is referred to as light-emitting diode display.Existing LED display uses PCB, in the upper surface of PCB
Multiple LED are installed, multiple control LED integrated package is installed in the lower surface of PCB, PCB does not radiate
Structure, the thermal diffusivity of PCB is very poor, and then existing LED and LED display weak heat-dissipating, poor quality, stability are poor；It is existing
LED support is needed in the LED production processes of some LED displays, LED support includes straight cutting LED support and paster LED branch
Frame, LED support cost is high, and LED support cuts unnecessary part after die bond, solder bonds metal wire and sealing（That is cutting
Technique）, LED production costs are high, and LED costs are high, LED stability, and LED display cost is high, and stability is poor.
The content of the invention
Existing LED display, which has wiring board, does not have the problem of radiator structure and weak heat-dissipating, and existing LED display
There is the problem of needing straight cutting LED support or paster LED bracket in LED, existing LED display has that cost is high and stability difference
Problem, the present invention propose a kind of LED display module, the technical solution adopted by the present invention to solve above-mentioned problem
It is：
A kind of LED display module, includes luminescence component；Described luminescence component includes LED component and upper component；It is described
Upper component include multiple connection sheets of left-right situs, the connection sheet is metal material, and each described connection sheet is provided with
The main terminal pads of multiple LED in tandem；Described upper component also includes horizontally disposed upper circuit pack, the upper circuit
Component includes the upper substrate of reach the standard grade layer and insulating materials, and described layer of reaching the standard grade is fixedly connected with upper substrate；The upper substrate position
In the lower section for layer of reaching the standard grade, the connection sheet is located at the lower section of upper substrate, and the top surface bonding of the upper substrate and connection sheet connects；Institute
The upper component stated is provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is corresponding with described in 1
The main terminal pads of LED；Described LED component includes multiple LED monomers of array distribution, and each described LED monomer is fixed
In the main terminal pads of corresponding 1 LED；The layer of reaching the standard grade include in tandem it is a plurality of first control metal foil, it is described on
Line layer also includes a plurality of second control metal foil in tandem, and the layer of reaching the standard grade also includes a plurality of 3rd in tandem
Metal foil is controlled, the first control metal foil and the second control metal foil are respectively equipped with LED terminal pad, the 3rd control
Metal foil is provided with LED times described terminal pad；Position of the position of the main terminal pads of LED less than LED terminal pad.
Described LED monomers include LED chip, and the LED chip is electrically connected with LED terminal pad；The LED core
Piece is fixed in the main terminal pads of LED by glue, and the LED chip is electrically connected with the main terminal pads of LED；Each described LED is mono-
Body includes 3 LED chips, is the first color LED chip, the second color LED chip and the 3rd color LED core respectively
Piece；First color LED chip of multiple LED monomers that left and right is arranged in a row is electrically connected with 1 first control metal foil；Left and right
Second color LED chip of the multiple LED monomers being arranged in a row is electrically connected with 1 second control metal foil；Line up one in left and right
3rd color LED chip of multiple LED monomers of row is electrically connected with 1 article of the 3rd control metal foil；The luminescence component also wraps
Included lower circuit pack, radiator and control integrated package, the radiator and be located at the lower section of lower circuit pack, the radiator and
Lower circuit pack is fixedly connected；Described lower circuit pack includes the lower circuit base plate of lower wiring layer and insulating materials, described
Lower wiring layer is fixedly connected with lower circuit base plate；The control integrated package is arranged on the lower surface of lower wiring layer；The lower circuit
Substrate is located at the lower section of connection sheet, and the lower wiring layer is located at the lower section of lower circuit base plate, the lower circuit base plate and connection sheet
Lower surface bonding connection；The lower circuit pack is provided with multiple heat conduction grooves, and the heat conduction slot opening is downward, and the heat conduction is recessed
The bottom land of groove is the lower surface of connection sheet；The radiator includes the multiple radiatings for the metal material for being welded on heat conduction groove
Pin；Each described connection sheet is corresponding with 1 heat conduction groove described above；Corresponding more than 1 institute of each described connection sheet
State radiating pin.
The radiator also includes the radiator of insulating materials and the radiating block of metal material, and the radiator, which is fixed, to be connected
It is connected between radiating pin and radiating block.
The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on
The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet.
Described luminescence component also includes top layer；The top layer includes the top line base board of the black of insulating materials；
The top layer is provided with top layer hole；The top layer hole is more than LED putting holes in the surface of LED putting holes, the top layer hole.
