CN214956944U

CN214956944U - Light emitting package module

Info

Publication number: CN214956944U
Application number: CN202120716578.2U
Authority: CN
Inventors: 李厚德; 应宗康
Original assignee: Lite On Technology Corp
Current assignee: Lite On Technology Corp
Priority date: 2020-08-14
Filing date: 2021-04-08
Publication date: 2021-11-30
Anticipated expiration: 2031-04-08
Also published as: CN215680687U; CN114078997A

Abstract

The application provides a luminous encapsulation module, includes: the light emitting device comprises a carrier plate, at least one light emitting chip and a packaging structure. The carrier plate comprises a conductive structure, and the conductive structure comprises a first electrode and a second electrode which are insulated from each other. The first top end surface and the first bottom end surface of the first electrode and the second electrode are respectively exposed on the first surface and the second surface of the carrier plate and are respectively used as a first/second contact area and a first/second electrical contact area. The light emitting chip is provided with a first connecting pad and a second connecting pad which are mutually spaced. The first pad and the second pad are electrically connected to the first electrode and the second electrode respectively by being coupled to the first contact region and the second contact region. The packaging structure covers the light-emitting chip and at least a part of the first surface of the carrier plate. The vertical projection areas of the first connecting pads and the second connecting pads on the carrier plate are at least partially overlapped with the conductive structure. The carrier plate has thinner thickness and better assembly convenience.

Description

Light emitting package module

Technical Field

The present disclosure relates to light emitting package modules, and particularly to a thin light emitting package module.

Background

Light Emitting Diodes (LEDs) have advantages of high energy conversion efficiency, small size, long service life, and the like, and are used in various light emitting devices. Conventionally, a Surface Mount Technology (SMT) is generally used to dispose a horizontal or vertical LED chip on a circuit substrate, and then the LED chip is electrically connected to the circuit substrate through a wire bonding process and is encapsulated by epoxy resin. However, the circuit substrate used in the LED package structure generally includes a core layer and a plurality of circuit layers, and is relatively thick. In addition, the LED packaging structure comprises a routing wire, so that the whole size of the LED packaging structure is difficult to reduce.

In order to further reduce the size of the LED package structure, a Chip Scale Package (CSP) is currently developed, so that the size of the LED package structure can be reduced to about 1.2 times of the size of the LED chip. However, as the size of the LED package structure is reduced, the size of the bonding pad of the LED package structure and the distance between two adjacent bonding pads are also reduced. When the LED package is to be assembled to another circuit board, the requirement of assembly accuracy is also increasing. Therefore, equipment with higher assembly precision is required for assembly, but the equipment cost is greatly increased. If a device with low assembly accuracy is used to save the cost of the device, the yield of the assembled product may be reduced. Therefore, how to improve the conventional LED package structure to improve the assembly convenience and the product yield without increasing the equipment cost while reducing the volume of the LED package structure is still one of the technical problems to be overcome by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application will solve lies in, under the circumstances that does not increase equipment cost and reduce equipment convenience and product yield, reduce the size of luminous encapsulation module.

In order to solve the above technical problem, one of the technical solutions provided in the present application is: a light emitting package module is provided, which includes a carrier, at least one light emitting chip and a package structure. The carrier has a first surface and a second surface opposite to the first surface. The carrier plate comprises a conductive structure extending from the first surface to the second surface, and the conductive structure comprises a first electrode and a second electrode which are insulated from each other. The first top end surface of the first electrode is exposed on the first surface to serve as a first contact area, and the second top end surface of the second electrode is exposed on the first surface to serve as a second contact area. The first bottom end surface of the first electrode is exposed on the second surface and used as a first electrical contact area, and the second bottom end surface of the second electrode is exposed on the second surface and used as a second electrical contact area. The light emitting chip is provided with a first connecting pad and a second connecting pad which are mutually spaced. The first pad and the second pad are electrically connected to the first electrode and the second electrode respectively by being coupled to the first contact region and the second contact region. The packaging structure covers at least one light-emitting chip and at least one part of the carrier plate. The vertical projection areas of the first connecting pads and the second connecting pads on the carrier plate are at least partially overlapped with the conductive structure.

The light emitting package module provided by the present application has the beneficial effects that by "the carrier plate includes a conductive structure extending from the first surface to the second surface, the conductive structure includes a first electrode and a second electrode insulated from each other, the first bottom end surface of the first electrode is exposed on the second surface and serves as a first electrical contact area, the second bottom end surface of the second electrode is exposed on the second surface and serves as a second electrical contact area", and the technical characteristics of "the vertical projection area of the first pad and the second pad on the carrier plate is at least partially overlapped with the conductive structure" can reduce the overall size of the light emitting package module, increase the area of the first and second electrical contact areas of the light emitting package module, and improve the assembly convenience and the assembly yield rate without increasing the assembly equipment cost.

For a better understanding of the nature and technical content of the present application, reference should be made to the following detailed description and accompanying drawings which are provided for purposes of illustration and description and are not intended to limit the present application.

Drawings

Fig. 1 is a schematic perspective view of a light emitting package module according to a first embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of a light emitting package module according to a first embodiment of the present application along line II-II of fig. 1.

Fig. 3 is a schematic cross-sectional view of a light emitting package module according to a second embodiment of the present application.

Fig. 4 is a perspective view of a light emitting package module according to a third embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a light emitting package module according to a third embodiment of the present application along the line V-V of fig. 4.

Fig. 6 is a schematic cross-sectional view illustrating a light emitting package module according to a fourth embodiment of the present application.

Fig. 7 is a schematic perspective view of a light emitting package module according to a fifth embodiment of the present application.

Fig. 8 is a cross-sectional view of a light emitting package module according to a fifth embodiment of the present application along line VIII-VIII of fig. 7.

