CN212907791U

CN212907791U - LED support, LED lamp pearl, module and illuminator

Info

Publication number: CN212907791U
Application number: CN202021869713.9U
Authority: CN
Inventors: 孙平如; 谭青青
Original assignee: Shenzhen Jufei Optoelectronics Co Ltd
Current assignee: Shenzhen Jufei Optoelectronics Co Ltd
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2021-04-06
Anticipated expiration: 2030-08-31

Abstract

The utility model provides a LED support, LED lamp pearl, module and illuminator, wherein the LED support is kept apart the sheetmetal that sets up by at least two insulation, and combine with the metal in order to be used for the colloid of casing, the upper surface of sheetmetal is located the bottom of the bowl cup of casing, and at least part exposes outside for bearing the weight of the LED chip, at least part of one of them side of sheetmetal exposes outside the casing, and the side exposes in the outside region protrusion of casing; because the LED chip is directly arranged on the metal sheet, heat generated during working can be directly transferred to the metal sheet and quickly dissipated outwards through the metal sheet, a heat dissipation path is greatly shortened, and meanwhile, the heat dissipation area is greatly increased; the exposed area of the metal sheet protrudes out of the shell and can be used as a bonding pad electrically connected to the outside, and the part protruding out of the shell can be used as a welding area, so that the welding area and the heat dissipation area are greatly improved; the LED lamp bead obtained by the LED support is simpler in structure, easier to manufacture and lower in cost.

Description

LED support, LED lamp pearl, module and illuminator

Technical Field

The utility model relates to a LED (Light Emitting Diode) field especially relates to a LED support, LED lamp pearl, module and illuminator.

Background

The color gamut and the brightness required by each display device are higher and thinner, the color gamut and the brightness are in a negative correlation relationship, the color gamut requirement is higher, the brightness is lower, the brightness of an original single chip packaging body cannot meet the requirement, and an ultrathin side light-emitting diode with higher brightness is required to be provided when the color gamut is high. For this reason, the related art provides a light emitting diode having higher brightness at the time of high color gamut, which includes, as shown in fig. 1, a plastic substrate 001, a circuit formed on the top surface of the plastic substrate 001 to be electrically connected to an LED chip, and a pad 004 provided on the bottom surface of the plastic substrate 001, the circuit on the top surface of the plastic substrate 001 being electrically connected to the pad 004 through a conductive material in a through hole penetrating the bottom surface. A housing 002 is formed on the plastic substrate 001, a cavity for placing the LED chip 003 is formed in the housing 002, and the cavity is filled with fluorescent glue 005. Although the light emitting diode with the structure can improve the brightness, the structure is more complex and the cost is high; in addition, because two LED chips are arranged, compared with the LED of a single LED chip, the heat generated during the working process of the LED chip is multiplied, and the heat generated by the LED chip in the LED is mainly transferred to the bonding pad 004 through the conductive material in the through hole penetrating through the plastic substrate 001 for heat dissipation, the heat dissipation path is long, the heat dissipation area is small, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of LED support, LED lamp pearl, module and illuminator solves current emitting diode structure complicacy, with high costs and the poor problem of heat dissipation.

In order to solve the technical problem, an embodiment of the present invention provides an LED bracket, including at least two metal sheets arranged in an insulating manner, and a colloid combined with the metal sheets to form a housing, where the housing is surrounded to form a bowl for placing an LED chip, and an upper surface of the metal sheet is located at a bottom of the bowl, and at least a part of the metal sheet is exposed outside; the upper surface of at least one metal sheet is used for bearing the LED chip, and the exposed area of the upper surface of each metal sheet is used for being electrically connected with the electrode of the corresponding LED chip;

the lower surface of the metal sheet is a surface opposite to the upper surface, at least part of one side surface of at least one metal sheet between the upper surface and the lower surface is exposed out of the shell, and the area of the side surface exposed out of the shell protrudes out of the shell.

Optionally, a region of the side surface exposed outside the housing is provided with a second recess for accommodating solder.

Optionally, at least a portion of the lower surface of the metal sheet is exposed outside the housing.

Optionally, a region of the lower surface of the metal sheet exposed outside the housing is provided with a first recess for accommodating solder.

Optionally, the first recess and the second recess communicate.

Optionally, the first recess is a first groove or a first hole, and the second recess is a second groove or a second hole.

Optionally, a region of the upper surface of the metal sheet, which is bonded to the housing, is provided with a rough surface having a concave-convex structure for enhancing a bonding force with the housing, or is provided with a bonding hole into which a gel forming the housing flows.

