CN211629107U

CN211629107U - Multi-chip package and PCB assembly

Info

Publication number: CN211629107U
Application number: CN201922319475.8U
Authority: CN
Inventors: 徐军; 张广谱; 朋朝明; 王博; 王玉年; 沈思宽; 侯斯文; 文勇兵
Original assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Current assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2020-10-02
Anticipated expiration: 2029-12-18

Abstract

The utility model discloses a multi-chip packaging body and PCB subassembly, wherein, the multi-chip packaging body includes: a substrate, which is a BT (Bismaleimide triazine) plate; and the LED chips are arranged at intervals and connected to one surface of the substrate. The utility model discloses technical scheme aims at reducing the installation offset between a plurality of LED chips, promotes the efficiency of LED chip installation.

Description

Multi-chip package and PCB assembly

Technical Field

The utility model relates to a LED shows technical field, in particular to multi-chip package body and applied this multi-chip package body's PCB subassembly.

Background

In the prior art, an LED (Light Emitting Diode) display screen has higher contrast than liquid crystal display, and a monochromatic LED has purer chromaticity and faster response time, so that LED display is a development trend in the future display field. However, when the size required by the lamp panel is large, a plurality of LED chips are required to be installed on the PCB lamp panel, and the plurality of LED chips are installed on the PCB lamp panel through the die bonder in a die bonding manner. Simultaneously when a LED chip damage back, because monoblock lamp plate all is with encapsulation colloid for can't maintain single LED chip, lead to monoblock PCB lamp plate to scrap, and then make whole maintenance difficulty.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a multi-chip package body aims at reducing the installation offset between a plurality of LED chips, promotes the efficiency of LED chip installation.

In order to achieve the above object, the utility model provides a multi-chip package body, include:

the substrate is a BT plate; and

the LED chips are arranged at intervals and connected to one surface of the substrate.

In an embodiment of the present application, the plurality of LED chips are equidistantly arranged on the surface of the substrate.

In an embodiment of the present application, a pitch value of two adjacent LED chips is L1, and L1 is 0.3mm or more and 2mm or less.

In an embodiment of the present application, a longitudinal section of the substrate facing the LED chip is rectangular or circular.

In an embodiment of the present application, when the longitudinal section of the substrate is rectangular, the side length of the substrate is L2, and L2 is greater than or equal to 0.5mm and less than or equal to 5 mm.

In an embodiment of the present application, the LED chip has a positive wiring pin and a negative wiring pin, and the positive wiring pin and the negative wiring pin are welded and fixed to the substrate.

In an embodiment of the present application, the plurality of substrates of the multi-chip package are stacked and electrically connected.

The utility model discloses still provide a PCB subassembly, including PCB board and a plurality of multi-chip package body, it is a plurality of multi-chip package body interval is located the PCB board, the multi-chip package body includes:

the substrate is a BT plate; and

In an embodiment of the present application, the BT board of the multi-chip package is soldered to the PCB board.

In an embodiment of the present application, the plurality of multi-chip packages are equidistantly arranged on the surface of the PCB;

and/or the distance between two adjacent multi-chip packages is L3, and L3 is more than or equal to 2mm and less than or equal to 10 mm.

The technical scheme of the utility model is through arranging and connecting a plurality of LED chips interval in the base plate in order to form the multi-chip packaging body, and this base plate is the BT board, so, through with a plurality of LED chips integration in a multi-chip packaging body, only need during the installation with this multi-chip packaging body installation and electric connection on the PCB lamp plate, can accomplish the installation of a plurality of LED chips to reduce the offset between the LED chips in the installation, improve the installation effectiveness, and then improve the production cycle of product; the multi-chip packaging body is more convenient to detect as a whole, the flexibility is stronger, and workers can obtain the specific BIN value of the multi-chip packaging body by detecting the substrate, so that the multi-chip packaging body is arranged in a corresponding area of a PCB (printed circuit board) according to the BIN value, and the whole visual effect is more uniform; in addition, the substrate is the BT plate which has higher dielectric property, low thermal expansion rate and other characteristics, so that the connection process of the LED chip and the PCB lamp panel is met, high-precision signal transmission and high-precision signal transmission rate are realized, the usability of the multi-chip packaging body is improved, and meanwhile, the high-precision BT type plate is adopted on the multi-chip packaging body, so that the situation that the chip is connected with the PCB panel in a large area and connected by using the high-precision plate is avoided, and the total cost of the system is reduced to a certain extent.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a multi-chip package according to the present invention;

FIG. 2 is a front view of the multi-chip package of the present invention;

FIG. 3 is a schematic structural diagram of an LED chip of the multi-chip package of the present invention;

fig. 4 is a schematic structural diagram of the PCB assembly of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	PCB assembly	121	Positive electrode wiring pin
10	Multi-chip package	122	Negative wiring pin
				11	Substrate	20	PCB board
12	LED chip

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a multi-chip package 10.