The upper circuit pack is provided with the interstitial hole directly over LED putting holes, the horizontal cross-section face of the interstitial hole
Horizontal section area of the product more than LED putting holes；The bottom of the interstitial hole is provided with chip and places position, and chip places the position of position
Higher than the position of the main terminal pads of LED, LED chip is fixed on chip and placed on position；The upper circuit pack also includes and upper base
The middle line layer of plate upper surface bonding connection；The middle line layer is provided with described chip and places position.
The distance of left and right be H1 between the main terminal pad left end of the LED and connection sheet left surface, and main connect of the LED is faced left
End is positioned at the right of connection sheet left surface, and the distance of left and right is H2, LED between the main terminal pad right-hand members of LED and connection sheet right flank
Main terminal pad right-hand member is located at the left side of connection sheet right flank, and H1 is more than 0, H2 and is more than 0.
Described lower wiring layer includes the multiple lower line layers being distributed up and down, is provided between two neighboring lower line layer exhausted
The underlying substrate of edge material；Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, two neighboring upper wiring layer it
Between be provided with insulating materials top substrate layer.
The upper circuit pack is provided with multiple blind holes, and partly or entirely LED times described terminal pad is located in blind hole respectively
Bottom.
The top surface of the connection sheet includes multiple bonding pads in tandem, and bonding pad is located at front and rear two adjacent LEDs
Between main terminal pad, the lower surface bonding connection of bonding pad and upper substrate.
The rear and front end distance of the heat conduction groove is H3, and the left and right ends distance of the heat conduction groove is H4, and H3 is more than
H4。
The radiator also includes multiple fin of metal material, and each described fin draws with corresponding radiating
Pin integrally connected；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin.
The beneficial effects of the invention are as follows：Luminescence component includes LED component and upper component, and upper component includes metal material
Multiple connection sheets, upper component also includes the main terminal pads of multiple LED of array distribution, and the main terminal pads of LED are arranged on connection sheet
On top surface, upper component is provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is corresponding with described in one
The main terminal pads of LED, LED component includes multiple LED monomers of array distribution, the bottom electrode of the LED chip of LED monomers with
The main terminal pads of LED are fixedly connected and are electrically connected with, and in LED chip heat transfer to connection sheet, luminescence component also includes offline
Road component and radiator, lower circuit pack include the lower circuit base plate of insulating materials, lower circuit base plate and connection sheet lower surface
Bonding connection, lower circuit pack are provided with heat conduction groove, and the bottom land of heat conduction groove is the lower surface of connection sheet, and radiator includes weldering
It is connected on the radiating pin of heat conduction groove, the heat in connection sheet is delivered to radiator by the pin that radiates, then LED display
Perfect heat-dissipating, quality better, stable performance.LED chip is electrical by bonding wire or connecting elements and LED terminal pad
Connection, LED chip are fixed in the main terminal pads of LED by glue, it is not necessary to the cost of traditional LED support, then LED display
Be greatly reduced, be advantageous to LED display luminous point spacing do it is small.The luminous point spacing that solves traditional LED display is big, cost
The problem of height, unstable bad and performance that radiates.
Brief description of the drawings
Fig. 1 is the main structure diagram of the luminescence component for not drawing radiator of inventive embodiments 1；
Fig. 2 is the overlooking the structure diagram of the luminescence component for not drawing LED component of inventive embodiments 1；
Fig. 3 is the right side structural representation of the luminescence component for not drawing radiator of inventive embodiments 1；
Fig. 4 is the right side structural representation of the connection sheet of inventive embodiments 1；
Fig. 5 is wherein 1 LED chips of inventive embodiments 1, connecting elements and controls the right side of metal foil to regard structure schematic diagram；
Fig. 6 is the overlooking the structure diagram of the LED chip in Fig. 5；
Fig. 7 is structure enlargement diagram in Fig. 2 in the range of 1 top through hole and that position is placed without chip；
Fig. 8 for do not have in Fig. 7 push up substrate have additional chip place position schematic diagram；
Fig. 9 be had additional in Fig. 8 the V-V ' after LED monomers to diagrammatic cross-section；
Figure 10 is to have additional the schematic diagram after LED chip in Fig. 8；
Figure 11 is that the schematic diagram after connection metal foil is had additional in Figure 10；
Figure 12 is the overlooking the structure diagram of the connection sheet of inventive embodiments 1；
Figure 13 is the present invention looks up structural representation of the heat conduction groove of the embodiment of the present invention 1；
Figure 14 is the main structure diagram of the radiator of inventive embodiments 1；
Figure 15 is the overlooking the structure diagram of the weld assembly of the embodiment of the present invention 2；
Figure 16 is the overlooking the structure diagram of the connection sheet of inventive embodiments 3；
Figure 17 is the overlooking the structure diagram of the LED chip of inventive embodiments 4.
