CN213546315U - Light-emitting unit - Google Patents
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- CN213546315U CN213546315U CN202022176328.2U CN202022176328U CN213546315U CN 213546315 U CN213546315 U CN 213546315U CN 202022176328 U CN202022176328 U CN 202022176328U CN 213546315 U CN213546315 U CN 213546315U
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Abstract
The utility model provides a light-emitting unit, at least two LED chips are arranged in a solid crystal area, the brightness can be doubled and improved compared with the LED adopted in the prior backlight field, and the requirement of high brightness in the backlight field can be better satisfied; the interval between the LED chips in one die bonding area is smaller than the interval between the single LED chips, the light mixing effect is better, and the black edge size is reduced in a backlight mode; the light-emitting unit comprises a first insulating substrate and a second insulating substrate, and the LED chips are arranged on the first insulating substrate, so when the total thickness of the first insulating substrate and the second insulating substrate is equal to the thickness of the existing single substrate, the heat generated by the LED chips is transferred to a heat dissipation path on the second insulating substrate, the heat dissipation path is shorter than that of the existing light-emitting diode, and the heat dissipation efficiency can be improved to a greater degree.
Description
Technical Field
The utility model relates to a light emitting diode field especially relates to a light emitting unit.
Background
At present, the color gamut and the brightness of mobile communication terminals such as pens, flat panels, mobile phones and the like which are required by backlight light sources are higher and higher, the thickness is thinner and thinner, the brightness of an original single chip packaging body cannot meet the requirement, and an ultrathin side light emitting diode with higher brightness is required to be provided when the color gamut is high. For example, a package of a single chip adopted in the prior art is shown in fig. 1, and includes a plastic substrate 001, a circuit formed on the top surface of the plastic substrate 001 and electrically connected to an LED chip, and a pad 004 disposed on the bottom surface of the plastic substrate 001, wherein the circuit on the top surface of the plastic substrate 001 is electrically connected to the pad 004 through a conductive material 006 in a through hole penetrating through the bottom surface. A housing 002 is formed on the plastic substrate 001, a cavity for placing the LED chip 003 is formed in the housing 002, and the cavity is filled with fluorescent glue 005. The light emitting diode of this structure has the following problems:
the brightness of a single LED chip is difficult to meet the requirement of a backlight light source on brightness at present; and the heat generated by the LED chip in the LED is mainly transferred to the pad 004 through the conductive material 006 in the through hole penetrating through the plastic substrate 001 for heat dissipation, which results in a long heat dissipation path and a poor heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of be used for luminescence unit, solve current emitting diode luminance not enough, the poor problem of radiating effect.
In order to solve the above technical problem, an embodiment of the present invention provides a light emitting unit, including: the LED chip packaging structure comprises a substrate support, at least two LED chips arranged on the substrate support and a packaging body arranged on the substrate support and used for covering the LED chips;
the substrate support comprises a first insulating substrate, a die bonding area arranged on the front surface of the first insulating substrate, a shell arranged on the first insulating substrate and enclosing the die bonding area, and an electrode welding area arranged in the die bonding area and used for being connected with the positive electrode and the negative electrode of the LED chip; the first insulating substrate is provided with a plurality of electrode pads, and the first insulating substrate is provided with a plurality of first conductive areas corresponding to the electrode pads;
the LED chip is arranged in the die bonding area, the positive electrode and the negative electrode of the LED chip are respectively connected with the corresponding electrode welding areas, and the packaging body is arranged in the shell and covers the LED chip;
the substrate support further comprises a second insulating substrate, second conductive regions which are arranged on the front surface of the second insulating substrate and respectively correspond to the first conductive regions, and third conductive regions which are arranged on the back surface of the second insulating substrate and respectively correspond to the second conductive regions, wherein conductive parts which electrically connect the corresponding second conductive regions and the corresponding third conductive regions are embedded in the second insulating substrate;
and after the back surface of the first insulating substrate and the front surface of the second insulating substrate are attached and fixed, the first conductive area and the second conductive area are electrically connected.
