CN213635308U

CN213635308U - Display panel and pixel packaging structure

Info

Publication number: CN213635308U
Application number: CN202022109464.XU
Authority: CN
Inventors: 任兴业
Original assignee: Shenzhen TCL Digital Technology Co Ltd
Current assignee: Shenzhen TCL Digital Technology Co Ltd
Priority date: 2020-09-22
Filing date: 2020-09-22
Publication date: 2021-07-06
Anticipated expiration: 2030-09-22

Abstract

The utility model discloses a display panel and pixel packaging structure, including pixel unit and drive circuit, the pixel unit includes the first row of pixel unit; the first column of pixel units comprise a first sub-pixel, a second sub-pixel and a third sub-pixel which are arranged along the Y direction; the drive circuit includes: a first driving signal contact, a second driving signal contact and a third driving signal contact which are arranged along the X direction, wherein the first driving signal contact is connected with the first electrode of the first sub-pixel, the second driving signal contact is connected with the first electrode of the second sub-pixel, and the third driving signal contact is connected with the first electrode of the third sub-pixel; and the common end contact is connected with the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel. The size of the display screen is matched with the size of the display device along the X direction and the size of the display device along the Y direction, and the type selection matching of a driving chip of the display screen is facilitated.

Description

Display panel and pixel packaging structure

Technical Field

The utility model relates to a display device field especially relates to a display panel and pixel packaging structure.

Background

An existing 2X2 pixel integrated pixel package in the market at present, as shown in fig. 1, one pixel unit includes four pixel groups, each pixel group is composed of a first sub-pixel 11(B), a second sub-pixel 12(G), and a third sub-pixel 13(R), the three sub-pixels have different light emitting colors, the circuit of the existing 2X2 pixel unit, as shown in fig. 2, is structurally described with the left-right direction in fig. 2 as the X direction and the up-down direction as the Y direction for convenience of description, the cathode of each sub-pixel in the pixel group in the same column adopts the same common terminal contact 30, and the pixel group arranged along the X direction has two common terminal 30 contacts and is arranged along the X direction; two sub-pixels in different pixel groups in the same row are controlled by one sub-pixel drive signal contact 40, so there are six sub-pixel drive signal contacts 40 in one unit, the six sub-pixel drive signal contacts 40 being arranged in the Y direction.

Therefore, the number of contacts in the X direction is small, the number of contacts in the Y direction is large, the number of contacts is large, the distribution of a circuit network in the Y direction is large, the occupied space of the packaged circuit in the Y direction is large, and the distribution of the circuit network in the X direction is small.

Based on the visual characteristics of human eyes, the visual angle in the X direction is relatively large, and the visual angle in the Y direction is relatively small; the display screen is long in the horizontal dimension (X direction) and short in the vertical dimension (Y direction), so that the space in the vertical direction is small. Therefore, the layout of the sub-pixel driving signal contacts of the conventional packaging circuit is not favorable for the type selection and matching of the driving chip of a common display screen.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art, an object of the present invention is to provide a display panel and a pixel package structure, which are larger than the dimension along the Y direction with the dimension along the X direction of the display device, thereby facilitating the type selection and matching of the driving chip of the display screen.

The technical scheme of the utility model as follows:

a display panel comprises a pixel unit and a driving circuit,

the pixel unit comprises at least one first column of pixel units, and the first column of pixel units are a first sub-pixel, a second sub-pixel and a third sub-pixel which are arranged along the Y direction;

the drive circuit includes:

a first driving signal contact, a second driving signal contact and a third driving signal contact which are arranged along the X direction, wherein the first driving signal contact is electrically connected with the first electrode of the first sub-pixel, the second driving signal contact is electrically connected with the first electrode of the second sub-pixel, and the third driving signal contact is electrically connected with the first electrode of the third sub-pixel; and

and the common terminal contact is electrically connected with the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel.

Further, the pixel units comprise two first columns of pixel units, and the two first columns of pixel units are arranged along the Y direction;

in the drive circuit:

the first driving signal contacts are respectively and electrically connected with the first electrodes of the first sub-pixels of the two first rows of pixel units, the second driving signal contacts are respectively and electrically connected with the first electrodes of the second sub-pixels of the two first rows of pixel units, and the third driving signal contacts are respectively and electrically connected with the first electrodes of the third sub-pixels of the two first rows of pixel units; and

the two common end contacts are respectively a first row common contact and a second row common contact, the first row common end contact is electrically connected with the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel of one first column of pixel units, and the second row common end contact is electrically connected with the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel of the other first column of pixel units; the first row of common contacts and the second row of common contacts are arranged along the Y direction, or the first row of common contacts and the second row of common contacts are arranged along the X direction.