Embodiment
The present embodiment is invention preferred embodiment, other its every principle and basic structure it is identical with the present embodiment or
Person is approximate, within invention protection domain.
Embodiment 1
Shown in reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, Figure 11, Figure 12, Figure 13 and Figure 14,
A kind of LED display module, includes luminescence component；Described luminescence component includes LED component and upper component；Described is upper
Component includes multiple connection sheets 21 of left-right situs, and the connection sheet 21 is metal material, and two neighboring connection sheet 21 is electrical
Isolation；Described upper component also includes horizontally disposed upper circuit pack 5, the upper circuit pack 5 include reach the standard grade layer and
The upper substrate 4 of insulating materials, described layer of reaching the standard grade are fixedly connected with upper substrate 4；The upper substrate 4 is located at the lower section for layer of reaching the standard grade,
The connection sheet 21 is located at the lower section of upper substrate 4, and the lower surface of the upper substrate 4 connects with the top surface bonding of connection sheet 21；Institute
The upper component stated also includes the main terminal pads 22 of multiple LED of array distribution, and the main terminal pads 22 of LED are arranged on connection sheet 21
On top surface, the main terminal pads 22 of LED are fixedly connected and are electrically connected with connection sheet 21；Described upper component is provided with array distribution
Multiple LED putting holes 6, the bottom of each LED putting hole 6 is correspondingly provided with the main terminal pads 22 of LED described in one；Institute
The LED component stated includes multiple LED monomers of array distribution, and multiple LED monomers are separately fixed at the described main terminal pads of LED
On 22, described LED monomers terminal pad 22 main with LED corresponds；The layer of reaching the standard grade includes a plurality of first in tandem
Metal foil 71 is controlled, the layer of reaching the standard grade also includes a plurality of second control metal foil 72 in tandem, and the layer of reaching the standard grade also wraps
A plurality of 3rd control metal foil in tandem is included, the first control metal foil 71 and second controls metal foil 72 to set respectively
There is LED terminal pad 8, the 3rd control metal foil is provided with described LED terminal pad 8；The position of the main terminal pads 22 of LED
Set low in the position of LED terminal pad 8.
The main terminal pads 22 of LED are turmeric pad, and the main terminal pads 22 of LED are arranged on the top surface of connection sheet 21,
The main terminal pads 22 of LED are not belonging to connection sheet 21.The top surface of the connection sheet 21 includes bonding pad 212, bonding pad 212 with
The lower surface bonding connection of upper substrate 4.
1 LED monomer is the LED of 1 pixel, LED monomer spacing 0.1-5 millimeters, i.e. pel spacing 0.1-5 millimeters.
Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes 51, chip
Main body 52 and bottom electrode 53；The terminal pad 22 main with LED of bottom electrode 53 of the LED chip is fixedly connected and is electrically connected with；
The connecting elements includes the articulamentum 502 of connection metal foil 50 and insulating materials, and the articulamentum 502 is with being connected metal foil
50 are fixedly connected；Connection metal foil 50 surface is provided with the top of the 1st pad and the 2nd pad, the 1st pad and LED chip
Portion's electrode 51 is fixedly connected and is electrically connected with；2nd pad is fixedly connected and is electrically connected with LED terminal pad 8；It is described
The top electrodes 51 of LED chip are located at the connection metal foil 50 connected close to the LED chip on the LED chip length direction
The 2nd pad side；Each described LED monomer includes 3 LED chips, be respectively the first color LED chip,
Second color LED chip and the 3rd color LED chip；First color LED chip of multiple LED monomers that left and right is arranged in a row with
1 first control metal foil 71 is electrically connected with；Second color LED chip of multiple LED monomers that left and right is arranged in a row with 1 article the
Two control metal foils 72 are electrically connected with；3rd color LED chip of multiple LED monomers that left and right is arranged in a row and 1 article of the 3rd control
Metal foil processed is electrically connected with.