Optionally, the first insulating substrate is provided with a through hole for communicating each corresponding electrode pad with the first conductive area, and the heat conduction portion is a metal conductive column filled in the through hole and electrically connecting the corresponding electrode pad with the first conductive area.
Optionally, a through groove for communicating the corresponding second conductive region with the third conductive region is formed on the second insulating substrate, and the conductive member is a metal conductive layer formed in the through groove.
Optionally, the cross section of the through groove is circular arc or square.
Optionally, the diameter of the circular arc is larger than the diameter of the through hole.
Optionally, at least two LED chips are disposed in the die attach region, at least one electrode of at least two LED chips shares one of the electrode bonding region, the first conductive region, or the second conductive region, and the LED chip is a forward LED chip or a flip LED chip.
Optionally, the substrate support further includes a conductive adhesive layer disposed on the first conductive region and/or the second conductive region, and after the back surface of the first insulating substrate is attached to the front surface of the second insulating substrate, the first conductive region and the second conductive region are electrically connected through the conductive adhesive layer.
Optionally, the substrate support further includes an adhesive layer disposed on the back surface of the first insulating substrate and/or the front surface of the second insulating substrate, and the back surface of the first insulating substrate and the front surface of the second insulating substrate are bonded and then fixed together by the adhesive layer.
Optionally, the first conductive area, the second conductive area, and the third conductive area are provided with a metal conductive layer.
Optionally, the thickness of the first insulating substrate and the second insulating substrate is 0.05mm to 0.3 mm.
Advantageous effects
The utility model provides a substrate bracket for a light-emitting unit, which comprises a first insulating substrate, a solid crystal area arranged on the front surface of the first insulating substrate, a shell arranged on the first insulating substrate and enclosing the solid crystal area, and an electrode welding area arranged in the solid crystal area and used for being respectively connected with the positive electrode and the negative electrode of at least two LED chips; the first insulating substrate is provided with a plurality of electrode pads, and the first insulating substrate is provided with a plurality of first conductive areas corresponding to the electrode pads; the conductive device comprises a first insulating substrate, a second insulating substrate, a first conductive area and a second conductive area, wherein the first conductive area is arranged on the front surface of the first insulating substrate and corresponds to the first conductive areas respectively; after the back surface of the first insulating substrate and the front surface of the second insulating substrate are attached and fixed, the first conductive area and the second conductive area are electrically connected. The manufacturing method of the LED lamp bead plate and the manufactured LED lamp bead plate at least have the following advantages:
at least two LED chips are arranged in the solid crystal area of the light-emitting unit, and the brightness of the light-emitting unit can be improved by times compared with that of a light-emitting diode adopted in the existing backlight field, so that the requirement of high brightness in the backlight field can be better met; the interval between the LED chips in one die bonding area is smaller than the interval between the single LED chips, the light mixing effect is better, and the backlight screen is more beneficial to reducing the size of the black edge;
the substrate support comprises a first insulating substrate and a second insulating substrate, and the LED chip is arranged on the first insulating substrate, so that when the total thickness of the first insulating substrate and the second insulating substrate is equal to the thickness of the existing single substrate, the heat generated by the LED chip is transferred to a heat dissipation path on the second insulating substrate, and the heat dissipation path is shorter than that of the existing light-emitting diode, so that the heat dissipation efficiency can be improved to a greater extent; just the utility model provides a heat conduction portion and conductive part set up in the thinner insulating substrate of current base plate relatively, realize more easily that efficiency and yields are higher, change in the volume production.