Referring to fig. 1 and 2, in the embodiment of the present invention, the multi-chip package 10 includes a substrate 11 and a plurality of LED chips 12, where the substrate 11 is a bt (binary triazine) board; the LED chips 12 are arranged at intervals and connected to one surface of the substrate 11.

The technical scheme of the utility model is through arranging a plurality of LED chips 12 at intervals and connecting in base plate 11 in order to form multi-chip packaging body 10, this base plate 11 is the BT board, so, through integrating a plurality of LED chips 12 in a multi-chip packaging body 10, only need during the installation with this multi-chip packaging body 10 installation and electric connection on the PCB lamp plate, can accomplish the installation of a plurality of LED chips 12 to reduce the offset between the LED chips 12 in the installation, improve the installation effectiveness, and then improve the production cycle of product; moreover, the multi-chip package 10 is more convenient to detect as a whole and has stronger flexibility, and a worker can obtain the specific BIN value of the multi-chip package 10 by detecting the substrate 11, so that the multi-chip package is arranged in a corresponding area of the PCB 20 according to the BIN value, and the whole visual effect is more uniform; in addition, the substrate 11 is a BT plate, which has high dielectric property and low thermal expansion rate, so that the requirement of high-precision signal transmission and speed in the connection process of the LED chip 12 and the PCB lamp panel is met, the usability of the multi-chip package 10 is improved, and meanwhile, the high-precision BT plates are only adopted on the multi-chip package 10, so that the situation that the chips are connected with the PCB 20 by using high-precision plates in a large area is avoided, and the overall cost of the system is reduced to a certain extent.

Wherein the BT board may be a BT resin substrate 11 material, such as: the multi-chip packaging body 10 can be applied to LED lamps of television display screens, such as Micro-LEDs and Mini-LEDs, for the Micro-LEDs with better luminous efficiency and lower power consumption, a group of R, G, B three-color chips can be packaged into one packaging body or a plurality of groups of R, G, B chips can be packaged into one packaging body, and then a layer of packaging glue is packaged to realize the multi-chip packaging body 10. For Mini-LED, a plurality of LED chips 12 may be die-bonded to a BT-type board with high precision by a die bonder, thereby realizing the multi-chip package 10. In order to avoid long-term exposure of the LED chip 12, the LED chip 12 is packaged with a conductive or non-conductive adhesive after being connected to the substrate 11, so as to protect the chips, so that the multi-chip package 10 is resistant to collision and abrasion, and the service life of the multi-chip package is ensured. It should be noted that the number of the LED chips 12 in each package is not fixed, and can be selected by those skilled in the art according to actual situations.

Referring to fig. 1 and 2, in an embodiment of the present application, a plurality of LED chips 12 are equidistantly arranged on a surface of the substrate 11. Specifically, the LED chips 12 are equidistantly arranged on the substrate 11, so that the multi-chip package 10 is connected to the PCB 20 to display more uniform visual effect, and the user's visual effect is better.

Further, the distance value between two adjacent LED chips 12 is L1, and L1 is more than or equal to 0.3mm and less than or equal to 2 mm. Among them, when the pitch value L1 of two adjacent LED chips 12 is less than 0.3mm, the adjacent LED chips 12 are easily mounted to cause interference therebetween due to an excessively small pitch value, and are inconvenient to mount. When the distance value L1 between two adjacent LED chips 12 is greater than 2mm, the visual effect of the display area after the multi-chip package 10 is connected to the PCB 20 has a certain difference, so that the viewing effect of the user is poor, therefore, the distance value L1 between two adjacent LED chips 12 is 0.3mm or more and L1 or more and 2mm or less, which not only prevents the two adjacent LED chips 12 from interfering with each other during installation, but also further makes the visual effect displayed after the multi-chip package 10 is connected to the PCB 20 more uniform, thereby ensuring the viewing effect of the user.

Referring to fig. 2, in an embodiment of the present application, a longitudinal section of the substrate 11 facing the LED chip 12 is rectangular or circular. Specifically, for convenient production and installation, with base plate 11 orientation the longitudinal section of LED chip 12 direction is rectangle or circular isotacticity shape to can install on PCB board 20 with multi-chip package 10 from arbitrary direction in the installation, need not distinguish the installation direction, the installation is comparatively convenient, and produces comparatively simply, further improves the production cycle of product.

Further, when the longitudinal section of the substrate 11 is rectangular, the side length of the substrate 11 is L2, and L2 is 0.5mm or more and 5mm or less. When the side length L2 of the substrate 11 is less than 0.5mm, it is difficult for a worker to mount the multi-chip package 10 on the PCB 20, which reduces the mounting efficiency and is not suitable for production. And when the length of side L2 of base plate 11 is greater than 5mm, because the great LED chip 12 that need install of the area of base plate 11, when multi-chip package body 10 breaks down, it is comparatively difficult to investigate the damage of specific certain LED chip 12, if directly abandon monoblock multi-chip package body 10 then waste more manufacturing cost, be unfavorable for the production of product. Therefore, when the longitudinal section of the substrate 11 is rectangular, the range of the length of the side of the substrate 11 being L2 is 0.5mm or more and L2 or more and 5mm or less, which not only facilitates the installation of the multi-chip package 10, but also facilitates the reduction of the overall system cost to realize standardized production.