Furthermore, the pixel unit also comprises at least one second row of pixel units, and the second row of pixel units comprises first sub-pixels, second sub-pixels and third sub-pixels which are arranged along the Y direction;

the drive circuit further includes:

a fourth drive signal contact, a fifth drive signal contact and a sixth drive signal contact arranged along the X direction;

the fourth driving signal contact is electrically connected with the first electrode of the first sub-pixel in the second row of pixel units, the fifth driving signal contact is electrically connected with the first electrode of the second sub-pixel in the second row of pixel units, and the sixth driving signal contact is electrically connected with the first electrode of the third sub-pixel in the second row of pixel units;

the second electrodes of the first sub-pixel, the second sub-pixel and the third sub-pixel in the second row of pixel units are electrically connected to the common terminal contact corresponding to the pixel column.

Furthermore, the first column of pixel units is provided with two pixel units along the Y direction, the second column of pixel units is provided with two pixel units along the Y direction, and the two common end contacts are respectively a first row of common contacts and a second row of common contacts.

Further, the first driving signal contact, the second driving signal contact, the third driving signal contact, the fourth driving signal contact, the fifth driving signal contact and the sixth driving signal contact are arranged along the X direction, and the first row of common contacts and the second row of common contacts are arranged along the Y direction; or

The first driving signal contact, the second driving signal contact, the third driving signal contact, the fourth driving signal contact, the fifth driving signal contact, the sixth driving signal contact, the first row of common contacts and the second row of common contacts are all arranged along the X direction.

Further, the second electrodes in the first row of pixel units and the second electrodes in the second row of pixel units are disposed in opposite directions, or the second electrodes in the first row of pixel units and the second electrodes in the second row of pixel units are disposed in facing directions toward the same side.

The utility model also provides a pixel packaging structure, be in including support plate, setting on the support plate as above display panel and cover be in encapsulation glue film on the support plate.

Further, the carrier plate comprises a top layer close to the packaging adhesive layer, a bottom layer far away from the packaging adhesive layer and a middle layer positioned between the top layer and the bottom layer; the top layer is used for welding each sub-pixel in the pixel unit, the bottom layer is used for welding and connecting an external device, the middle layer comprises at least one wiring layer, and the wiring layer is arranged on a driving circuit in the display panel.

Furthermore, the carrier plate also comprises a first insulating layer and a second insulating layer, wherein the first insulating layer is arranged between the top layer and the middle layer; the second insulating layer is arranged between the bottom layer and the middle layer; the first insulating layer and the second insulating layer are both BT substrates.

Further, the carrier plate also comprises a top solder mask layer covering the surface of the top layer facing the packaging adhesive layer;

a bottom solder mask layer is arranged on the surface of the bottom layer, which is back to the top layer; and the surface of the bottom solder mask layer, which is back to the top layer, is provided with a pasting layer.

Further, the packaging adhesive layer comprises an epoxy resin layer covering the surface of the carrier plate and an anti-reflection membrane arranged on the upper surface of the epoxy resin layer; the epoxy resin layer wraps the first sub-pixel, the second sub-pixel and the third sub-pixel in the display panel.

Furthermore, trapezoidal grooves are formed in the epoxy resin layer and are located between two adjacent first-column pixel units, between two adjacent second-column pixel units, or/and between the adjacent first-column pixel units and the adjacent second-column pixel units.

Compared with the prior art, the utility model provides a pair of display panel and pixel packaging structure, arrange first drive signal contact along the X direction in this scheme, second drive signal contact and third drive signal contact, the circuit network distribution that makes the X direction just more like this, it is big to occupy the volume along the space of X direction, it is less to distribute along the circuit network of Y direction, the circuit network distribution that makes the Y direction just is less, it is little to occupy the volume along the space of Y direction, thereby be greater than the size phase-match along the Y direction with the size of display device's edge X direction, consequently, do benefit to the driver chip lectotype matching of display screen, better general constant current driver chip's of matching drive channel.