Optionally, the LED support includes three metal sheets sequentially disposed, and an exposed area of an upper surface of the metal sheet located in the middle is electrically connected to electrodes corresponding to the two LED chips, respectively.

Optionally, the housing further comprises a partition wall disposed on the upper surface of the middle sheet metal to form two separate bowls on the upper surfaces of the three sheet metals.

In order to solve the technical problem, the embodiment of the utility model provides a still provide a LED lamp pearl, include as above the LED support, still including set up in LED chip in the bowl cup, and set up in will in the bowl cup the packaging layer that the LED chip covered, the electrode of LED chip with correspond the exposed region of the upper surface of sheetmetal forms the electricity and connects.

In order to solve the technical problem, the embodiment of the utility model provides a still provide a LED module, including base plate and many as above LED lamp pearl, many LED lamp pearl electricity connect in on the base plate.

In order to solve the above technical problem, an embodiment of the present invention further provides a light emitting device, including the LED module as described above.

Advantageous effects

The utility model provides a LED support, LED lamp bead, module and illuminator, wherein at least two metal sheets which are arranged in an insulating and isolating way are combined with colloid which is used for forming a shell to form the LED support, the upper surfaces of the metal sheets are positioned at the bottom which is formed by the enclosure of the shell and is used for placing a bowl cup of an LED chip, and at least part of the metal sheets are exposed outside; the upper surface of the at least one metal sheet is used for bearing the LED chip, at least part of one side surface of the at least one metal sheet, which is positioned between the upper surface and the lower surface, is exposed out of the shell, and the area, exposed out of the shell, of the side surface protrudes out of the shell; because the LED chip is directly placed on the metal sheet, heat generated by the LED chip during working can be directly transferred to the metal sheet and quickly emitted outwards through the metal sheet, a heat radiation path is greatly shortened, and meanwhile, the heat radiation area is greatly increased, so that the heat radiation effect is greatly improved, and the performance of the LED lamp bead is ensured;

in addition, at least part of the side surface of at least one metal sheet between the upper surface and the lower surface is exposed out of the shell, the exposed area protrudes out of the shell and can be used as a bonding pad electrically connected to the outside, and the part of the exposed area protruding out of the shell can be used as a welding area, so that the welding area can be greatly increased, the welding firmness can be improved, and the heat dissipation area can be increased, thereby comprehensively improving the reliability of the product;

the LED lamp bead is composed of an LED chip placed in a bowl cup in the LED support and a packaging layer covering the LED chip, and compared with the existing LED lamp bead, the LED lamp bead is simpler in structure, easier to manufacture and lower in cost.

Drawings

FIG. 1 is a schematic diagram of a conventional LED structure;

fig. 2 is a schematic view of a metal sheet set in an example provided by an embodiment of the present invention;

fig. 3 is a schematic view of an example of an LED support according to an embodiment of the present invention;

fig. 4 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 5 is a schematic view of an LED support according to another example provided by an embodiment of the present invention;

fig. 6 is a side projection view of an LED support in another example provided by an embodiment of the present invention;

fig. 7 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 8 is a schematic view of an LED support according to another example provided by an embodiment of the present invention;

fig. 9 is a schematic view of an LED support according to another example provided by an embodiment of the present invention;

fig. 10 is a schematic view of a metal sheet set in another example provided by an embodiment of the present invention;

fig. 11 is a schematic view of a metal sheet set in another example provided by the embodiment of the present invention;

fig. 12 is a schematic view third illustrating a metal sheet set according to another example provided in the embodiment of the present invention;

fig. 13 is a schematic view of a metal sheet set in another example provided by the embodiment of the present invention;

fig. 14 is a schematic view of a LED lamp bead in another example provided by the embodiment of the present invention;

fig. 15 is a schematic diagram of a second LED lamp bead in another example provided by the embodiment of the present invention;

fig. 16 is a schematic diagram of a LED lamp bead in another example provided by the embodiment of the present invention;

fig. 17 is a schematic view of an LED module according to another example provided in the embodiment of the present invention;

