CN216671632U - Integrated packaged high-power LED - Google Patents
Integrated packaged high-power LED Download PDFInfo
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- CN216671632U CN216671632U CN202123438377.XU CN202123438377U CN216671632U CN 216671632 U CN216671632 U CN 216671632U CN 202123438377 U CN202123438377 U CN 202123438377U CN 216671632 U CN216671632 U CN 216671632U
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Abstract
The utility model discloses an integrated packaged high-power LED (light-emitting diode), which comprises a substrate, packaging glue, a fence and a plurality of light-emitting components, wherein a conducting circuit is used for conducting the plurality of light-emitting components and comprises a front electrode pad, a back electrode pad, a front metal circuit and a back metal circuit, wherein the front electrode pad and the back electrode pad are respectively arranged at two sides of the substrate, and the front metal circuit and the back metal circuit are respectively positioned at the same side with the front electrode pad and the back electrode pad; the encapsulation is glued and is filled in the enclosure and wraps up each light emitting component's side, a plurality of light emitting component concentrate set up and arrange on the base plate and be a plurality of lines, each light emitting component that is located two lines of head and the tail communicates through positive metallic wiring and front electrode pad, reduce the interval between continuous light emitting component and the front electrode pad, each light emitting component that is located between two lines of head and the tail communicates through back metallic wiring and back electrode pad, reduce the shared space of front metallic wiring, make the whole size of encapsulation LED further reduce.
Description
Technical Field
The utility model belongs to the technical field of semiconductors, and particularly relates to an integrally packaged high-power LED.
Background
At present, generally adopt many LEDs to paste the dress on the PCB board in LED's manufacture process, because the restriction of LED self size and PCB circuit structural design, it can lead to the pixel resolution to be low to reduce the interval between the luminescence chip, often need adopt the PCB board of great size specification to each LED's distance is far away, and the luminescence chip interval is big, leads to the pixel interval big, is difficult to satisfy fields such as intelligent car light to high-power, small-size, little interval, high integrated market demand.
Therefore, a new technology is needed to solve the problems of large chip spacing and over-size of the LED in the prior art.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems in the prior art, the present invention provides an integrally packaged high power LED, which has the effects of small chip pitch and small overall size of the LED.
The utility model adopts the following technical scheme:
an integrated packaged high-power LED comprises a substrate, packaging glue, an enclosing wall and a plurality of light-emitting components, wherein a conducting circuit for conducting the light-emitting components is arranged on the substrate;
the conducting circuit comprises a front electrode pad, a back electrode pad, a front metal circuit and a back metal circuit, wherein the front electrode pad and the back electrode pad are respectively arranged on two sides of the substrate, the front metal circuit and the back metal circuit are respectively positioned on the same side as the front electrode pad and the back electrode pad, the light-emitting assemblies are arranged on the substrate in a plurality of rows, the light-emitting assemblies positioned in the head row and the tail row are communicated with the front electrode pad through the front metal circuit, and the light-emitting assemblies positioned between the head row and the tail row are communicated with the back electrode pad through the back metal circuit;
the enclosing walls are arranged on the substrate in an end-to-end connection mode and surround the light-emitting assemblies; the packaging adhesive is filled in the surrounding wall and wraps the side face of each light-emitting component.
As a further improvement of the technical solution of the present invention, the substrate is further provided with a plurality of pad units disposed corresponding to the plurality of light emitting assemblies, the plurality of pad units are sequentially arranged, each pad unit includes an anode pad and a cathode pad, the anode pad of the pad unit is connected to the cathode pad of the next adjacent pad unit, the anode and the cathode of each light emitting assembly are respectively connected to the anode pad and the cathode pad, and the connection node between each anode pad and each cathode pad is connected to the front metal line or the back metal line.
As a further improvement of the technical solution of the present invention, the substrate is further provided with a plurality of pad units corresponding to the plurality of light emitting assemblies, each pad unit includes an anode pad and a cathode pad, the plurality of light emitting assemblies are divided into a plurality of functional regions, the plurality of pad units are sequentially arranged in the same functional region, the anode pad of each pad unit is connected to the cathode pad of the next adjacent pad unit, the anode and the cathode of each light emitting assembly are respectively connected to the anode pad and the cathode pad, and the connection node between each anode pad and each cathode pad is connected to the front metal line or the back metal line.
