CN216563124U

CN216563124U - LED packaging structure, LED lamp strip, backlight unit and display screen

Info

Publication number: CN216563124U
Application number: CN202122925984.2U
Authority: CN
Inventors: 李耀森
Original assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd
Current assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2022-05-17
Anticipated expiration: 2031-11-24

Abstract

The application provides a LED packaging structure, a LED lamp strip, a backlight module and a display screen. The LED encapsulation includes support and illuminating part, the illuminating part includes phosphor powder and LED wafer, the holding tank has on the support, the phosphor powder sets up in the holding tank, the holding tank includes that first section and the second of holding holds the section, the tank bottom that the section was held to first section and the notch intercommunication that the section was held to the second, the first notch that holds the section is circular, the LED wafer interval sets up the tank bottom that the section was held at the second, the edge of LED wafer and the second relative with the edge of LED wafer hold the maximum distance between the lateral wall of section for the edge of LED wafer and hold 1 doubly ~ 2 times of minimum distance between the lateral wall of section with the edge relative second of LED wafer. The LED packaging structure provided by the application can enable the quantity of the fluorescent powder distributed around the light-emitting wafer to be consistent, so that the color temperature uniformity in all directions of light irradiation is ensured.

Description

LED packaging structure, LED lamp strip, backlight unit and display screen

Technical Field

The application relates to the technical field of LEDs, in particular to an LED packaging structure, an LED lamp bar, a backlight module and a display screen.

Background

Most of the backlight modules of liquid crystal displays currently use white light LEDs (light emitting diodes) with a power of 2W as the light source for driving. The white light LED mainly comprises a light emitting wafer, a bracket, fluorescent powder, gold wires and other components.

Wherein, the support is composed of a metal bonding pad embedded with a reflection bowl cup of epoxy resin. The light-emitting wafer is of a rectangular structure and is fixed at the bottom of the reflecting bowl cup, and the light-emitting wafer is electrically connected with the metal bonding pad through a gold wire. The fluorescent powder is dispersed in the reflecting bowl cup. The light emitting chip can uniformly emit blue light after being electrified, the fluorescent powder can emit yellow light under the excitation of the blue light, and the white light can be obtained after the yellow light and the blue light are mixed. Meanwhile, the white light LED uniformly diffuses the white light in all directions by matching with the secondary optical lens, and the reflecting bowl cup is made into a circular shape due to the fact that the optical lens is of a 360-degree rotational symmetry structure, so that the light in all directions is guaranteed to be consistent.

However, in the prior art, the amount of the fluorescent powder around the light emitting chip cannot be uniformly distributed, and after the white light emitted by the LED is emitted, the yellow spots appear in the edge area due to the non-uniform color temperature of the white light in each direction.

SUMMERY OF THE UTILITY MODEL

The application provides an LED packaging structure, LED lamp strip, backlight unit and display screen to solve the unable evenly distributed's of the phosphor powder quantity around the luminous wafer among the prior art problem.

The utility model provides a LED packaging structure, include the support and can send the luminescent part of white light, the luminescent part includes phosphor powder and two at least LED wafers, the holding tank that is the bowl form has on the support, phosphor powder sets up in the holding tank, the holding tank includes that it holds the section to set up first section and the second of holding along holding tank depth direction, the second holds the projection that the section orientation was first to hold and is located first section of holding, the tank bottom that the section was held to first section and the notch intercommunication that the section was held to the second, the notch that the section was held to first section is circular, the LED wafer interval sets up the tank bottom that the section was held at the second, the maximum distance between the lateral wall that the section was held to the edge of LED wafer and the second relative with the edge of LED wafer holds the lateral wall between the section is 1 doubly-2 times of minimum distance between the edge of LED wafer and the lateral wall that the second relative with the edge of LED wafer.

In one possible implementation manner, the LED package structure provided by the present application, a distance between two adjacent LED chips is less than or equal to a maximum distance between an edge of the LED chip and a sidewall of the second accommodating section opposite to the edge of the LED chip.