fig. 18 is a schematic view of a light-emitting device according to still another example of the embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The embodiment provides an LED support, an LED lamp bead, a module and a light-emitting device, and the LED support and the LED lamp bead are simple in structure, low in cost, good in heat dissipation performance and simple, convenient and reliable in welding. The LED support comprises at least two metal sheets which are arranged in an insulating and isolating mode, the metal sheets and the colloid which is used for forming the shell are combined to form the LED support, the upper surface of each metal sheet is located at the bottom, formed by the enclosure of the shell, of the bowl cup which is used for placing the LED chip, and at least part of each metal sheet is exposed outside; the upper surface of at least one metal sheet is used for bearing the LED chip, and the exposed area of the upper surface of each metal sheet is used for being electrically connected with the electrode of the corresponding LED chip; the lower surface of the metal sheet is a surface opposite to the upper surface, at least part of the side surface of at least one metal sheet between the upper surface and the lower surface is exposed out of the shell, and the area of the side surface exposed out of the shell protrudes out of the shell. This LED support can directly place the LED chip on the sheetmetal, and the heat that the LED chip produced at the during operation can directly transmit the sheetmetal to outwards give off fast via the sheetmetal, by a wide margin shortened the heat dissipation route, increased heat radiating area. At least part of the side face, located between the upper surface and the lower surface, of the metal sheet is exposed out of the shell, the exposed area protrudes out of the shell and can be used as a bonding pad electrically connected to the outside, and the exposed area is set to be a plane or lower than the shell, so that the welding area and the heat dissipation area can be further increased, and the reliability of a product is comprehensively improved.

In an application scenario of the embodiment, the metal sheet may be, but is not limited to, a copper substrate, and the copper substrate has the advantages of low cost, convenience in processing, good electrical conductivity and heat conductivity, and the like.

Optionally, in other application examples of this embodiment, a reflective layer for improving light extraction efficiency may be further disposed on at least the exposed region on the upper surface of the metal sheet, so as to improve efficiency of the LED lamp bead. The reflective layer in this embodiment can be, but is not limited to, a silver layer, and the silver layer can be formed on the copper substrate by, but is not limited to, electroplating, electroless silver plating, and the like.

It should be understood that the overall shape of the LED support in this embodiment may be a long strip, a square, a hexagon, etc., and the overall shape of the LED support in this embodiment is not limited.

It should be understood that any metal plate that can achieve reliable conductive connection and support strength meeting the requirements of the LED support can be used as the metal sheet in the present embodiment; because the heat dispersion of metal sheet is better, can promote the heat dispersion of LED support, of course, also can replace for other boards that can satisfy above-mentioned demand have other materials of electric conductivity. In this embodiment, the specific shape and size of the metal sheet can be flexibly set according to the application requirements, and this embodiment is not limited thereto.

The colloid material forming the housing in this embodiment may also be flexibly selected according to the requirement, for example, but not limited to, a thermosetting adhesive or a hot-pressing adhesive may be adopted, and a white adhesive with a better reflection performance may be selected, but not limited to. For example, the gel may be, but is not limited to, epoxy or resin (e.g., epoxy, silicone, resin, etc.).

Optionally, in some examples of this embodiment, at least a partial region of the lower surface of the at least one metal sheet may also be exposed outside the housing, and the exposed region may not only increase the heat dissipation area, but also serve as a welding region, which may further improve the flexibility of the LED bracket in use. For example, in a side-emitting application scenario, the first side surface may be welded with the outside as a main mounting surface, or the first side surface and the lower surface may be welded at the same time; in a positive light emitting application scene, the lower surface can be used as a main mounting surface for welding, or the lower surface and the first side surface can be welded at the same time, so that the method is suitable for various application scenes, is convenient to weld, can be used for welding the two surfaces according to requirements, can improve the welding firmness, and further improves the reliability of products; that is, in the embodiment, the three surfaces of the upper surface, the lower surface and one of the side surfaces of the metal sheet may be at least partially exposed outside the housing, and the other surfaces are covered by the housing, so that the bonding area between the housing and the metal sheet is increased, the bonding strength and the air tightness of the housing and the metal sheet are improved, and the reliability of the LED support is improved.

Because the LED chip can be directly arranged on the upper surface of the metal sheet, and the lower surface and the side surface of the metal sheet are exposed out of the shell, the heat generated by the LED chip during working can be directly transferred to the metal sheet and is quickly and outwards emitted through the metal sheet, the heat dissipation path is shortened to a great extent, the heat dissipation area is increased, the heat dissipation effect is greatly improved, and the performance of the LED lamp bead is ensured. For ease of understanding, the following description will be made with reference to the sheet metal set and the LED holder shown in fig. 2 and 3 as examples.

