CN212907792U

CN212907792U - LED support, light-emitting unit module and display device

Info

Publication number: CN212907792U
Application number: CN202021870262.0U
Authority: CN
Inventors: 孙平如; 谭青青
Original assignee: Shenzhen Jufei Optoelectronics Co Ltd
Current assignee: Shenzhen Jufei Optoelectronics Co Ltd
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2021-04-06
Anticipated expiration: 2030-08-31

Abstract

The utility model provides a LED support, luminescence unit module and display device, LED support comprises metal lead frame and the enclosure with metal lead frame cladding, and the electrically conductive metal sheet first surface of metal lead frame is used for bearing the weight of the LED chip, and second surface and third surface are at least partly exposed outside, and its structure is greatly simplified compared with current LED; the conductive metal plate is used for realizing the bearing of the LED chip and the electric connection with the LED chip and is used as a bonding pad to realize the electric connection with the outside, and the integration level is high; when the LED lamp works, heat generated by the LED chip can be directly transferred to the conductive metal plate to be quickly dissipated outwards, so that a heat dissipation path is shortened, and a heat dissipation area is increased, so that the heat dissipation effect is greatly improved, and the performance of the light emitting unit is ensured; because the second surface and the third surface of electrically conductive metal sheet all have to expose, applicable in various application scenes, and the welding is convenient, still can weld on two surfaces as required, can promote the fastness of welding.

Description

LED support, light-emitting unit module and display device

Technical Field

The utility model relates to a LED (Light Emitting Diode) field especially relates to a LED support, luminescence unit module and display device.

Background

At present, the color gamut and the brightness of mobile communication terminals such as pens, tablets, mobile phones and the like are required to be higher and higher, the thickness is thinner and thinner, the color gamut and the brightness are in a negative correlation relationship, the color gamut requirement is higher, the brightness is lower, the brightness of an original single chip packaging body cannot meet the requirement, and an ultrathin side light-emitting diode with higher brightness needs to be provided when the color gamut is high. For this reason, the related art provides a light emitting diode having higher brightness at the time of high color gamut, which includes, as shown in fig. 1, a plastic substrate 001, a circuit formed on the top surface of the plastic substrate 001 to be electrically connected to an LED chip, and a pad 004 provided on the bottom surface of the plastic substrate 001, the circuit on the top surface of the plastic substrate 001 being electrically connected to the pad 004 through a conductive material in a through hole penetrating the bottom surface. A housing 002 is formed on the plastic substrate 001, a cavity for placing the LED chip 003 is formed in the housing 002, and the cavity is filled with fluorescent glue 005. Although the light emitting diode with the structure can improve the brightness, the light emitting diode with the structure has the following defects:

the structure is complicated, so that the manufacturing process is complicated, the cost is high, and the yield is difficult to control;

due to the fact that the two LED chips are arranged, compared with the light emitting diode with a single LED chip, heat generated during working is multiplied, the heat generated by the LED chips in the light emitting diode is mainly transmitted to the bonding pad 004 through the conductive materials in the through hole penetrating through the plastic substrate 001 to be dissipated, the heat dissipation path is long, the heat dissipation area is small, the heat dissipation effect is poor, and the performance of the light emitting diode is seriously affected.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of LED support, luminescence unit module and display device solves current emitting diode structure complicacy, leads to the manufacturing process loaded down with trivial details, and is with high costs, yields are difficult to obtain the poor problem of control and heat dissipation.

In order to solve the technical problem, an embodiment of the present invention provides an LED support, including a metal lead frame, a wall covered by the metal lead frame, wherein the wall is formed with an accommodating cavity for placing an LED chip, the metal lead frame includes at least two separately disposed conductive metal plates, a first surface of each conductive metal plate is located at the bottom of the accommodating cavity, and at least a part of the first surface is exposed outside, at least one first surface of each conductive metal plate is used for bearing the LED chip, and an exposed area of the first surface of each conductive metal plate is used for electrically connecting with a corresponding electrode of the LED chip;

at least part of a second surface, opposite to the first surface, of the conductive metal plate is exposed out of the enclosure, at least part of a third surface, located between the first surface and the second surface, of the conductive metal plate is exposed out of the enclosure, and an area, exposed out of the enclosure, of the third surface of at least one conductive metal plate is in a set welding shape and is flush with the enclosure.

Optionally, the set weld shape is a non-rectangular shape.

Optionally, the area of the third surface of each conductive metal plate exposed outside the enclosure wall is flush with the enclosure wall.