In a possible implementation manner, the LED package structure provided in the present application, the shape of the notch of the second accommodating section is similar to the shape of the groove bottom of the second accommodating section, and the center of symmetry of the notch of the second accommodating section coincides with the center of symmetry of the groove bottom of the second accommodating section, and a projection of the groove bottom of the second accommodating section toward the notch of the second accommodating section is located in the notch of the second accommodating section.

In a possible implementation manner, in the LED package structure provided in the present application, the bottom of the second accommodating section is an ellipse.

In a possible implementation manner, in the LED package structure provided in the present application, the bottom of the second accommodating section is rectangular or rounded rectangular.

In a possible implementation manner, in the LED package structure provided in the present application, the bottom of the second accommodating section is a long hole.

In a possible implementation manner, in the LED package structure provided in the present application, the sidewall of the first accommodating section is an inclined surface, and the sidewall of the second accommodating section is an inclined surface or an arc surface protruding toward the LED chip.

In a possible implementation manner, the present application provides an LED package structure, wherein a diameter of the notch of the first accommodating section is 1.8 times to 2.2 times a width of the groove bottom of the second accommodating section.

In a possible implementation manner, the number of the LED chips is two, the two LED chips are symmetrically disposed, and the symmetric centers of the two LED chips coincide with the symmetric center of the accommodating groove.

In a possible implementation manner, the LED package structure provided in the present application includes a frame body and a pad located on the frame body, the accommodating groove is located on the frame body, and the pad forms a groove bottom of the second accommodating section;

the LED wafer is adhered to the bonding pad through the adhesive layer, and the LED wafer is electrically connected with the bonding pad through the connecting piece.

The application provides a LED lamp strip, LED packaging structure in circuit board, a plurality of lens and a plurality of above-mentioned content, each LED packaging structure interval sets up on the circuit board, and lens and LED packaging structure one-to-one set up, and the notch at LED packaging structure's first section of holding is established to the lens lid.

The application provides a backlight module, including LED lamp strip in the above-mentioned content and the light guide plate of setting in LED lamp strip one side.

The application provides a display screen, including the body and the backlight unit who sets up in the above-mentioned content on the body.

The application provides an LED packaging structure, an LED lamp strip, a backlight module and a display screen, the LED packaging structure comprises a support and a light-emitting piece capable of emitting white light, the light-emitting piece comprises fluorescent powder and at least two LED wafers, the fluorescent powder is arranged in a containing groove on the support, the containing groove comprises a first containing section and a second containing section, the LED wafers are arranged at the bottom of the second containing section at intervals, the maximum distance between the edge of the LED wafer and the side wall of the second containing section opposite to the edge of the LED wafer is 1-2 times of the minimum distance between the edge of the LED wafer and the side wall of the second containing section opposite to the edge of the LED wafer, therefore, the fluorescent powder filled in the second containing section can be uniformly dispersed around the LED wafer, the quantity of the fluorescent powder distributed in each direction irradiated by the blue light emitted by the LED wafer is consistent, and the color temperature in each direction irradiated by the blue light is uniform, thereby avoiding the yellow spots of the white light emitted by the luminous element due to the color difference.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of an LED package structure provided in the present application;

FIG. 2 is a front view of a first LED package structure provided herein;

FIG. 3 is a cross-sectional view taken at A-A of FIG. 2;

FIG. 4 is a cross-sectional view taken at B-B of FIG. 2;

FIG. 5 is a front view of a second LED package structure provided herein;

FIG. 6 is a front view of a third LED package structure provided herein;

FIG. 7 is a front view of a fourth LED package structure provided herein;

FIG. 8 is an enlarged partial schematic view of FIG. 3 at position C;

FIG. 9 is a cross-sectional view of a frame provided herein;

FIG. 10 is a cross-sectional view of a bond pad provided herein;

fig. 11 is a schematic structural diagram of an LED light bar provided in the present application.

