CN100499119C - LED module - Google Patents
LED module Download PDFInfo
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- CN100499119C CN100499119C CNB2006100984805A CN200610098480A CN100499119C CN 100499119 C CN100499119 C CN 100499119C CN B2006100984805 A CNB2006100984805 A CN B2006100984805A CN 200610098480 A CN200610098480 A CN 200610098480A CN 100499119 C CN100499119 C CN 100499119C
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- emitting diode
- light emitting
- diode module
- dielectric layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention is concerned with the light-emitting diode module group, includes the metal circuit board and the complex number of light-emitting diode grain. The metal circuit board includes the metal plate, the first dielectric layer and the circuitry layer orderly; the first dielectric layer is with the complex number of hatch; where the light - emitting diode grain set on and they connects with the circuitry layer by electricity. The invention resolves the problem of thermolysis prolongs the light-emitting diode module group life-cycle and ensures the quality of the production by reinsuring the heat energy generated by the light-emitting diode grain can be transmitted to the metal plate through the base board directly, which can reduce the temperature of the light-emitting diode component.The complex number of hatch can use as the enveloping outskirts of the packaging process and the setting up of the light-emitting is just simple set on the metal basal board, both can reduce the making step of the packaging process and the module forming and their time consuming.
Description
Technical field
The present invention relates to a kind of illuminating module, particularly relate to the heat energy that a kind of quick transmission LED crystal particle produces, the heat radiation of assistance LED crystal particle, prolong light emitting diode module useful life, more luminescent quality be can guarantee, packaging technology and the step of packaging technology and the light emitting diode module of time reduced.
Background technology
Light-emitting diode is by the made light-emitting component of semi-conducting material, and element has two electrode terminals, applies voltage between terminal, feeds minimum voltage, via the combination of electron hole, then dump energy can be excited with the form of light and disengage.
Be different from general incandescent lamp bulb, light-emitting diode is to belong to chemiluminescence, has advantages such as power consumption is low, component life long, need not warm up the lamp time, reaction speed is fast.Add that its volume is little, vibration resistance, be fit to volume production, demand on the fit applications is made the module of minimum or array easily, so can be widely used in becoming one of critical elements indispensable in the daily life on the indicating device and display unit of lighting apparatus, information, communication, consumption electronic products.
Seeing also shown in Figure 1ly, is the schematic diagram of light emitting diode module of the prior art.Existing known light emitting diode module (led module) 10, comprise a loading plate S and a plurality of light-emitting diode 20, each light-emitting diode (led device) the 20th is arranged on the loading plate S, and utilizes circuit on the loading plate S to electrically connect.In addition, in order to improve the utilance of light, existing known techniques also can be sticked the reflector plate (not shown) on the loading plate S surface of light emitting diode module 10.
Seeing also shown in Figure 2ly, is that light-emitting diode in the existing known techniques light emitting diode module is along the generalized section of A-A hatching among Fig. 1.This light-emitting diode 20 is to comprise a substrate 21, a LED crystal particle (Die) 22, a lead frame 23 and an adhesive body 24.
This lead frame 23 is to be arranged at substrate 21; LED crystal particle 22 is to utilize projection 221 and be arranged on the lead frame 23; utilize lead frame 23 to be used as the external electric connection of LED crystal particle 22 again; and adhesive body 24 is to cover LED crystal particle 22; with protection LED crystal particle 22, and form light-emitting diode 20.
By Fig. 1 and Fig. 2 as can be known, the assembling of light emitting diode module 10 is quite complicated, and lead frame 23 needs combine with substrate 21 earlier, LED crystal particle 22 then need to form projection 221 with lead frame 23 electric connections.After finishing the assembling of light-emitting diode 20, also to more a plurality of light-emitting diodes 20 be set on the loading plate S, just calculate and finish light emitting diode module 10.And in order to promote the utilance of light, even also to attach the surface of one deck reflecting plate in loading plate S, increased the time of assembling especially.
In addition, solve the heat radiation of LED crystal particle 22 or light-emitting diode 20, especially an important problem.Along with the increase of service time, the temperature of light-emitting diode 20 may be incomplete because of the opto-electronic conversion of LED crystal particle 22, and produce appreciable heat energy.If do not assist to reduce the temperature of light-emitting diode 20 immediately, then will have influence on the luminous efficiency of LED crystal particle 22, even can shorten its useful life.In the existing known techniques, the heat energy that each LED crystal particle 22 is produced can only conduct to loading plate S by projection 221 through lead frames 23 by the mode identical with electric connection, the heat dissipation path that does not have other is so obviously can't meet the demand with light emitting diode module 10.