Optionally, an area of the second surface exposed outside the enclosing wall is flush with the enclosing wall.

Optionally, a region of the second surface exposed outside the enclosing wall is provided with a recess for accommodating solder.

Optionally, the metal lead frame includes three conductive metal plates sequentially arranged, and an exposed area of the first surface of the conductive metal plate located in the middle is electrically connected to electrodes corresponding to the two LED chips, respectively.

Optionally, the enclosure further includes a partition wall disposed on the first surface of the middle conductive metal plate to form two separated accommodating cavities on the first surfaces of the three conductive metal plates.

Optionally, a lateral width of an upper end of at least one of the conductive metal plates near the first surface is larger than a lateral width of a lower end near the second surface, and a portion of the upper end of the conductive metal plate is embedded in the gel of the enclosure;

and/or the presence of a gas in the gas,

the section of the conductive metal plate close to the second surface is a lower end, an outward convex boss is arranged between the upper end and the lower end of at least one conductive metal plate, and at least one part of the boss is embedded in the glue body.

Optionally, the conductive metal plate is a copper substrate, and a reflective layer is disposed on at least an exposed area of the first surface.

In order to solve the above technical problem, an embodiment of the present invention further provides a light emitting unit, including as above the LED bracket, still including set up in the LED chip of holding intracavity, and set up in the holding intracavity will the packaging layer that the LED chip covered, the electrode of LED chip with correspond the exposed region of the first surface of conductive metal plate forms the electricity and connects.

In order to solve the above technical problem, an embodiment of the present invention further provides a light emitting unit module, which includes a substrate and a plurality of light emitting units as described above, wherein the plurality of light emitting units are electrically connected to the substrate.

In order to solve the above technical problem, an embodiment of the present invention further provides a display device, where the display device includes the light emitting unit module as described above.

Advantageous effects

The utility model provides a LED support, luminescence unit module and display device, the LED support that luminescence unit adopted comprises metal lead frame and the enclosure with metal lead frame cladding, and its structure is current emitting diode greatly simplified relatively, consequently can simplify its manufacturing process, promotes preparation efficiency and yields, simultaneously reduce cost.

The metal lead frame comprises at least two separately arranged conductive metal plates, the first surfaces of the conductive metal plates are positioned at the bottom of an accommodating cavity formed by enclosing walls, at least parts of the conductive metal plates are exposed outside, the first surface of at least one conductive metal plate is used for bearing an LED chip, and the exposed area of the first surface of each conductive metal plate is used for being electrically connected with the electrode of the corresponding LED chip; at least part of the second surface opposite to the first surface on the conductive metal plate is exposed outside the enclosure, at least part of the third surface of the conductive metal plate between the first surface and the second surface is exposed outside the enclosure, and the region of the third surface of at least one conductive metal plate exposed outside the enclosure is in a set welding shape and flush with the enclosure, as can be seen:

the conductive metal plate in the utility model can simultaneously realize the bearing of the LED chip and the electric connection with the LED chip, and can be used as a bonding pad to realize the electric connection with the outside, the integration level is high, and the structure is simple;

because the LED chip is directly placed on the first surface of the conductive metal plate, and the second surface and the third surface of the conductive metal plate are exposed, the heat generated by the LED chip can be directly transferred to the conductive metal plate during working and is quickly dissipated outwards through the conductive metal plate, the heat dissipation path is greatly shortened, and the heat dissipation area is greatly increased, so that the heat dissipation effect is greatly improved, and the performance of the light-emitting unit is ensured;

because the second surface and the third surface of the conductive metal plate are exposed and can be used as the bonding pads electrically connected with the outside, the third surface can be welded with the outside in a side-lighting application scene, or the third surface and the second surface can be welded at the same time; in a positive luminous application scene, the second surface can be welded, or the second surface and the third surface can be welded simultaneously, so that the method is applicable to various application scenes, is convenient to weld, can be used for welding the two surfaces according to requirements, can improve the welding firmness, and further improves the reliability of products; the area of the third surface of the conductive metal plate exposed outside the enclosing wall is in a set welding shape and is flush with the enclosing wall, so that the convenience and the reliability of welding can be further improved.

