CN213366622U - LED support, light-emitting unit, light-emitting module and display device - Google Patents

Abstract

The utility model provides a LED support, luminescence unit, light-emitting module and display device, LED support is kept apart the sheetmetal that sets up by at least two insulation to and combine to form the colloid of base main part with the sheetmetal and constitute, LED support structure is simpler than current support structure, and it is easier to make, and the cost is lower, and the first surface of at least one sheetmetal is used for bearing the weight of the LED chip, and the heat that LED chip produced during operation can directly be transmitted to the sheetmetal, and give off outward fast through the sheetmetal; because the second surface, the third surface and the fourth surface of the metal sheet are exposed and can be used as the bonding pads electrically connected with the outside, the metal sheet can be suitable for various application scenes and can improve the heat dissipation area.

Description

LED support, light-emitting unit, light-emitting module and display device

Technical Field

The utility model relates to a LED (Light Emitting Diode) field especially relates to a LED support, luminescence unit, Light-Emitting module and display device.

Background

The color gamut and the brightness required by each display device are higher and thinner, the color gamut and the brightness are in a negative correlation relationship, the color gamut requirement is higher, the brightness is lower, the brightness of an original single chip packaging body cannot meet the requirement, and an ultrathin side light-emitting diode with higher brightness is required to be provided when the color gamut is high. To this end, the related art provides a light emitting diode having higher brightness at a high color gamut, which includes a substrate, a circuit formed on a top surface of the substrate to be electrically connected to an LED chip, and a pad provided on a bottom surface of the substrate, the circuit on the top surface of the substrate being electrically connected to the pad through a conductive material in a through hole penetrating the bottom surface. A shell is formed on the plastic substrate, a cavity for placing the LED chip is formed in the shell, and fluorescent glue is filled in the cavity. Although the light emitting diode with the structure can improve the brightness, the structure is more complex and the cost is high; in addition, heat generated by the LED chip in the light-emitting diode is mainly transmitted to the bonding pad for heat dissipation through the conductive material in the through hole penetrating through the substrate, the heat dissipation path is long, the heat dissipation area is small, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of LED support, luminescence unit, light-emitting module and display device solves current emitting diode structure complicacy, with high costs and the poor problem of heat dissipation.

In order to solve the technical problem, an embodiment of the present invention provides an LED bracket, including three metal sheets sequentially insulated and isolated from each other, and a colloid combined with the metal sheets to form a base main body, wherein the base main body is surrounded and formed with a bowl for placing an LED chip, and a first surface of the metal sheet is located at the bottom of the bowl, and at least a part of the metal sheet is exposed outside; the first surface of at least one metal sheet is used for bearing the LED chips, the exposed areas of the first surfaces of the metal sheets at the two ends are respectively used for being electrically connected with the corresponding electrode of one LED chip, and the exposed area of the first surface of the metal sheet in the middle is respectively electrically connected with the corresponding electrodes of the two LED chips;

at least part of the second surface of the metal sheet is exposed out of the base body, the second surface is a surface opposite to the first surface, at least part of the third surface and the fourth surface of the metal sheet between the first surface and the second surface is exposed out of the base body to serve as a welding area, and the third surface and the fourth surface are two opposite surfaces.

Optionally, a region of the third surface exposed outside the base body is provided with a first recess for accommodating solder.

Optionally, a region of the second surface exposed outside the base body is provided with a second recess for accommodating solder.

Optionally, the first recess communicates with the second recess.

Optionally, a region of the fourth surface exposed outside the base body is provided with a third recess for accommodating solder.

Optionally, an inner wall of at least one of the first recess, the second recess and the third recess is provided with a weld-assistant layer for improving welding capacity.

Optionally, the first recess communicates with the third recess.

Optionally, the first recess is a first groove or a first hole, the second recess is a second groove or a second hole, and the third recess is a third groove or a third hole.

Optionally, a region of the first surface of the metal sheet, which is bonded to the base main body, is provided with a rough surface having a concave-convex structure for enhancing a bonding force with the base main body, or is provided with a bonding hole into which a colloid forming the base main body flows.

Optionally, one end of the combination hole close to the first surface is an upper end, one end of the combination hole close to the second surface is a lower end, and the aperture of the upper end of the combination hole is larger than that of the lower end of the combination hole.

Optionally, the base body further comprises a separating wall disposed on the first surface of the middle sheet metal to form two separated bowls on the first surfaces of the three sheet metals.

Optionally, a lateral width of the metal sheet near an upper end of the first surface is larger than a lateral width near a lower end of the second surface, and a portion of the upper end of the metal sheet is embedded in the base body;

or, at least one of the metal sheets is provided with a protrusion protruding outward between the first surface and the second surface, and at least a part of the protrusion is embedded in the base body.

Optionally, the protrusion is a protrusion inclined to the second surface.

Optionally, the metal sheet is a copper substrate, and a reflective layer is disposed on at least an exposed region of the first surface.

Optionally, the areas of the third surface and the fourth surface exposed outside the base body are different in shape and/or size.

In order to solve the above technical problem, an embodiment of the present invention further provides a light emitting unit, including as above the LED bracket, still including set up in the LED chip in the bowl cup, and set up in will in the bowl cup the packaging layer that the LED chip covered, the electrode of LED chip with correspond the exposed region of the first surface of sheetmetal forms the electricity and connects.