Drawings

FIG. 1 is a front view of a prior art pixel package structure;

FIG. 2 is a circuit diagram of a prior art display panel;

fig. 3 is a circuit diagram of a 2x1 pixel unit of a display panel according to the present invention;

fig. 4 is a circuit diagram of a 1x1 pixel unit of a display panel according to the present invention;

fig. 5 is a schematic circuit diagram of one form of a 2x2 pixel cell of a display panel according to the present invention;

fig. 6 is a schematic circuit diagram of a second form of a 2x2 pixel cell of a display panel according to the present invention;

fig. 7 is a schematic circuit diagram of a third form of a 2x2 pixel cell of a display panel according to the present invention;

fig. 8 is a schematic circuit diagram of a fourth form of a 2x2 pixel cell of a display panel according to the present invention;

fig. 9 is a schematic circuit diagram of a fifth embodiment of a 2x2 pixel cell of a display panel according to the present invention;

fig. 10 is a schematic circuit diagram of a sixth form of a 2x2 pixel cell of a display panel according to the present invention;

fig. 11 is a schematic structural diagram of a pixel packaging structure according to the present invention.

The reference numbers in the figures: 10. a first column of pixel cells; 11. a first sub-pixel; 12. a second sub-pixel; 13. a third sub-pixel; 20. a second column of pixel cells; 30. a common terminal contact; 31. a first row of common contacts; 32. a second row of common contacts; 40. a subpixel drive signal contact; 41. a first drive signal contact; 42. a second drive signal contact; 43. a third drive signal contact; 44. A fourth drive signal contact; 45. a fifth drive signal contact; 46. a sixth drive signal contact; 50. a carrier plate; 51. a top solder mask layer; 52. a top layer; 53. a first insulating layer; 54. an intermediate layer; 55. a second insulating layer; 56. a bottom layer; 57. a bottom solder mask layer; 58. pasting a layer; 60. packaging the adhesive layer; 61. an epoxy resin layer; 62. an anti-reflection membrane; 63. a trapezoidal groove.

Detailed Description

The utility model provides a display panel and pixel packaging structure, for making the utility model discloses a purpose, technical scheme and effect are clearer, make clear and definite, and it is right that the following refers to the drawing and lifts the example the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 3, the present invention provides a display panel, which includes a pixel unit and a driving circuit; fig. 3 is a circuit diagram of a 2X1 pixel unit, and the left-right direction in fig. 3 is the X direction, and the up-down direction is the Y direction, and the X direction is also the left-right direction of the display screen, and the Y direction is the up-down direction of the display screen. The display panel comprises at least one first column of pixel units 10 arranged along the Y direction, wherein the first column of pixel units 10 comprises a first sub-pixel 11, a second sub-pixel 12 and a third sub-pixel 13 arranged along the Y direction. The first sub-pixel 11(B) emits blue light, the second sub-pixel 12(G) emits green light, and the third sub-pixel 13(R) emits red light. The first column of pixel cells 10 thus forms a pixel cell containing three primary colors. The driving circuit of the present embodiment includes a first driving signal contact 41, a second driving signal contact 42 and a third driving signal contact 43 arranged along the X direction; the driving signal contacts are used for being connected with a driving chip of a display screen. The first pixel units form a pixel column in the Y direction, and the first pixel units form a plurality of pixel rows independently. In the circuit of the 2X1 pixel unit, 1 pixel column and 2 pixel rows are formed.

The first driving signal contact 41 is electrically connected to the first electrodes of the first sub-pixels 11 in the first columns of pixel units 10, that is, the first electrodes of the first sub-pixels 11 in all the first columns of pixel units 10 are connected to the first driving signal contact 41. Such that the first drive signal contact 41 can connect a plurality of first column pixel cells 10.

The second driving signal contact 42 is electrically connected to the first electrodes of the second sub-pixels 12 in the first columns of pixel units 10, that is, the first electrodes of the second sub-pixels 12 in all the first columns of pixel units 10 are connected to the second driving signal contact 42.

The third driving signal contact 43 is electrically connected to the first electrodes of the third sub-pixels 13 in the first column of pixel units 10, that is, the first electrodes of the third sub-pixels 13 in all the first column of pixel units 10 are connected to the third driving signal contact 43.

In this embodiment, a plurality of common terminal contacts 30 are arranged along the Y direction, and the plurality of common terminal contacts 30 are respectively disposed corresponding to the plurality of first column pixel units 10, that is, the plurality of common terminal contacts 30 correspond to the number of the plurality of pixel rows. The common terminal contact 30 is electrically connected to the second electrode of the first sub-pixel 11, the second electrode of the second sub-pixel 12, and the second electrode of the third sub-pixel 13 in the first column of pixel units 10, that is, one common terminal contact 30 is correspondingly connected to the second electrodes of all the sub-pixels in one first column of pixel units 10, and serves as a common terminal of one first column of pixel units 10. Of course, in other embodiments, several common terminal contacts 30 may be arranged along the X direction, that is, the common terminal contacts 30 and the first, second, and third

driving signal contacts

41, 42, and 43 are all arranged along the X direction.