Drawings

FIG. 1 is a schematic diagram of a conventional LED structure;

fig. 2-1 is a schematic view of a metal lead frame in an example i according to an embodiment of the present invention;

fig. 2-2 is a schematic diagram of a metal lead frame in an example a according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a light emitting unit in a first example provided by the embodiment of the present invention;

fig. 4 is a schematic diagram of a metal lead frame according to a second example provided by the embodiment of the present invention;

fig. 5 is a schematic view of a light emitting unit in a second example provided by the embodiment of the present invention;

fig. 6 is a schematic diagram of a light emitting unit in an example i according to an embodiment of the present invention;

fig. 7 is a schematic diagram of a metal lead frame in a third example provided by the embodiment of the present invention;

fig. 8 is a schematic view of a light emitting unit in a third example provided by the embodiment of the present invention;

fig. 9 is a schematic diagram of a metal lead frame according to a fourth example provided by the embodiment of the present invention;

fig. 10 is a schematic view of an LED support according to a fourth example provided by the embodiment of the present invention;

fig. 11 is a schematic view of another metal lead frame in a fourth example provided by the embodiments of the present invention;

fig. 12 is a first schematic diagram of a light emitting unit in a fifth example provided by the embodiment of the present invention;

fig. 13 is a schematic view of a second light-emitting unit in a fifth example provided by the embodiment of the present invention;

fig. 14 is a schematic diagram of a light emitting unit in a fifth example provided by the embodiment of the present invention;

fig. 15 is a schematic view of a light emitting unit module according to an embodiment of the present invention;

fig. 16 is a schematic view of a display device according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The embodiment provides an LED support which is simple in structure, low in cost, high in yield, good in heat dissipation performance and simple and reliable in welding, and the LED support comprises a metal lead frame and an enclosing wall for covering the metal lead frame, wherein an accommodating cavity for placing an LED chip is formed in the enclosing wall, the metal lead frame comprises at least two separately arranged conductive metal plates, a first surface (namely a top surface) of each conductive metal plate is positioned at the bottom of the accommodating cavity, at least part of the conductive metal plate is exposed outside, the first surface of at least one conductive metal plate is used for bearing the LED chip, and an exposed area of the first surface of each conductive metal plate is used for being electrically connected with an electrode of the corresponding LED chip;

at least part of a second surface (namely, a bottom surface) opposite to the first surface of the conductive metal plate is exposed out of the enclosure, at least part of a third surface of the conductive metal plate between the first surface and the second surface is exposed out of the enclosure, and the region of the third surface of at least one conductive metal plate exposed out of the enclosure is in a set welding shape and is flush with the enclosure. And optionally, in some examples of this embodiment, only the first surface, the second surface, and the third surface of the conductive metal plate may be exposed outside the enclosure, and the other surfaces are covered by the enclosure, so as to improve the reliability of the bonding between the conductive metal plate and the enclosure. The LED support can be used more flexibly, has a better heat dissipation effect, and has better air tightness, so that the safety and the reliability of an LED product are improved.

It should be understood that the overall shape of the LED support in this embodiment may be a long strip, a square, a hexagon, etc., and the overall shape of the LED support in this embodiment is not limited.

It should be understood that any metal plate that can achieve reliable conductive connection and support strength meeting the requirements of the LED support can be used as the conductive metal plate in the present embodiment; because the heat dispersion of metal sheet is better, can promote the heat dispersion of LED support, of course, also can replace for other boards that can satisfy above-mentioned demand have other materials of electric conductivity. In this embodiment, the specific shape and size of the conductive metal plate can be flexibly set according to the application requirements, and this embodiment is not limited thereto.

The colloid material forming the enclosing wall in this embodiment may also be flexibly selected according to the requirement, for example, but not limited to, a thermosetting adhesive or a hot-pressing adhesive may be adopted, and a white adhesive with a better reflection performance is selected, but not limited to. For example, the gel may be, but is not limited to, epoxy or resin (e.g., epoxy, silicone, resin, etc.).

In this embodiment, the LED support may be directly formed by at least two separately disposed conductive metal plates (one of the separately disposed conductive metal plates is to achieve insulation between the conductive metal plates), and an enclosure wall covering the conductive metal plates, which greatly simplifies the structure of the LED compared with the conventional LED, thereby simplifying the manufacturing process, improving the manufacturing efficiency and yield, and reducing the cost.

It should be understood that the number of the conductive metal plates included in one LED support in this embodiment can be flexibly set according to specific application scenarios. For example, only two insulated and isolated conductive metal plates may be provided, the enclosure may only enclose to form an accommodating cavity, at least a portion of the first surfaces of the two insulated and isolated conductive metal plates is exposed at the bottom of the accommodating cavity for carrying the LED chips and completing electrical connection with the electrodes of the LED chips, and the number of the LED chips and the light emitting color of the LED chips disposed in the accommodating cavity may be flexibly set according to the requirements. For example, the number of the holes may be one, two or three, and the like.