In order to solve the above technical problem, an embodiment of the present invention further provides a light emitting module, which includes a substrate and a plurality of light emitting units, wherein the plurality of light emitting units are electrically connected to the substrate.

In order to solve the above technical problem, an embodiment of the present invention further provides a display device, including the light emitting unit module as described above.

Advantageous effects

The utility model provides a LED support, a light-emitting unit, a light-emitting module and a display device, wherein the LED support is composed of at least two metal sheets which are arranged in an insulating and isolating way and a colloid which is combined with the metal sheets to form a base main body;

the first surface of the metal sheet is positioned at the bottom of a bowl cup formed by the enclosing of the base main body and used for placing the LED chip, and at least part of the first surface of the metal sheet is exposed outside; the first surface of at least one metal sheet is used for bearing the LED chip, and the exposed area of the first surface of each metal sheet is used for being electrically connected with the electrode of the corresponding LED chip; at least part of the second surface of the metal sheet is exposed out of the base main body, and at least part of the third surface and the fourth surface of at least one metal sheet is also exposed out of the base main body, so that heat generated by the LED chip during working can be directly transferred to the metal sheets and is quickly dissipated outwards through the metal sheets, the heat dissipation path is greatly shortened, and meanwhile, the heat dissipation area is greatly increased, so that the heat dissipation effect is greatly improved, and the performance of the light-emitting unit is ensured;

in addition, at least parts of the second surface, the third surface and the fourth surface of at least one metal sheet are exposed out of the base main body, and the exposed areas can be used as bonding pads electrically connected to the outside, so that at least one of the exposed areas of the second surface, the third surface and the fourth surface can be flexibly selected to be welded according to the requirements of specific application scenes, the welding device is suitable for various application scenes and convenient to weld, the welding device can be used for welding two or three surfaces according to the requirements, the welding firmness can be improved, and the reliability of a product is further improved;

the luminous unit is by placing the LED chip in the bowl cup in this LED support to and constitute with the packaging layer that this LED chip covered, the luminous unit structure is simpler than the structure of current LED lamp pearl, and the preparation is easier, and the cost is lower.

Drawings

Fig. 1 is a schematic view of a metal sheet set in an example provided by an embodiment of the present invention;

fig. 2 is a schematic view of an example of an LED support according to an embodiment of the present invention;

fig. 3 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 4 is a schematic view of an LED support according to another example provided by an embodiment of the present invention;

fig. 5 is a schematic view of an LED support according to another example provided by an embodiment of the present invention;

fig. 6 is a third surface projection view of an LED support according to yet another example provided by an embodiment of the present invention;

fig. 7 is a fourth surface projection view of an LED support according to yet another example of the present invention;

fig. 8 is a schematic view of an LED support according to another example provided by an embodiment of the present invention;

fig. 9 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 10 is a schematic view of an LED support according to another example of the present invention;

fig. 11 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 12 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 13 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 14 is a schematic view three of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 15-1 is a schematic perspective view of a metal sheet set in another example provided in an embodiment of the present invention;

fig. 15-2 is a schematic perspective view of a metal sheet set in another example provided in the embodiment of the present invention;

fig. 15-3 are schematic perspective views of a metal sheet set in another example provided in the embodiment of the present invention;

fig. 15-4 are schematic plan views of a metal sheet assembly in another example provided by an embodiment of the present invention;

fig. 15-5 are schematic perspective views of an LDE holder according to another example provided in the embodiment of the present invention;

fig. 15-6 are schematic perspective views of a LDE holder according to another example provided in the embodiment of the present invention;

fig. 15-7 are cross-sectional views of an LDE holder in accordance with yet another example provided by an embodiment of the present invention;

fig. 15-8 are cross-sectional views of a metal sheet stack in yet another example provided by an embodiment of the present invention;

fig. 16 is a first schematic diagram of a light-emitting unit according to another example provided by the embodiment of the present invention;

fig. 17 is a schematic view of a second light-emitting unit in another example provided by the embodiment of the present invention;

fig. 18 is a schematic view of a light emitting module according to another example of the embodiment of the present invention;

fig. 19 is a schematic view of a display device according to another example of the embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The embodiment provides the LED support which has the advantages of simple structure, low cost, good heat dissipation performance, simplicity and convenience in welding and wider applicable scene, and the light-emitting unit manufactured by the LED support is collected. For ease of understanding, the LED support is first illustrated below.

The LED support comprises at least two metal sheets arranged in an insulating and isolating mode, the metal sheets and a colloid used for forming a base main body are combined to form the LED support, the first surfaces of the metal sheets are located at the bottom, formed by the base main body in a surrounding mode, of a bowl cup used for placing an LED chip, and at least part of the metal sheets are exposed outside; the first surface of at least one metal sheet is used for bearing the LED chip, and the exposed area of the first surface of each metal sheet is used for being electrically connected with the electrode of the corresponding LED chip; at least part of the second surface of the metal sheet is exposed out of the base body, the second surface is a surface opposite to the first surface, at least part of the third surface and the fourth surface of the metal sheet between the first surface and the second surface is exposed out of the base body, and the third surface and the fourth surface are two opposite side surfaces. That is, in this embodiment, the four surfaces of the first surface, the second surface, the third surface and the fourth surface of the metal sheet may be at least partially exposed outside the base main body, and the other surfaces are all covered by the base main body, so that the bonding area of the base main body on the metal sheet is increased, the bonding strength of the base main body and the metal sheet is improved, the reliability of the LED support is improved, and meanwhile, the LED support has better air tightness, so that the safety and reliability of the LED product are improved.