Taking the first sub-pixel 11 in the first column of pixel units 10 as an example to illustrate the control principle, when the first sub-pixel 11 in the first column of pixel units 10 needs to be controlled, the driving chip communicates the first driving signal contact 41 and the corresponding common terminal contact 30, so that the first sub-pixel 11 in the first column of pixel units 10 emits light, thereby realizing the control of the sub-pixel. The other color sub-pixels are controlled in a corresponding manner.

As shown in fig. 4, taking a pixel unit of which the first column of pixel units 10 is 1X1 as an example, the first driving signal contact 41, the second driving signal contact 42 and the third driving signal contact 43 are arranged along the X direction, and 3 sub-pixel driving signal contacts are formed in the X direction, so that the circuit network distribution in the X direction is more, the space occupation amount in the X direction is large, the circuit network distribution in the Y direction is less, the space occupation amount in the Y direction is small, and when there are a plurality of pixel units, the size in the X direction of the display device is larger than the size in the Y direction, and therefore, the selection and matching of the driving chips of the display screen are facilitated.

As shown in fig. 5, the pixel units in the display panel in this embodiment may further include at least one second row of pixel units 20 arranged along the Y direction, the second row of pixel units 20 and the first row of pixel units 10 are arranged side by side along the X direction, and the second row of pixel units 20 includes a first sub-pixel 11, a second sub-pixel 12, and a third sub-pixel 13 arranged along the Y direction. Thus the second column of sub-pixel groups forms a pixel comprising three primary colors. The drive circuit further comprises a fourth drive signal contact 44, a fifth drive signal contact 45 and a sixth drive signal contact 46 arranged in the X-direction. Similarly, the sub-pixel driving signal contacts are used for being connected with a driving chip of a display screen, and the driving chip controls the light emission of the sub-pixel driving signal contacts.

The fourth driving signal contact 44 is electrically connected to the first electrodes of the first sub-pixels 11 in the second rows of pixel units 20, that is, the first electrodes of the first sub-pixels 11 in all the second rows of pixel units 20 are connected to the fourth driving signal contact 44.

The fifth driving signal contact 45 is electrically connected to the first electrodes of the second sub-pixels 12 in the second row of pixel units 20, that is, the first electrodes of the second sub-pixels 12 in all the second row of pixel units 20 are connected to the fifth driving signal contact 45.

The sixth driving signal contact 46 is electrically connected to the first electrodes of the third sub-pixels 13 in the second row of pixel units 20, that is, the first electrodes of the third sub-pixels 13 in all the second row of pixel units 20 are connected to the sixth driving signal contact 46.

The second electrodes of the first sub-pixel 11, the second sub-pixel 12 and the third sub-pixel 13 in the second row of pixel units 20 are electrically connected to the common terminal contact 30 corresponding to the pixel row, that is, one common terminal contact 30 is correspondingly connected to one first row of pixel units 10 and one second row of pixel units 20 as the common terminal of one first row of pixel units 10 and one second row of pixel units 20.

In the pixel unit of this embodiment, the second electrodes of the sub-pixels in the first column of pixel units 10 face the same side direction, and the second electrodes of the sub-pixels in the second column of pixel units 20 face the same side direction.

As shown in fig. 5, in the present embodiment, two first columns of pixel units 10 and two second columns of pixel units 20 are taken as an example to form a pixel unit of 2 × 2; a first driving signal contact 41, a second driving signal contact 42, a third driving signal contact 43, a fourth driving signal contact 44, a fifth driving signal contact 45 and a sixth driving signal contact 46 are arranged in the X direction; thus forming six sub-pixel drive signal contacts in the X direction; two common contacts 30 are provided in the Y direction, a first row of common contacts 31 and a second row of common contacts 32 on different pixel rows; wherein the first row common contact 31 connects the first column pixel cell 10 of the first row and the second column pixel cell 20 of the first row in common, and the second row common contact 32 connects the first column pixel cell 10 of the second row and the second column pixel cell 20 of the second row in common. The pixel cells of 2X2 form two rows of first and second columns of

pixel cells

10 and 20, and thus, there are two common terminal contacts 30 arranged in the Y direction, which results in more circuit network distribution in the X direction, a large space occupation in the X direction, less circuit network distribution in the Y direction, and a small space occupation in the Y direction, matching the size of the display device in the X direction to be larger than that in the Y direction, with a consistent length ratio. Therefore, the type selection matching of the driving chip of the display screen is facilitated, and the driving channel of the general constant current driving chip is better matched.