The LED chip in the embodiment can be a flip LED chip, two electrodes of the flip LED chip can directly span on the exposed first surfaces of the two adjacent conductive metal plates, and the LED chip is supported and simultaneously electrically connected; the LED chip in this embodiment may also be a front-mounted LED chip, one front LED chip may be disposed on the first surface of any one of the conductive metal plates, or may also be disposed across the first surfaces of the plurality of conductive metal plates, and two electrodes of the front-mounted LED chip are electrically connected to the exposed first surfaces of the two corresponding conductive metal plates through leads, respectively.

In some application examples of the embodiment, the metal lead frame may include three conductive metal plates sequentially disposed, and the exposed areas of the first surfaces of the conductive metal plates located in the middle are electrically connected to the electrodes corresponding to the two LED chips, respectively; the exposed areas of the first surfaces of the conductive metal plates on the two sides are respectively and electrically connected with the corresponding residual electrodes of the two LED chips, so that the two LED chips are connected in series. In this example, three conductive metal plates may also be located at the bottom of the same accommodating cavity. In other application scenarios of this example, the enclosure wall may further include a separation wall disposed on the first surface of the middle conductive metal plate to form two separated accommodating cavities on the first surfaces of the three conductive metal plates, so that the middle conductive metal plate crosses over the bottoms of the two separated accommodating cavities, and the two conductive metal plates are respectively located at the bottoms of the two separated accommodating cavities. Which kind of structure is adopted can be flexibly set according to the requirement. In the application example, the number and color of the LED chips arranged in one accommodating cavity, whether the forward-mounted LED chips or the flip-chip LED chips are adopted, and the like can be flexibly arranged according to the requirements. In some application scenarios of the present application example, the third surface and/or the second surface of the conductive metal plate located in the middle may also not be exposed outside the enclosing wall according to requirements. When the third surface and/or the second surface of the middle conductive metal plate are exposed outside the enclosing wall according to requirements, the third surface and/or the second surface of the middle conductive metal plate can be selectively welded during welding, the third surface and/or the second surface of the middle conductive metal plate can also be selectively not welded, and the welding method can be flexibly selected according to application scenes.

When the light-emitting unit provided by the embodiment is manufactured by adopting the LED bracket, because the LED chip is directly placed on the first surface of the conductive metal plate, and the second surface and the third surface of the conductive metal plate are exposed, the heat generated by the LED chip can be directly transferred to the conductive metal plate during operation and quickly dissipated outwards through the conductive metal plate, the heat dissipation path can be shortened to a great extent, the heat dissipation area is increased, the heat dissipation effect is greatly improved, and the performance of the light-emitting unit is ensured;

Optionally, in this embodiment, in order to further improve the welding reliability, an auxiliary welding layer for improving the welding force may be disposed on the conductive metal plate exposed outside the enclosing wall and on the area to be welded, where the auxiliary welding layer may be a metal layer, such as a metal plating layer, or may be another layer structure capable of improving the welding force. For example, in some examples, a metal plating layer for improving the welding force may be provided on at least one of the third surface and the second surface in the above examples, and the metal plating layer may be, but is not limited to, a silver plating layer.

In some application examples of the embodiment, an area of the third surface and/or the second surface of the at least one conductive metal plate exposed outside the enclosure wall may be presented as a set welding shape and flush with the enclosure wall, for example, the set welding shape may be a non-rectangular shape, and in some examples, the set welding shape may include but is not limited to: at least one of the I shape, the H shape, the horseshoe shape, the arc shape, the cross shape, the X shape and the 8 shape can be flexibly arranged according to the application scene. The welding shape is set, so that the welding operation is convenient, the welding area is increased, and the manufacture of the conductive metal plate or the cutting in the manufacturing process of the LED bracket is convenient.

In this embodiment, the area of the third surface and/or the second surface of the at least one conductive metal plate exposed outside the enclosing wall is set to be flush with the enclosing wall, so that after the support of the LED support is completed, the gap between the LED support and the circuit board during the welding of the LED support is reduced, and the reliability of the welding of the LED support is improved. In this embodiment, the area of the third surface of the partial conductive metal plate exposed outside the enclosure wall may be flush with the enclosure wall as required. However, in another application scenario of the embodiment, the third surface of each conductive metal plate is exposed outside the enclosure, and the area exposed outside the enclosure is flush with the enclosure. In the application scenario, optionally, the second surfaces of the conductive metal plates may be exposed outside the enclosure wall and flush with the enclosure wall.