Drawings
FIG. 1 is a schematic diagram of a conventional LED structure;
fig. 2 is a first schematic structural diagram of a substrate support according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a substrate support structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a substrate support according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a substrate support structure according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a substrate support structure according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a light emitting unit according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a light emitting unit according to an embodiment of the present invention;
fig. 9 is a schematic view of a third structure of a light-emitting unit according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a light emitting unit according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment provides a light-emitting unit which has higher brightness, better heat dissipation effect and light mixing effect and is more beneficial to reducing the size of a black edge of a backlight module, and the light-emitting unit comprises a substrate support, at least two LED chips arranged on the substrate support and a packaging body arranged on the substrate support and covering the LED chips; wherein:
the substrate support comprises a first insulating substrate, a die bonding area arranged on the front surface of the first insulating substrate, a shell arranged on the first insulating substrate and enclosing the die bonding area, and an electrode welding area arranged in the die bonding area and used for being connected with the positive electrode and the negative electrode of the LED chip; the first insulating substrate is provided with a plurality of electrode pads, and the first insulating substrate is provided with a plurality of first conductive areas corresponding to the electrode pads. It should be understood that the electrode pad and the conductive layer in the first conductive area in this embodiment may be disposed by using various conductive materials and disposing processes, for example, a metal conductive layer may be disposed, and the disposing may be realized by, but not limited to, electroplating, deposition, and the like. The metal conductive layer in this embodiment may be various metal layers with good conductivity, such as but not limited to a metal layer including at least one of gold, silver, copper, and the like.
It should be understood that, in this embodiment, the number and the specific distribution of the electrode pads in the die attach region may be flexibly set according to the number of the LED chips arranged in the die attach region and the electrical connection relationship between the LED chips, for example:
in one example, when two light emitting chips are disposed in the die attach region and the two light emitting chips are connected in parallel, at least two electrode pads may be disposed in the die attach region, one of the electrode pads being bonded to the positive electrodes of the two light emitting chips and the other electrode pad being bonded to the negative electrodes of the two light emitting chips.
In still another example, when two light emitting chips are disposed in the die attach area and the two light emitting chips are connected in series, at least three electrode pads may be disposed in the die attach area, wherein one electrode pad is respectively bonded to the positive and negative electrodes of the two light emitting chips, and the other two electrode pads are respectively bonded to the corresponding positive and negative electrodes of the two light emitting chips. In this example, four electrode pads may be provided, and each two electrode pads are respectively connected to the positive electrode and the negative electrode of a corresponding light emitting chip, wherein two electrode pads respectively connected to the positive electrode and the negative electrode of different light emitting chips may be electrically connected to the corresponding first conductive region, so that the two light emitting chips may be electrically connected.
In another example, when two light emitting chips are disposed in the die attach area and the two light emitting chips are independent from each other and are not electrically connected, at least four electrode pads may be disposed in the die attach area, and each two electrode pads are respectively connected to the positive electrode and the negative electrode of a corresponding light emitting chip.
It should be understood that, when the number of the light emitting chips arranged in the die attach area is greater than two, the arrangement manner of the corresponding electrode pads is similar, and will not be described herein again.
Accordingly, it should be understood that the positional distribution and the number of the first conductive regions provided on the back surface of the first insulating substrate in the present embodiment can be flexibly set according to the positional distribution and the number of the electrode pads provided on the front surface of the first insulating substrate and the specific electrical connection relationship between the upper electrode pads and the first conductive regions. It should be understood that each of the first conductive regions disposed on the back surface of the first insulating substrate in the present embodiment may be a conductive portion electrically connected to one end of the heat conducting portion exposed to the back surface of the first insulating substrate on the back surface of the first insulating substrate, or may be directly one end of the heat conducting portion exposed to the back surface of the first insulating substrate. Specifically, the setting can be flexibly selected according to the application scene, and is not limited herein.