Referring to fig. 2 to 3, a metal sheet group 1 and an LED bracket are shown, in which the metal sheet group 1 includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13, which are sequentially disposed in an insulating and isolating manner, at least a portion of upper surfaces a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of a bowl, and at least a portion of an upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the side surface c is a surface located between the upper surface a and the lower surface b. Referring to fig. 2 and 3, in the present example, the side surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the side surface 22 of the housing 2 protrude from the side surface 22 of the housing 2. The convex part can be a radiating surface directly radiating outwards from the left outside and can also be used as a welding area, the welding area is larger than that of the welding area in a setting mode that the welding area is flush with or lower than the shell, and the welding stability is better. The areas of the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the lower surface 23 of the housing 2 are also planar areas. Optionally, in this embodiment, the areas of the lower surfaces b of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 exposed on the lower surface 23 of the housing 2 may also be flush with the lower surface 23 of the housing 2, and may also be configured to protrude from the lower surface 23 of the housing 2, or be slightly lower than the lower surface 23 of the housing 2. In fig. 3, 21 is the upper surface of the housing, and may be parallel to, but not limited to, the upper surface a of the metal sheet.

Optionally, in order to further increase the soldering area and improve the reliability and flatness of soldering, a second recess for accommodating solder may be provided in a region of the side surface of the metal sheet exposed outside the housing. The shape and size of the second recess can be flexibly set. For example, it may be provided as a second recess or a second hole or any other shape that can function as described above.

For example, referring to another metal sheet set 1 and an LED bracket shown in fig. 4 to fig. 6, the metal sheet set 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13, which are sequentially and isolatedly arranged, at least a portion of the upper surfaces a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and at least a portion of the upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the side surface c is a surface located between the upper surface a and the lower surface b. Referring to fig. 4 and 5, in the present example, the areas of the side surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the side surface 22 of the housing 2 are provided with second recesses c1 in the shape of horseshoe-shaped grooves. Optionally, in this embodiment, the areas of the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed from the lower surface 23 of the housing 2 may also be flush with the lower surface 23 of the housing 2. Fig. 6 shows a projection view of the side of the LED holder.

For another example, referring to another metal sheet set 1 and an LED bracket shown in fig. 7 to 8, the metal sheet set 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13, which are sequentially and isolatedly arranged, at least a portion of the upper surfaces a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and at least a portion of the upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl. Referring to fig. 7 and 8, in the present example, the areas of the side surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the side surface 22 of the case 2 are provided with second recesses c1 in the shape of circular holes. Optionally, in this embodiment, the areas of the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed from the lower surface 23 of the housing 2 may also be flush with the lower surface 23 of the housing 2.

Optionally, in this embodiment, in order to further increase the soldering area and improve the reliability and flatness of soldering, a first recess for accommodating solder may be further disposed in a region of the lower surface of the metal sheet exposed outside the housing. The shape and size of the first recess can also be flexibly set. For example, it may be provided as a first recess or a first hole or any other shape that can serve the above-mentioned purpose. And the arrangement of the first concave part and the second concave part can contain redundant welding flux in the concave part during welding, thereby ensuring the smoothness and reliability of welding.

Optionally, in this embodiment, in order to further improve the reliability of the welding, a solder mask layer for improving the welding force may be disposed on the metal sheet and exposed outside the housing, and the area to be welded is provided with a solder mask layer, where the solder mask layer may be a metal layer, such as a metal plating, or may be another layer structure capable of improving the welding force. For example, in some examples, a metal plating layer for improving the welding force may be provided on at least one sidewall of the first groove and the second groove in the above examples, and the metal plating layer may be, but is not limited to, a silver plating layer.

For another example, please refer to the LED support shown in fig. 9, which also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 that are sequentially and isolatedly disposed, wherein at least a portion of the upper surfaces a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and at least a portion of the upper surface a of the second metal sheet 12 is also exposed at the bottom of the bowl. Referring to fig. 9, in the present example, the areas of the side surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed to the side surface 22 of the housing 2 are provided with second recesses c1 in the shape of circular holes. In this embodiment, the areas of the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the lower surface 23 of the casing 2 are provided with first recesses b1 having square holes, and the other areas of the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 exposed on the lower surface 23 of the casing 2 without square holes may be flush with the lower surface 23 of the casing 2, or may protrude from the lower surface 23 or be slightly lower than the lower surface 23.