Optionally, in other examples of the present embodiment, a region of the second surface of the at least one conductive metal plate exposed outside the enclosing wall is provided with a recess for accommodating solder. Therefore, in the welding process, part of the solder can flow into the concave part, so that the welding area is increased, when the flowing solder is used for welding redundant solder on the third surface, the redundant solder can be accommodated in the concave part, various risks such as short circuit caused by outflow of the redundant solder are avoided, and meanwhile, the flat shape after welding is ensured. The recess in the present embodiment may include, but is not limited to, at least one of a groove and a hole. And the specific shape of the grooves and holes is not limited in this embodiment.

In one example of the present example, at least one conductive metal plate may be provided to have a lateral width greater than that of the third surface near the upper end of the first surface, so that when the LED support is formed, a portion of the upper end of the conductive metal substrate is embedded in the glue of the fence, thereby improving the stability of the bonding between the conductive metal plate and the fence. Of course, in some application examples, the lateral width of the conductive metal plate near the upper end of the first surface and the lateral width of the conductive metal plate near the lower end of the second surface may also be the same or substantially the same, and the combination of the two may be achieved by the adhesive force between the fence and the bonding area of the conductive metal plate. The method is flexibly set according to requirements. In addition, the transverse width W2 of the third surface is smaller than the transverse width W1 of the upper end, so that the interval between the third surfaces of the conductive metal plates can be increased, short circuit between the conductive metal plates during welding is avoided, and the safety can be further improved. Of course, in some application examples, the lateral width of the upper end of the conductive metal plate near the first surface and the lateral width of the lower end of the first side surface c may also be communicated or substantially the same, and the combination of the two may be realized by the adhesive force between the enclosing wall and the combination area of the conductive metal plate. The method is flexibly set according to requirements.

In another example of this example, at least one conductive metal plate may be provided with an outwardly protruding boss between an upper end and a lower end, wherein a section of the conductive metal plate adjacent to the second surface is the lower end. At least one part of the boss is embedded in the colloid, so that the stability of the combination between the conductive metal plate and the enclosing wall can be improved. In addition, the lug boss is arranged to increase the interval between the lower ends of the conductive metal plates, so that short circuit between the conductive metal plates during welding is avoided, and the safety can be further improved. Alternatively, in this example, the projection provided on the conductive metal plate may be a projection inclined to the lower surface of the conductive metal plate, and the inclination angle may be flexibly set, for example, may be set to any value between 30 ° and 60 °, such as 30 °, 45 °, 60 °, or the like.

In an application scenario of the embodiment, the conductive metal plate may be, but is not limited to, a copper substrate, and the copper substrate has the advantages of low cost, convenience in processing, good conductivity and heat conductivity, and the like.

Optionally, in other application examples of this embodiment, a reflective layer for improving light extraction efficiency may be further disposed on the first surface of the conductive metal plate at least in the exposed area, so as to improve efficiency of the light emitting unit. The reflective layer in this embodiment can be, but is not limited to, a silver layer, and the silver layer can be formed on the copper substrate by, but is not limited to, electroplating, electroless silver plating, and the like.

The embodiment further provides a light emitting unit, which includes the LED bracket as above, and further includes an LED chip disposed in the accommodating cavity, the LED chip may be a front-mounted LED chip or a flip LED chip, and a package layer disposed in the accommodating cavity and covering the LED chip, and an electrode of the LED chip is electrically connected to an exposed area of the first surface of the corresponding conductive metal plate. The encapsulation layer in this embodiment may be a fluorescent adhesive layer, or a combination of a fluorescent adhesive layer and a transparent adhesive layer, or a quantum dot QD film, or a combination of a QD film and a transparent adhesive layer, or a combination of at least two of a fluorescent adhesive layer, a QD film, and a transparent adhesive layer.

For the convenience of understanding, the present embodiment will be described below with reference to the accompanying drawings in terms of several exemplary structures of a metal lead frame and a light emitting unit.