Description of the reference numerals

100-a scaffold; 110-a holding tank; 111-a first containment section; 112-a second containment section; 113-mounting holes; 120-a frame body; 130-a pad; 131-a boss; 140-an adhesive layer;

200-a light emitting member; 210-fluorescent powder; 220-LED chip; 221-a first edge; 222-a second edge;

300-a light bar; 310-a circuit board; 320-a lens;

h1 — maximum distance between first edge and side wall of second containment section;

h2 — minimum distance between first edge and side wall of second containment section;

h1 — maximum distance between the second edge and the side wall of the second containment section;

h2 — minimum distance between second edge and side wall of second containment section;

l-the distance between two LED chips;

d-the diameter of the notch of the first containment section;

d-the width of the groove bottom of the second accommodation section.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interaction between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

The terms "first," "second," and "third" (if any) in the description and claims of this application and the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.

Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or maintenance tool that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or maintenance tool.

Wherein, the support is composed of a metal bonding pad embedded with a reflection bowl cup of epoxy resin. The light-emitting wafer is of a rectangular structure and is fixed at the bottom of the reflecting bowl cup, and the light-emitting wafer is electrically connected with the metal bonding pad through a gold wire. The fluorescent powder is dispersed in the reflecting bowl cup. The light-emitting chip can uniformly emit blue light (λ p is 465nm, and Wd is 30nm) after being electrified, the fluorescent powder can emit yellow light with a peak value of 550nm under the excitation of the blue light after absorbing a part of the blue light, and the yellow light and the other part of the blue light are mixed to obtain white light. Further, various white lights with color temperature ranging from 3500K to 10000K can be obtained by changing the chemical composition of the fluorescent powder and adjusting the thickness of the fluorescent powder layer.

Generally, the white light LED uniformly diffuses the emitted white light in all directions by matching with the secondary optical lens, and the reflecting bowl cup is made into a circular shape due to the fact that the optical lens is of a 360-degree rotational symmetry structure, and therefore light in all directions is guaranteed to be consistent.

However, since the light emitting chips are all rectangular, when the light emitting chips are fixed to the bottom of the circular reflective bowl, the distribution amount of the phosphor powder in the length direction and the width direction of the light emitting chips is not uniform. When the blue light uniformly emitted from the light emitting chip irradiates the fluorescent powder with non-uniform distribution, the color temperature of the white light emitted from the mixed LED in each direction is not uniform, for example, the color temperature of the blue light is lower when a large amount of fluorescent powder is excited, and the color temperature of the blue light is higher when a small amount of fluorescent powder is excited, so that the yellow spot phenomenon occurs in the white light emitted from the edge region with more fluorescent powder distribution.

Based on this, the application provides a LED packaging structure, LED lamp strip, backlight unit and display screen, through setting up the inside shape structure of holding tank among the LED packaging structure, so that the LED wafer is installed behind the holding tank bottom, the distribution that the phosphor powder of the packing in the holding tank can be equallyd divide is around the LED wafer, just so can guarantee that the blue light that the LED wafer sent shines the phosphor powder quantity unanimous in each direction, avoid appearing the uneven phenomenon of colour temperature and lead to the white light after the mixture yellow spot phenomenon to appear.

Examples

Fig. 1 is a schematic structural view of an LED package structure provided in the present application, fig. 2 is a front view of the LED package structure provided in the present application, fig. 3 is a cross-sectional view taken along line a-a in fig. 2, and fig. 4 is a cross-sectional view taken along line B-B in fig. 2.

As shown in fig. 1 to 4, the LED package structure provided by the present application includes a support 100 and a light emitting element 200 capable of emitting white light, the light emitting element 200 includes a phosphor 210 and at least two LED chips 220, the support 100 has a bowl-shaped receiving groove 110, the phosphor 210 is disposed in the receiving groove 110, the receiving groove 110 includes a first receiving section 111 and a second receiving section 112 disposed along a depth direction of the receiving groove 110, a projection of the second receiving section 112 toward the first receiving section 111 is located in the first receiving section 111, a groove bottom of the first receiving section 111 is communicated with a groove bottom of the second receiving section 112, the groove bottom of the first receiving section 111 is circular, the LED chips 220 are disposed at intervals at the groove bottom of the second receiving section 112, the maximum distance between the edge of the LED wafer 220 and the sidewall of the second receiving section 112 opposite to the edge of the LED wafer 220 is 1 to 2 times the minimum distance between the edge of the LED wafer 220 and the sidewall of the second receiving section 112 opposite to the edge of the LED wafer 220.