It should be understood that the manner of embedding the heat conduction portion in the first insulating substrate in the present embodiment can be flexibly selected, and the present embodiment is not limited thereto. Can be after making first insulating substrate, set up the through-hole that runs through first insulating substrate front and back in corresponding position department on first insulating substrate, then bury heat-conducting portion underground in this through-hole, wherein the shape and the aperture size of this through-hole can set up in a flexible way as required, for example can set up to circular port, quad slit, triangle-shaped hole, oval-shaped hole, also can set up to the hole of non-regular shape, it is not repeated here, wherein the heat-conducting portion that buries underground in this through-hole fills up and is filled up this through-hole and form metal-conducting pillar. In other examples, the heat conduction portions penetrating the front and back surfaces of the first insulating substrate may also be embedded at respective positions during the formation of the first insulating substrate.
The substrate support further comprises a second insulating substrate, second conductive regions which are arranged on the front surface of the second insulating substrate and correspond to the first conductive regions respectively, and third conductive regions which are arranged on the back surface of the second insulating substrate and correspond to the second conductive regions respectively, and conductive parts which are used for electrically connecting the corresponding second conductive regions and the third conductive regions are embedded in the second insulating substrate. After the back surface of the first insulating substrate and the front surface of the second insulating substrate are attached and fixed, the first conductive area and the second conductive area are electrically connected.
The LED chip is arranged in the die bonding area, and the positive electrode and the negative electrode of the LED chip are respectively connected with the corresponding electrode welding areas. It should be understood that the LED chip in the present embodiment may include, but is not limited to, at least one of a front-mounted LED chip and a flip-chip LED chip, and may also include a vertical LED chip in some examples.
It should be understood that the first insulating substrate and the second insulating substrate in the present embodiment may be made of various insulating materials, such as, but not limited to, various insulating plastic materials. In the embodiment, the first insulating substrate and the second insulating substrate may be made of the same material or different materials.
In this embodiment, the position distribution and the number of the second conductive regions disposed on the front surface of the second insulating substrate can be flexibly set according to the position distribution and the number of the first conductive regions disposed on the back surface of the first insulating substrate and the specific electrical connection relationship between the first conductive regions and the second conductive regions. Accordingly, the position distribution and number of the third conductive regions disposed on the back surface of the second insulating substrate in this embodiment can be flexibly set according to the position distribution and number of the second conductive regions disposed on the front surface of the second insulating substrate and the specific electrical connection relationship between the middle electrode pad and the third conductive region. It should be understood that, in the present embodiment, the manner of embedding the conductive member in the second insulating substrate can be flexibly selected, and the present embodiment does not limit this. After the second insulating substrate is manufactured, a groove penetrating through the front surface and the back surface of the second insulating substrate is formed in a corresponding position on the second insulating substrate, and then the conductive member is embedded in the groove, wherein the shape and the aperture size of the groove can also be flexibly set according to requirements, for example, the cross section of the groove can be arc-shaped, square-shaped or other shapes, can be arc-shaped when being arc-shaped, can also be other arc-shaped, and can also be set to be irregular shapes, which is not described herein in detail. The conductive piece embedded in the groove can fill the groove, at least one part of the groove wall of the groove can be covered to form a metal conductive layer, the groove is not filled with the metal conductive layer, and the rest space of the groove can be used for containing solder in the subsequent welding process, so that an inward shrinkage type bonding pad is formed, a smaller space is occupied, the space between adjacent light emitting chips or adjacent light emitting units can be reduced, and the light mixing effect is improved. In other examples, conductive members penetrating through the front and rear surfaces of the second insulating substrate may also be embedded at corresponding positions during the formation of the second insulating substrate. In this embodiment, the conductive body may be made of various conductive materials with good conductivity, for example, but not limited to, at least one of gold, silver, and copper.
It can be seen that, the electrode pad area on the substrate support of the light emitting unit provided in this embodiment is electrically connected to the first conductive area below through the heat conduction portion, the first conductive area is electrically connected to the third conductive area at the lowermost layer through the second conductive area and the conductive member, and the third conductive area can be used as a pad electrically connected to the outside. In addition, in this embodiment, the heat conduction portion and the conductive member are respectively embedded in the first insulating substrate and the second insulating substrate, which can be realized by using the existing mature process, and is simple and fast.