In addition, the LED chip can be directly arranged on the first surface of the metal sheet, and the second surface and the third surface of the metal sheet are exposed outside the base main body, so that heat generated by the LED chip during working can be directly transferred to the metal sheet and can be quickly dissipated outwards through the metal sheet, a heat dissipation path is shortened to a great extent, the heat dissipation area is increased, the heat dissipation effect is greatly improved, and the performance of the light-emitting unit is ensured.

For example, referring to fig. 1 to 2, an example of a metal sheet set 1 and an LED support of an LED support is shown, and an LED support includes a metal sheet set 1. The metal sheet set 1 comprises a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially arranged in an insulation and isolation mode, and at least one part of a first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown). Referring to fig. 1 and 2, in the present example, the areas of the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the third surface 22 of the base body 2 are planar areas, and optionally, the areas of the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the base body 2 may be flush with the third surface 22 of the base body 2, or may be slightly higher or lower than the third surface 22 of the base body 2. In this example, the areas of the fourth surfaces of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the fourth surface of the base body 2, the areas of the fourth surfaces exposed to the base body 2 may be flush with the fourth surface of the base body 2, or may be slightly higher or lower than the fourth surface of the base body 2.

In this example, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 are also planar, and optionally, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2, or slightly higher or lower than the second surface 23 of the base body 2 in this embodiment. In fig. 2, 21 is a first surface of the base body, and may be parallel to, but not limited to, a first surface a of the metal sheet.

In the LED bracket shown in fig. 2, three surfaces of the metal sheet are exposed outside the base body, and can be used as a bonding pad and a heat dissipation surface, which can be flexibly applied to welding in various application scenarios, and can increase the heat dissipation area, thereby increasing the heat dissipation effect.

Optionally, in this embodiment, in order to increase the soldering area and improve the reliability of soldering, the region of the third surface of the metal sheet exposed outside the base body may be provided with a first recess for accommodating solder. And the shape, the size and the structure of the first concave part can be flexibly arranged according to specific application scenes. For example, the first recess may be, but is not limited to, a first groove, or a first hole, and the shape, size, etc. of the specific groove and hole may be flexibly set.

For example, please refer to fig. 3 to 4 for another example of a metal sheet set 1 and an LED support of an LED support, where an LED support includes a metal sheet set 1. The metal sheet set 1 comprises a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially arranged in an insulation and isolation mode, and at least one part of a first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown). Referring to fig. 3 and 4, in the present example, the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the first concave portion c1 provided with a horseshoe-shaped groove in the area of the third surface 22 of the base body 2, and optionally, the areas of the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the base body 2 and not provided with the first concave portion c1 may be flush with the third surface 22 of the base body 2, or may be slightly higher or lower than the third surface 22 of the base body 2. In this example, the areas of the fourth surfaces of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the fourth surface of the base body 2 may be a plane, and the areas of the fourth surfaces exposed to the base body 2 may be flush with the fourth surface of the base body 2, or may be slightly higher or lower than the fourth surface of the base body 2.

In this example, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 are also planar, and optionally, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2, or slightly higher or lower than the second surface 23 of the base body 2 in this embodiment.

Optionally, in this embodiment, in order to increase the soldering area and enhance the reliability of soldering, and to enhance the flexibility of soldering, so as to better adapt to various application scenarios, the area of the fourth surface of the metal sheet exposed outside the base body may be provided with a third recess for accommodating solder. And the shape, the size and the structure of the third concave part can be flexibly arranged according to specific application scenes. For example, the third recess may be, but is not limited to, a third groove, or a third hole, and the shape, size, etc. of the specific groove and hole may be flexibly set.

For another example, please refer to the LED holders shown in fig. 5 to 7, fig. 5 is a schematic perspective view of the LED holder, fig. 6 is a projection view of a third surface of a base main body of the LED holder, and fig. 7 is a projection view of a fourth surface of the base main body of the LED holder. The LED support comprises a metal sheet group 1, wherein the metal sheet group 1 comprises a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially arranged in an insulating and isolating mode, and at least one part of a first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed at the bottom of the bowl cup. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown). Referring to fig. 5 to 7, in this example, the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the third surface 22 of the base body 2 are provided with a first concave portion c1 having a horseshoe-shaped groove, the fourth surfaces d of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the fourth surface of the base body 2 are also provided with a third concave portion d1 having a horseshoe-shaped groove, the third concave portion d1 and the first concave portion c1 may have the same shape and size and have the same position, and the third concave portion d1 and the first concave portion c1 may have different shapes and sizes and have different positions. The method can be flexibly set according to requirements.

Optionally, the third surface c and the fourth surface d of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 in this example are exposed out of the base body 2, and the area where the first recess c1 and the third recess d1 are not provided may be flush with the base body 2, or may be slightly higher or lower than the base body 2. In this example, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 are also planar, and optionally, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2, or slightly higher or lower than the second surface 23 of the base body 2 in this embodiment.

In this embodiment, the third recess and the first recess may or may not be in communication with each other. When communicating, the redundant solder in one concave part can directly flow into the other concave part through the communicating structure.