In a specific implementation, the bracket 100 is mainly used for fixing the light emitting element 200, the light emitting element 200 can be mounted in the receiving groove 110 of the bracket 100, and the receiving groove 110 can have a reflection function, so that the white light emitted from the light emitting element 200 can be uniformly irradiated in all directions by the reflection function of the receiving groove 110.

With continued reference to fig. 1 and 2, the receiving groove 110 may be a bowl-shaped structure, and the shape of the "bowl" is generally a circle, and has the characteristics of a large opening and a small bottom, a wide bowl opening and a narrow bowl bottom, specifically, the receiving groove 110 is divided into a first receiving section 111 and a second receiving section 112 along an axial direction perpendicular to the receiving groove 110, that is, the first receiving section 111 and the second receiving section 112 are adjacently disposed along a depth direction of the receiving groove 110. The notch of the first accommodating section 111 forms the notch of the accommodating groove 110, the groove bottom of the second accommodating section 112 forms the groove bottom of the accommodating groove 110, and the groove bottom of the first accommodating section 111 and the notch of the second accommodating section 112 are oppositely arranged and are communicated with each other. The shape of the notch of the first receiving section 111 may be a circle, and the opening of the circle may ensure that the white light emitted from the light emitting member 200 is rotationally symmetrical and the illumination intensity is uniform in all directions of 360 degrees within the range of the notch of the first receiving section 111.

The white light emitted from the light emitting member 200 is a mixed light. Specifically, as shown in fig. 3 and 4, white light is formed by mixing blue light emitted from the LED chip 220 and yellow light emitted from the phosphor 210. Specifically, after a part of the blue light emitted from the LED chip 220 irradiates the phosphor 210, the phosphor 210 can be excited to emit yellow light, and the yellow light is mixed with another part of the blue light emitted from the LED chip 220 to obtain white light.

The LED chip 220 may be gallium nitride (GaN) and the phosphor 210 may be Yttrium Aluminum Garnet (YAG).

As shown in fig. 2 and 3, the number of the LED chips 220 may be two, and the LED chips 220 may be rectangular in shape. Two LED chips 220 are spaced apart from each other at the bottom of the groove of the second receiving section 112. The phosphor 210 is filled inside the accommodating groove 110, that is, the phosphor 210 is distributed in both the first accommodating section 111 and the second accommodating section 112, and the phosphor 210 covers the LED chip 220.

As shown in fig. 2, the edge of the LED chip 220 may be divided into a first edge 221 extending in a length direction (Y direction in fig. 2) and a second edge 222 extending in a width direction (X direction in fig. 2). Wherein the maximum distance and the minimum distance between the first edge 221 and the side wall of the second accommodating section 112 opposite to the first edge 221 are H1 and H2, respectively, and then H1 is 1-2 times of H2. The maximum and minimum distances between the second edge 222 and the side wall of the second accommodation section 112 opposite to the second edge 222 are h1 and h2, respectively, and then h1 is 1-2 times h 2.

The purpose of this arrangement is to make the space between the first edge 221 of the LED chip 220 in the length direction and the sidewall of the second accommodating section 112 substantially the same as the space between the second edge 222 of the LED chip 220 in the width direction and the sidewall of the second accommodating section 112, so that the phosphor 210 is distributed around the LED chip 220 more uniformly.