Fig. 9 is a schematic top view of a light emitting package module according to a sixth embodiment of the present application.

Fig. 10 is a perspective view of a light emitting package module according to a sixth embodiment of the present application.

Fig. 11 is a schematic top view illustrating a light emitting package module according to a seventh embodiment of the present application.

Fig. 12 is a perspective view of a light emitting package module according to a seventh embodiment of the present application.

Fig. 13 is a cross-sectional view of a light emitting package module of a seventh embodiment of the present application along line XIII-XIII of fig. 11.

Detailed Description

The following description is provided for the embodiments of the "light emitting package module" disclosed in the present application by specific embodiments, and those skilled in the art can understand the advantages and effects of the present application from the disclosure of the present application. The present application is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present application. The drawings in the present application are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present application in detail, but the disclosure is not intended to limit the scope of the present application. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

The following is a description of the light emitting package module according to the present application by way of specific embodiments, but the present application is not limited to the following embodiments and may be variously embodied within the scope of the claims thereof.

[ first embodiment ]

Please refer to fig. 1 and 2, which are a schematic perspective view of a light emitting package module according to a first embodiment of the present application and a schematic cross-sectional view along line II-II of fig. 1. In the present embodiment, the light emitting package module Z1 can be a light emitting package module for generating monochromatic light or a light mixing type light emitting package module. For convenience of illustration and understanding of the present disclosure, in the present embodiment, the light emitting package module Z1 includes a carrier 1, a light emitting chip 2 and a package structure 3 for an exemplary illustration and is not limited to the present embodiment.

In view of the foregoing, in the present embodiment, the carrier 1 may be a coreless package substrate having a first surface 1a and a second surface 1b opposite to the first surface 1 a. The first surface 1a is, for example, an assembly surface; the second surface 1b is, for example, a bottom surface. The carrier 1 includes an insulating substrate 10 and a conductive structure C1 combined with the insulating substrate 10. As shown in fig. 2, at least a portion of the conductive structure C1 is embedded in the insulating substrate 10. Specifically, the conductive structure C1 includes a first electrode 11 and a second electrode 12 that are spaced apart from each other, and the first electrode 11 and the second electrode 12 can be insulated from each other by the insulating substrate 10. In the present embodiment, the conductive structure C1 may be made of copper foil, silver, gold, aluminum or other conductive metal materials.

Further, as shown in fig. 2, in the present embodiment, the insulating substrate 10 surrounds and covers the sidewalls of the first electrode 11 and the second electrode 12, and a portion of the insulating substrate 10 is filled into a space region defined by the first electrode 11 and the second electrode 12, that is, is located between the first electrode 11 and the second electrode 12. In an embodiment, the insulating substrate 10 is made of a material such as a curable adhesive, polypropylene (PP), Epoxy resin (Epoxy), organic and inorganic fillers, white paint, ink, or other materials with insulating properties, but the present application is not limited thereto.

In addition, as shown in fig. 2, the first bottom surface of the first electrode 11 is exposed to the second surface 1b of the carrier 1 to serve as a first electrical contact region 111, and the first top surface of the first electrode 11 is exposed to the first surface 1a of the carrier 1 to serve as a first contact region 112.

Similarly, the second bottom surface of the second electrode 12 is exposed to the second surface 1b as the second electrical contact region 121, and the second top surface of the second electrode 12 is exposed to the first surface 1a of the carrier 1 as the second contact region 122. That is, the first electrode 11 and the second electrode 12 of the conductive structure C1 extend from the first surface 1a to the second surface 1b of the carrier 1.

It should be noted that the first contact region 112 and the second contact region 122 may be used to connect the light emitting chip 2. In addition, the light emitting package module Z1 can be assembled on another circuit board (not shown) through the first electrical contact 111 and the second electrical contact 121. As shown in fig. 1 and fig. 2, the first contact region 112 and the second contact region 122 are spaced apart from each other, and the first electrical contact region 111 and the second electrical contact region 121 are spaced apart from each other. Further, the first electrical contact region 111 and the second electrical contact region 121 are separated by the insulating substrate 10, and the first electrical contact region 111 and the second electrical contact region 121 are located on the same horizontal reference plane.

As shown in fig. 2, in the present embodiment, the insulating substrate 10 has a first thickness t1, and the conductive structure C1 (including the first electrode 11 and the second electrode 12) has a second thickness t2, and the first thickness t1 is substantially the same as the second thickness t 2. Accordingly, the first electrical contact region 111 and the second electrical contact region 121 are both flush with the bottom surface 10b of the insulating substrate 10, but the present application is not limited thereto. In another embodiment, the first thickness t1 is not necessarily the same as the second thickness t2, for example, the first electrical contact region 111 and the second electrical contact region 121 may slightly protrude from the bottom surface 10b of the insulating substrate 10. In addition, in the present embodiment, the first contact region 112 and the second contact region 122 may also be substantially flush with the top surface 10a of the insulating substrate 10.

In addition, referring to fig. 2, in the present embodiment, the cross-sectional width of the first electrode 11 and the cross-sectional width of the second electrode 12 are consistent from top to bottom, but the present application is not limited thereto. In another embodiment, the first electrode 11 may have different cross-sectional widths at different portions. Similarly, the second electrode 12 may have different cross-sectional widths at different portions, as will be described in detail later.

Referring to fig. 2 again, in the embodiment, the cross-sectional area (parallel to the bottom surface of the light emitting chip 2) of the first electrical contact region 111 is equal to the cross-sectional area of the first contact region 112, and the cross-sectional area of the second electrical contact region 121 is equal to the cross-sectional area of the second contact region 122, but the application is not limited thereto. In another embodiment, the cross-sectional area of the first electrical contact region 111 is different from the cross-sectional area of the first contact region 112, and the cross-sectional area of the second electrical contact region 121 is different from the cross-sectional area of the second contact region 122.