In this embodiment, a combination of a shape of the first concave portion disposed in the region where the lower surface of the metal sheet is exposed outside the housing and a shape of the second concave portion disposed in the region where the side surface of the metal sheet is exposed outside the housing may be flexibly disposed. For example, but not limited to, the second recess may be a second groove or a second hole. For example, the first recess may be configured as a first groove, and the second recess may be configured as a second groove or a second hole, or the first recess may be configured as a first hole, and the second recess may be configured as a second groove or a second hole, and may be flexibly configured according to requirements. It should be understood that, in this embodiment, the shapes of the first concave portions and/or the second concave portions disposed on the metal sheets may be the same or at least partially different, and may be flexibly disposed according to application scenarios. For example, referring to fig. 10, the second recesses c1 formed in the areas where the side surfaces c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the housing 2 are all square grooves. Referring to fig. 11, the second concave portion c1 disposed in the region where the side surface c of the first metal sheet 11 is exposed to the case 2 is a circular hole, and the second concave portions c1 disposed in the regions where the side surfaces c of the second metal sheet 12 and the third metal sheet 13 are exposed to the case 2 are square grooves.

In this embodiment, the first concave portion provided on the lower surface of the metal sheet and the second concave portion provided on the side surface may not communicate with each other. For example, in a side-lighting application scene, when the side surface is placed on a welding surface provided with welding flux, the side surface extrudes the welding flux on the welding surface, part of the welding flux overflows along the side surface, when the welding flux is heated, the welding flux gathers towards a metal sheet, so that the overflowing welding flux preferentially gathers into a first concave part arranged on the lower surface to be bonded with the lower surface, and meanwhile, the welding flux positioned below the side surface is bonded with the first surface, so that the welding of the side surface and the lower surface is realized, and the welding reliability is improved; meanwhile, due to the arrangement of the first concave part and the second concave part, the welding area can be increased relative to a plane arrangement mode, redundant welding flux can be contained in the concave parts, the welding stability can be further improved, and meanwhile the welding smoothness is improved. In the application scene of positive light emission, the process of welding when the lower surface of the metal sheet is placed on the welding surface provided with the welding flux is similar to the welding process in the application scene of side light emission, and is not repeated here.

In this embodiment, the first concave portion provided on the lower surface of the metal sheet and the second concave portion provided on the side surface of the metal sheet can be communicated with each other, and this kind of communicated structure can form better drainage for the solder of the liquid, and can more reliably ensure that the redundant solder is contained in the concave portion. In this embodiment, when the first concave portion and the second concave portion are communicated with each other, the communication may be formed inside the metal sheet, or the communication may be formed on the lower surface of the metal sheet and the outer surface of the side surface, and the structure of the communication portion between the two may be a groove, a hole, or another structure. For example, in the application scene of side lighting, when the side surface is placed on the welding surface provided with the solder, the side surface presses the solder on the welding surface, and because the first concave part is communicated with the second concave part, a part of the solder pressed to the second concave part can directly flow into the first concave part along the position where the first concave part and the second concave part are communicated, so that the solder can be ensured to be in the first concave part and the second concave part as much as possible, and the lower surface and the side surface can be ensured to be welded; when part of the solder overflows along the side surface, the overflowing solder can be gathered to the metal sheet preferentially in the heating process because the solder is heated and gathered to the metal sheet. Therefore, the first concave part and the second concave part are communicated, so that the side surface and the lower surface can be better welded, and the welding reliability is improved. In the application scene of positive light emission, the process of welding when the lower surface of the metal sheet is placed on the welding surface provided with the welding flux is similar to the welding process in the application scene of side light emission, and is not repeated here.

It should be understood that the number of the metal sheets included in one LED support in this embodiment can be flexibly set according to a specific application scenario. For example, only two insulating and isolating metal sheets can be arranged, the shell can only enclose to form a bowl body, at least one part of the upper surfaces of the two insulating and isolating metal sheets is exposed out of the bottom of the bowl body to be used for bearing the LED chips and completing electrical connection with the electrodes of the LED chips, and the number of the LED chips and the light emitting color of the LED chips arranged in the bowl body can be flexibly arranged according to requirements. For example, the number of the holes may be one, two or three, and the like.

The LED chip in the embodiment can be a flip LED chip, two electrodes of the flip LED chip can directly span on the exposed upper surfaces of the two adjacent metal sheets, and the LED chip is supported and simultaneously electrically connected; the LED chip in this embodiment may also be a front-mounted LED chip, one front-mounted LED chip may be disposed on the upper surface of any one of the metal sheets, or may also be disposed across the upper surfaces of the metal sheets, and two electrodes of the front-mounted LED chip are electrically connected to the exposed upper surfaces of the two corresponding metal sheets through leads, respectively.