The luminescence component also includes lower circuit pack 35, radiator and control integrated package 34, the radiator and is located at
The lower section of lower circuit pack 35, the radiator are fixedly connected with lower circuit pack 35；Described lower circuit pack 35 includes
The lower circuit base plate 30 of lower wiring layer 36 and insulating materials, the lower wiring layer 36 are fixedly connected with lower circuit base plate 30；It is described
Integrated package 34 is controlled to be arranged on the lower surface of lower wiring layer 36；The lower circuit base plate 30 is located at the lower section of connection sheet 21, described
Lower wiring layer 36 is located at the lower section of lower circuit base plate 30, and the lower circuit base plate 30 connects with the bonding of the lower surface of connection sheet 21；Institute
State lower circuit pack 35 and be provided with multiple heat conduction grooves 78, Open Side Down for the heat conduction groove 78, the bottom land of the heat conduction groove 78
For the lower surface of connection sheet 21；The radiator includes the multiple radiating pins for the metal material being welded at heat conduction groove 78
701；Each described connection sheet 21 is corresponding with 1 heat conduction groove 78 described above；Corresponding 1 of each described connection sheet 21 with
The upper radiating pin 701；The rear and front end distance of the heat conduction groove 78 is H3, the left and right ends of the heat conduction groove 78 away from
It is more than H4 from for H4, H3.The luminescence component also includes the main control integrated package for being separately mounted to the lower lower surface of wiring layer 36
28 and lead socket 58, the control integrated package 34, which passes through, is arranged on leading among the main terminal pads 22 of four LED that two rows two arrange
Electric hole is electrically connected with LED terminal pad 8, and main control integrated package 28 is electrically connected with connection sheet 21.
The radiator also includes multiple fin 702 of metal material, each described fin 702 with it is corresponding
Radiate the integrally connected of pin 701；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin 702
703。
The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on
The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet 21.
Described luminescence component also includes top layer 10；The top layer 10 includes the top line roadbed of the black of insulating materials
Plate；The top layer 10 is provided with top layer hole 62；The top layer hole 62 is more than in the surface of LED putting holes 6, the top layer hole 62
LED putting holes 6；The top layer hole 62 makes LED terminal pad 8 not blocked by top layer 10.
The distance of left and right is H1 between the main left end of terminal pad 22 of the LED and the left surface of connection sheet 21, the main connections of LED
The left end of disk 22 is located at the right of the left surface of connection sheet 21, left and right between the main right-hand members of terminal pad 22 of LED and the right flank of connection sheet 21
Distance is H2, and the main right-hand members of terminal pad 22 of LED are located at the left side of the right flank of connection sheet 21, and H1 is more than 0, H2 and is more than 0.
The height of the connection sheet 21 is 10 microns to 3 millimeters.The LED monomers, which also include, encases LED chip, connection
The Protection glue of metal foil 50 and LED terminal pad 8, Protection glue belong to more than one of silica gel and epoxy resin.
The upper circuit pack 5 is provided with the interstitial hole 63 directly over LED putting holes 6, interstitial hole 63 be square opening or
Circular port, the horizontal section area of interstitial hole 63 are more than the horizontal section area of LED putting holes 6；The bottom of interstitial hole 63 is provided with
Chip places position 42, and chip places position of the position higher than the main terminal pads 22 of LED of position 42, and chip places position 42 and blocked LED
Chip makes LED chip terminal pad 22 main with LED not contact, and LED chip is placed on chip and placed on position 42.
The upper circuit pack 5 also includes the upper circuit base plate 2 of wiring layer 1, middle wiring layer 3 and insulating materials；Institute
The lower surface and the bonding of upper circuit base plate 2 for stating wiring layer 1 connect, and the lower surface of the upper circuit base plate 2 and middle wiring layer 3 are viscous
Close connection；Described upper circuit pack 5 also includes the tertiary circuit substrate 40 of the 3rd wiring layer 41 and insulating materials, described
Chip is placed position 42 and is arranged on the 3rd wiring layer 41；The lower surface of the middle wiring layer 3 is viscous with tertiary circuit substrate 40
Close connection, the bonding of the lower surface of the tertiary circuit substrate 40 and the 3rd wiring layer 41 connects, the 3rd wiring layer 41 with it is upper
The upper surface bonding connection of substrate 4.The upper wiring layer 1 includes a plurality of first control metal foil 71, and the middle wiring layer 3 wraps
A plurality of second control metal foil 72 and a plurality of 3rd control metal foil are included.
Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, and insulation is provided between two neighboring upper wiring layer
The top substrate layer of material, the upper wiring layer 1 and middle wiring layer 3 belong to described upper wiring layer, and upper circuit base plate 2 belongs to described
Top substrate layer.