It should be noted that the conventional package substrate may include a core layer and at least two circuit layers, but the carrier 1 provided in the present application is, for example, a package substrate without a core layer, which omits a core layer (core layer) and one of the circuit layers and has a thinner thickness. Specifically, in one embodiment, the conductive structure C1 may be a single circuit layer formed by etching a metal layer, wherein the metal layer may be a single layer or multiple layers of metal. Then, the insulating substrate 10 is formed, and the insulating substrate 10 covers the side of the conductive structure C1, and exposes the first contact area 112 and the second contact area 122, and the first electrical contact area 111 and the second electrical contact area 121 to form the carrier board 1, so that the carrier board 1 has better strength and support performance. Accordingly, in the present application, the thickness of the carrier 1 may be substantially the same as that of the single metal layer, for example, between 0.03 mm and 0.05 mm, but the present application is not limited thereto.

Referring to fig. 1 and fig. 2, the light emitting package module Z1 of the present embodiment includes a light emitting chip 2, but the present application is not limited thereto. In other embodiments, the light emitting package module Z1 may also include a plurality of light emitting chips 2, which will be described in detail later. The light emitting chips 2 are, for example, Light Emitting Diodes (LEDs), infrared light (IR), or Laser (Laser), etc., and the plurality of light emitting chips 2 may be the same type of light emitting chips or a mixture of different types of light emitting chips. In this embodiment, the light emitting chip 2 is a flip-chip type horizontal light emitting chip, and two electrodes of the light emitting chip are located on the same side.

As shown in fig. 2, the light emitting chip 2 has a light emitting surface 2a, a bottom surface 2b opposite to the light emitting surface 2a, and a side surface 2c connected between the light emitting surface 2a and the bottom surface 2 b. In addition, the light emitting chip 2 includes a first pad 21 and a second pad 22 on the bottom surface 2b thereof, and the first pad 21 and the second pad 22 are disposed at an interval. One of the first pad 21 and the second pad 22 serves as a positive electrode of the light emitting chip 2, and the other serves as a negative electrode of the light emitting chip 2.

As mentioned above, the light emitting chip 2 is disposed on the carrier 1. Further, the light emitting chip 2 is disposed on the first surface 1a (the assembly surface) with the first pad 21 and the second pad 22 facing the carrier 1. As shown in fig. 2, the first pad 21 and the second pad 22 of the light emitting chip 2 are respectively coupled to the first contact region 112 and the second contact region 122 exposed on the first surface 1 a. Accordingly, the first pad 21 and the second pad 22 of the light emitting chip 2 are electrically connected to the first electrode 11 and the second electrode 12 of the carrier 1, respectively, and further electrically connected to an external circuit (not shown) through the first electrical contact region 111 and the second electrical contact region 121. In addition, in the present embodiment, the material of the insulating base material 10 may be white paint having a reflection effect, so that light emission of the light emitting chip 2 is facilitated.

In addition, referring to fig. 1, the area of the first contact region 112 is greater than or equal to the area of the first pad 21, and the area of the second contact region 122 is greater than or equal to the area of the second pad 22. Thus, when the light emitting chip 2 is disposed on the carrier 1, it is easier to align the first pad 21 and the second pad 22 to the positions of the first contact region 112 and the second contact region 122, respectively, so as to avoid electrical short circuit caused by misalignment. In the embodiment of fig. 1, it is taken as an example that the area of the first contact region 112 is larger than the area of the first pad 21, and the area of the second contact region 122 is larger than the area of the second pad 22, but the application is not limited thereto.

Referring to fig. 2, the first pad 21 and the second pad 22 are separated by a first distance D1, the first contact region 112 and the second contact region 122 are separated by a second distance D2, and the second distance D2 may be greater than or equal to the first distance D1. In the embodiment, the first distance D1 is substantially the same as the second distance D2, but the disclosure is not limited thereto. In another embodiment, the first distance D1 may be less than the second distance D2.

In view of the above, the first electrical contact regions 111 and the second electrical contact regions 121 are exposed at the bottom of the light emitting package module Z1, so that the light emitting package module Z1 can be assembled on another circuit board (not shown) by Surface Mounting Technology (SMT).

Furthermore, the vertical projection areas of the first and

second pads

21 and 22 projected onto the carrier 1 at least partially overlap the conductive structure C1. In the present embodiment, the partial conductive structure C1 is located outside the vertical projection area of at least one light emitting chip 2 on the carrier board 1. Further, a vertical projection area of the first pad 21 projected onto the carrier 1 at least partially overlaps the first electrical contact region 111, and a vertical projection area of the second pad 22 at least partially overlaps the second electrical contact region 121. As shown in fig. 1, in the embodiment, the vertical projection areas of the first and

second pads

21 and 22 projected onto the carrier 1 completely overlap the first and second

electrical contact areas

111 and 121, that is, the area of the first electrical contact area 111 is larger than the area of the first pad 21, and the area of the second electrical contact area 121 is larger than the area of the second pad 22, but the present application is not limited thereto, and may be determined according to the size of the light emitting chip 2.

For example, when the size of the light emitting chip 2 is large enough to make the area of the first pad 21 and the area of the second pad 22 both larger than or equal to a predetermined value, the area of the first electrical contact region 111 may be substantially the same as the area of the first pad 21, and the area of the second electrical contact region 121 may be substantially the same as the area of the second pad 22. When the size of the light emitting chip 2 is reduced to conform to the trend of miniaturization, and the area of the first pad 21 and the area of the second pad 22 are both smaller than the predetermined value, the area of the first electrical contact region 111 may be larger than the area of the first pad 21, and the area of the second electrical contact region 121 may be larger than the area of the second pad 22, and the electrical contact area is increased, so that the convenience of assembling the light emitting chip on another circuit board (not shown) can be increased.