In some application examples of the embodiment, the metal sheet group may include three metal sheets sequentially arranged, and the exposed areas of the upper surfaces of the metal sheets located in the middle are electrically connected to the electrodes corresponding to the two LED chips, respectively; the exposed areas of the upper surfaces of the metal sheets on the two sides are respectively and electrically connected with the corresponding residual electrodes of the two LED chips, so that the two LED chips are connected in series. In this example, three metal pieces may also be located at the bottom of the same bowl. In other application scenarios of the present example, the housing may further include a partition wall disposed on the upper surface of the middle metal sheet to form two separated bowls on the upper surfaces of the three metal sheets (or a large bowl may be formed on the three metal sheets without the partition wall), such that the middle metal sheet spans two separated bowl bottoms, and the two metal sheets are respectively disposed at two separated bowl bottoms. Which kind of structure is adopted can be flexibly set according to the requirement. In the application example, the number and the color of the LED chips arranged in one bowl cup, whether the LED chips are positively arranged or inversely arranged, and the like can be flexibly arranged according to requirements. In some application scenarios of the present application example, the side and/or lower surface of the metal sheet located in the middle may not be exposed outside the housing according to requirements. When the side surface and/or the lower surface of the middle metal sheet can be exposed out of the shell according to requirements, the side surface and/or the lower surface of the middle metal sheet can be selectively welded during welding, the side surface and/or the lower surface of the middle metal sheet can also be selectively not welded, and the welding method can be flexibly selected according to application scenes.

Alternatively, in an example of the present example, at least one metal sheet may be provided to have a lateral width greater than that of the side surface c near an upper end of the upper surface, so that when the LED support is formed, a portion of the upper end of the conductive metal substrate is embedded in the glue of the housing, thereby improving the stability of the bonding between the metal sheet and the housing. On the other hand, the transverse width of the side surface c is smaller than that of the upper end, so that the interval between the side surfaces c of the metal sheets can be increased, short circuit between the metal sheets during welding is avoided, and the safety can be further improved. Of course, in some application examples, the transverse width of the upper end of the metal sheet near the upper surface and the transverse width of the lower end of the side surface c may also be the same or substantially the same, and the combination of the two can be realized by the adhesive force between the shell and the metal sheet combination area; the method is flexibly set according to requirements.

For example, referring to the sheet metal group shown in fig. 1, the lateral width W1 of the upper end of the third sheet metal 13 is greater than the width W2 of the side c. Also, the lateral width W1 of the upper end of the first metal sheet 11 and the second metal sheet 12 may be greater than the lateral width W2 of the side surface c thereof.

In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheets and the housing, the side surface of the upper end of at least one metal sheet may be further provided as an inclined surface, and the inclination angle of the inclined surface may be flexibly set according to the requirement. For example, the side surfaces of the upper ends of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces, and after the first metal sheet is combined with the housing, the inclined surfaces can have a larger contact area with the housing relative to the structure of the non-inclined surfaces, and can better bear the pressure of the bracket housing on the metal sheets, so that the combination force between the metal sheets and the housing can be better improved. Of course, the side surface of the upper end of the second metal sheet 12 may be provided as an inclined surface as required.

Optionally, in another example of the present example, at least one metal sheet may be provided with a step protruding outward between the upper surface and the lower surface, so that when the LED bracket is formed, at least a part of the step is embedded (may be completely embedded or partially embedded, and may be flexibly configured according to requirements) into the colloid of the housing, thereby improving the stability of the combination between the metal sheet and the housing. In addition, the step is arranged to increase the interval between the lower ends of the metal sheets, so that short circuit between the metal sheets during welding is avoided, and the safety can be further improved. Alternatively, in this example, the step provided on the metal sheet may be a step inclined toward the lower surface of the metal sheet to further improve the stability of the bonding between the metal sheet and the housing. The inclination angle can be flexibly set, for example, it can be set to any value between 30 ° and 75 °, such as 30 °, 35 °, 40 °, 60 °, or 70 °.

In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the housing, the side surface of the step of at least one metal sheet may be further provided as an inclined surface, and the inclination angle of the inclined surface may be flexibly set according to the requirement. For example, the side surfaces of the upper steps of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces, and after the first metal sheet is combined with the bracket shell, the inclined surfaces can have a larger contact area with the shell and can better bear the pressure of the bracket shell on the metal sheets relative to the structure of the non-inclined surfaces, so that the combination force between the metal sheets and the bracket shell can be better improved. Of course, the second metal sheet 12 may be provided with a structure similar to the steps on the first metal sheet 11 and the third metal sheet 13 as required.