Described upper component also includes control metal foil 7, and the described first control metal foil 71, second controls metal foil
72 and the 3rd control metal foil to belong to described control metal foil 7.
Described upper circuit pack 5 also includes the top substrate 9 of insulating materials, pushes up the lower surface of substrate 9 and upper wiring layer 1
Upper surface be fixedly connected.The LED monomers also include electric conductor, and the connection metal foil 50 passes through electric conductor and LED times
Terminal pad 8 connects.In order to eliminate the influence of the difference in height of 3 LED terminal pads 8 corresponding to 3 LED chips, and in order to limit
The scope of conductive body, blind hole, each LED terminal pad 8 are respectively equipped with corresponding to each LED monomer at each LED terminal pad 8
Place is located at the inner bottom part of blind hole respectively, and blind hole has spacing not connect with LED putting holes 6.The electric conductor is located in blind hole,
Blind hole is divided into the first hole 91, the second hole 92 and the 3rd hole 93.It can not also set or set blind hole less, blind hole can also place with LED
Hole 6 connects.For the ease of laser boring, there is rounding 90 at the 3rd 93 4 jiaos of hole（Other various holes can also have rounding）.
The main terminal pads 22 of LED, LED terminal pad 8, the 1st pad and the 2nd pad are turmeric pad, gold plated pads, plating silver soldering
One or more among disk, alloy pad, five kinds of spray soldering disk,
Connecting elements is obtained by circuit board technique, and the connection metal foil 50 of connecting elements is copper foil layer, the articulamentum of insulating materials
502 use FPC sheet material, and the articulamentum 502 connects with being connected the bonding of metal foil 50, is advantageous to connect metal foil 50
It is easy to operation in process of production and to stablize connection metal foil 50 indeformable.
LED chip uses the LED chip of vertical stratification, and LED chip rectangle, the top electrodes 51 of LED chip, which are located at, to be leaned on
The side of nearly LED terminal pad 8, connecting elements would not block the luminous of the non-electrode place of LED chip.Top electrodes 51 pass through altogether
Brilliant technique or soldering tin technique are fixedly connected with connecting elements, or top electrodes 51 pass through ultrasonic welding process and connecting elements
It is fixedly connected, requires no solder bonds wire, the area of required top electrodes 51 is smaller, is easy to reduce the body of LED chip
Product, beneficial to the cost for reducing LED chip.
Described upper component also includes the insulator 271 or collets being arranged between two neighboring connection sheet 21.
Using four kinds of the soldering tin technique containing Reflow Soldering, eutectic welding procedure, ultrasonic welding process and dispensing die bond technique
Among more than a kind of technique, connection metal foil 50 is fixedly connected with corresponding LED top electrodes 51 and secondary terminal pad 8,
It is fixedly connected with the terminal pad 22 main with LED of LED bottom electrodes 53.
Described upper circuit group, connection sheet 21 and lower circuit pack 35 and the connection between them all mainly uses circuit
Plate technique obtains（Containing printed circuit technology and printed substrate technique）, the copper foil of wiring board can be with turmeric, gold-plated, silver-plated and spray
Tin etc. is surface-treated.Described connection sheet 21 is copper foil layer, and the upper circuit pack 5, connection sheet 21 and lower circuit pack 35 are viscous
After conjunction, laser gets the hole LED putting holes 6 at circuit pack 5 on described, then connects corresponding to the bottom hole in LED putting holes 6
The top surface turmeric of contact pin 21 obtains the main terminal pads 22 of LED.
In actual use, when LED display, which is erect, to be set, this is now defined as in front of the light-emitting area of LED display
The upper direction of text, the bonnet direction of LED display are defined as this paper lower direction, i.e., being defined as this paper's in front of LED display
Top, LED display rear are defined as this paper lower section, the length direction rule of the connection sheet 21 of luminescence component in LED display
It is set to this paper fore-and-aft direction, the orientation of the connection sheet 21 in LED display in the upper component of 1 of luminescence component is defined as
This paper left and right directions, now the light-emitting area of LED display be defined as this paper horizontal plane or the horizontal plane close to this paper.