Accordingly, even if the size of the light emitting chip 2 is reduced to reduce the distance or area between the first pad 21 and the second pad 22, since the first electrical contact region 111 and the second electrical contact region 121 of the carrier board 1 extend from the lower side of the light emitting chip 2 along the horizontal direction (i.e. along the second surface 1b of the carrier board) to exceed the side surface 2c of the light emitting chip 2, the area of the first and second

electrical contact regions

111 and 121 is larger than the area of the first and

second pads

21 and 22, when the light emitting chip 2 is disposed on the carrier board 1 in a flip chip bonding manner, or when the light emitting package module Z1 is assembled to another circuit board, the required assembly accuracy is not increased due to the reduction in size of the light emitting chip 2. Therefore, it is not necessary to additionally use equipment with higher assembly precision, and equipment cost can be saved. Meanwhile, the yield of the assembled product is not reduced due to electrical short circuit caused by misalignment.

Referring to fig. 1 and fig. 2 again, the light emitting package module Z1 further includes a package structure 3, and the package structure 3 encapsulates the light emitting chip 2 and covers at least a portion of the first surface 1a of the carrier 1. In the present embodiment, the material of the package structure 3 is a package adhesive layer, such as a transparent silicone or an epoxy resin, but the application is not limited thereto. For example, the material of the encapsulation layer may include silica gel and phosphor powder doped in the silica gel to convert the wavelength of the light beam of the light emitting chip 2.

In view of the above, in the light emitting package module Z1 of the embodiment of the present application, the carrier 1 with a thinner thickness, such as a coreless package substrate, is used, so that the overall size of the light emitting package module Z1 can be reduced. In addition, the first electrical contact region 111 and the second electrical contact region 121 both extend outward from the lower portion of the light emitting chip 2 along the horizontal direction and exceed the side surface 2c of the light emitting chip 2. In this way, the first electrical contact region 111 and the second electrical contact region 121 have a larger electrical contact area. When the light emitting package module Z1 is assembled to another circuit board, the assembly yield can be improved without increasing the equipment cost.

[ second embodiment ]

Fig. 3 is a schematic cross-sectional view of a light emitting package module according to a second embodiment of the present application. The same or similar components of the light emitting package module Z2 of the present embodiment and the light emitting package module Z1 of the first embodiment have the same or similar reference numerals, and the description of the same parts is omitted.

As shown in fig. 3, in the embodiment, a second distance D2 between the first contact region 112 and the second contact region 122 is different from a first distance D1 between the first pad 21 and the second pad 22. Further, the second distance D2 may be greater than the first distance D1, but the application is not limited thereto. In another embodiment, the second distance D2 may also be equal to or less than the first distance D1. That is, the vertical projection area of the first pad 21 projected onto the carrier 1 and the first electrical contact region 111 do not completely overlap, but partially overlap. Similarly, the vertical projection area of the second pads 22 projected onto the carrier 1 does not completely overlap with the second electrical contact area 121, but partially overlaps. Accordingly, even if the light emitting chip 2 has a smaller size or the first distance D1 between the first pad 21 and the second pad 22 is smaller, the first electrical contact region 111 and the second electrical contact region 121 have a larger distance (the second distance D2), so that the problem of tin-soldering short circuit is less likely to occur when the light emitting chip 2 is disposed on the carrier board 1 in a flip-chip bonding manner or when the light emitting package module Z1 is assembled on another circuit board, and the assembly yield is reduced.

It should be noted that the cross-sectional width (or area) of the first contact region 112 (or the first electrical contact region 111) of the light emitting package module Z2 of the present embodiment may be greater than or equal to the cross-sectional width (or area) of the first pad 21, and the cross-sectional width (or area) of the second contact region 122 (or the second electrical contact region 121) may be greater than or equal to the cross-sectional width (or area) of the second pad 22, which is not limited herein.

Furthermore, referring to fig. 3, in the present embodiment, the first thickness t1 of the insulating substrate 10 is smaller than the second thickness t2 of the conductive structure C1. That is, the first electrical contact region 111 of the first electrode 11 and the second electrical contact region 121 of the second electrode 12 both protrude from the bottom surface 10b of the insulating substrate 10. Thus, when the light-emitting package module Z2 is assembled on another circuit board, the area of the light-emitting package module Z2 contacting with solder (such as soldering tin) can be increased, thereby improving the soldering quality and the product reliability.

In addition, referring to fig. 3, the package structure 3' of the present embodiment may be made of different materials. In detail, the package structure 3' includes a package adhesive layer 31 and a reflective frame 32. The encapsulant layer 31 encapsulates the light emitting chip 2 and at least a portion of the first surface 1a of the carrier 1. The material of the encapsulating adhesive layer 31 may be a light-transmitting adhesive, an atomized adhesive, or a yellow adhesive, but the application is not limited thereto. For example, the material of the encapsulant layer 31 may include silica gel and phosphor doped in the silica gel to convert the wavelength of the light beam of the light emitting chip 2.

As mentioned above, the reflective frame 32 surrounds the package adhesive layer 31 and is disposed on the carrier 1. That is, the reflective bezel 32 is disposed around the side surface 2c of the light emitting chip 2 without covering the light emitting surface 2a of the light emitting chip 2. The reflective frame 32 is made of opaque and reflective material, such as white silica gel doped with titanium dioxide or silicon dioxide, and can reflect the light beam generated by the light emitting chip 2 and adjust the light emitting angle of the light emitting package module Z2. Through setting up reflection frame 32, the light that can reflect emitting chip 2 side direction and emit reaches the effect of spotlight to promote the luminance of luminous encapsulation module Z2.