Alternatively, in the present embodiment, the size of the groove for forming the conductive member may be set larger than the size of the through hole for forming the heat conductive portion. Optionally, in some examples, the position of the heat conducting member on the first insulating substrate may partially overlap with the position of the through hole for forming the electrical conductor on the lower substrate, or may be completely staggered (i.e., there is no overlap between the two, and in this case, after the first insulating substrate and the second insulating substrate are stacked, there is no overlap between the heat conducting member and the through hole). The arrangement mode of partial overlapping or complete staggering can improve the comprehensive strength of the obtained substrate support after the first insulating substrate and the second insulating substrate are stacked to form the substrate support, thereby further improving the reliability of the substrate support.
As described above, in the present embodiment, the through hole for forming the electric conductor provided on the second insulating substrate may be larger than the diameter of the heat-conducting member formed on the first insulating substrate. For example, when the cross-sectional shape of the groove is a circular arc shape, the diameter of the circular arc shape may be set larger than the diameter of the through hole. For example, in some application examples, the diameter of the groove in the circular arc shape provided on the second insulating substrate may be, but is not limited to, 0.25mm to 0.75mm, and the diameter of the through hole of the heat conduction portion formed on the first insulating substrate may be, but is not limited to, 0.05mm to 0.2 mm.
As shown in the above analysis, in the present embodiment, at least two LED chips are disposed in the die attach region, and when the LED chips are connected in series or in parallel, the LED chips can share the corresponding electrode pads. In some examples, the corresponding electrode pads may not be shared, that is, one electrode pad in the die attach area is correspondingly connected to one electrode of one LED chip, and for LED chips that need to be connected in series or in parallel, the first conductive area corresponding to the electrode pad connected to the electrode pad or the second conductive area corresponding to the first conductive area may be used to realize corresponding series or parallel connection. For example, two or more corresponding electrode pads may share one first conductive area, or two or more corresponding first conductive areas may share one second conductive area to implement corresponding serial connection or parallel connection, that is, in this embodiment, when at least two LED chips are disposed in the die attach area, at least one electrode of at least two LED chips may share one electrode pad, the first conductive area, or the second conductive area to implement corresponding serial connection, parallel connection, or serial-parallel connection, according to the requirement.
In some examples of this embodiment, the substrate support may further include a conductive adhesive layer disposed on the first conductive region and/or the second conductive region, and after the back surface of the first insulating substrate is attached to the front surface of the second insulating substrate, the corresponding first conductive region and the corresponding second conductive region are electrically connected through the conductive adhesive layer; the conductive adhesive layer is arranged to form a tight connection between the corresponding first conductive area and the second conductive area, thereby ensuring the reliability of the electrical connection between the first conductive area and the second conductive area. It should be understood that the conductive glue layer may be, but is not limited to, a conductive glue layer. It should be understood that the material and structure of at least two of the electrode pad, the first conductive region, the second conductive region and the third conductive region in this embodiment may be the same, for example, they may be all configured as metal conductive layers, or they may be configured differently according to the requirement. For example, in one example, the electrode pad and the third conductive region may be the same in material and structure; in another example, the first conductive region and the second conductive region may have the same material and structure. The above examples are only two setting examples listed in this embodiment, and may be flexibly set according to actual requirements, and no limitation is made herein.