Optionally, in some examples, an area of the second surface of the metal sheet exposed outside the base body may be further provided with a second recess for accommodating solder, and the shape, size and structure of the second recess may also be flexibly set according to a specific application scenario. For example, the second recess may be, but is not limited to, a second groove, or a second hole, and the shape, size, etc. of the specific groove and hole may be flexibly set. The second concave part, the first concave part and the third concave part are arranged, so that redundant welding flux is contained in the concave parts in the welding process, and the smoothness and the reliability of welding are guaranteed.

Optionally, in this embodiment, in order to further improve the reliability of the welding, a solder mask layer for improving the welding force may be disposed on the metal sheet and exposed outside the base body, and the area to be welded is provided with a solder mask layer, where the solder mask layer may be a metal layer, such as a metal plating, or may be another layer structure capable of improving the welding force. For example, in some examples, a metal plating layer for improving the welding force may be provided on at least one sidewall of the first groove, the second groove, and the third groove in each of the above examples, and the metal plating layer may be, but is not limited to, a silver plating layer.

For another example, please refer to fig. 8 for another example, which shows an LED support, which includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13, which are sequentially disposed in an insulating and isolating manner, wherein at least a portion of a first surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed at the bottom of a bowl. The second surface b is a surface opposite to the first surface, the third surface c is a surface between the first surface a and the second surface b, and the fourth surface d is a surface opposite to the third surface c (not shown). Referring to fig. 5 to 7, in this example, the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the third surface 22 of the base body 2 are provided with a first concave portion c1 having a horseshoe-shaped groove, the fourth surfaces d of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the fourth surface of the base body 2 are also provided with a third concave portion d1 having a horseshoe-shaped groove, the third concave portion d1 and the first concave portion c1 may have the same shape and size and have the same position, and the third concave portion d1 and the first concave portion c1 may have different shapes and sizes and have different positions. The method can be flexibly set according to requirements. In this example, the areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base main body 2 are provided with groove-shaped second recesses b1, and the second recesses b1 communicate the first recesses c1 with the third recesses d 1. Optionally, in the embodiment, the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 and the area where the second recess b1 is not disposed may also be flush with the second surface 23 of the base body 2, or slightly higher or lower than the second surface 23 of the base body 2. The third surface c and the fourth surface d of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 in this example are exposed to the base body 2, and the area where the first recess c1 and the third recess d1 are not provided may be flush with the base body 2, or may be slightly higher or lower than the base body 2.

It should be understood that the number of the metal sheets included in one LED support in this embodiment can be flexibly set according to a specific application scenario. For example, only two insulating and isolating metal sheets may be provided, the base main body may only enclose to form a bowl body, at least a portion of the first surfaces of the two insulating and isolating metal sheets is exposed at the bottom of the bowl body to be used for carrying the LED chips and completing electrical connection with the electrodes of the LED chips, and the number of the LED chips and the light emitting color of the LED chips provided in the bowl body may be flexibly set according to the requirements. For example, the number of the holes may be one, two or three, and the like.

The LED chip in the embodiment can be a flip LED chip, two electrodes of the flip LED chip can directly span the exposed first surfaces of the two adjacent metal sheets, and the LED chip is supported and simultaneously electrically connected; the LED chip in this embodiment may also be a front-mounted LED chip, one front-mounted LED chip may be disposed on the first surface of any one of the metal sheets, or may also be disposed across the first surfaces of the metal sheets, and two electrodes of the front-mounted LED chip are electrically connected to the exposed first surfaces of the two corresponding metal sheets through leads, respectively.

In some application examples of the embodiment, the LED support may include three metal sheets sequentially disposed, and the exposed area of the first surface of the metal sheet located in the middle is electrically connected to the electrodes corresponding to the two LED chips respectively; the exposed areas of the first surfaces of the metal sheets on the two sides are respectively and electrically connected with the corresponding residual electrodes of the two LED chips, so that the two LED chips are connected in series. In this example, three metal pieces may also be located at the bottom of the same bowl. In other application scenarios of the present example, the base body may further include a partition wall disposed on the first surface of the middle metal sheet to form two separated bowls on the first surfaces of the three metal sheets (the partition wall may also be omitted and a large bowl may be formed on the three metal sheets), so that the middle metal sheet spans two bottom portions of the two separated bowls, and the two metal sheets are respectively disposed at two bottom portions of the two separated bowls. Which kind of structure is adopted can be flexibly set according to the requirement. In the application example, the number and the color of the LED chips arranged in one bowl cup, whether the LED chips are positively arranged or inversely arranged, and the like can be flexibly arranged according to requirements. In some application scenarios of the present application example, at least one of the third surface, the second surface, and the fourth surface of the metal sheet located in the middle may also be not exposed outside the base body according to requirements. When at least one of the third surface, the second surface, and the fourth surface of the middle metal sheet is exposed outside the base body as required, during welding, at least one of the third surface, the second surface, and the fourth surface of the middle metal sheet may be selectively welded, or at least one of the third surface, the second surface, and the fourth surface of the middle metal sheet may not be selectively welded, and may be flexibly selected according to an application scenario.