[ third embodiment ]

Please refer to fig. 4 to 5. Fig. 4 is a perspective view of a light emitting package module according to a third embodiment of the present application. Fig. 5 is a schematic cross-sectional view of a light emitting package module according to a third embodiment of the present application along the line V-V of fig. 4. The same or similar components of the light emitting package module Z3 of the present embodiment and the light emitting package module Z1 of the first embodiment have the same or similar reference numerals, and the description of the same parts is omitted.

In the light emitting package module Z3 of the present embodiment, the first electrode 11 includes a first upper conductive portion 113 and a first lower conductive portion 114 embedded in the carrier 1; the second electrode 12 includes a second upper conductive portion 123 and a second lower conductive portion 124 embedded in the carrier 1.

In one embodiment, the first upper conductive portion 113 and the first lower conductive portion 114 are composed of the same material, and the second upper conductive portion 123 and the second lower conductive portion 124 are composed of the same material, but in another embodiment, the first upper conductive portion 113 and the second upper conductive portion 123 are composed of a different material than the first lower conductive portion 114 and the second lower conductive portion 124. That is, the first electrode 11 (or the second electrode 12) may be formed by stacking at least two conductive layers made of different materials, which is not limited in the present application.

As shown in fig. 5, further, the first upper conductive portion 113 includes a first contact region 112 exposed on the first surface 1a, and the first lower conductive portion 114 includes a first electrical contact region 111 exposed on the second surface 1 b. Similarly, the second upper conductive portion 123 includes a second contact region exposed on the first surface 1a, and the second lower conductive portion 124 includes a second electrical contact region 121 exposed on the second surface 1 b.

Referring to fig. 5, the first pad 21 and the second pad 22 of the light emitting chip 2 are separated by a first distance D1. In addition, the first contact area 112 and the second contact area 122 are separated by a second distance D2, and the first electrical contact area 111 and the second electrical contact area 121 are separated by a third distance D3.

In the present embodiment, as shown in fig. 4 and 5, the first upper conductive portion 113 and the first lower conductive portion 114 are connected to each other in a staggered manner, so that the first electrode 11 has a stepped structure. Similarly, the second upper conductive portion 123 and the second lower conductive portion 124 are connected to each other with a staggered structure, so that the second electrode 12 has a stepped structure. That is, in the thickness direction of the carrier board 1, the vertical projection areas of the first upper conductive portion 113 and the first lower conductive portion 114 do not completely overlap, but partially overlap. Similarly, the vertical projection areas of the second upper conductive part 123 and the second lower conductive part 124 are also partially overlapped. In the embodiment, as shown in fig. 5, the third distance D3 is greater than the second distance D2, and the second distance D2 is greater than or equal to the first distance D1, such that the cross-sectional shapes of the first and

second electrodes

11, 12 are similar to a zigzag, but the disclosure is not limited thereto.

For example, as long as the area of the first electrical contact region 111 is larger than the area of the first contact region 112, and the area of the second electrical contact region 121 is larger than the area of the second contact region 122, the third distance D3 is not necessarily larger than the second distance D2. That is, in other embodiments, the first distance D1 may be equal to the second distance D2, or the second distance D2 may be equal to the third distance D3, or the first distance D1, the second distance D2, and the third distance D3 are the same. It should be noted that, when the size of the light emitting chip 2 is smaller and the first distance D1 between the first pad 21 and the second pad 22 is smaller, the third distance D3 is greater than the first distance D1, so as to increase the assembly convenience and the assembly yield when the light emitting package module Z1 is assembled on another circuit board.

As described in the foregoing embodiments, in the present embodiment, referring to fig. 4, the area of the first contact region 112 is larger than the area of the first pad 21, and the area of the second contact region 122 is larger than the area of the second pad 22. In this way, when the light emitting chip 2 is disposed on the carrier 1, the first contact pad 21 and the second contact pad 22 are easily aligned to the first contact region 112 and the second contact region 122, but the application is not limited thereto. In another embodiment, the areas of the first and

second contact regions

112 and 122 may also be equal to the areas of the first and

second pads

21 and 22, respectively. That is, as long as the first pad 21 and the second pad 22 can be connected to the first contact region 112 and the second contact region 122, respectively, the area of the first contact region 112 and the area of the second contact region 122 are not necessarily larger than the area of the first contact region 21 and the area of the second contact region 22.

In addition, in the embodiment, as shown in fig. 4, the areas of the first contact region 112 and the first electrical contact region 111 are not the same. Further, the area of the first contact region 112 is smaller than that of the first electrical contact region 111, and the area of the second contact region 122 is smaller than that of the second electrical contact region 121. In addition, the first electrical contact region 111 and the second electrical contact region 121 are located below the package structure 3, and both extend from below the light emitting chip 2 to the outside along the horizontal direction beyond the side surface 2c of the light emitting chip 2. Therefore, the assembly convenience and the assembly yield of the light-emitting packaging module Z3 can be improved.

In addition, in the embodiment, the first thickness t1 of the insulating substrate 10 is smaller than the second thickness t2 of the conductive structure C1. That is, the first electrical contact region 111 of the first lower conductive portion 114 and the second electrical contact region 121 of the second lower conductive portion 124 both protrude from the bottom surface 10b of the insulating substrate 10. Thus, when the light-emitting package module Z3 is assembled on another circuit board, the area of the light-emitting package module Z3 contacting with solder (such as soldering tin) can be increased, thereby improving the soldering quality and the product reliability.

[ fourth embodiment ]

Fig. 6 is a schematic cross-sectional view of a light emitting package module according to a fourth embodiment of the present application. The same or similar components of the light emitting package module Z4 of the present embodiment and the light emitting package module Z3 of the third embodiment have the same or similar reference numerals, and the description of the same parts is omitted.