Because the luminescence component includes LED component and upper component, upper component includes multiple connections of metal material
Piece 21, upper component also include the main terminal pads 22 of multiple LED of array distribution, and the main terminal pads 22 of LED are arranged on connection sheet 21 and pushed up
On face, upper component is provided with multiple LED putting holes 6 of array distribution, and the bottom of each LED putting hole 6 is corresponding with described in one
The main terminal pads 22 of LED, LED component includes multiple LED monomers of array distribution, the bottom electrode of the LED chip of LED monomers
53 terminal pads 22 main with LED are fixedly connected and are electrically connected with, and in LED chip heat transfer to connection sheet 21, luminescence component also wraps
Lower circuit pack 35 and radiator are included, lower circuit pack 35 includes the lower circuit base plate 30 of insulating materials, lower circuit base plate
30 connect with the bonding of the lower surface of connection sheet 21, and lower circuit pack 35 is provided with heat conduction groove 78, and the bottom land of heat conduction groove 78 is connection
The lower surface of piece 21, radiator include the radiating pin 701 being welded at heat conduction groove 78, and the heat in connection sheet 21 passes through
Radiating pin 701 is delivered to radiator, then the perfect heat-dissipating of LED display, quality better, stable performance.
Because the connecting elements includes the articulamentum 502 of connection metal foil 50 and insulating materials, articulamentum 502 is with connecting
Connect metal foil 50 to be fixedly connected, connecting elements is just stablized, and connection metal foil 50 surface is provided with the 1st pad and the 2nd pad, the 1st weldering
Disk is fixedly connected and is electrically connected with the top electrodes 51 of LED chip, and the 2nd pad is fixedly connected and electrically with LED terminal pad 8
Connection, the top electrodes 51 of LED chip are located at the connection connected close to the LED chip the gold on the LED chip length direction
Belong to the side of the 2nd pad of paper tinsel 50, connection metal foil 50 would not block the luminous of the non-electrode place of LED chip, and then LED is shown
The LED of screen requires no solder bonds metal wire, and the tie point of LED chip and the main connection positions of LED is firm, and LED chip is with being connected
The tie point of metal foil 50 is firm, and the tie point of connection metal foil 50 and LED terminal pad 8 is firm, and each LED monomer is broken
It is replaceable, it is not necessary to traditional LED support, to also help and reduce LED chip volume, then the technique of LED display is simple, good
Rate is high, easily maintenance and stability are good, and LED packaging costs are greatly reduced, and LED costs are greatly reduced, LED is greatly reduced and shows
Display screen cost, solving the LED of traditional LED display needs solder bonds metal wire and traditional LED support and technique be present
It is complicated, yield is low, bond wire line is not shockproof, bond wire line tie point easily disconnects, luminous point spacing is big, cost is high and stably
The problem of property difference.
Embodiment 2
Embodiment 2 is similar to Example 1, shown in reference picture 15, for the ease of production, using weld assembly, weld assembly bag
Welding matrix 503 and multiple connecting elements are included, welds and the 1st connector the 505 or the 2nd company is provided between matrix 503 and connecting elements
The 1st connector 505 and the 2nd connector 506 are provided between junctor 506, or welding matrix 503 and connecting elements, welds matrix
503 are fixedly connected by the 1st connector 505 and the one of both of the 2nd connector 506 or both with multiple connecting elements respectively.Weldering
Connected components are provided with matrix hole 504, and matrix hole 504 is easy to the movement and positioning of weld assembly in production.
Weld assembly is obtained by circuit board technique, and connection metal foil 50 is copper foil layer, and the articulamentum 502 of insulating materials uses
FPC sheet material, the 1st connector 505, the 2nd connector 506 and welding matrix 503 use the FPC of insulating materials
Sheet material.
Embodiment 3
Embodiment 3 is similar to Example 1, and shown in reference picture 16, main difference is one of left side or right side of connection sheet 21
Or the left and right sides is provided with multiple breach 215, breach 215 is located between front and rear two neighboring main terminal pad 22, and left and right is two neighboring
The breach 215 of connection sheet 21 is oppositely arranged.
Embodiment 4
Embodiment 4 is similar to Example 1, and shown in reference picture 17, huge is not that the position of LED chip top electrodes 51 is different.
In order to not have the electric conductor of spilling after the welding of top electrodes 51 and connecting elements（The electric conductor of spilling easily makes LED core
Piece short circuit or electric leakage）, top electrodes 51 four in outer rim four less than the LED chip top surface outer rim.
Embodiment 4 and embodiment 1 it is other it is huge be not that the upper circuit pack 5 does not set chip and places position 42, the LED chip
It is fixed on by glue in main terminal pad 22.Described lower wiring layer includes the multiple lower line layers being distributed up and down；It is described offline
Road component 35 also includes the underlying substrate of the insulating materials between two neighboring lower line layer, i.e., described lower circuit pack
35 be multilayer circuit board.