In this embodiment, the phosphor 210 is filled in the accommodating groove 110 and then dispersed at various positions in the inner space of the accommodating groove 110. Through set up first container section 111 and second container section 112 in holding tank 110, install the LED wafer 220 that will be used for giving out light in the tank bottom that the second container section 112 was held to the second, and set up the edge of LED wafer 220 and the edge of LED wafer 220 adjacent the lateral wall of second container section 112 the biggest distance be 1 ~ 2 times of minimum distance, therefore, can guarantee to fill the phosphor powder 210 that fills in second container section 112 can be comparatively even dispersion around LED wafer 220, just so can guarantee that the phosphor powder 210 quantity that distributes in each direction that the blue light that LED wafer 220 sent shines is unanimous in each direction, with the colour temperature that ensures that the blue light shines is even in each direction, and then avoid the white light that illuminating part 200 sent to appear the phenomenon of macula owing to the colour difference reason.

With continued reference to fig. 2 and 3, the distance between two adjacent LED chips 220 is less than or equal to the maximum distance between the edge of the LED chip 220 and the sidewall of the second accommodating section 112 opposite to the edge of the LED chip 220.

In a specific implementation, as shown in fig. 2, the maximum distance between the edge of the LED chip 220 and the sidewall of the second receiving section 112 may be the maximum distance H1 between the first edge 221 of the LED chip 220 and the second receiving section 112, or may be the maximum distance H1 between the second edge 222 of the LED chip 220 and the second receiving section 112.

As shown in fig. 3, the distance between two adjacent LED chips 220 is L, so when H1 is equal to or greater than H1, L is equal to or less than H1; otherwise, L is less than or equal to h 1. By such arrangement, the fluorescent powder 210 distributed around the single LED chip 220 can be uniform, and the blue light emitted by the single LED chip 220 can be irradiated to the fluorescent powder 210 with uniform quantity in each direction.

With continued reference to fig. 2 and 3, the shape of the notch of the second accommodating section 112 is similar to the shape of the groove bottom of the second accommodating section 112, and the symmetry center of the notch of the second accommodating section 112 coincides with the symmetry center of the groove bottom of the second accommodating section 112, and the projection of the groove bottom of the second accommodating section 112 toward the notch of the second accommodating section 112 is located in the notch of the second accommodating section 112.

In the present application, the shape of the groove bottom of the second receiving section 112 may be a regular shape or an irregular shape. It should be noted that, on the premise of ensuring that the shape of the notch of the second accommodating section 112 is similar to the shape of the groove bottom of the second accommodating section 112, the shape of the notch of the second accommodating section 112 may be a regular shape or an irregular shape.

The symmetry center of the notch of the second receiving section 112 coincides with the symmetry center of the groove bottom of the second receiving section 112, so that the space between the sidewall of the second receiving section 112 and each edge of the LED chip 220 is substantially the same, and further, the phosphor 210 distributed around the LED chip 220 is more uniform.

The projection of the groove base of the second receiving section 112 onto the groove base of the second receiving section 112 is located in the groove base of the second receiving section 112, and is arranged such that the groove base of the second receiving section 112 is larger than the groove base of the second receiving section 112.

The shape of the groove bottom of the second receiving section 112 is not particularly limited in the present embodiment as long as the size of the space formed between the side wall of the second receiving section 112 and each edge of the adjacent LED chip 220 can be ensured to be constant.

In a specific implementation, the groove bottom of the second receiving section 112 may have a regular shape, thereby facilitating the machining of the receiving groove 110. Illustratively, the bottom of the second receiving section 112 is oval. The groove bottom of the second receiving section 112 is rectangular or rounded rectangular. The bottom of the second receiving section 112 is a long hole.

For example, as shown in fig. 2, the bottom of the second accommodating section 112 may be an ellipse, two LED chips 220 may be distributed on the bottom of the ellipse along the direction of the major axis of the ellipse, and the two LED chips 220 may be symmetrical along the minor axis of the ellipse, so that the amount of the phosphor 210 distributed in each direction irradiated by the blue light emitted from the LED chips 220 is uniform.

Fig. 5 is a front view of a second LED package structure provided herein, fig. 6 is a front view of a third LED package structure provided herein, and fig. 7 is a front view of a fourth LED package structure provided herein.