In the embodiment, the area of the first contact region 112 is substantially the same as the area of the first pad 21, and the area of the second contact region 122 is substantially the same as the area of the second pad 22. However, in the present embodiment, similar to the third embodiment (refer to fig. 4 and fig. 5), the area of the first electrical contact region 111 is larger than the area of the first pad 21, and the area of the second electrical contact region 121 is also larger than the area of the second pad 22.

In the embodiment, the first distance D1 between the first pad 21 and the second pad 22 is substantially equal to the second distance D2 between the first contact region 112 and the second contact region 122. In addition, the third distance D3 between the first electrical contact region 111 and the second electrical contact region 121 is greater than the second distance D2, but the disclosure is not limited thereto.

It should be noted that the bonding force between the package structure 3' and the insulating substrate 10 is greater than the bonding force between the package structure and the conductive structure C1. Accordingly, in the present embodiment, in the first surface 1a of the carrier 1, the top surface 10a of the insulating substrate 10 has a larger area ratio than the area occupied by the exposed upper surface of the conductive structure C1 (i.e., the sum of the areas of the first contact region 112 and the second contact region 122), so that the bonding force between the package structure 3' and the carrier 1 can be increased.

On the other hand, referring to fig. 6, since the first electrical contact region 111 and the second electrical contact region 121 still extend from the lower portion of the light emitting chip 2 to the outside along the horizontal direction beyond the side surface 2c of the light emitting chip 2, when the light emitting package module Z4 is to be assembled to another circuit board, the assembly convenience and the assembly yield are not affected.

In addition, referring to fig. 6, in the embodiment, the package structure 3' disposed on the carrier 1 includes a package adhesive layer 31 and a reflective frame 32. The packaging adhesive layer 31 covers each light-emitting chip 2 and at least a part of the carrier plate 1; the reflective bezel 32 is disposed around the side surface 2c of the light emitting chip 2 without covering the light emitting surface 2a of the light emitting chip 2. In addition, in the present embodiment, the first thickness t1 of the insulating substrate 10 is substantially the same as the second thickness t2 of the conductive structure C1. That is, in the present embodiment, the first electrical contact region 111 of the first lower conductive portion 114 and the second electrical contact region 121 of the second lower conductive portion 124 are substantially aligned with the bottom surface 10b of the insulating substrate 10.

[ fifth embodiment ]

Please refer to fig. 7 and 8. Fig. 7 is a schematic perspective view of a light emitting package module according to a fifth embodiment of the present application. Fig. 8 is a cross-sectional view of a light emitting package module according to a fifth embodiment of the present application along line VIII-VIII of fig. 7. The same or similar components of the light emitting package module Z5 of the present embodiment and the light emitting package module Z3 of the third embodiment have the same or similar reference numerals, and the description of the same parts is omitted.

As shown in fig. 8, the area of the first electrical contact region 111 is smaller than that of the first contact region 112, and the area of the second electrical contact region 121 is smaller than that of the second contact region 122.

In addition, referring to fig. 8, a first distance D1 between the first pad 21 and the second pad 22 is substantially equal to a second distance D2 between the first contact region 112 and the second contact region 122. In addition, the third distance D3 between the first electrical contact region 111 and the second electrical contact region 121 is greater than the second distance D2.

That is, in the present embodiment, as long as the third distance D3 between the first electrical contact region 111 and the second electrical contact region 121 is greater than the first distance D1, even if the areas of the first and second

electrical contact regions

111, 121 are smaller than the areas of the first and

second contact regions

112, 122, the assembly convenience of the light emitting package module Z5 can be increased and the assembly yield can be improved. However, the present application is not limited thereto, and in different embodiments, the area of the first electrical contact region 111 may be equal to or larger than the area of the first electrical contact region 112. Similarly, the area of the second electrical contact region 121 may be equal to or larger than the area of the second contact region 122.

[ sixth embodiment ]

Please refer to fig. 9 and 10, which are a schematic top view and a schematic perspective view of a light emitting package module according to a sixth embodiment of the present application, respectively. In the present embodiment, the light emitting package module Z6 includes a plurality of light emitting chips 2. That is, more than one light emitting chip 2 can be packaged together to form the light emitting package module Z6 of the present embodiment. The same or similar components of the light emitting package module Z6 of the present embodiment and the light emitting package modules Z3-Z5 of the third to fifth embodiments have the same reference numerals, and the description of the same parts is omitted.

It should be noted that, in fig. 9, three light emitting chips 2 are taken as an example for illustration, but the application does not limit the number of the light emitting chips 2 in the light emitting package module Z6. In addition, the three light emitting chips 2 may be used to generate light beams with the same wavelength, or may generate light beams with different wavelengths respectively. For example, when the light emitting package module Z6 is a light mixing type light emitting package module, the three light emitting chips 2 can be used to generate red light, green light and blue light, respectively, but the application is not limited thereto.

In the present embodiment, three light emitting chips 2 are disposed on the carrier board 1 at intervals independently from each other. Specifically, the conductive structure C1 of the carrier 1 of the present embodiment includes a plurality of first electrodes 11 and a plurality of second electrodes 12. The plurality of first electrodes 11 and the plurality of second electrodes 12 are disposed separately from each other, and each light emitting chip is electrically connected to the corresponding first electrode 11 and the corresponding second electrode 12.