This shows that above-mentioned existing light emitting diode module obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore, how to provide a kind of light emitting diode module, can solve the heat dissipation problem of LED crystal particle and light-emitting diode, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing light emitting diode module exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of light emitting diode module of new structure, can improve general existing light emitting diode module, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The objective of the invention is to, overcome the defective that existing light emitting diode module exists, and a kind of light emitting diode module that can solve heat dissipation problem of new structure is provided, thereby be suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.According to a kind of light emitting diode module that the present invention proposes, it comprises: a circuit substrate is to comprise a metal level, one first dielectric layer, a line layer and one second dielectric layer in regular turn, and this first dielectric layer is to have a plurality of openings; This second dielectric layer is arranged on this line layer and exposes this opening; And a plurality of LED crystal particle, be to be arranged at these openings respectively, these LED crystal particle be respectively with this line layer electrically connect, wherein this second dielectric layer is to extend in this edge of opening, these LED crystal particle be pass this second dielectric layer and with this line layer electrically connect.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid light emitting diode module, the material of wherein said metal level are copper or aluminium.
Aforesaid light emitting diode module, wherein said metal level are a metal composite lamination.
Aforesaid light emitting diode module, it more comprises a thermal conductive metal plate, is to link with this metal level.
Aforesaid light emitting diode module, it more comprises a heat dissipation element, is to be connected with this thermal conductive metal plate.
Aforesaid light emitting diode module, wherein said second dielectric layer are to be a reflector.
Aforesaid light emitting diode module, it more comprises an adhesive body, is that the edge with this second this opening that dielectric layer is exposed is the sealing border.
Aforesaid light emitting diode module, wherein said metal level are to be equipped with a protrusion respectively in this opening respectively.
Aforesaid light emitting diode module, wherein said protrusion are a sheet metal, a tin cream or its composition.
Aforesaid light emitting diode module, wherein said these LED crystal particle are that routing links or upside-down mounting (promptly cover crystalline substance, this paper is referred to as upside-down mounting) is linked to this line layer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of light emitting diode module that the present invention proposes, a circuit substrate is to comprise a metal level, one first dielectric layer and a line layer in regular turn, and this first dielectric layer is to have a plurality of openings; A plurality of metal bed courses are filled at described opening respectively; And a plurality of LED crystal particle, be to be arranged at described opening respectively, described LED crystal particle be respectively with this line layer electrically connect, wherein said metal bed course extends in the edge of this first dielectric layer from described opening respectively, and described LED crystal particle is arranged at respectively on the described metal bed course.
Aforesaid light emitting diode module, the material of wherein said metal level are copper or aluminium.
Aforesaid light emitting diode module, wherein said metal level are a metal composite lamination.
Aforesaid light emitting diode module, it more comprises a thermal conductive metal plate, is to link with this metal level.
Aforesaid light emitting diode module, it more comprises a heat dissipation element, is to be connected with this thermal conductive metal plate.
Aforesaid light emitting diode module wherein more comprises one second dielectric layer, be to be arranged on this line layer and to expose this opening, and this second dielectric layer is a reflector.
Aforesaid light emitting diode module, wherein said light emitting diode module more comprises an adhesive body, is that the edge with this second this opening that dielectric layer is exposed is encapsulation sealing border.
Aforesaid light emitting diode module, wherein said metal level are to be equipped with a protrusion respectively in this opening respectively.
Aforesaid light emitting diode module, wherein said protrusion are to comprise a sheet metal, a tin cream or its composition.
Aforesaid light emitting diode module, wherein said LED crystal particle are that routing connects or upside-down mounting is connected in this line layer.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
In order to achieve the above object, the invention provides a kind of light emitting diode module, comprise a circuit substrate and a plurality of LED crystal particle.Circuit substrate is to comprise a metal level, one first dielectric layer and a line layer in regular turn; First dielectric layer is to have a plurality of openings; These LED crystal particle are to be arranged at these openings respectively, and respectively with the line layer electrically connect.