As a further improvement of the technical scheme of the utility model, the substrate is also provided with a plurality of conductive through holes, and each pad unit positioned between the head row and the tail row passes through the conductive through holes and the back metal circuit.
As a further improvement of the technical scheme of the utility model, the substrate is further provided with a solder mask, and the solder mask is arranged at intervals with the positive electrode pad and the negative electrode pad.
As a further improvement of the technical scheme of the utility model, the size of the light-emitting assemblies is 10-50mil, the number of the light-emitting assemblies is 20-200pcs, and the distance between two adjacent light-emitting assemblies is 20-65 μm.
As a further improvement of the technical scheme of the utility model, the light-emitting component is a monochromatic light chip, or the light-emitting component is a blue light chip provided with a light conversion material.
As a further improvement of the technical scheme of the utility model, the packaging adhesive is filling adhesive, and the filling adhesive is single-layer or multi-layer.
As a further improvement of the technical scheme of the utility model, the filling adhesive is a light-colored light reflecting material or a dark-colored light absorbing material.
As a further improvement of the technical scheme of the utility model, the line width and the line distance of the conducting circuit are 0.1-0.3 mm.
Compared with the prior art, the utility model has the beneficial effects that:
the enclosing wall is arranged on the substrate in an end-to-end connection way and surrounds a plurality of light-emitting components, the packaging adhesive is filled in the enclosing wall and wraps the side surfaces of the light-emitting components, the light-emitting components are arranged in a plurality of rows in the enclosing wall on the substrate, the front electrode bonding pads are positioned on the outer side of the enclosing wall, the light-emitting components positioned in the end-to-end rows are communicated with the front electrode bonding pads through the front metal circuit, the distance between the connected light-emitting components and the front electrode bonding pads can be reduced, thereby reducing the space occupied by the front metal circuit, each light-emitting component positioned between the head line and the tail line is communicated with the back electrode pad through the back metal circuit, the space occupied by the conducting circuit on the same side of the substrate can be reduced, the overall size of the packaged LED is reduced, meanwhile, each light-emitting component is centrally located in the center area of the enclosing wall, so that the space occupied by the light-emitting components is reduced, and the overall size of the packaged LED is further reduced.
Drawings
The technology of the present invention will be described in further detail with reference to the accompanying drawings and detailed description below:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a backside metal trace;
FIG. 3 is a schematic view of the overall structure of the present embodiment;
FIG. 4 is a circuit connection diagram of area A of FIG. 3;
FIG. 5 is a schematic diagram of a pad cell;
fig. 6 is a schematic diagram of the front metal circuit of the embodiment.
Reference numerals:
1-a substrate; 11-front electrode pad; 12-back electrode pads; 13-front side metal lines; 14-back side metal lines;
2-packaging glue;
3-enclosing walls;
4-a light emitting component;
5-a pad unit; 51-positive electrode pad; 52-negative electrode pad;
6-functional region;
7-conductive vias;
8-Back side Heat sink pad.
Detailed Description
The conception, the specific structure and the technical effects of the present invention will be clearly and completely described in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the schemes and the effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The same reference numbers will be used throughout the drawings to refer to the same or like parts.
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Further, the description of the upper, lower, left, right, etc. used in the present invention is only with respect to the positional relationship of the respective components of the present invention with respect to each other in the drawings.
Referring to fig. 1 to 4, an integrally packaged high power LED includes a substrate 1, a packaging adhesive 2, a wall 3, and a plurality of light emitting components 4.
The substrate 1 is provided with a conducting circuit for conducting the light emitting elements 4, and the material of the substrate 1 includes but is not limited to AlN ceramic, Al2O3 ceramic, FR4, and the like.
The conducting circuit comprises a front electrode pad 11 and a back electrode pad 12 which are respectively arranged at two sides of the substrate 1, and a front metal circuit 13 and a back metal circuit 14 which are respectively positioned at the same side with the front electrode pad 11 and the back electrode pad 12, the line width and the line distance of the conducting circuit are 0.1-0.3mm, namely the line width and the line distance of the front metal circuit 13 and the back metal circuit 14 are 0.1-0.3mm, a back heat dissipation pad 8 is also arranged at the same side with the back electrode pad 12 on the substrate 1, and the back heat dissipation pad 8 is arranged at the region outside the back electrode pad 12 and the back metal circuit 14, so that the heat dissipation function of the packaged LED is improved, and adverse effects caused by overhigh temperature in the operation process are avoided.