It should be noted that, in fig. 9, the first electrode 11 and the second electrode 12 of the third embodiment are taken as an example for description, but the present application does not limit the structure of the first electrode 11 and the second electrode 12 in the light emitting package module Z6. As shown in fig. 9, in the present embodiment, each of the first electrodes 11 includes a first upper conductive portion 113 and a first lower conductive portion 114, and each of the second electrodes 12 also includes a second upper conductive portion 123 and a second lower conductive portion 124. Since the plurality of first upper conductive portions 113 are separated by the insulating substrate 10, a plurality of exposed and separated first contact regions 112 are formed on the first surface 1a of the carrier 1. Similarly, the second upper conductive portions 123 are separated from each other by the insulating base material 10, and a plurality of exposed and separated second contact regions 122 are formed on the first surface 1a of the carrier 1. Accordingly, each light emitting chip 2 is connected to the corresponding first contact region 112 and the corresponding second contact region 122.

In addition, referring to fig. 10, the plurality of first lower conductive portions 114 are separated from each other by the insulating substrate 10, and the first bottom end surface of each first lower conductive portion 114 is exposed on the second surface 1b of the carrier 1 to serve as the first electrical contact region 111. Accordingly, the first electrical contact regions 111 are disposed at a predetermined distance from each other. Similarly, the plurality of second lower conductive portions 124 are separated from each other by the insulating substrate 10, and each of the second lower conductive portions 124 is exposed on the second surface 1b of the carrier 1 to serve as a second electrical contact region 121, and the plurality of second electrical contact regions 121 are separated from each other by a predetermined distance.

Note that, in fig. 9, the package structure 3 'shown in fig. 6 is taken as an example for description, but the present application does not limit the structure of the package structure 3' in the light emitting package module Z6. Referring to fig. 9, in the present embodiment, the package structure 3' disposed on the carrier 1 includes a package adhesive layer 31 and a reflective frame 32. The packaging adhesive layer 31 covers each light-emitting chip 2 and at least a part of the carrier plate 1; the reflective frame 32 surrounds all the sides of the light emitting chips 2, but does not cover the light emitting surface 2a of the light emitting chips 2. Through setting up reflection frame 32, can reach the spotlight effect, promote luminous luminance of luminous encapsulation module Z6. In addition, when the light emitting package module Z6 is a light mixing type light emitting package module, the reflective border 32 can improve the light mixing uniformity of the light emitting package module Z6. The reflective frame 32 is made of opaque and reflective material, such as white silica gel doped with titanium dioxide or silicon dioxide, and can reflect the light beam generated by the light emitting chip 2 and adjust the light emitting angle of the light emitting package module Z6. In other embodiments, the reflective border 32 may be omitted, depending on the product requirements.

[ seventh embodiment ]

Please refer to fig. 11 to 13. Fig. 11 is a schematic top view, fig. 12 is a schematic perspective view, and fig. 13 is a schematic cross-sectional view of the light emitting package module of the seventh embodiment of the present application along the line XIII-XIII in fig. 11. The same or similar components of the light emitting package module Z7 of the present embodiment and the light emitting package module Z6 of the sixth embodiment have the same reference numerals, and the description of the same parts is omitted.

In the present embodiment, the light emitting package module Z7 includes a plurality of light emitting chips 2, but the conductive structure C1 includes a plurality of first electrodes 11 and a second electrode 12. That is, the light emitting chips 2 are connected to the corresponding first electrodes 11, but connected to the same second electrode 12. Further, a plurality of first pads (not shown in fig. 11) of the plurality of light emitting chips 2 are electrically connected to the plurality of first electrodes 11, respectively, and a plurality of second pads (not shown in fig. 11) of the plurality of light emitting chips 2 are electrically connected to the same second electrode 12. In addition, the second electrode 12 may be electrically connected to the positive electrode or the negative electrode of the light emitting chip 2, and may serve as a common anode or a common cathode, which is not limited in the present application.

In detail, as shown in fig. 11 and 13, the second electrode 12 includes a plurality of second upper conductive portions 123 and a second lower conductive portion 124. The second upper conductive portions 123 are embedded in the carrier 1 and separated from each other by the insulating substrate 10. As shown in fig. 13, the second top end surfaces of the second upper conductive portions 123 are exposed on the first surface 1a of the carrier 1 and are separated from each other to respectively serve as a plurality of second contact regions 122.

Referring to fig. 13, the second lower conductive portion 124 is embedded in the carrier 1, and the plurality of second upper conductive portions 123 are commonly connected to the second lower conductive portion 124. In addition, referring to fig. 12 and 13, the second bottom end surface of the second lower conductive portion 124 is exposed on the second surface 1b to serve as the second electrical contact region 121. Referring to fig. 11 again, the area of the second electrical contact region 121 is larger than the sum of the areas of the second contact regions 122.

As shown in fig. 11, the carrier 1 has a plurality of first contact regions 112 and a plurality of second contact regions 122 on the first surface 1a, which are independent of each other. However, as shown in fig. 12, the carrier board 1 has a plurality of independent first electrical contact regions 111 and a single second electrical contact region 121 on the second surface 1 b. That is, the second electrical contact 121 of the light emitting package module Z7 of the present embodiment can be used as a common electrode of the plurality of light emitting chips 2.

It should be noted that, in other embodiments, the conductive structure C1 may also include a first electrode 11 and a plurality of second electrodes 12, and the first electrode 11 has the same structure as the second electrode 12 in fig. 11, so that the first electrical contact region 111 of the light emitting package module Z7 serves as a common electrode of the plurality of light emitting chips 2, which is not limited in the present application.

[ technical effects of the embodiments ]

The invention has the beneficial effects that the light emitting package module Z1-Z7 provided by the present application can reduce the overall size of the light emitting package module Z1-Z7 by "the carrier board 1 includes a conductive structure C1, the conductive structure C1 includes a first electrode 11 and a second electrode 12 that are insulated from each other, a first bottom end surface of the first electrode 11 is exposed on the second surface 1b to serve as a first electrical contact region 111, a second bottom end surface of the second electrode 12 is exposed on the second surface 1b to serve as a second electrical contact region 121", and "the vertical projection areas of the first pad 21 and the second pad 22 on the carrier board 1 are at least partially overlapped with the conductive structure C1". Specifically, the total thickness of the light emitting package modules Z1-Z7 provided by the present application may be between 0.05 mm and 0.3 mm.