In this embodiment, the shape of the second concave portion disposed in the region where the second surface of the metal sheet is exposed outside the base body and the shape of the first concave portion disposed in the region where the third surface is exposed outside the base body and used for accommodating the solder may be flexibly combined, for example, the second concave portion may be set as a second groove, the first concave portion is set as a first groove or a first hole, or the second concave portion is set as a second hole, the first concave portion is set as a first groove or a first hole, and particularly, the second concave portion may be flexibly disposed according to requirements. Similarly, the shapes of the first concave part and the third concave part and the shapes of the third concave part and the second concave part can be flexibly combined; and whether the first concave part, the second concave part and the third concave part are communicated or not can be flexibly arranged. For example, the second recess provided in the second surface of the metal sheet and the first recess provided in the third surface may not communicate with each other. For example, in a side-lighting application scene, when the third surface is placed on the welding surface provided with the solder, the third surface presses the solder on the welding surface, and a part of the solder overflows along the third surface; meanwhile, due to the arrangement of the second concave part and the first concave part, the welding area can be increased relative to a plane arrangement mode, redundant welding flux can be contained in the concave part, the welding stability can be further improved, and meanwhile the welding smoothness is improved. In the application scene of positive light emission, the process of welding when the second surface of the metal sheet is placed on the welding surface provided with the welding flux is similar to the welding process in the application scene of side light emission, and the description is omitted again.

For another example, the second concave portion provided on the second surface of the metal sheet and the first concave portion provided on the third surface of the metal sheet can be communicated with each other, and this communicated structure can form better drainage for the solder of the liquid, and can more reliably ensure that the redundant solder is contained in the concave portion. In this embodiment, when the second recess communicates with the first recess, the second recess may communicate with the first recess inside the metal sheet, or the second surface and the third surface of the metal sheet may communicate with each other on the outer surface thereof, and the communicating portion between the second recess and the third recess may be a groove, a hole, or another structure. For example, in a side-lighting application scenario, when the third surface is placed on a welding surface provided with solder, the third surface presses the solder on the welding surface, and since the second concave portion is communicated with the first concave portion, a part of the solder pressed to the first concave portion can directly flow into the second concave portion along the position where the second concave portion is communicated with the first concave portion, so that solder can be ensured to be in the second concave portion and the first concave portion as much as possible, and the second surface and the third surface can be welded; when part of the solder overflows along the third surface, the overflowing solder can be gathered to the metal sheet preferentially in the second concave part arranged on the second surface due to the fact that the solder is heated in the heating process. Therefore, the second concave part is communicated with the first concave part, so that the third surface and the second surface can be better welded, and the welding reliability is improved. In the application scenario of positive light emission, the process of soldering when the second surface of the metal sheet is placed on the soldering surface provided with the solder is similar to the soldering process in the application scenario of side light emission, and is not described herein again.

It should be understood that, in the embodiment, the second recess is configured as the first groove or the first hole, and when the first recess is configured as the second groove or the second hole, the specific shape and size of the first groove and the second groove, and the specific shape and size of the second hole and the first hole can be flexibly configured according to the requirement. For example, referring to fig. 9 and 10, a metal sheet set 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially and isolatedly arranged, at least a portion of a first surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and a first surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The second surface b is a surface opposite to the first surface, and the third surface c and the fourth surface d are two surfaces located between and opposite to the first surface a and the second surface b. Referring to fig. 9 and 10, in the present example, the areas of the third surfaces c of the first, second and third metal sheets 11, 12 and 13 exposed to the third surface 22 of the base body 2 are provided with first recesses c1 in the shape of circular holes, and optionally, the areas of the third surfaces c of the first, second and third metal sheets 11, 12 and 13 exposed to the base body 2 and not provided with the first recesses are flush with the third surface 22 of the base body 2. The areas of the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 are provided with second recesses b1 in the shape of square holes, in this example, the second recesses b1 are communicated with the first recesses c 1. Optionally, in this embodiment, the second surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the second surface 23 of the base body 2 may also be flush with the second surface 23 of the base body 2 in an area where the first recess is not disposed.

As shown in fig. 11 and 12, the first recess c1 may also be a square groove, or a combination of a square groove and a hole. Similarly, the shapes of the third recess and the second groove may also be deformed in a similar manner, and the setting relationship between the third recess and the second recess may refer to, but is not limited to, the relationship between the first recess and the second recess, which is not described herein again.

Alternatively, in an example of the present example, at least one metal sheet may be provided to have a lateral width greater than that of the third surface and/or the fourth surface near an upper end of the first surface, so that when the LED support is formed, a portion of the upper end of the metal sheet is embedded in the glue of the base body, thereby improving the stability of the bonding between the metal sheet and the base body. In addition, the transverse width of the third surface and/or the fourth surface is smaller than that of the upper end, so that the interval between the third surfaces of the metal sheets can be increased, and/or the interval between the fourth surfaces of the metal sheets can be increased, short circuit between the metal sheets during welding can be avoided, and the safety can be further improved. Of course, in some application examples, the transverse width of the upper end of the metal sheet near the upper surface and the transverse width of the third surface and/or the fourth surface may also be the same or substantially the same, and the combination of the two can be realized by the adhesive force between the base main body and the metal sheet combination area. The method is flexibly set according to requirements.

Referring to the conductive base shown in fig. 1, for example, the lateral width W1 of the upper end of the third metal sheet 13 is greater than the lateral width W2 of the third surface. Likewise, the lateral width W1 of the upper end of the first metal sheet 11 and the second metal sheet 12 may also be greater than the lateral width W2 of the third surface.

In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheets and the base main body, a side surface of an upper end of at least one metal sheet may be further provided as an inclined surface, and an inclination angle of the inclined surface may be flexibly set as required. For example, in an example, the side surfaces of the upper ends of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces, and after the first metal sheet is combined with the base main body, the inclined surfaces can have a larger contact area with the base main body relative to the structure of the non-inclined surfaces, and can better bear the pressure of the base main body on the metal sheets, so that the combination force between the metal sheets and the base main body can be better improved. Of course, the side surface of the upper end of the second metal sheet 12 may be provided as an inclined surface as required.