In this embodiment, the first insulating substrate and the second insulating substrate may be aligned and fixedly connected. For example: in some examples, corresponding snap structures may be disposed at corresponding positions on the first and second insulating substrates, and the two may be fixedly connected together by the snap structures to form the substrate support. In other examples, the substrate support further comprises an adhesive layer disposed on the back surface of the first insulating substrate and in an area outside the first conductive area, and/or an adhesive layer disposed on the front surface of the second insulating substrate and in an area outside the second conductive area, the adhesive layer having good adhesion and insulation properties; the back surface of the first insulating substrate and the front surface of the second insulating substrate are bonded together through the bonding layer after being aligned and attached. Meanwhile, the air tightness of the substrate support can be further improved by the arrangement of the bonding layer, and the method is simple to realize, low in cost, high in efficiency and good in universality. Of course, in still other examples, the first insulating substrate and the second insulating substrate may be connected in a stacked manner by combining the snap structure and the adhesive layer in the above examples. And it should be understood that the above examples are merely illustrative of several implementations of the alignment-stacking connection of the first insulating substrate and the second insulating substrate, and the connection manner of the two is not limited to the above examples.
For the convenience of understanding, the present embodiment will be described below by way of example with reference to the accompanying drawings.
Referring to fig. 2, a substrate holder 1 includes a first insulating substrate 11 and a second insulating substrate 12, wherein the first insulating substrate 11 and the second insulating substrate 12 are fixedly bonded together by an adhesive layer 13. The adhesive layer 13 is located outside the area where the first electrical connection area and the second electrical connection area are located, so that the adhesive strength between the first insulating substrate 11 and the second insulating substrate 12 can be improved, the air tightness after the first insulating substrate 11 and the second insulating substrate 12 are adhered can be improved, and the reliability and the protective performance of the adhesive layer are improved. Referring to fig. 2, three electrode pads 111 are disposed in the die attach region, wherein the middle electrode pad 111 is used for connecting the positive electrodes and the negative electrodes of the two LED chips, and the two electrode pads 111 on the two sides are respectively used for connecting the remaining negative electrodes and the positive electrodes of the two LED chips, thereby realizing the series connection between the two LED chips. Referring to fig. 2, the electrode pad 111 in this example is electrically connected to the corresponding second electrical connection region 121 on the front surface of the first insulating substrate 12 through the thermal conduction portion 112, and the end of the thermal conduction portion 112 exposed to the back surface of the first insulating substrate 11 serves as a first electrical connection region. The second electrical connection region 121 may then be electrically connected to a corresponding third electrical connection region 123 via a metal conductive layer 122 provided on the wall of the recess 120. The third electrical connection area 123 and the groove 120 can form a retractable pad, when in use, the third electrical connection area 123 is welded with an area corresponding to the outside, and redundant solder in the welding process can be contained in the groove 120, so that the solder is prevented from overflowing outwards to form electrical connection with other adjacent pads, and the interval between the adjacent pads can be smaller, and the light mixing effect is further improved. And more light-emitting units can be arranged in the same area, so that the light-emitting brightness is integrally improved.
Alternatively, in this embodiment, a white oil layer 124 and a green oil layer 125 may be respectively disposed at corresponding positions on the back surface of the second insulating substrate 12 according to requirements.
Please refer to fig. 3, which is different from fig. 2 mainly in that 4 electrode pads are disposed in the die attach area, the electrodes of the two LED chips disposed in the die attach area may not share the electrode pads, the positive and negative electrodes of the two LED chips are respectively connected to the electrode pads in a one-to-one correspondence, and the middle two electrode pads are connected to the same second electrical connection area to realize series connection.
Please refer to fig. 4, which is different from fig. 3 mainly in that 4 electrode pads are also disposed in the die attach region, the electrodes of the two LED chips disposed in the die attach region may not share the electrode pads, the positive and negative electrodes of the two LED chips are respectively connected to the electrode pads in a one-to-one correspondence, the two electrode pads in the middle are also not connected to the same second electrical connection region to realize a series connection, and at this time, there is no electrical connection between the two LED chips in the die attach region.
Referring to fig. 5, a housing 2 enclosing a die bonding region is formed on a first insulating substrate 11 of a substrate holder 1, and the housing may be a gel or other material. For example, in one example, the housing may be a white wall glue that is relatively reflective. In fig. 5, no white wall glue is left between adjacent LED chips in the die attach region. Of course, according to the requirement, white wall glue can be additionally arranged between the adjacent LED chips, for example, as shown in fig. 6, so that the reflection efficiency can be further improved, and the uniformity of the light emitted from the light emitting unit can be further improved.