Optionally, to further improve the robustness of the bond between the sheet metal and the housing. In the region of the upper surface of the metal sheet bonded to the case, a rough surface having a concave-convex structure for enhancing the bonding force with the case may be provided (of course, other regions of the metal sheet contacting the case may also be provided with a rough surface having a concave-convex structure for enhancing the bonding force with the case), and/or a bonding hole into which the gel forming the case flows may be provided.

Alternatively, in this embodiment, the combination hole provided on the upper surface of the metal sheet may communicate with a first recess provided on the lower surface of the metal sheet, and may also communicate with a second recess provided on the side surface.

Optionally, in this embodiment, an end of the combining hole close to the upper surface is an upper end, an end of the combining hole close to the lower surface is a lower end, and an aperture of the upper end of the combining hole is larger than an aperture of the lower end of the combining hole, that is, at least one step surface is arranged between the upper end and the lower end of the combining hole, so that a contact area between the combining hole and a colloid for forming the housing can be further increased, and a combining strength of the combining hole and the colloid is further increased.

For example, referring to fig. 12, an area for contact with the case on the upper surfaces a of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13 is provided with a rough surface a1 having a concavo-convex structure. For another example, as shown in fig. 13, a bonding hole a2 having a stepped structure is provided in an area for contacting the case on the upper surfaces a of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13. Of course, in other arrangement examples, the rough surface a1 having the concave-convex structure and the coupling hole a2 having the step structure may be simultaneously provided on the region for contacting the case on the upper surface a of at least one of the first metal sheet 11, the second metal sheet 12, and the third metal sheet 13.

The embodiment also provides an LED lamp bead, including as above shown LED support, still including setting up the LED chip in the bowl cup, this LED chip can be for just adorning the LED chip, also can be flip-chip LED chip to and set up the encapsulated layer that covers the LED chip in the bowl cup, the electrode of LED chip and the exposed regional formation electricity of the upper surface of the sheetmetal that corresponds. The encapsulation layer in this embodiment may be a fluorescent adhesive layer, or a combination of a fluorescent adhesive layer and a transparent adhesive layer, or a quantum dot QD film, or a combination of a QD film and a transparent adhesive layer, or a combination of at least two of a fluorescent adhesive layer, a QD film, and a transparent adhesive layer.

The LED lamp bead provided by the embodiment is made by adopting the LED bracket. For the convenience of understanding, the following description is provided with reference to several lamp bead structure examples.

Please refer to fig. 14, which shows a transverse cross-sectional view of an LED lamp bead manufactured by using the LED support in each of the above examples. It can be seen from this figure that the gaps between the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are filled with the colloid forming the housing, and two isolated bowls are formed on the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13, each bowl is provided with one LED chip 4, the LED chips are flip LED chips, each flip LED chip is arranged on two adjacent metal sheets in a crossing manner, and the bowl is filled with the packaging layer 3.

Referring to fig. 15, a transverse cross-sectional view of another LED lamp bead manufactured by using the LED support in each of the above examples is shown, which is different from the lamp bead shown in fig. 14 in that the LED chip 4 disposed in the bowl cup is a front-mounted LED chip, and both the front-mounted LED chips are disposed on the upper surface of the second metal sheet 12. Of course, two front-mounted LED chips may be disposed on the upper surfaces of the first metal sheet 11 and the third metal sheet 13, respectively, or one front-mounted LED chip may be disposed on the upper surface of the first metal sheet 11 and the other front-mounted LED chip may be disposed on the upper surface of the second metal sheet 12, or one front-mounted LED chip may be disposed on the upper surface of the third metal sheet 13 and the other front-mounted LED chip may be disposed on the upper surface of the second metal sheet 12.

Please refer to fig. 16, the LED lamp bead shown in this figure is different from the LED lamp bead shown in fig. 14 in that the second metal sheet 12 is omitted, and it should be understood that, when more than three LED chips are required to be connected in series, a fourth metal sheet, a fifth metal sheet, and the like may be further added in sequence on the basis shown in fig. 11, and the arrangement may be flexibly selected according to requirements.

The LED lamp bead shown in each example is composed of the metal sheet group and the shell covering the metal sheet group, and compared with the existing light-emitting diode, the structure of the LED lamp bead is greatly simplified, and the cost is low.