Embodiment 5
Embodiment 5 is similar to Example 1, and mainly huge is not that the main terminal pad 22 belongs to the connection sheet 21, the connection sheet
The bonding pad 212 of 21 top surface and main terminal pad 22 are all electrodeposited coatings.The bottom of each LED putting hole 6 correspondingly sets one
The individual described main terminal pads 22 of LED, the main terminal pads 22 of described LED belong to the bottom of LED putting holes 6.Connection sheet described in production
21 first electroplate, and then connection sheet 21 bonds with the upper circuit pack 5 and lower circuit pack 35 again.
Embodiment 6
Embodiment 6 is similar to Example 1, the difference is that LED chip is electrically connected with by bonding wire and LED terminal pad 8.
The red LED chips of embodiment 6 are electrically connected with by elargol terminal pad 22 main with LED, non-perpendicular structure blue LED die and green
Color LED chip is electrically connected with by bonding wire terminal pad 22 main with LED respectively, or vertical stratification blue LED die and green
Color LED chip is electrically connected with by elargol terminal pad 22 main with LED respectively.
Claims (10)
1. a kind of LED display module, includes luminescence component；It is characterized in that：Described luminescence component include LED component and
Upper component；Described upper component includes multiple connection sheets of left-right situs, and the connection sheet is metal material, described in each
Connection sheet is provided with the main terminal pads of multiple LED in tandem；Described upper component also includes horizontally disposed upper circuit group
Part, the upper circuit pack include the upper substrate of reach the standard grade layer and insulating materials, and described layer of reaching the standard grade is fixedly connected with upper substrate；
The upper substrate is located at the lower section for layer of reaching the standard grade, and the connection sheet is located at the top of the lower section of upper substrate, the upper substrate and connection sheet
Face bonding connection；Described upper component is provided with multiple LED putting holes of array distribution, the bottom of each LED putting hole
It is corresponding with the main terminal pads of LED described in 1；Described LED component includes multiple LED monomers of array distribution, each institute
LED monomers are stated to be fixed in corresponding 1 main terminal pad of LED；The layer of reaching the standard grade includes a plurality of first control in tandem
Metal foil, the layer of reaching the standard grade also include a plurality of second control metal foil in tandem, and the layer of reaching the standard grade also includes front and rear
The a plurality of 3rd control metal foil of arrangement, the first control metal foil and the second control metal foil are respectively equipped with LED connection
Disk, the 3rd control metal foil are provided with LED times described terminal pad；Less than the LED times connection in the position of the main terminal pads of LED
The position of disk；Described LED monomers include LED chip, and the LED chip is electrically connected with LED terminal pad；The LED
Chip is fixed in the main terminal pads of LED by glue, and the LED chip is electrically connected with the main terminal pads of LED；The luminescence component is also
Include lower circuit pack, radiator and control integrated package, the radiator and be located at the lower section of lower circuit pack, the radiator
It is fixedly connected with lower circuit pack；Described lower circuit pack includes the lower circuit base plate of lower wiring layer and insulating materials, institute
Lower wiring layer is stated to be fixedly connected with lower circuit base plate；The control integrated package is arranged on the lower surface of lower wiring layer；It is described offline
Base board is located at the lower section of connection sheet, and the lower wiring layer is located at the lower section of lower circuit base plate, and the lower circuit base plate is with being connected
The bonding connection of piece lower surface；The lower circuit pack is provided with multiple heat conduction grooves, and the heat conduction slot opening is downward, the heat conduction
The bottom land of groove is the lower surface of connection sheet；The radiator includes the multiple of metal material for being welded on heat conduction groove and dissipated
Hot pin；Each described connection sheet is corresponding with 1 heat conduction groove described above；Each described connection sheet is corresponding more than 1
The radiating pin.
2. a kind of LED according to claim 1 display module, it is characterized in that：The radiator also includes insulation material
The radiator of material and the radiating block of metal material, the radiator are fixedly connected between radiating pin and radiating block.
3. a kind of LED according to claim 1 display module, it is characterized in that：The luminescence component also includes vertically
The perpendicular circuit pack and main integrated package set；The main integrated package is arranged on the surface of perpendicular circuit pack；The main integrated package with
Connection sheet is electrically connected with.