Example one:

please refer to fig. 2-1 to fig. 3. The metal lead frame 1 comprises a first conductive metal plate 11, a second conductive metal plate 12 and a third conductive metal plate 13 which are sequentially arranged in an insulation isolation mode, wherein the transverse width W1 of the upper end of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 is larger than the transverse width W2 of the lower end of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13. At least a part of the first surfaces a of the first conductive metal plate 11 and the third conductive metal plate 13 are exposed at the bottom of the accommodating cavity, and at least a part of the first surfaces a of the second conductive metal plate 12 are also exposed at the bottom of the accommodating cavity. The second surface b is a face opposite to the first surface, and the third surface c is a face between the first surface a and the second surface b. Referring to fig. 2-1 and 3, in the present example, the areas of the third surfaces c of the first and third

conductive metal plates

11 and 13 exposed to the third surface 22 of the enclosing wall 2 are in an i shape or H shape and are flush with the third surface 22 of the enclosing wall 2. In fig. 3, the area of the third surface c of the second conductive metal plate 12 exposed to the third surface 22 of the enclosing wall 2 is a plane and is flush with the third surface 22. In fig. 3, 21 is the first surface of the fence, and 23 is the second surface of the fence. The second surfaces b of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 are also exposed out of and flush with the second surface 23 of the enclosing wall 2.

In some examples of this embodiment, in order to further improve the stability of the combination between the conductive metal plate and the enclosing wall, the side surface of the upper end of at least one conductive metal plate may be further configured to be an inclined surface, and the inclination angle of the inclined surface may be flexibly set according to the requirement. For example, as shown in fig. 2-2, the side surfaces of the upper ends of the first conductive metal plate 11 and the second conductive metal plate 13 are inclined surfaces, and after the conductive metal plate is combined with the fence, the inclined surfaces have a larger contact area with the fence compared to the non-inclined surfaces, and can better bear the pressure of the fence on the conductive metal plate, so as to better improve the combination force between the conductive metal plate and the fence. Of course, the side surface of the upper end of the second conductive metal plate 12 may be provided as an inclined surface as required.

Example two:

please refer to fig. 4 to 5. The metal lead frame 1 in this example also includes a first conductive metal plate 11, a second conductive metal plate 12 and a third conductive metal plate 13 which are sequentially arranged in an insulation and isolation manner, and at least a part of the first surface a of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 is exposed at the bottom of the accommodating cavity. The second surface b is a face opposite to the first surface, and the third surface c is a face between the first surface a and the second surface b. Referring to fig. 4 to 5, in the present example, the areas of the third surfaces c of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 exposed to the third surface 22 of the enclosure wall 2 are all in an i shape or an H shape, and are flush with the third surface 22 of the enclosure wall 2. The second surfaces b of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 are also exposed out of and flush with the second surface 23 of the enclosing wall 2.

Referring to fig. 6, which shows the light emitting unit in this example, at least a portion of the first surface a of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 is exposed at the bottom of the accommodating cavity, and the enclosure wall 2 is formed with a partition wall 24 in the middle area of the first surface a of the second conductive metal plate 12, so as to form two accommodating cavities, in which one LED chip 4 is disposed, and the two LED chips 4 are connected in series through the second conductive metal plate 12.

Example three:

please refer to fig. 7 to 8. The metal lead frame 1 in this example also includes a first conductive metal plate 11, a second conductive metal plate 12 and a third conductive metal plate 13 which are sequentially arranged in an insulation and isolation manner, and at least a part of the first surface a of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 is exposed at the bottom of the accommodating cavity. Referring to fig. 7 to 8, in the present example, the areas of the third surfaces c of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 exposed to the third surface 22 of the enclosure wall 2 are all in the shape of a square horseshoe, and the opening faces the second surface b, although the opening may be disposed to face the first surface a. The areas of the third surfaces c of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 exposed to the third surface 22 of the enclosure 2 are all flush with the third surface 22 of the enclosure 2. The second surfaces b of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 are also exposed on the second surface 23 of the enclosing wall 2 and are flush with the second surface, but may also be disposed not flush with the second surface, and may be slightly higher or lower than the second surface 23 of the enclosing wall 2.