Referring to fig. 7, the light-emitting unit formed by encapsulating the LED chip 4 with the substrate holder 1 shown in fig. 6 further includes an encapsulant 3 filled in the housing 2 and covering the LED chip 4, where the encapsulant 3 may be a transparent adhesive layer, a light-emitting conversion layer, or a combination of the light-emitting conversion layer and the transparent adhesive layer. The luminescence conversion layer may be a fluorescent glue layer, a quantum dot thin film layer or other layer structure capable of performing luminescence conversion, and is not limited herein. The LED chip 4 shown in fig. 7 is a flip LED chip, and two LED chips in the die attach region are connected in series. Of course, the LED chip 4 in the present embodiment may also be a front-mounted LED chip, for example, as shown in fig. 8.
Referring to fig. 9 and 10, the main difference from the light emitting unit shown in fig. 7 and 8 is that no white wall paste is disposed between adjacent LED chips.
Therefore, at least two LED chips can be disposed in the die attach region of the light emitting unit provided in this embodiment, and the brightness of the LED chip can be increased by times compared with that of the LED chip used in the existing backlight field, so that the requirement of high brightness in the backlight field can be better satisfied; the interval between the LED chips in one die bonding area is smaller than the interval between the single LED chips, the light mixing effect is better, and the black edge size is reduced in a backlight mode; the substrate support of the light emitting unit comprises a first insulating substrate and a second insulating substrate, and the LED chip is disposed on the first insulating substrate, so that when the total thickness of the first insulating substrate and the second insulating substrate is equal to the thickness of the existing single substrate (for example, the thickness of the first insulating substrate and the second insulating substrate may be, but is not limited to, 0.05mm to 0.3 mm, so that the thickness of the first insulating substrate and the second insulating substrate after being stacked is substantially equal to the thickness of the existing single-layer PCB), the heat dissipation path for transferring the heat generated by the LED chip to the second insulating substrate is shorter than that of the existing light emitting diode, and thus the heat dissipation efficiency can be improved to a greater extent; just the utility model provides a heat conduction portion and conductive part set up in the thinner insulating substrate of current base plate relatively, realize more easily that efficiency and yields are higher, change in the volume production.
The present embodiment also provides a display panel including the light-emitting unit employing the above-described example as a backlight light source. The display panel may be used for, but is not limited to, various displays, mobile phones, PCs, advertising devices, and the like. An exemplary display panel is shown in fig. 11, which includes a frame 506, a film 501 assembled in the frame 506, a light guide plate 502, a reflective sheet 503 and a metal back plate 504, and a backlight source 505 disposed corresponding to the film 501, the light guide plate 502, the reflective sheet 503 and the metal back plate 504; backlight source 505 emits light on the upper side of the display backplane. It should be understood that fig. 11 is only an exemplary display panel, and the specific structure of the display panel can be flexibly configured, and is not described herein again. The display panel has the advantages of better heat dissipation performance, more LED chips arranged in the same area, smaller black edges and the like.
The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (10)
1. A light-emitting unit, comprising: the LED chip packaging structure comprises a substrate support, at least two LED chips arranged on the substrate support and a packaging body arranged on the substrate support and used for covering the LED chips;
the substrate support comprises a first insulating substrate, a die bonding area arranged on the front surface of the first insulating substrate, a shell arranged on the first insulating substrate and enclosing the die bonding area, and an electrode welding area arranged in the die bonding area and used for being connected with the positive electrode and the negative electrode of the LED chip; the first insulating substrate is provided with a plurality of electrode pads, and the first insulating substrate is provided with a plurality of first conductive areas corresponding to the electrode pads;
the LED chip is arranged in the die bonding area, the positive electrode and the negative electrode of the LED chip are respectively connected with the corresponding electrode welding areas, and the packaging body is arranged in the shell and covers the LED chip;
the substrate support further comprises a second insulating substrate, second conductive regions which are arranged on the front surface of the second insulating substrate and respectively correspond to the first conductive regions, and third conductive regions which are arranged on the back surface of the second insulating substrate and respectively correspond to the second conductive regions, wherein conductive parts which electrically connect the corresponding second conductive regions and the corresponding third conductive regions are embedded in the second insulating substrate;
and after the back surface of the first insulating substrate and the front surface of the second insulating substrate are attached and fixed, the first conductive area and the second conductive area are electrically connected.