4. a kind of LED according to claim 1 display module, it is characterized in that：Described luminescence component also includes top
Layer；The top layer includes the top line base board of the black of insulating materials；The top layer is provided with top layer hole；The top layer hole exists
The surface of LED putting holes, the top layer hole are more than LED putting holes.
5. a kind of LED according to claim 1 display module, it is characterized in that：The upper circuit pack, which is provided with, is located at LED
Interstitial hole directly over putting hole, the horizontal section area of the interstitial hole are more than the horizontal section area of LED putting holes；It is described
The bottom of interstitial hole is provided with chip and places position, and chip places position of the position higher than the main terminal pads of LED of position, and LED chip is fixed
Placed in chip on position；The upper circuit pack also includes the middle line layer with the bonding connection of upper substrate upper surface；In described
Line layer is provided with described chip and places position.
6. a kind of LED according to claim 1 display module, it is characterized in that：The main terminal pad left ends of LED are with being connected
The distance of left and right is H1 between piece left surface, and the main terminal pad left ends of LED are located at the right of connection sheet left surface, the main companies of LED
The distance for connecing left and right between disk right-hand member and connection sheet right flank is H2, and the main terminal pad right-hand members of LED are located at a left side for connection sheet right flank
Side, and H1 is more than 0, H2 and is more than 0.
7. a kind of LED according to claim 1 display module, it is characterized in that：Each described LED monomer includes 3
The individual LED chip, it is the first color LED chip, the second color LED chip and the 3rd color LED chip respectively；Line up left and right
First color LED chip of multiple LED monomers of one row is electrically connected with 1 first control metal foil；What left and right was arranged in a row
Second color LED chip of multiple LED monomers is electrically connected with 1 second control metal foil；Multiple LED that left and right is arranged in a row
3rd color LED chip of monomer is electrically connected with 1 article of the 3rd control metal foil.
8. a kind of LED according to claim 1 display module, it is characterized in that：Before the top surface of the connection sheet includes
The multiple bonding pads arranged afterwards, bonding pad are located between the main terminal pad of front and rear two adjacent LEDs, the following table of bonding pad and upper substrate
Face bonding connection.
9. a kind of LED according to claim 1 display module, it is characterized in that：The rear and front end of the heat conduction groove away from
From for H3, the left and right ends distance of the heat conduction groove is H4, and H3 is more than H4.
10. a kind of LED according to claim 1 display module, it is characterized in that：The radiator also includes metal material
Multiple fin of matter, each described fin and corresponding radiating pin integrally connected；The radiator also includes use
In the radiating piece of the insulating materials of the multiple fin of fixation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610521388 | 2016-07-05 | ||
| CN2016105213889 | 2016-07-05 |
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| Publication Number | Publication Date |
|---|---|
| CN107578711A true CN107578711A (en) | 2018-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710544259.6A Pending CN107578712A (en) | 2016-07-05 | 2017-07-05 | L ED display assembly and production method thereof |
| CN201710543811.XA Pending CN107578711A (en) | 2016-07-05 | 2017-07-05 | L ED display assembly |
| CN201710543783.1A Pending CN107146543A (en) | 2016-07-05 | 2017-07-05 | LED display assembly |
| CN201710543781.2A Pending CN107146542A (en) | 2016-07-05 | 2017-07-05 | LED display assembly |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710544259.6A Pending CN107578712A (en) | 2016-07-05 | 2017-07-05 | L ED display assembly and production method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710543783.1A Pending CN107146543A (en) | 2016-07-05 | 2017-07-05 | LED display assembly |
| CN201710543781.2A Pending CN107146542A (en) | 2016-07-05 | 2017-07-05 | LED display assembly |
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| Country | Link |
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| CN (4) | CN107578712A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899407B (en) * | 2018-07-09 | 2019-08-09 | 安徽触威电子科技有限公司 | The packaging method of integrated LED display module |
| CN108806525A (en) * | 2018-07-11 | 2018-11-13 | 深圳明智超精密科技有限公司 | A kind of LED display mask |
| CN111029396B (en) * | 2019-12-26 | 2022-08-19 | 维沃移动通信有限公司 | Display module and electronic equipment |
-
2017
- 2017-07-05 CN CN201710544259.6A patent/CN107578712A/en active Pending
- 2017-07-05 CN CN201710543811.XA patent/CN107578711A/en active Pending
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| Publication number | Publication date |
|---|---|
| CN107146543A (en) | 2017-09-08 |
| CN107146542A (en) | 2017-09-08 |
| CN107578712A (en) | 2018-01-12 |
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