Alternatively, in another example of the present example, at least one metal sheet may be provided with a protrusion protruding outward between the first surface and the second surface, such that at least a portion of the protrusion is embedded (may be embedded completely or partially, and particularly, the colloid embedded in the base main body may be flexibly arranged according to requirements, so as to improve the stability of the combination between the metal sheet and the base main body when the LED bracket is formed 45 °, 60 °, or 70 °, etc.

For example, referring to fig. 15-1 to 15-4, the LED support also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13, which are sequentially disposed in an insulating and isolating manner, at least a portion of the first surface a of the first metal sheet 11, the first surface a of the first metal sheet 11 and the first surface a of the third metal sheet 13 are exposed at the bottom of the bowl, and at least a portion of the first surface a of the second metal sheet 12 is also exposed at the bottom of the bowl. In this example, the third surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed from the third surface 22 of the base main body 2 are provided with second concave portions c1 having a circular arc shape. In the embodiment, the protrusions 3 protruding outward are disposed between the first surface and the second surface on the left and right sides of the first metal sheet 11 and the third metal sheet 13, and the shapes, sizes, and the like of the protrusions 3 can be flexibly set. In some examples, the protrusion 3 may be provided only on one of the left and right sides of the first metal sheet 11 and the third metal sheet 13, or the protrusion 3 may be flexibly provided on at least one of the front, rear, left and right sides of the first metal sheet 11 and the third metal sheet 13 as required; the device can be flexibly set according to requirements. Referring to fig. 15-3, the second surface b is two discontinuous surfaces (i.e. two non-adjacent surfaces) on the fourth surface d, and the two discontinuous surfaces are separated by the bottom surface (also called as a step surface) of the protrusion 3; the step surface can be embedded into the base main body to improve the binding force with the base main body.

Referring to fig. 15-5 to 15-7, after the LED support is formed in the present embodiment, the protrusion 3 disposed on the metal sheet is embedded into the base body, and at the bottom of the bowl, the colloid 20 forming the base body is flush with the first surface a of the metal sheet. Referring specifically to fig. 15-5 and 15-7, the glue 20 is disposed between the first surface a of the metal sheet and the sidewall of the base main body, and the glue 20 is disposed flush with the first surface a, in this disposing example, there is no limitation on the thickness of the sidewall of the base main body, and the sidewall can be disposed to be thinner under the requirement of meeting the strength of the LED support, so as to reduce the size of the LED support as a whole, and facilitate miniaturization thereof. It should be understood that the second metal sheet 12 may be provided with the protrusions 3 in the manner of referring to the first metal sheet 11 or the third metal sheet 13, or the protrusions 3 may not be provided, and may be flexibly provided according to requirements.

In some examples of the embodiment, in order to further improve the stability of the combination between the metal sheet and the base main body, the side surface of the protrusion 3 of at least one metal sheet may be further provided as an inclined surface, and the inclination angle of the inclined surface may be flexibly set according to the requirement. For example, as shown in fig. 15-8, the side surface 31 of the upper protrusion 3 of the first metal sheet 11 and the second metal sheet 13 is an inclined surface, and after the metal sheet is combined with the base body, the inclined surface has a larger contact area with the base body relative to the structure of the non-inclined surface, and can better bear the pressure of the base body on the metal sheet, so as to better improve the combination force between the metal sheet and the base body. Of course, the second metal sheet 12 may be provided with a structure similar to the protrusions 3 of the first metal sheet 11 and the third metal sheet 13 as required.

Optionally, to further improve the robustness of the bond between the metal sheet and the base body. The region of the first surface of the metal sheet bonded to the base body may be provided with a rough surface having a concave-convex structure for enhancing the bonding force with the base body (of course, other regions of the metal sheet contacting the base body may also be provided with a rough surface having a concave-convex structure for enhancing the bonding force with the base body), and/or may be provided with bonding holes into which the adhesive forming the base body flows.

Alternatively, in this embodiment, the bonding hole provided on the first surface of the metal sheet may communicate with the second recess provided on the second surface of the metal sheet, and may also communicate with the first recess provided on the third surface and/or the fourth recess provided on the fourth surface.

Optionally, in this embodiment, an end of the combination hole close to the first surface is an upper end, an end of the combination hole close to the second surface is a lower end, and an aperture of the upper end of the combination hole is larger than an aperture of the lower end of the combination hole, that is, at least one level of convex surface is arranged between the upper end and the lower end of the combination hole, so that a contact area between the combination hole and the colloid for forming the base body can be further increased, and a combination strength of the combination hole and the colloid is further increased.

For example, as shown in fig. 13, a rough surface a1 having a concave-convex structure is provided on the first surface a of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 in the region for contact with the base main body. For another example, as shown in fig. 14, bonding holes a2 having a convex structure are provided on the first surfaces a of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 in the areas for contacting the base main body. Of course, in other arrangement examples, the rough surface a1 having the concave-convex structure and the coupling hole a2 having the convex structure may be simultaneously provided on the first surface a of at least one of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 for contacting the base main body.