In the pixel unit of this embodiment, the second electrodes in the first column of pixel units and the second electrodes in the second column of pixel units are disposed toward a side close to each other, that is: the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel in the first column pixel unit are arranged opposite to the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel in the second column pixel unit, only the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel in the first column pixel unit and the second electrode of the first sub-pixel in the second column pixel unit are arranged on the right side of the first electrode of the first sub-pixel, the first electrode of the second sub-pixel and the first electrode of the third sub-pixel in the first column pixel unit from the left side in the X direction, and the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel in the second column pixel unit are arranged on the first electrode of the first sub-pixel in the second column pixel unit, The first electrode of the second sub-pixel and the first electrode of the third sub-pixel are arranged at the left side. In the driving circuit in this embodiment, the third driving signal contact 43, the second driving signal contact 42, the first driving signal contact 41, the fourth driving signal contact 44, the fifth driving signal contact 45, and the sixth driving signal contact 46 are sequentially arranged in the X direction; the first row of common contacts 31 and the second row of common contacts 32 are arranged in the Y direction.

In other embodiments, for example, as shown in fig. 6, the second electrodes in the first column of pixel units are disposed opposite to the second electrodes in the second column of pixel units. The first row of common contacts 31 and the second row of common contacts 32 may both be arranged in the X-direction, further reducing the connection lines in the Y-direction. The method specifically comprises the following steps: the third drive signal contact 43, the second drive signal contact 42, the first drive signal contact 41, the first row common contact 31, the second row common contact 32, the fourth drive signal contact 44, the fifth drive signal contact 45, and the sixth drive signal contact 46 are arranged in this order in the X direction.

In other embodiments, as shown in fig. 7, the second electrodes in the first column of pixel units are disposed toward the same side as the second electrodes in the second column of pixel units, that is, in the X direction, only from the left, the second electrode of the first sub-pixel, the second electrode of the second sub-pixel, and the second electrode of the third sub-pixel in the first column of pixel units and the second electrode of the first sub-pixel in the second column of pixel units are disposed on the right side of the first electrode of the first sub-pixel, the first electrode of the second sub-pixel, and the first electrode of the third sub-pixel in the first column of pixel units, and the second electrode of the first sub-pixel, the second electrode of the second sub-pixel, and the second electrode of the third sub-pixel in the second column of pixel units are also disposed on the right side of the first electrode of the first sub-pixel, the first electrode of the second sub-pixel, and the first electrode of the third sub-pixel in the second column of pixel units. The third drive signal contact 43, the second drive signal contact 42, the first drive signal contact 41, the fourth drive signal contact 44, the fifth drive signal contact 45, and the sixth drive signal contact 46 are arranged in this order in the X direction. The first row of common contacts 31 and the second row of common contacts 32 are arranged in this order in the Y direction.

In other embodiments, as shown in fig. 8, the second electrodes in the first column of pixel units are disposed toward the same side as the second electrodes in the second column of pixel units. The third drive signal contact 43, the second drive signal contact 42, the first drive signal contact 41, the first row common contact 31, the second row common contact 32, the fourth drive signal contact 44, the fifth drive signal contact 45, and the sixth drive signal contact 46 are arranged in this order in the X direction.

In other embodiments, as shown in fig. 9, the second electrodes in the first column of pixel units and the second electrodes in the second column of pixel units are oriented in the same direction. The third drive signal contact 43, the second drive signal contact 42, the first drive signal contact 41, the sixth drive signal contact 46, the fifth drive signal contact 45, and the fourth drive signal contact 44 are arranged in this order in the X direction. The first row of common contacts 31 and the second row of common contacts 32 are arranged in this order in the Y direction.

In other embodiments, as shown in fig. 10, the second electrodes in the first column of pixel units and the second electrodes in the second column of pixel units are arranged facing the same direction. The third drive signal contact 43, the second drive signal contact 42, the first drive signal contact 41, the first row common contact 31, the second row common contact 32, the sixth drive signal contact 46, the fifth drive signal contact 45, and the fourth drive signal contact 44 are arranged in this order in the X direction.