In an embodiment of the present application, referring to fig. 1 to 3, the LED chip 12 has a positive connection pin 121 and a negative connection pin 122, and the positive connection pin 121 and the negative connection pin 122 are fixed to the substrate 11 by welding. Specifically, the substrate 11 is used as a bonding pad, and the positive electrode connection pin 121 and the negative electrode connection pin 122 of the LED chip 12 are directly soldered to the substrate 11, so that the substrate 11 is electrically connected to the LED chips 12, and the substrate 11 is electrically connected to the PCB 20, so that the LED chips 12 are electrically connected to the PCB 20. The BT board as the substrate 11 is designed to be a double-sided board, so that a plurality of LED chips 12 can be connected in series and in parallel to achieve various effects of display.

Further, the substrate 11 of the multi-chip package 10 is provided in plural, and the plural substrates 11 are stacked and electrically connected. Specifically, when the number of the LED chips 12 mounted on the substrate 11 is large, the corresponding physical circuit is relatively complex, and the circuit distribution is reasonable, so that the plurality of substrates 11 can be stacked to reasonably arrange the connection circuit of the multi-chip package 10, and the plurality of substrates 11 can be fixed in a pressing manner.

The utility model discloses still provide a PCB subassembly 100, refer to fig. 4, this PCB subassembly 100 includes PCB board 20 and multi-chip package body 10, and is a plurality of multi-chip package body 10 interval is located PCB board 20, this multi-chip package body 10's concrete structure refers to above-mentioned embodiment, because this PCB subassembly 100 has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is not repeated here one by one. Wherein a plurality of the multi-chip package 10 independently is fixed in the PCB board 20 through SMT (Surface Mounted Technology, Surface mount Technology), and if one of them package has badly, can directly take off the back through SMT welding process and change the non-defective products LED package to convenient maintenance realizes maintainability, the PCB board 20 has a plurality of independent multi-chip package 10 promptly.

In an embodiment of the present application, the BT board of the multi-chip package 10 is soldered to the PCB board 20. Specifically, the BT board of the multi-chip package 10 is used as a bonding pad, so that an additional metal structure and a gold wire are not required to be arranged, and all circuits inside the multi-chip package 10 are realized in a BT board internal wiring mode.

In an embodiment of the present application, a plurality of the multi-chip packages 10 are equidistantly arranged on the surface of the PCB board 20. Specifically, the plurality of multi-chip packages 10 are equidistantly arranged on the PCB 20, so that the display visual effect of the plurality of multi-chip packages 10 integrally presented after being connected to the PCB 20 is more uniform, and the user's impression effect is better.

In an embodiment of the present application, the distance between two adjacent multi-chip packages 10 is L3, and L3 is 2mm or more and 10mm or less. Specifically, when the pitch value L3 of two adjacent multi-chip packages 10 is smaller than 2mm, the adjacent multi-chip packages 10 are easily interfered with each other when being mounted due to the excessively small pitch value, and the mounting is inconvenient. When the distance value L3 between two adjacent multi-chip packages 10 is greater than 10mm, the visual effect of the display area after the multi-chip packages 10 are connected to the PCB 20 has a certain difference, so that the viewing effect of the user is poor, therefore, the range value L3 of the distance value between two adjacent multi-chip packages 10 is 2mm or more and L3 or more and 10mm or less, which not only prevents the two adjacent multi-chip packages 10 from interfering with each other during installation, but also further makes the display visual effect after the multi-chip packages 10 are connected to the PCB 20 more even, thereby ensuring the viewing effect of the user.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A multi-chip package, comprising:

the substrate is a BT plate; and

the LED chip comprises a plurality of LED chips which are arranged at intervals and connected to one surface of the substrate, the LED chips are arranged on the surface of the substrate at equal intervals, the distance between every two adjacent LED chips is L1, and the distance between every two adjacent LED chips is not less than 0.3mm and not more than L1 and not more than 2 mm.

2. The multi-chip package of claim 1, wherein the substrate has a rectangular or circular longitudinal cross-section in a direction toward the LED chip.

3. The multi-chip package of claim 2, wherein when the substrate has a rectangular longitudinal cross-section, the substrate has a side length of L2, L2 mm and L5 mm.

4. The multi-chip package of claim 1, wherein the LED chip has a positive terminal pin and a negative terminal pin, the positive terminal pin and the negative terminal pin being solder-fixed to the substrate.

5. The multi-chip package of claim 4, wherein the plurality of substrates are stacked and electrically connected.

6. A PCB assembly comprising a PCB and a plurality of multi-chip packages spaced apart from the PCB, the multi-chip packages comprising a multi-chip package according to any one of claims 1 to 5.

7. The PCB assembly of claim 6, wherein the BT board of the multi-chip package is solder-bonded to the PCB board.

8. The PCB assembly of claim 6, wherein a plurality of the multi-chip packages are arranged equidistantly on a surface of the PCB board;