The embodiment also provides a light-emitting unit, which comprises the LED bracket as above, and further comprises an LED chip disposed in the bowl cup, wherein the LED chip can be a front-mounted LED chip or a flip LED chip, and a package layer disposed in the bowl cup and covering the LED chip, and an electrode of the LED chip is electrically connected to an exposed area of the first surface of the corresponding metal sheet. The encapsulation layer in this embodiment may be a fluorescent adhesive layer, or a combination of a fluorescent adhesive layer and a transparent adhesive layer, or a quantum dot QD film, or a combination of a QD film and a transparent adhesive layer, or a combination of at least two of a fluorescent adhesive layer, a QD film, and a transparent adhesive layer.

The light emitting unit provided by the embodiment is manufactured by adopting the LED bracket. For ease of understanding, the following description will be made in conjunction with several examples of light emitting cell structures.

Referring to fig. 16, a transverse sectional view of a light emitting unit manufactured using the LED holders in the above examples is shown. It can be seen from this figure that the gaps between the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are filled with the colloid forming the base main body, and two isolated bowls are formed on the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13, each bowl is provided with one LED chip 4, the LED chips are flip LED chips, each flip LED chip is arranged on two adjacent metal sheets in a crossing manner, and the bowl is filled with the packaging layer 3.

Referring to fig. 17, which is a transverse cross-sectional view of another light-emitting unit manufactured by using the LED support in each of the above examples, it is different from the light bead shown in fig. 16 in that the LED chip 4 disposed in the bowl cup is a front-mounted LED chip, and both the front-mounted LED chips are disposed on the first surface of the second metal sheet 12. Of course, two front-mounted LED chips may be disposed on the first surfaces of the first metal sheet 11 and the third metal sheet 13, respectively, or one front-mounted LED chip is disposed on the first surface of the first metal sheet 11 and the other front-mounted LED chip is disposed on the first surface of the second metal sheet 12, or one front-mounted LED chip is disposed on the first surface of the third metal sheet 13 and the other front-mounted LED chip is disposed on the first surface of the second metal sheet 12. It should be understood that, of course, when more than three LED chips are required to be connected in series, a fourth metal sheet, a fourth fifth metal sheet, and the like may be further added in sequence on the basis shown in fig. 17, and the arrangement may be flexibly selected according to the requirement.

Optionally, in some examples of this embodiment, the third surface and the fourth surface of the metal sheet may be exposed outside the base main body in different shapes and/or sizes, so that a user can accurately identify which surface is the third surface and which surface is the fourth surface when using the LED lamp, and thus the foolproof effect when installing the LED lamp bead is achieved, and the convenience of use can be further improved. For example, the third surface and the fourth surface may be different in shape in the region exposed outside the base body, one of which is circular, and the other of which is square, triangular, or elliptical; the third surface and the fourth surface may also be arranged in different sizes of the regions exposed outside the base body, or the third surface and the fourth surface may be arranged in different shapes and sizes of the regions exposed outside the base body, which may be specifically set according to application requirements and will not be described herein again.

The light emitting unit shown in each example is composed of the conductive base and the base main body covering the conductive base, and compared with the existing light emitting diode, the structure of the light emitting unit is greatly simplified, and the cost is low.

The metal sheet can simultaneously realize the bearing of the LED chip and the electric connection with the LED chip, and can be used as a bonding pad to realize the electric connection with the outside, the integration level is high, and the structure is simple;

because the LED chip is directly placed on the first surface of sheetmetal, and the second surface and the third surface of sheetmetal all have to expose, the heat that the during operation LED chip produced can directly transmit the sheetmetal to outwards give off fast via the sheetmetal, promote light-emitting unit's performance.

Since the second surface, the third surface and the fourth surface of the metal sheet are exposed, at least one of the third surface, the third surface and the fourth surface can be used as a bonding pad electrically connected to the outside, for example, in a side-emitting application scenario, the third surface and the outside can be welded, or the third surface and the second surface can be welded at the same time, or the fourth surface and the second surface can be welded at the same time; in a positive lighting application scenario, the second surface may be welded, or the second surface and the third surface may be welded at the same time, or the second surface and the fourth surface may be welded at the same time, and the third recess, the second recess, and the first recess may be arranged to further improve reliability and convenience of welding. Therefore, the welding method is applicable to various application scenes, is convenient to weld, can weld on two surfaces according to requirements, can improve the welding firmness, and further improves the reliability of products.

Optionally, in some examples of this embodiment, only the first surface, the second surface, the third surface, and the fourth surface of the metal sheet may be exposed outside the enclosure, and the other surfaces are covered by the base body, so as to improve the reliability of the bonding between the conductive metal plate and the enclosure.

In an application scenario of the embodiment, the metal sheet may be, but is not limited to, a copper substrate, and the copper substrate has the advantages of low cost, convenience in processing, good electrical conductivity and heat conductivity, and the like.

Optionally, in other application examples of this embodiment, a reflective layer for improving light extraction efficiency may be further disposed on the first surface of the metal sheet at least in the exposed region, so as to improve efficiency of the light emitting unit. The reflective layer in this embodiment can be, but is not limited to, a silver layer, and the silver layer can be formed on the copper substrate by, but is not limited to, electroplating, electroless silver plating, and the like.

It should be understood that the overall shape of the LED support in this embodiment may be a long strip, a square, a hexagon, etc., and the overall shape of the LED support in this embodiment is not limited.