The enclosing wall 3 is arranged on the substrate 1 in an end-to-end connection mode and surrounds the light-emitting assemblies 4, the packaging glue 2 is filled in the enclosing wall 3 and wraps the side faces of the light-emitting assemblies 4, the enclosing wall 3 can prevent the filling glue from flowing to other areas in the packaging process, the filling glue can accumulate thickness to wrap the side faces, and the light-emitting assemblies 4 can be firmly fixed with other structures after the filling glue wraps the light-emitting assemblies 4.
The light-emitting components 4 are arranged on the substrate 1 in a plurality of rows, the front electrode pads 11 are located on the outer side of the enclosing wall 3, the light-emitting components 4 located at the head and the tail of the light-emitting components are communicated with the front electrode pads 11 through the front metal lines 13, the light-emitting components 4 located between the head and the tail of the light-emitting components are communicated with the back electrode pads 12 through the back metal lines 14, the light-emitting components 4 can be connected through the connection mode to supply power, the light-emitting components 4 are not required to be connected through external lead wires, and the space for welding the lead wires is not required to be reserved, so that the distance between the two light-emitting components 4 and the gap between the two light-emitting components 4 are reduced, the whole size of a packaged LED is reduced, and high integration is realized. Meanwhile, each light emitting component 4 is centrally located in the central area of the enclosing wall 3, so that the space occupied by the light emitting components 4 is reduced, and the overall size of the packaged LED is further reduced.
Specifically, the size of the light emitting component 4 is 10-50mil, the number of the light emitting components 4 is 20-200pcs, the distance between two adjacent light emitting components 4 is 20-65 μm, and the light emitting component 4 is a monochromatic light chip, or the light emitting component 4 is a blue light chip provided with a light conversion material.
Specifically, the substrate 1 is further provided with a plurality of pad units 5 corresponding to the plurality of light emitting assemblies 4, the pad units 5 are sequentially arranged, each pad unit 5 includes an anode pad 51 and a cathode pad 52, the anode pad 51 of each pad unit 5 is connected to the cathode pad 52 of the next adjacent pad unit 5, the anode pad 51 between two adjacent pad units 5 is connected to the cathode pad 52, the anode and the cathode of each light emitting assembly 4 are respectively connected to the anode pad 51 and the cathode pad 52, and the connection node between each anode pad 51 and each cathode pad 52 is connected to the front metal line 13 or the back metal line 14. The front metal circuit 13 is led out from the connecting node of the two pad units 5 and the pad units 5 from head to tail, so that the pad units 5 are arranged in parallel, the chip spacing is shortened, the occupied space of the front metal circuit 13 is reduced, the size of the whole structure can be reduced, meanwhile, the leading-out mode of the front metal circuit 13 is convenient for circuit design, the parallel arrangement of the pad units 5 enables each light-emitting chip to be controlled independently, and the PCB circuit design and mounting are convenient. In one embodiment, there are basically 32 light emitting cells, and … … pad cells 5, arranged in 4 rows,
wherein, still be equipped with on the base plate 1 with a plurality of the corresponding a plurality of pad units 5 that set up of light-emitting component 4, pad unit 5 includes anodal pad 51 and negative pole pad 52, and anodal pad 51 in each pad unit 5 is not connected with negative pole pad 52, a plurality of light-emitting component 4 divide into a plurality of functional areas 6, can set up a plurality of functional areas 6 on same base plate 1 according to actual demand, reduce the dispersion of structure for encapsulated LED's integrated level is higher. The pad units 5 in different functional areas 6 are not connected, so that circuit design is facilitated, in the same functional area 6, a plurality of pad units 5 are sequentially arranged, the positive pad 51 of each pad unit 5 is connected with the negative pad 52 of the next adjacent pad unit 5, the positive pad 51 and the negative pad 52 between two adjacent pad units 5 are connected, the positive and negative electrodes of each light-emitting assembly 4 are respectively connected with the positive pad 51 and the negative pad 52, the connection node of each positive pad 51 and each negative pad 52 is connected with the front metal line 13 or the back metal line 14, the front metal line 13 is led out from the connection node of the two pad units 5 and the pad units 5 at the head and the tail to enable each pad unit 5 to be arranged in parallel, external lead welding connection is not needed, the chip spacing is shortened, and the occupied space of the front metal line 13 is reduced, therefore, the size of the whole structure can be reduced, meanwhile, the leading-out mode of the front metal circuit 13 is convenient for circuit design, and the parallel arrangement of the pad units 5 also enables each light-emitting chip to be independently controlled, so that the design and mounting of a PCB circuit are convenient.