In addition, in order to achieve the above object, the present invention provides a kind of light emitting diode module in addition, comprises a circuit substrate and a plurality of light-emitting diode.Circuit substrate is to comprise a metal level, one first dielectric layer and a line layer in regular turn, and first dielectric layer is to have a plurality of openings; A plurality of light-emitting diodes are to be arranged at these openings respectively, these light-emitting diodes be respectively with the line layer electrically connect.
By technique scheme, light emitting diode module of the present invention has following advantage at least:
1, from the above, because according to a kind of light emitting diode module of the present invention, be to comprise a circuit substrate and a plurality of LED crystal particle, wherein circuit substrate is to comprise a metal level.Compared with prior art, the LED crystal particle of light emitting diode module of the present invention is can be directly and metal layer contacting, and the heat energy that transmits LED crystal particle fast and produced, so can effectively assist the LED crystal particle heat radiation, and prolong the useful life of light emitting diode module, more can guarantee the luminescent quality of light emitting diode module.
2, secondly, LED crystal particle is the opening that is arranged in circuit substrate, and each opening more can be used as the sealing border of packaging technology, and can reduce packaging technology step and time.
3 moreover, LED crystal particle can be finished the assembling of light emitting diode module after only need being arranged at metal substrate, so also reduced the step and the time of packaging technology.
4, in addition, another kind of light emitting diode module of the present invention is to comprise a circuit substrate and a plurality of light-emitting diode, and wherein light-emitting diode is to comprise a substrate and a LED crystal particle, and LED crystal particle is arranged on the substrate.The heat energy that LED crystal particle produced, can directly reach line layer or metal level by substrate, can reduce the temperature of light-emitting diode, can prolong the useful life of light emitting diode module equally, and can guarantee the luminescent quality of light emitting diode module.
In sum, the invention provides a kind of light emitting diode module that can solve heat dissipation problem of new structure, be very suitable for practicality.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing light emitting diode module has the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of the light emitting diode module in the existing known techniques.
Fig. 2 is that light-emitting diode in the existing known techniques light emitting diode module is along the generalized section of A-A hatching among Fig. 1.
Fig. 3 is the schematic perspective view of first embodiment of the invention light emitting diode module.
Fig. 4 is the generalized section of first embodiment of the invention light emitting diode module along B-B hatching among Fig. 3.
Fig. 5 is another generalized section of first embodiment of the invention light emitting diode module.
Fig. 6 is another generalized section of first embodiment of the invention light emitting diode module.
Fig. 7 is another generalized section of first embodiment of the invention light emitting diode module.
Fig. 8 is another generalized section of first embodiment of the invention light emitting diode module.
Fig. 9 is another generalized section of first embodiment of the invention light emitting diode module.
Figure 10 is another generalized section of first embodiment of the invention light emitting diode module.
Figure 11 is a schematic diagram of second embodiment of the invention light emitting diode module.
Figure 12 is the generalized section of second embodiment of the invention light emitting diode module along B-B hatching among Fig. 3.
Figure 13 is another generalized section of second embodiment of the invention light emitting diode module.
Figure 14 is another generalized section of second embodiment of the invention light emitting diode module.
Figure 15 is another generalized section of second embodiment of the invention light emitting diode module.
Figure 16 is another schematic perspective view of second embodiment of the invention light emitting diode module.
10: light emitting diode module 20: light-emitting diode
21: substrate 22: LED crystal particle
221: projection 23: lead frame
24: adhesive body 30: light emitting diode module
31: circuit substrate 311: metal level
314: 315: the second dielectric layers of opening
32: LED crystal particle 33: adhesive body
34: drive loop 35: the metal bed course
36: protrusion 37: heat dissipation element
371: radiating fin 40: light emitting diode module
41: circuit substrate 411: metal level
414: 415: the second dielectric layers of opening
42: light-emitting diode 421: substrate
422: LED crystal particle 423: adhesive body
424: protuberance 44: drive the loop
45: heat dissipation element 451: radiating fin
46: protrusion A-A: straight line
B-B: straight line P: tin cream
S: loading plate V: through hole
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of light emitting diode module, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
First embodiment
At first, please consult Fig. 3 to Figure 10 earlier, with first embodiment of explanation light emitting diode module of the present invention.