Example four:

please refer to fig. 9 to 10. The metal lead frame 1 in this example also includes a first conductive metal plate 11, a second conductive metal plate 12 and a third conductive metal plate 13 which are sequentially arranged in an insulation and isolation manner, and in this example, the areas of the third surfaces c of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 exposed to the third surface 22 of the enclosing wall 2 are all shown as the areas where the third surfaces c of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 are exposed

And the opening is directed towards the second surface b, although the opening may also be arranged towards the first surface a. The areas of the third surfaces c of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 exposed to the third surface 22 of the enclosure 2 are all flush with the third surface 22 of the enclosure 2. The second surfaces b of the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13 are also exposed on the second surface 23 of the enclosing wall 2 and are flush with the second surface, but may also be disposed not flush with the second surface, and may be slightly higher or lower than the second surface 23 of the enclosing wall 2. First conductive metal plate 11 and third conductive metal plateAt least a portion of the first surface a of the second conductive metal plate 12 is exposed at the bottom of the accommodating cavity, and at least a portion of the first surface a of the first conductive metal plate 13 is exposed at the bottom of the accommodating cavity. In this embodiment, the bosses 3 protruding outward are provided between the first surface and the second surface on both left and right sides of the first conductive metal plate 11 and the third conductive metal plate 13, and the shape, size, and the like of the bosses 3 can be flexibly set. In some examples, the bosses 3 may be provided only on one of the left and right sides of the first conductive metal plate 11 and the third conductive metal plate 13, or the bosses 3 may be flexibly provided on at least one of the front, rear, left, and right sides of the first conductive metal plate 11 and the third conductive metal plate 13 as required; the device can be flexibly set according to requirements. Referring to fig. 10, after the LED support is formed in this embodiment, the boss 3 disposed on the conductive metal plate is embedded into the wall, and at the bottom of the accommodating cavity, the colloid 20 constituting the direct housing is flush with the first surface a of the conductive metal plate. In the setting example, the setting of the thickness of the side wall of the enclosing wall is not limited, and the side wall can be set to be thinner under the condition of meeting the requirement of the strength of the LED support, so that the size of the LED support is reduced on the whole, and the miniaturization of the LED support is facilitated. It should be understood that the second conductive metal plate 12 may be provided with the boss 3 in a manner of referring to the first conductive metal plate 11 or the third conductive metal plate 13, or the boss 3 may not be provided, and may be flexibly provided according to the requirement.

In some examples of this embodiment, in order to further improve the stability of the combination between the conductive metal plate and the enclosing wall, the side surface of the boss 3 of at least one conductive metal plate may also be provided as an inclined surface, and the inclination angle of the inclined surface may be flexibly set according to the requirement. For example, as shown in fig. 11, the side surface 31 of the upper end boss 3 of the first conductive metal plate 11 and the second conductive metal plate 13 is an inclined surface, and after the conductive metal plate is combined with the fence, the inclined surface has a larger contact area with the fence compared with a non-inclined surface structure, and can better bear the pressure of the fence on the conductive metal plate, so as to better improve the combination force between the conductive metal plate and the fence. Of course, the second conductive metal plate 12 may be provided with a structure similar to the structure of the lands 3 on the first conductive metal plate 11 and the third conductive metal plate 13 as required.

Example five:

referring to fig. 11, a transverse cross-sectional view of the light emitting unit in each of the above examples is shown. It can be seen from this figure that the first conductive metal plate 11, the gap between the second conductive metal plate 12 and the third conductive metal plate 13 are filled with the colloid forming the enclosure, and two isolated accommodating cavities are formed in the first conductive metal plate 11, the second conductive metal plate 12 and the third conductive metal plate 13, each accommodating cavity is provided with one LED chip 4, the LED chips are flip LED chips, each flip LED chip spans over two adjacent conductive metal plates, and the accommodating cavities are filled with the encapsulation layers 3.

Referring to fig. 12, the light emitting unit shown in the figure is different from the light emitting unit shown in fig. 11 in that the LED chip 4 disposed in the accommodating cavity is a front-mounted LED chip, and both the front-mounted LED chips are disposed on the first surface of the second conductive metal plate 12. Of course, two front-mounted LED chips may be disposed on the first surfaces of the first conductive metal plate 11 and the third conductive metal plate 13, respectively, or one front-mounted LED chip may be disposed on the first surface of the first conductive metal plate 11 and the other front-mounted LED chip may be disposed on the first surface of the second conductive metal plate 12, or one front-mounted LED chip may be disposed on the first surface of the third conductive metal plate 13 and the other front-mounted LED chip may be disposed on the first surface of the second conductive metal plate 12.

Please refer to fig. 14, the light emitting unit shown in the figure is different from the light emitting unit shown in fig. 11 in that the second conductive metal plate 12 is omitted, and it should be understood that, when more than three LED chips are required to be connected in series, a fourth conductive metal plate, a fourth fifth conductive metal plate, and the like may be further added in sequence on the basis of fig. 11, and the arrangement may be flexibly selected according to requirements.