Specifically, the substrate 1 is further provided with a plurality of conductive through holes 7, each pad unit 5 located between the head line and the tail line passes through the conductive through hole 7 and the back metal line 14, and a conductive layer is arranged on the inner surface of each hole of the conductive through hole 7 and can be a conductive metal layer.
Specifically, a solder resist layer is further provided on the substrate 1, and the solder resist layer is arranged at intervals with the positive electrode pad 51 and the negative electrode pad 52, that is, the solder resist layer can be selectively coated in the region other than the front surface pad and the back surface pad.
Specifically, the packaging adhesive 2 is an underfill adhesive, and the underfill adhesive is a single layer or multiple layers. The filling glue is a light-color reflecting material or a dark-color light absorption material, when the filling glue is two layers, the bottom layer filling glue is white silica gel, the top layer filling glue is black silica gel, in the packaging process of the LED, firstly, an inverted blue light chip is pasted on a bonding pad of the functional area 6, the blue light chip is fixed after backflow, then, a fluorescent sheet is pasted on the surface of the blue light chip, the size of the fluorescent sheet is close to or slightly larger than that of the blue light chip, then, a fence 3 is applied to the edge of the functional area 6, the fence 3 can prevent the filling glue from flowing to other areas in the packaging process, after the fence 3 is cured and formed, a layer of white silica gel is filled in the fence 3, the height of the white silica gel layer is flush with or slightly higher than that of the surface of the luminous chip and is lower than that of the fluorescent sheet, the black silica gel layer is filled after the white silica gel is cured, the black silica gel layer is on the white silica gel layer, and the height is not higher than that of the surface of the fluorescent sheet, and curing to obtain the LED finished product.
In this embodiment, referring to fig. 3, the overall size of the integrally packaged high-power LED is 27 × 12.5mm, 100 pad units 5 are disposed in the central region in the enclosure 3, each pad unit 5 includes one positive pad 51 and one negative pad 52, 100 pad units 5 are arranged in 4 rows and divided into A, B, C, D, E, F, G, H, I functional regions 6, 8 to 12 pad units 5 are disposed in each functional region 6, the positive pad 51 and the negative pad 52 between two adjacent pad units 5 in each functional region 6 are connected, the pad units 5 between different pad units are not connected, and the front metal lines 13 are LED out from the connection nodes of the two pad units 5 and the pad units 5 at the head and the tail, the front electrode pad 11 is located outside the enclosure 3, the front metal lines 13 are connected to the front electrode pad 11, and the two rows at the head and the tail of the central region, i.e. the 1 st row, the second row, the first row and the tail row are connected to the front electrode pad 11, A plurality of pad units 5 of 4 lines all are connected with positive metal circuit 13, be located 2 between two rows of head and the tail, a plurality of pad units 5 of 3 lines are connected with back metal circuit 14 through electrically conductive through hole 7, luminous chip is connected with each pad unit 5, the side of filling glue cover in enclosure 3 and parcel each luminous chip, the filling glue is equipped with two-layerly, the bottom is white silica gel, the top layer is black silica gel, enclosure 3 can prevent that the filling glue from flowing to other regions at the in-process of encapsulation, luminous chip quantity corresponds to 100pcs with pad unit 5, luminous chip's size is 20 x 26mil, interval between two adjacent luminous chips is 65 um.