In this embodiment, the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 are light emitting diodes emitting light of different colors, the first sub-pixel 11 is a light emitting diode emitting blue light, the second sub-pixel 12 is a light emitting diode emitting green light, and the third sub-pixel 13 is a light emitting diode emitting red light, respectively. The light emitting diode mainly adopts miniLED (submillimeter light emitting diode, namely LED chip unilateral size is 50 um-200 um) or microLED (micrometric light emitting diode, namely LED chip unilateral size is less than 50umm)

The first electrode of the first sub-pixel 11, the first electrode of the second sub-pixel 12 and the first electrode of the third sub-pixel 13 are all positive electrodes; the second electrode of the first sub-pixel 11, the second electrode of the second sub-pixel 12, and the second electrode of the third sub-pixel 13 are negative electrodes. The sub-pixel driving signal contact in this application is used to connect with the anode of the led, the common terminal contact 30 is connected with the cathode of the led, and the common terminal contact 30 is also a common cathode contact.

The present application further provides a pixel package structure, as shown in fig. 6, the pixel package structure includes a carrier 50 and a package adhesive layer 60 covering the carrier 50, the thickness of the carrier 50 is not greater than 0.2mm, and the warpage is less than 0.5%; the carrier 50 is fixedly provided with the display panel, a plurality of pixel units are provided in the display panel, and a plurality of corresponding driving circuits are provided. Thus, COB (chip on board) packaging is realized, namely, the LED bare chip is directly packaged on the module substrate, and then integral molding is carried out. The COB-packaged full-color LED module has the characteristics of less manufacturing process flow, lower packaging cost, high packaging integration level, good reliability of a display screen, uniform and fine display effect and the like.

As shown in fig. 11, the carrier 50 includes a top layer 52 close to the packaging adhesive layer 60, a bottom layer 56 far away from the packaging adhesive layer 60, and an intermediate layer 54 located between the top layer 52 and the bottom layer 56; the top layer 52 is used for COB soldering (240 degree centigrade soldering) of each color sub-pixel, so that pads (not shown in the figure) for soldering the first sub-pixel 11, the second sub-pixel 12 and the third sub-pixel 13 are arranged on the top layer 52, and the pads are formed by a gold deposition process. With light emitting diodes, the pad size on the top layer 52 must satisfy two conditions: firstly, the sizes of the bonding pad in the X direction and the Y direction are 0.5-2 mils larger than the size of the light emitting diode; and secondly, the bonding pad can not exceed the edge size of the light-emitting diode by 1 mil. The top layer 52 is connected with the bottom layer 56 through metal through holes or metal blind holes, and the designed pore diameter is 75 um; in the stage of packaging the device, the pads on the top layer 52 need to be soldered and fixed by reflow soldering, and medium-high temperature solder paste with a melting point higher than 217 ℃ is used in the soldering process, and nano-scale solder is used.

The bottom layer 56 is used for soldering external devices, thereby implementing the function of the display module. Therefore, the bottom layer 56 is provided with a first driving signal contact 41, a second driving signal contact 42, a third driving signal contact 43, a fourth driving signal contact 44, a fifth driving signal contact 45 and a sixth driving signal contact 46 which are connected with the driving circuitAndthe common terminal contact 30 and the pad are used for SMT (surface mount technology) stage welding of the display module device, so that the driver chip can be directly welded to connect each contact in the subsequent process. The size of the bonding pad in the X direction of the bonding pad of the bottom layer 56 is larger than 0.2mm or the size of the bonding pad in the Y direction of the bonding pad is larger than 0.2mm, and medium-low temperature tin paste is adopted in the welding process.

The intermediate layer 54 comprises at least one wiring layer (not shown) for arranging the driving circuit, i.e. a network of electrically connected wires in the driving circuit is arranged on the wiring layer. The middle layer 54 is the electrical wiring layer from the top layer 52 wiring network to the bottom layer 56 wiring network. The top layer 52 is connected to the middle layer 54 through holes or blind holes, and the wiring networks of the wiring layers of the middle layer 54 are connected differently and then connected to the bottom layer 56 through the through holes or blind holes; when the pixel pitch becomes smaller and the routing network density becomes larger, the number of routing layers and the buried via connection mode can be properly increased to realize electrical connectivity. For a carrier plate 50 with a pixel pitch larger than 0.75mm, 1 layer of routing layers is preferentially used, and for a carrier plate 50 with a pixel pitch smaller than 0.75mm, multiple layers of routing layers are added as required to realize communication.