Seeing also shown in Figure 3ly, is the schematic perspective view of the light emitting diode module of first embodiment of the invention.This light emitting diode module 30 comprises a circuit substrate 31 and a plurality of LED crystal particle 32.It is noted that the number and the arrangement mode of LED crystal particle 32 that light emitting diode module 30 has are also unrestricted.In the present embodiment, be to be array with LED crystal particle 32 to be arranged as example and to describe, certainly, each LED crystal particle 32 also can be arranged in a linear.
Please consult Fig. 3 and shown in Figure 4 simultaneously, wherein Fig. 4 is the generalized section of first embodiment of the invention light emitting diode module along B-B hatching among Fig. 3, in order to the connection relationship of each LED crystal particle 32 and circuit substrate 31 to be described.This circuit substrate 31, comprise a metal level 311, one first dielectric layer 312 and a line layer 313 in regular turn, for example circuit substrate 31 is to can be a tellite (PCB), first dielectric layer 312 that is folded between metal level 311 and the line layer 313 is as an insulating barrier, and tellite can be the flexible printed circuit or the printed circuit board (PCB) of rigidity.Wherein, the material of metal level 311 can have high-termal conductivity, for example is copper or aluminium, and the thickness of metal level 311 can reach several microns (μ m).Wherein, metal level 311 also can be a metal composite lamination (compositelaminate layer), that is to say, metal level 311 can be formed by a plurality of metal layer stack, for example piles up the layer of copper metal level on aluminum metal layer.In addition, first dielectric layer 312 is to have a plurality of openings 314, to expose metal level 311.
Each LED crystal particle 32 is to be arranged at each opening 314 respectively, and respectively with line layer 313 electrically connects, become the wafer that is commonly called as directly encapsulate (chip on board, COB), by the binding of line layer 313, can each LED crystal particle 32 of controlling and driving.In the present embodiment, the type of LED crystal particle 32 is also unrestricted, is that the LED crystal particle 32 that is produced on one side with electrode is that example describes among Fig. 4, therefore, needs to break two-wire so that LED crystal particle 32 and line layer 313 electrically connects.Certainly, the electrode of LED crystal particle 32 also can be at homonymy not, and becomes the crystal grain (as shown in Figure 5) of vertical conducting type.According to dissimilar LED crystal particle 32, and the mode that routing links or upside-down mounting links be can utilize, LED crystal particle 32 and line layer 313 electrically connects made.
Seeing also shown in Figure 6ly, is another generalized section of first embodiment of the invention light emitting diode module.In the present embodiment, circuit substrate 31 more can comprise one second dielectric layer 315, and it is to be arranged on the line layer 313 and to expose opening 314.Wherein, second dielectric layer 315 is to be a high reflection layer, and its material is to can be titanium dioxide (TiO
2) with the mixture of resin.Utilize the mixture of titanium dioxide and resin can form white high reflecting surface on circuit substrate 31, thus, the light that LED crystal particle 32 is sent can have light utilization preferably.When circuit substrate 31 was a printed circuit board (PCB), second dielectric layer 315 can be an insulating barrier that is formed at printed circuit board surface in addition again.
In addition, light emitting diode module 30 more can comprise an adhesive body 33, and this adhesive body 33 is sealing borders that the edge with second opening 314 that dielectric layer 315 is exposed is used as encapsulating.Thus, can form the sealing border that pothole is used as encapsulating in addition again, so can reduce the step and the time of packaging technology.In addition, adhesive body 33 can be the clad material of lens or other light transmissions, can have the effect of modifying LED crystal particle 32 smooth shapes.
Please consult shown in Figure 6ly again, light emitting diode module 30 more can comprise a thermal conductive metal plate 34, and it is to be connected with metal level 311, and the mode of binding can comprise the mode of attaching, adhesion or locking.Thus, can increase the metal thickness partly of circuit substrate 31, to assist heat radiation.
Because each LED crystal particle 32 is directly to contact with metal level 311, therefore the heat energy that produced of LED crystal particle 32, can directly conduct via metal level 311, so can effectively assist LED crystal particle 32 heat radiations, and prolong the useful life of LED crystal particle 32, more can promote the luminescent quality of LED crystal particle 32.In addition, 32 need of the LED crystal particle among the present invention can be finished the assembling of light emitting diode module after being arranged at metal substrate 31, so also reduced the step and the time of packaging technology.