Other contents of the integrally packaged high-power LED of the present invention are referred to in the prior art, and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. An integrally packaged high-power LED, characterized in that: the LED packaging structure comprises a substrate, packaging glue, an enclosing wall and a plurality of light-emitting components, wherein a conducting circuit for conducting the light-emitting components is arranged on the substrate;
the conducting circuit comprises a front electrode pad, a back electrode pad, a front metal circuit and a back metal circuit, wherein the front electrode pad and the back electrode pad are respectively arranged on two sides of the substrate, the front metal circuit and the back metal circuit are respectively positioned on the same side with the front electrode pad and the back electrode pad, the plurality of light-emitting assemblies are arranged on the substrate in a plurality of rows, the light-emitting assemblies positioned in the head row and the tail row are communicated with the front electrode pad through the front metal circuit, and the light-emitting assemblies positioned between the head row and the tail row are communicated with the back electrode pad through the back metal circuit;
the enclosing walls are arranged on the substrate in an end-to-end connection mode and surround the light-emitting assemblies; the packaging adhesive is filled in the surrounding wall and wraps the side face of each light-emitting component.
2. The integrally packaged high power LED of claim 1, wherein: the light-emitting module comprises a substrate, and is characterized in that a plurality of pad units which correspond to the light-emitting modules are further arranged on the substrate, the pad units are sequentially arranged and comprise positive pads and negative pads, the positive pads of the pad units are connected with the negative pads of the next adjacent pad units, the positive and negative electrodes of each light-emitting module are respectively connected with the positive pads and the negative pads, and the connection nodes of the positive pads and the negative pads are connected with the front metal circuit or the back metal circuit.
3. The integrally packaged high power LED of claim 1, wherein: the light-emitting module is characterized in that a plurality of pad units which correspond to the light-emitting modules are further arranged on the substrate, each pad unit comprises an anode pad and a cathode pad, the light-emitting modules are divided into a plurality of functional areas, the pad units are sequentially arranged in the same functional area, the anode pad of each pad unit is connected with the cathode pad of the next adjacent pad unit, the anode and the cathode of each light-emitting module are respectively connected with the anode pad and the cathode pad, and the connecting node of each anode pad and each cathode pad is connected with the front metal circuit or the back metal circuit.
4. The integrally packaged high power LED of claim 3, wherein: the substrate is further provided with a plurality of conductive through holes, and each pad unit positioned between the head line and the tail line passes through the conductive through holes and the back metal circuit.
5. The integrally packaged high power LED of claim 4, wherein: the substrate is further provided with a solder mask, and the solder mask is arranged at intervals with the positive electrode bonding pad and the negative electrode bonding pad.
6. The integrally packaged high power LED of claim 5, wherein: the size of the light-emitting components is 10-50mil, the number of the light-emitting components is 20-200pcs, and the distance between every two adjacent light-emitting components is 20-65 mu m.
7. The integrally packaged high power LED of claim 6, wherein: the light emitting component is a monochromatic light chip, or the light emitting component is a blue light chip provided with a light conversion material.
8. The integrally packaged high power LED of claim 1, wherein: the packaging adhesive is filling adhesive, and the filling adhesive is single-layer or multi-layer.
9. The integrally packaged high power LED of claim 8, wherein: the filling adhesive is light-colored reflective material or dark light-absorbing material.
10. The integrally packaged high power LED of claim 1, wherein: the line width and the line distance of the conducting circuit are 0.1-0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123438377.XU CN216671632U (en) | 2021-12-30 | 2021-12-30 | Integrated packaged high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123438377.XU CN216671632U (en) | 2021-12-30 | 2021-12-30 | Integrated packaged high-power LED |
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| Publication Number | Publication Date |
|---|---|
| CN216671632U true CN216671632U (en) | 2022-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202123438377.XU Active CN216671632U (en) | 2021-12-30 | 2021-12-30 | Integrated packaged high-power LED |
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| CN (1) | CN216671632U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116111033A (en) * | 2023-03-03 | 2023-05-12 | 佛山市国星半导体技术有限公司 | LED car light source and manufacturing method thereof |
-
2021
- 2021-12-30 CN CN202123438377.XU patent/CN216671632U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116111033A (en) * | 2023-03-03 | 2023-05-12 | 佛山市国星半导体技术有限公司 | LED car light source and manufacturing method thereof |
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