In addition, by increasing the area of the first and second

electrical contact regions

111, 121 of the light emitting package module Z1-Z7 or the third distance D3 between the first and second

electrical contact regions

111, 121, the assembly convenience and the assembly yield of the light emitting package module Z1-Z7 can be improved without increasing the precision and cost of the assembly equipment.

The disclosure is only an alternative embodiment and is not intended to limit the scope of the claims, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the claims.

Claims

1. A light emitting package module, comprising:

a carrier having a first surface and a second surface opposite to the first surface, wherein the carrier includes a conductive structure extending from the first surface to the second surface, the conductive structure includes a first electrode and a second electrode insulated from each other, a first top end surface of the first electrode is exposed on the first surface to serve as a first contact area, a second top end surface of the second electrode is exposed on the first surface to serve as a second contact area, a first bottom end surface of the first electrode is exposed on the second surface to serve as a first electrical contact area, and a second bottom end surface of the second electrode is exposed on the second surface to serve as a second electrical contact area;

at least one light emitting chip having a first pad and a second pad spaced apart from each other, wherein the first pad and the second pad are electrically connected to the first electrode and the second electrode, respectively, by being coupled to the first contact region and the second contact region; and

the packaging structure covers the at least one light-emitting chip and covers at least one part of the first surface of the carrier plate;

wherein, the vertical projection areas of the first pads and the second pads on the carrier board are at least partially overlapped with the conductive structure.

2. The light emitting package module as claimed in claim 1, wherein the carrier further comprises an insulating substrate, wherein the first electrode and the second electrode are insulated from each other by the insulating substrate, and the first electrode, the second electrode and the insulating substrate together form a coreless package substrate.

3. The light emitting package module as claimed in claim 2, wherein a portion of the conductive structure is located outside a vertical projection area of the at least one light emitting chip on the carrier.

4. The light emitting package module as claimed in claim 3, wherein the first pad and the second pad are separated from each other by a first distance, the first contact region and the second contact region are separated from each other by a second distance, the first electrical contact region and the second electrical contact region are separated from each other by a third distance, the second distance is greater than or equal to the first distance, and the third distance is greater than or equal to the second distance.

5. The light emitting package module as claimed in claim 4, wherein the first electrode comprises a first upper conductive portion and a first lower conductive portion embedded in the carrier, the second electrode comprises a second upper conductive portion and a second lower conductive portion embedded in the carrier, the first upper conductive portion and the first lower conductive portion are connected in a staggered manner, the second upper conductive portion and the second lower conductive portion are connected in a staggered manner, and the third distance is greater than the second distance, and the second distance is greater than or equal to the first distance.

6. The light emitting package module as claimed in any one of claims 1 to 5, wherein the area of the first contact region is greater than or equal to the area of the first pad, and the area of the second contact region is greater than or equal to the area of the second pad.

7. The light emitting package module as recited in claim 6, wherein the area of the first electrical contact region is greater than or equal to the area of the first contact region, and the area of the second electrical contact region is greater than or equal to the area of the second contact region.

8. The light emitting package module as claimed in claim 7, wherein a vertical projection area of the first pads projected onto the carrier at least partially overlaps the first contact area, and a vertical projection area of the second pads projected onto the carrier at least partially overlaps the second contact area.

9. The light emitting package module as claimed in claim 6, wherein the first and second electrical contact regions extend horizontally outward from under the at least one light emitting chip and beyond a side surface of the at least one light emitting chip.

10. The light emitting package module as recited in claim 2, wherein the first electrical contact region and the second electrical contact region are aligned with or protrude from the bottom surface of the insulating substrate.

11. The light emitting package module as recited in claim 10, wherein the package structure comprises:

the packaging adhesive layer is used for coating the at least one light-emitting chip; and

and the reflecting frame surrounds the packaging adhesive layer and is arranged on the first surface of the carrier plate, wherein the reflecting frame surrounds the side surface of the at least one light-emitting chip and does not cover the light-emitting surface of the at least one light-emitting chip.

12. The light emitting package module as claimed in claim 1, wherein the number of the at least one light emitting chip is plural, and the conductive structure comprises a plurality of first electrodes and a plurality of second electrodes, the plurality of first electrodes and the plurality of second electrodes are spaced apart from each other, and each of the light emitting chips is electrically connected to the corresponding first electrode and the corresponding second electrode.

13. The light emitting package module as claimed in claim 1, wherein the at least one light emitting chip is plural in number, the conductive structure includes a plurality of first electrodes, and the plurality of first electrodes are spaced apart from each other, wherein the plurality of first pads of the plurality of light emitting chips are respectively electrically connected to the corresponding plurality of first electrodes, and the plurality of second pads of the plurality of light emitting chips are commonly electrically connected to the second electrodes.

14. The light emitting package module as set forth in claim 13, wherein the second electrode comprises:

a plurality of second upper conductive portions embedded in the carrier, wherein second top end surfaces of the second upper conductive portions are exposed on the first surface and separated from each other to serve as a plurality of second contact regions, respectively; and

the second lower conductive part is embedded in the carrier plate, wherein the plurality of second upper conductive parts are commonly connected to the second lower conductive part, the second bottom end surface of the second lower conductive part is exposed on the second surface to serve as the second electrical contact area, and the area of the second electrical contact area is larger than the sum of the areas of the plurality of second contact areas.