The carrier plate 50 further comprises a top solder mask layer 51, the top solder mask layer 51 covers the surface of the top layer 52 facing the packaging adhesive layer 60, and the top solder mask layer 51 uses high-temperature resistant black ink to increase the display contrast.

A first insulating layer 53 is disposed between the top layer 52 and the middle layer 54, a second insulating layer 55 is disposed between the bottom layer 56 and the middle layer 54, and a BT substrate (bismleimide triazine substrate) is used for each of the first insulating layer 53 and the second insulating layer 55. The substrate made of BT resin has high Tg (255-330 deg.C), high heat resistance (160-230 deg.C), high moisture resistance, low dielectric constant (Dk), and low dissipation factor (Df).

A bottom solder mask layer 57 is disposed on a surface of the bottom layer 56 opposite to the top layer 52, and the bottom solder mask layer 57 uses black-black high temperature resistant ink.

The bottom solder mask layer 57 is back to be provided with pastes picture layer 58 on the surface of top layer 52, paste picture layer 58 and be used for increasing white high temperature resistant silk screen printing mark, the silk screen printing mark is used for the sign device direction.

The encapsulating adhesive layer 60 includes an epoxy resin layer 61 covering the surface of the carrier 50, the epoxy resin layer 61 simultaneously covers the sub-pixels (first sub-pixel, second sub-pixel, and third sub-pixel) of each color in the display panel, and an anti-reflection film 62 disposed on the upper surface of the epoxy resin layer 61.

The molding process includes:

firstly, use special mould strip tool, through the surface of filling the mode with epoxy coating on the support plate 50 emitting diode, form epoxy layer 61, epoxy adopts and has high transparency (transmissivity > 95%), high heat conduction, the good advantage of stability. On one hand, the epoxy resin seals and protects the light-emitting diode; on the other hand, the epoxy resin surface forms cross-shaped trapezoidal grooves 63 between the pixel units (the first row of pixel units, the second row of pixel units), and the trapezoidal sides of the cross-shaped trapezoidal grooves 63 form a lens structure, which is beneficial to the pixel display effect. Namely, the trapezoid-shaped groove is positioned between two adjacent first columns of pixel units, between two adjacent second columns of pixel units, or/and between two adjacent first columns of pixel units and second columns of pixel units.

Secondly, a layer of anti-reflection film 62 which is used for anti-reflection and is black is pressed on the surface of the epoxy resin to increase the contrast of the display; the anti-reflection film 62 absorbs the light entering the device from the outside, and at the same time, the anti-reflection film 62 has high transmittance (at least more than 80%) for the light exiting from the light emitting diode; such an antireflection film 62 may be made of a resin material. Making the anti-reflection film 62 very compatible with previously applied epoxy materials.

The total thickness of the pixel packaging structure is A, and the size of A is not more than 0.6 mm; the thickness of the anti-reflection membrane 62 is B, and the size of B is not more than 0.14 mm; the thickness of the encapsulated epoxy resin layer 61 is C, and the size of C is not more than 0.2 mm; the thickness of the carrier plate 50 is D, and the dimension of D is not more than 0.2 mm; the height of the light emitting diode from the surface of the carrier plate 50 is E, and the dimension of E is not more than 0.1 mm; the length of the short side of the trapezoidal groove 63 is F, and F is 0.1 mm; the length of the long side of the trapezoidal groove 63 is G, and G is 0.18 mm; the included angle between two bevel edges of the trapezoidal groove 63 is a, and a is 44-45 degrees.

Compared with the prior art, the utility model provides a pair of display panel and pixel packaging structure, arrange first drive signal contact 41 along the X direction in this scheme, second drive signal contact 42 and third drive signal contact 43, the circuit network that makes the X direction distributes just more like this, it is big to occupy the volume along the space of X direction, it is less to distribute along the circuit network of Y direction, the circuit network that makes the Y direction distributes just lessly, it is little to occupy the volume along the space of Y direction, thereby be greater than the size phase-match along the Y direction with the size of display device along the X direction, consequently, do benefit to the drive chip lectotype matching of display screen.