2. The light-emitting unit according to claim 1, wherein the first insulating substrate is provided with a through hole for communicating each corresponding one of the electrode pads with the first conductive region, and the heat conduction portion is a metal conductive pillar filled in the through hole and electrically connecting the corresponding one of the electrode pads with the first conductive region.
3. The light-emitting unit according to claim 2, wherein a through groove for connecting each of the second conductive regions and the third conductive regions is provided in the second insulating substrate, and the conductive member is a metal conductive layer formed in the through groove.
4. A lighting unit as claimed in claim 3, characterized in that the cross-section of the through slot is circular or square.
5. The light-emitting unit according to claim 4, wherein a diameter of the circular arc is larger than a diameter of the through hole.
6. The light-emitting unit according to any one of claims 1 to 5, wherein at least two of the LED chips are disposed in the die attach region, at least one electrode of at least two of the LED chips shares one of the electrode pad region, the first conductive region, or the second conductive region, and the LED chip is a front-mounted LED chip or a flip-chip LED chip.
7. The light-emitting unit according to any one of claims 1 to 5, wherein the substrate holder further comprises a conductive adhesive layer disposed on the first conductive region and/or the second conductive region, and after the back surface of the first insulating substrate and the front surface of the second insulating substrate are attached to each other, the first conductive region and the second conductive region are electrically connected through the conductive adhesive layer.
8. The light-emitting unit according to any one of claims 1 to 5, wherein the substrate holder further comprises an adhesive layer provided on a back surface of the first insulating substrate and/or a front surface of the second insulating substrate, and the back surface of the first insulating substrate and the front surface of the second insulating substrate are fixed together by the adhesive layer after being bonded.
9. The light-emitting unit according to any one of claims 1 to 5, wherein the first conductive region, the second conductive region, and the third conductive region are provided with a metal conductive layer.
10. The light-emitting unit according to any one of claims 1 to 5, wherein the first insulating substrate and the second insulating substrate have a thickness of 0.05mm to 0.3 mm.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022176328.2U CN213546315U (en) | 2020-09-28 | 2020-09-28 | Light-emitting unit |
| PCT/CN2021/119458 WO2022057937A1 (en) | 2020-09-21 | 2021-09-18 | Substrate, and led light source assembly and manufacturing method therefor |
| US18/027,223 US20230411574A1 (en) | 2020-09-21 | 2021-09-18 | Substrate, led light source assembly and manufacturing methods therefor |
| EP21868759.8A EP4216275A1 (en) | 2020-09-21 | 2021-09-18 | Substrate, and led light source assembly and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022176328.2U CN213546315U (en) | 2020-09-28 | 2020-09-28 | Light-emitting unit |
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| CN213546315U true CN213546315U (en) | 2021-06-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022057937A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市聚飞光电股份有限公司 | Substrate, and led light source assembly and manufacturing method therefor |
| CN114497319A (en) * | 2022-01-07 | 2022-05-13 | 芜湖聚飞光电科技有限公司 | LED light-emitting component, LED bracket and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022057937A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市聚飞光电股份有限公司 | Substrate, and led light source assembly and manufacturing method therefor |
| CN114497319A (en) * | 2022-01-07 | 2022-05-13 | 芜湖聚飞光电科技有限公司 | LED light-emitting component, LED bracket and manufacturing method thereof |
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