Please consult shown in Figure 3ly again, light emitting diode module 30 can comprise that more one drives loop 34, drives loop 34 and is arranged on circuit substrate 31, and electrically connect with each LED crystal particle 32, to drive these LED crystal particle 32.Wherein, drive loop 34 and can comprise an active element or a passive component, active element can be a switch element, for example is that an electric crystal is a diode; Passive component then can be an electric capacity, a resistance, an inductance or its combination.In the present embodiment, be to comprise that with light emitting diode module 30 a plurality of drivings loop 34 is that example describes.
What deserves to be mentioned is that in the present embodiment, the structure of circuit substrate 31 also can have different structure aspects.
Seeing also shown in Figure 7ly, is another generalized section of first embodiment of the invention light emitting diode module.Second dielectric layer 315 also can extend to opening 314 edges, LED crystal particle 32 be pass second dielectric layer 315 and with line layer 313 electrically connects.In actual process, can in second dielectric layer 315, stay the needed through hole V of routing earlier, be beneficial to the carrying out of routing technology.
Please consult Fig. 3 and shown in Figure 8 simultaneously, Fig. 8 is another generalized section of first embodiment of the invention light emitting diode module.Circuit substrate 31 more can comprise a plurality of metal bed courses 35, metal bed course 35 is to be filled at each opening 314 respectively, even metal bed course 35 more can extend in the edge of first dielectric layer 312 from opening 314 respectively, or even extend to the edge of line layer 313, be connected with the pattern of part line layer 313, and each LED crystal particle 32 is to be arranged at respectively on the metal bed course 35.Wherein, metal bed course 35 can directly contact with LED crystal particle 32, except increasing the height of LED crystal particle 32, avoid outside the light that sent by the side of light-emitting diodes crystal grain 32 covered by first dielectric layer 312 and second dielectric layer 315, the surface of metal bed course 35 more can plate the metal with high reflectance, for example: silver makes progress with the sidelight reflection that LED crystal particle 32 is sent, to promote the utilance of light.In addition, metal bed course 35 can also be assisted the conduction of heat energy.And LED crystal particle 32 is when being provided with, and is arranged on the metal bed course 35 after can being stained with tin cream P again, and can increases strength of connection between LED crystal particle 32 and the metal bed course 35.
Seeing also shown in Figure 9ly, is another generalized section of first embodiment of the invention light emitting diode module.Metal bed course 35 also can be one-body molded with metal level 311, just is equipped with a protrusion 36 respectively from metal level 311 in each opening 314.Wherein, protrusion 36 is to can be a sheet metal, a tin cream or its combination, for example be to be arranged in the opening 314 behind sheet metal one side or the two side tin sticky cream, and the height of protrusion 36 can freely be adjusted, be beneficial to LED crystal particle 32 and line layer 313 electrically connects.
Please consult Figure 10 and shown in Figure 11 simultaneously, Figure 10 is another generalized section of first embodiment of the invention light emitting diode module, because LED crystal particle 32 is directly to contact with metal level 311, so metal level 311 can be assisted LED crystal particle 32 heat radiations.Yet, in order to promote the efficient of heat radiation again, as shown in figure 10, also can be that light emitting diode module 30 has a heat dissipation element that adds 37, this heat dissipation element 37 is to link with metal level 311, for example utilize the mode that attaches, adheres, locks, and heat dissipation element 37 and metal level 311 are connected.Heat dissipation element 37 can have a plurality of radiating fin 371 or have the radiating subassembly of other modes (for example: heat pipe, fan or the like), is to be that example describes with the heat dissipation element with a plurality of radiating fins 371 among Figure 10.
Second embodiment
Then, see also Figure 11 to Figure 16, with second embodiment of explanation light emitting diode module of the present invention.
Seeing also shown in Figure 11ly, is the schematic diagram of second embodiment of the invention light emitting diode module.This light emitting diode module 40 comprises a circuit substrate 41 and a plurality of light-emitting diode 42.Wherein, circuit substrate 41 be with first embodiment in circuit substrate 31 have identical technical characterictic and effect, so do not repeat them here.
Light emitting diode module 40 can comprise that more one drives loop 44, and this driving loop 44 is arranged on circuit substrate 41, and electrically connects with each light-emitting diode 42, to drive these light-emitting diodes 42.Wherein, drive loop 44 and be with first embodiment in driving loop 34 have identical technical characterictic and effect, so do not repeat them here.