The metal sheet can simultaneously realize the bearing of the LED chip and the electric connection with the LED chip, and can be used as a bonding pad to realize the electric connection with the outside, the integration level is high, and the structure is simple; because the LED chip is directly placed on the upper surface of sheetmetal, and the lower surface and the side of sheetmetal all have to expose, but the heat direct transfer who produces at the during operation LED chip reaches the sheetmetal to give off outward fast via the sheetmetal, promote the performance of LED lamp pearl.

Because the lower surface and the side surface of the metal sheet are exposed, the metal sheet and the side surface can be used as a bonding pad electrically connected with the outside, and the side surface protrudes out of the shell. In a side-emitting application scene, the side surface can be welded with the outside, or the side surface and the lower surface can be welded at the same time; in the positive light emitting application scene, the lower surface can be welded, or the lower surface and the side surface can be welded simultaneously, and the reliability and the convenience of welding can be further improved by the arrangement of the first concave part and the second concave part. Therefore, the welding method is applicable to various application scenes, is convenient to weld, can weld on two surfaces according to requirements, can improve the welding firmness, and further improves the reliability of products. Optionally, in some examples of this embodiment, only the upper surface, the lower surface, and the side surfaces of the metal sheet may be exposed outside the enclosure, and the other surfaces are covered by the housing, so as to improve the reliability of the bonding between the conductive metal plate and the enclosure.

The embodiment also provides an LED module, which can be used for, but not limited to, various lighting scenes and/or display scenes, and includes a substrate and a plurality of LED beads as described above, wherein the plurality of LED beads are electrically connected to the substrate. The LED lamp beads in the embodiment can be light-emitting LED lamp beads and can also be side light-emitting LED lamp beads. Fig. 17 shows an exemplary LED module, where the LED module 5 shown in the figure includes a substrate 52 and a plurality of side-emitting LED beads 51 disposed on the substrate 52.

The embodiment also provides a light-emitting device which comprises the LED module. The light emitting device can be used for, but not limited to, various displays, mobile phones, PCs, advertising equipment, and the like. An exemplary light emitting device is shown in fig. 18, and includes an outer frame 6, a diaphragm 701, a light guide plate 702, a light reflecting sheet 703 and a metal back plate 704 assembled in the outer frame 6, and LED modules 5 correspondingly disposed on the diaphragm 701, the light guide plate 702, the light reflecting sheet 703 and the metal back plate 704. It should be understood that fig. 18 shows only one example of the light emitting device, and the specific structure of the light emitting device can be flexibly set, and will not be described herein again.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. An LED support is characterized by comprising at least two metal sheets arranged in an insulating and isolating mode and a colloid, wherein the metal sheets are combined to form a shell, a bowl cup for placing an LED chip is formed by the shell in an enclosing mode, the upper surface of each metal sheet is located at the bottom of the bowl cup, and at least part of the metal sheet is exposed outside; the upper surface of at least one metal sheet is used for bearing the LED chip, and the exposed area of the upper surface of each metal sheet is used for being electrically connected with the electrode of the corresponding LED chip;

2. The LED holder according to claim 1, wherein a region of the side surface exposed outside the housing is provided with a second recess for receiving solder.

3. The LED holder according to claim 2, wherein at least a portion of the lower surface of the metal sheet is exposed outside the housing.

4. The LED holder according to claim 3, wherein a region of the lower surface of the metal sheet exposed outside the housing is provided with a first recess for receiving solder.

5. The LED holder according to claim 4, wherein the first recess and the second recess communicate.

6. The LED support according to any one of claims 1 to 5, wherein the LED support comprises three metal sheets arranged in sequence, and exposed areas of the upper surfaces of the metal sheets in the middle are electrically connected with corresponding electrodes of the two LED chips respectively.

7. The LED support of claim 6, wherein said housing further comprises a dividing wall disposed on the upper surface of the middle sheet of metal to form two separate said bowls on the upper surfaces of said three sheets of metal.

8. An LED lamp bead, characterized in that, includes the LED support of any claim 1-7, further includes the LED chip that sets up in the bowl cup, and set up in the bowl cup with the packaging layer that the LED chip covers, the electrode of LED chip forms the electricity with the exposure region of the upper surface of corresponding sheetmetal and connects.

9. An LED module, comprising a substrate and a plurality of LED beads according to claim 8, wherein the plurality of LED beads are electrically connected to the substrate.

10. A light emitting device comprising the LED module according to claim 9.