It should be understood that any metal plate that can achieve reliable conductive connection and support strength meeting the requirements of the LED support can be used as the metal sheet in the present embodiment; because the heat dispersion of metal sheet is better, can promote the heat dispersion of LED support, of course, also can replace for other boards that can satisfy above-mentioned demand have other materials of electric conductivity. In this embodiment, the specific shape and size of the metal sheet can be flexibly set according to the application requirements, and this embodiment is not limited thereto.

The material of the colloid forming the base main body in this embodiment can also be flexibly selected according to the requirement, for example, but not limited to, thermosetting glue or hot-pressing glue can be adopted, and but not limited to, white glue with better reflection performance is selected. For example, the gel may be, but is not limited to, epoxy or resin (e.g., epoxy, silicone, resin, etc.).

The present invention also provides a light emitting module, which can be used for, but not limited to, various lighting scenes and/or display scenes, and includes a substrate and a plurality of light emitting units as described above, wherein the plurality of light emitting units are electrically connected to the substrate. The light emitting unit in this embodiment may be a positive light emitting unit or a side light emitting unit. Fig. 18 shows an exemplary light-emitting unit module 5, which includes a substrate 52 and a plurality of side-emitting light-emitting units 51 disposed on the substrate 52.

The embodiment also provides a display device, which comprises the light-emitting unit module. The display device may be used for, but not limited to, various displays, mobile phones, PCs, advertising equipment, and the like. An exemplary display device is shown in fig. 19, and includes an outer frame 6, a membrane 701, a light guide plate 702, a reflective sheet 703 and a metal back plate 704 assembled in the outer frame 6, and light emitting unit modules 5 correspondingly disposed on the membrane 701, the light guide plate 702, the reflective sheet 703 and the metal back plate 704. It should be understood that fig. 19 shows only an exemplary display device, and the specific structure of the display device can be flexibly set, and will not be described herein.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims (17)

1. An LED support is characterized by comprising three metal sheets which are sequentially arranged in an insulating and isolating mode and a colloid which is combined with the metal sheets to form a base main body, wherein the base main body is surrounded with a bowl cup for placing an LED chip, and a first surface of each metal sheet is positioned at the bottom of the bowl cup and at least part of the metal sheet is exposed outside; the first surface of at least one metal sheet is used for bearing the LED chips, the exposed areas of the first surfaces of the metal sheets at the two ends are respectively used for being electrically connected with the corresponding electrode of one LED chip, and the exposed area of the first surface of the metal sheet in the middle is respectively electrically connected with the corresponding electrodes of the two LED chips;

at least part of the second surface of the metal sheet is exposed out of the base body, the second surface is a surface opposite to the first surface, at least part of the third surface and the fourth surface of the metal sheet between the first surface and the second surface is exposed out of the base body to serve as a welding area, and the third surface and the fourth surface are two opposite surfaces.

2. The LED holder according to claim 1, wherein an area of the third surface exposed outside the body of the base is provided with a first recess for receiving solder.

3. The LED holder according to claim 2, wherein a region of the second surface exposed outside the base body is provided with a second recess for receiving solder.

4. The LED holder of claim 3, wherein the first recess communicates with the second recess.

5. The LED support according to claim 3 or 4, wherein the area of the fourth surface exposed out of the base body is provided with a third recess for accommodating solder.

6. The LED support according to claim 5, wherein the inner wall of at least one of the first, second and third recesses is provided with a solder flux layer for improving soldering ability.

7. The LED holder of claim 5, wherein the first recess communicates with the third recess.

8. The LED holder of claim 5, wherein the first recess is a first groove or a first hole, the second recess is a second groove or a second hole, and the third recess is a third groove or a third hole.

9. The LED support according to any one of claims 1 to 4, wherein a region of the first surface of the metal sheet bonded to the base body is provided with a rugged surface having a rugged structure for enhancing a bonding force with the base body, or with a bonding hole into which a paste forming the base body flows.

10. The LED holder according to claim 9, wherein an end of the combining hole adjacent to the first surface is an upper end, and an end adjacent to the second surface is a lower end, and an aperture of the upper end of the combining hole is larger than an aperture of the lower end of the combining hole.

11. The LED support according to any of claims 1-4, wherein the base body further comprises a dividing wall disposed on the first surface of the middle sheet of metal to form two separate bowls on the first surface of the three sheets of metal.

12. The LED support according to any of claims 1-4, wherein at least one of the metal sheets has a lateral width proximate an upper end of the first surface that is greater than a lateral width of the third surface and/or the fourth surface, a portion of the upper end of the metal sheet being embedded in the base body;

or, at least one of the metal sheets is provided with a protrusion protruding outward between the first surface and the second surface, and at least a part of the protrusion is embedded in the base body.

13. An LED support according to any of claims 1 to 4, wherein the metal sheet is a copper substrate and the first surface is provided with a reflective layer at least in the exposed areas.

14. The LED support according to any one of claims 1 to 4, wherein the areas of the third and fourth surfaces exposed outside the base body are different in shape and/or size.

15. A lighting unit, comprising the LED support according to any one of claims 1 to 14, further comprising an LED chip disposed in the bowl cup, and an encapsulation layer disposed in the bowl cup and covering the LED chip, wherein an electrode of the LED chip is electrically connected to a corresponding exposed area of the first surface of the metal sheet.

16. A light emitting module comprising a substrate and a plurality of light emitting units according to any one of claims 15, wherein the plurality of light emitting units are electrically connected to the substrate.

17. A display device comprising the light emitting cell module according to claim 16.

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