Please consult Figure 11 and shown in Figure 12 simultaneously, Figure 12 is the generalized section of second embodiment of the invention light emitting diode module along B-B hatching among Fig. 3.Present embodiment is with first the different of embodiment maximum, and being placed in the present embodiment in the opening 414 of circuit substrate 41 is light-emitting diode 42, but not an independent crystal grain.Light-emitting diode 42 is to comprise a substrate 421, a LED crystal particle 422 and an adhesive body 423, wherein, LED crystal particle 422 is to be arranged at substrate 421, and substrate 421 can be a lead frame (leadframe), a ceramic substrate or a metal substrate.Certainly, also can print in the ceramic substrate or other modes are inserted metal (shown in oblique line) and electrically connected to form with the electrode of LED crystal particle 422.In addition, adhesive body 423 is to coat LED crystal particle 422, and can have identical effect and technical characterictic with the adhesive body 33 among first embodiment, so do not repeat them here.In Figure 12, substrate 421 is to be that example describes with a metal substrate, and light-emitting diode 42 can utilize the mode of mounted on surface (SMT), and with line layer 413 electrically connects.
In addition, seeing also shown in Figure 13ly, is another generalized section of second embodiment of the invention light emitting diode module.For the heat energy that allows LED crystal particle 422 be produced, can be directly and be passed to metal level 411 apace, the substrate 421 of light-emitting diode 42 is to have extended a protuberance 424 (as shown in figure 13), protuberance 424 is to be connected with metal level 411, and for example substrate 421 can be connected with metal level 411 at protuberance 424 places tin sticky cream P.
In order to promote radiating efficiency, can certainly be to be equipped with a protrusion 46 by the opening 414 of metal level 411.See also Figure 14 and shown in Figure 15, Figure 14 is another generalized section of the light emitting diode module of second embodiment of the invention, and Figure 15 is another generalized section of the light emitting diode module of second embodiment of the invention.Metal level 411 is to have a protrusion 46, and wherein protrusion 46 can be a sheet metal, a metallic gasket, a tin cream or its composition, wherein, metallic gasket be with previous embodiment in metallic gasket 35 have identical technical characterictic, so do not repeat them here.
Seeing also shown in Figure 16ly, is another schematic perspective view of second embodiment of the invention light emitting diode module.In the present embodiment, light emitting diode module 40 is to add a heat dissipation element 45, and this heat dissipation element 45 is to have a plurality of radiating fins 451, and heat dissipation element 45 is to be connected with metal level 411, for example utilize the mode that attaches, adheres, locks, and heat dissipation element 45 and metal level 411 are connected.
In sum, a kind of light emitting diode module of the present invention is to comprise a circuit substrate and a plurality of LED crystal particle, and wherein circuit substrate is to comprise a metal level.Compare with existing known techniques, the LED crystal particle of light emitting diode module is can be directly and metal layer contacting, and the heat energy that transmits LED crystal particle fast and produced, so can effectively assist the LED crystal particle heat radiation, and prolong the useful life of light emitting diode module, more can guarantee the luminescent quality of light emitting diode module.Secondly, LED crystal particle is the opening that is arranged in circuit substrate, and each opening more can be used as the sealing border of packaging technology, can reduce packaging technology step and time.Moreover LED crystal particle can be finished the assembling of light emitting diode module after only need being arranged at metal substrate, so also reduced the step and the time of packaging technology.In addition, another kind of light emitting diode module of the present invention is to comprise a circuit substrate and a plurality of light-emitting diode, and wherein light-emitting diode is to comprise a substrate and a LED crystal particle, and LED crystal particle is arranged on the substrate.The heat energy that LED crystal particle produced, can directly reach line layer or metal level by substrate, can reduce the temperature of light-emitting diode, can prolong the useful life of light emitting diode module equally, and can guarantee the luminescent quality of light emitting diode module.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (20)
1, a kind of light emitting diode module is characterized in that it comprises:
One circuit substrate is to comprise a metal level, one first dielectric layer, a line layer and one second dielectric layer in regular turn, and this first dielectric layer is to have a plurality of openings; This second dielectric layer is arranged on this line layer and exposes this opening; And
A plurality of LED crystal particle are to be arranged at these openings respectively, these LED crystal particle be respectively with this line layer electrically connect,
Wherein this second dielectric layer is to extend in this edge of opening, these LED crystal particle be pass this second dielectric layer and with this line layer electrically connect.