The light emitting unit shown in each of the above examples is composed of a metal lead frame and a surrounding wall covering the metal lead frame, and the structure is greatly simplified and the cost is low compared with the conventional light emitting diode.

The conductive metal plate can simultaneously realize the bearing of the LED chip and the electric connection with the LED chip, and can be used as a bonding pad to realize the electric connection with the outside, the integration level is high, and the structure is simple;

because the LED chip is directly placed on the first surface of the conductive metal plate, and the second surface and the third surface of the conductive metal plate are exposed, the heat generated by the LED chip can be directly transferred to the conductive metal plate during working and can be quickly dissipated outwards through the conductive metal plate;

The present invention also provides a light emitting unit module, which can be used for, but not limited to, various lighting scenes and/or display scenes, and includes a substrate and a plurality of light emitting units as described above, wherein the plurality of light emitting units are electrically connected to the substrate. The light emitting unit in this embodiment may be a positive light emitting unit or a side light emitting unit. Fig. 15 shows an exemplary light-emitting unit module, in which the light-emitting unit module 5 includes a substrate 52 and a plurality of the side-emitting light-emitting units 51 disposed on the substrate 52.

The embodiment also provides a display device, which comprises the light-emitting unit module. The display device may be used for, but not limited to, various displays, mobile phones, PCs, advertising equipment, and the like. An exemplary display device is shown in fig. 16, and includes an outer frame 6, a membrane 701, a light guide plate 702, a reflective sheet 703 and a metal back plate 704 assembled in the outer frame 6, and light emitting unit modules 5 correspondingly disposed on the membrane 701, the light guide plate 702, the reflective sheet 703 and the metal back plate 704. It should be understood that fig. 16 is only an exemplary display device, and the specific structure of the display device can be flexibly set, and will not be described herein.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. An LED support is characterized by comprising a metal lead frame and an enclosing wall covering the metal lead frame, wherein an accommodating cavity for placing an LED chip is formed in the enclosing wall, the metal lead frame comprises at least two separately arranged conductive metal plates, the first surfaces of the conductive metal plates are positioned at the bottom of the accommodating cavity and at least partially exposed outside, the first surface of at least one conductive metal plate is used for bearing the LED chip, and the exposed area of the first surface of each conductive metal plate is used for being electrically connected with the corresponding electrode of the LED chip;

2. The LED holder of claim 1, wherein the set solder shape is a non-rectangular shape.

3. The LED support of claim 1, wherein the area of the third surface of each conductive metal plate exposed outside the perimeter wall is flush with the perimeter wall.

4. The LED support of any of claims 1-3, wherein an area of the second surface exposed outside the perimeter wall is flush with the perimeter wall.

5. The LED support according to any one of claims 1 to 3, wherein the area of the second surface exposed outside the enclosing wall is provided with a recess for accommodating solder.

6. The LED support according to any one of claims 1 to 3, wherein the metal lead frame comprises three conductive metal plates arranged in sequence, and the exposed areas of the first surfaces of the conductive metal plates in the middle are electrically connected with the corresponding electrodes of the two LED chips respectively.

7. The LED support of claim 6, wherein the enclosure further comprises a partition wall disposed on the first surface of the middle conductive metal plate to form two separate receiving cavities on the first surfaces of the three conductive metal plates.

8. The LED support according to any one of claims 1 to 3, wherein at least one of the conductive metal plates has a lateral width near an upper end of the first surface that is greater than a lateral width near the third surface, and a portion of the upper end of the conductive metal substrate is embedded in the gel of the enclosure;

and/or the presence of a gas in the gas,

9. An LED support according to any one of claims 1 to 3, wherein the conductive metal plate is a copper substrate and the first surface is provided with a reflective layer at least in the exposed area.

10. A light-emitting unit, comprising the LED support according to any one of claims 1 to 9, further comprising an LED chip disposed in the accommodating cavity, and an encapsulation layer disposed in the accommodating cavity and covering the LED chip, wherein an electrode of the LED chip is electrically connected to a corresponding exposed area of the first surface of the conductive metal plate.

11. A light-emitting unit module, comprising a substrate and a plurality of light-emitting units according to claim 10, wherein the plurality of light-emitting units are electrically connected to the substrate.

12. A display device, characterized in that the display device comprises the light emitting cell module according to claim 11.