The pixel packaging structure is applied to the LED display device, and the driving cost is optimized. For example, the following steps are carried out: designing an LED display device with a 240X180 pixel point, and using a general driving chip with a 48X32 channel; because the length of the left and right directions and the up and down directions of the display device are different, the pixel packaging structure of the scheme is adopted, so that the driving chips are more suitable for being matched with the arrangement directions of the sub-pixel driving signal contacts arranged in the left and right directions, only 90 driving chips are needed, and the original packaging structure needs 96 driving chips. Therefore, in the scheme, the electrical optimized connection of the 2X2 pixel unit more effectively utilizes the channel utilization rate of the existing constant current driving chip. Under the condition that the display screen has the same pixels, the circuit in the scheme can save the cost of the driving chip.

The technical scheme of the application is also suitable for a mini LED display device and a Micro LED display device, when the mini LED display device is applied to the mini LED display device with the pixel spacing of less than 0.781mm, a 2X2 SMD packaged display panel is formed by integrating 12 mini LEDs (sub-pixels) on one packaging device, and then the PCBA assembly of the lamp driving module is realized by the plurality of 2X2 SMD packaged display panels through the conventional SMT process. The difficulty of huge transfer of the miniLED is effectively reduced, and the application of the mini LED display with ultra-small distance is realized.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. A display panel comprises a pixel unit and a driving circuit,

the pixel unit comprises at least one first column of pixel units, and the first column of pixel units comprise a first sub-pixel, a second sub-pixel and a third sub-pixel which are arranged along the Y direction;

the drive circuit includes:

2. The display panel of claim 1, wherein the pixel units comprise two first columns of pixel units, the two first columns of pixel units being arranged along a Y-direction;

in the drive circuit:

the two common end contacts are respectively a first row common contact and a second row common contact, the first row common end contact is electrically connected with the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel of one first column of pixel units, and the second row common end contact is electrically connected with the second electrode of the first sub-pixel, the second electrode of the second sub-pixel and the second electrode of the third sub-pixel of the other first column of pixel units;

the first row of common contacts and the second row of common contacts are arranged along the Y direction, or the first row of common contacts and the second row of common contacts are arranged along the X direction.

3. The display panel of claim 1, wherein the pixel units further comprise at least one second column of pixel units, the second column of pixel units comprising a first sub-pixel, a second sub-pixel and a third sub-pixel arranged along the Y-direction;

the drive circuit further includes:

4. The display panel according to claim 3, wherein there are two pixel cells in the first column, two pixel cells in the second column, and two common terminal contacts, namely a first row common contact and a second row common contact.

5. The display panel according to claim 4, wherein the first, second, third, fourth, fifth, and sixth drive signal contacts are arranged in an X direction, and the first and second rows of common contacts are arranged in a Y direction; or

6. The display panel according to claim 5, wherein the second electrodes of the first column of pixel units are opposite to the second electrodes of the second column of pixel units, or

The second electrodes in the first column of pixel units and the second electrodes in the second column of pixel units are arranged towards the same side.

7. A pixel package structure, comprising a carrier, the display panel of any one of claims 1 to 6 disposed on the carrier, and a package adhesive layer covering the surface of the carrier.

8. The pixel package structure of claim 7, wherein the carrier comprises a top layer adjacent to the encapsulation adhesive layer, a bottom layer away from the encapsulation adhesive layer, and an intermediate layer between the top layer and the bottom layer; the top layer is used for welding each sub-pixel in the pixel unit, the bottom layer is used for welding and connecting an external device, the middle layer comprises at least one wiring layer, and the wiring layer is arranged on a driving circuit in the display panel.

9. The pixel package structure of claim 8, wherein the carrier further comprises a first insulating layer and a second insulating layer, the first insulating layer is disposed between the top layer and the middle layer; the second insulating layer is arranged between the bottom layer and the middle layer; the first insulating layer and the second insulating layer are both BT substrates.

10. The pixel package structure of claim 9, wherein the carrier further comprises a top solder mask layer covering a surface of the top layer facing the package glue layer;

a bottom solder mask layer is arranged on the surface of the bottom layer, which is back to the top layer;

and the surface of the bottom solder mask layer, which is back to the top layer, is provided with a pasting layer.

11. The pixel packaging structure of claim 7, wherein the packaging adhesive layer comprises an epoxy resin layer covering a surface of the carrier and an anti-reflection film disposed on an upper surface of the epoxy resin layer; the epoxy resin layer wraps the first sub-pixel, the second sub-pixel and the third sub-pixel in the display panel.

12. The pixel packaging structure according to claim 11, wherein a trapezoid groove is disposed on the epoxy layer, and the trapezoid groove is located between two adjacent first columns of pixel units, between two adjacent second columns of pixel units, or/and between two adjacent first columns of pixel units and two adjacent second columns of pixel units.