2, light emitting diode module according to claim 1, the material that it is characterized in that wherein said metal level is copper or aluminium.
3, light emitting diode module according to claim 1 is characterized in that wherein said metal level is a metal composite lamination.
4, light emitting diode module according to claim 1 is characterized in that it more comprises a thermal conductive metal plate, is to link with this metal level.
5, light emitting diode module according to claim 4 is characterized in that it more comprises a heat dissipation element, is to link with this thermal conductive metal plate.
6, light emitting diode module according to claim 1 is characterized in that wherein said second dielectric layer is a reflector.
7, light emitting diode module according to claim 1 is characterized in that it more comprises an adhesive body, is that the edge with this second this opening that dielectric layer is exposed is the sealing border.
8, light emitting diode module according to claim 1 is characterized in that wherein said metal level is to be equipped with a protrusion respectively in this opening respectively.
9, light emitting diode module according to claim 8 is characterized in that wherein said protrusion is a sheet metal, a tin cream or its composition.
10, light emitting diode module according to claim 1 is characterized in that wherein said these LED crystal particle are that routing links or upside-down mounting is linked to this line layer.
11, a kind of light emitting diode module is characterized in that it comprises:
One circuit substrate is to comprise a metal level, one first dielectric layer and a line layer in regular turn, and this first dielectric layer is to have a plurality of openings; A plurality of metal bed courses are filled at described opening respectively; And
A plurality of LED crystal particle are to be arranged at described opening respectively, described LED crystal particle be respectively with this line layer electrically connect,
Wherein said metal bed course extends in the edge of this first dielectric layer from described opening respectively, and described LED crystal particle is arranged at respectively on the described metal bed course.
12, light emitting diode module according to claim 11, the material that it is characterized in that wherein said metal level is copper or aluminium.
13, light emitting diode module according to claim 11 is characterized in that wherein said metal level is a metal composite lamination.
14, light emitting diode module according to claim 11 is characterized in that it more comprises a thermal conductive metal plate, is to link with this metal level.
15, light emitting diode module according to claim 14 is characterized in that it more comprises a heat dissipation element, is to link with this thermal conductive metal plate.
16, light emitting diode module according to claim 11 is characterized in that wherein more comprising one second dielectric layer, be to be arranged on this line layer and to expose this opening, and this second dielectric layer is a reflector.
17, light emitting diode module according to claim 16 is characterized in that it more comprises an adhesive body, is that the edge with this second this opening that dielectric layer is exposed is encapsulation sealing border.
18, light emitting diode module according to claim 11 is characterized in that wherein said metal level is to be equipped with a protrusion respectively in this opening respectively.
19, light emitting diode module according to claim 18 is characterized in that wherein said protrusion comprises a sheet metal, a tin cream or its composition.
20, light emitting diode module according to claim 11 is characterized in that wherein said LED crystal particle is that routing connects or upside-down mounting is connected in this line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100984805A CN100499119C (en) | 2006-07-07 | 2006-07-07 | LED module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100984805A CN100499119C (en) | 2006-07-07 | 2006-07-07 | LED module |
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| CN101101910A CN101101910A (en) | 2008-01-09 |
| CN100499119C true CN100499119C (en) | 2009-06-10 |
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| CNB2006100984805A Expired - Fee Related CN100499119C (en) | 2006-07-07 | 2006-07-07 | LED module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102255036A (en) * | 2011-08-02 | 2011-11-23 | 彩虹集团公司 | Light-Emitting Diode (LED) package structure of high-power substrate |
| CN102287662A (en) * | 2011-09-09 | 2011-12-21 | 福建省万邦光电科技有限公司 | Light emitting diode (LED) light source single-cup module for ceramic layer plating base plate |
| CN102287663A (en) * | 2011-09-09 | 2011-12-21 | 福建省万邦光电科技有限公司 | Light emitting diode (LED) light source single-cup module for high-whiteness base plate |
| CN104115290B (en) | 2011-11-23 | 2017-04-05 | 夸克星有限责任公司 | The light-emitting device of the asymmetric propagation of light is provided |
| US9752757B2 (en) | 2013-03-07 | 2017-09-05 | Quarkstar Llc | Light-emitting device with light guide for two way illumination |
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