As shown in fig. 5 and 6, the groove bottom of the second receiving section 112 may also be rectangular or rounded rectangular in shape. At this time, since the edge of the LED chip 220 of the rectangular structure and the bottom edge of the groove of the rectangular second receiving section 112 are parallel to each other, the maximum distance and the minimum distance between the first edge 221 of the LED chip 220 and the side wall of the second receiving section 112 opposite to the first edge 221 are equal. Likewise, the maximum distance and the minimum distance between the second edge 222 of the LED chip 220 and the sidewall of the second receiving section 112 opposite to the second edge 222 are also equal.

With this arrangement, the phosphor 210 distributed around the LED chip 220 can be most uniform, and the color temperature of the blue light emitted from the LED chip 220 in each direction can be most uniform.

The shape of the groove bottom of the second accommodating section 112 may also be a long-strip hole shape, and the principle and function of the long-strip hole shape are consistent with the above-mentioned embodiments, and therefore, the detailed description is omitted here.

It should be noted that, as shown in fig. 7, the shape of the elongated hole is similar to that of a "circular track" in a stadium, that is, the elongated hole is formed by connecting a straight line and a circular arc in sequence.

The sidewall of the first accommodating section 111 is a slope, and the sidewall of the second accommodating section 112 is a slope or a cambered surface protruding toward the LED chip 220.

For example, the side walls of the first accommodating section 111 and the second accommodating section 112 may be both inclined surfaces, and an inclination angle of the side wall of the first accommodating section 111 with respect to the depth direction of the accommodating groove 110 is smaller than an inclination angle of the side wall of the second accommodating section 112 with respect to the depth direction of the accommodating groove 110.

With such an arrangement, the sidewall of the second accommodating section 112 can be ensured to be closer to the edge of the LED chip 220 without changing the shape of the notch of the first accommodating section 111, so that the amount of the phosphor 210 distributed on each edge of the LED chip 220 can be kept uniform.

As shown in fig. 2 to 4, the sidewall of the second receiving section 112 may also be a cambered surface protruding toward the LED chip 220, and is configured such that the sidewall of the second receiving section 112 is further close to the edge of the LED chip 220. It should be noted that the arc of the arc surface may be different.

For example, in the area where the sidewall of the second accommodating section 112 is closer to the edge of the LED chip 220, the arc is relatively smaller, i.e., the protruding portion of the sidewall of the second accommodating section 112 is relatively less; in the region where the sidewall of the second receiving section 112 is farther from the edge of the LED chip 220, the arc is set relatively large, i.e., the sidewall of the second receiving section 112 protrudes relatively more. This is done so that the phosphor 210 is dispersed as uniformly as possible around the edge of the LED chip 220.

In some embodiments, the diameter of the notch of the first receiving section 111 is 1.8 to 2.2 times the width of the groove bottom of the second receiving section 112.

Specifically, the diameter of the notch of the first receiving section 111 is D, and the width of the groove bottom of the second receiving section 112 is D, so that D is 1.8 times to 2.2 times of D.

For example, as shown in fig. 2, D is 2 times D in this embodiment. So configured, the amount of the phosphor 210 distributed in various directions around the LED chip 220 can be substantially uniform.

As shown in fig. 2, the number of the LED chips 220 is two, and the two LED chips 220 are symmetrically disposed, and the symmetric centers of the two LED chips 220 are coincident with the symmetric center of the accommodating groove 110.

Fig. 8 is a partially enlarged schematic view at a position C in fig. 3, fig. 9 is a sectional view of a frame body provided in the present application, and fig. 10 is a sectional view of a pad provided in the present application.

As shown in fig. 1 and 2, the bracket 100 includes a body 120 and a pad 130 on the body 120, the receiving groove 110 is on the body 120, and the pad 130 forms a groove bottom of the second receiving section 112. As shown in fig. 8, the LED chip 220 is adhered to the bonding pad 130 by the adhesive layer 140, and the LED chip 220 is electrically connected to the bonding pad 130 by a connecting member (not shown).

As shown in fig. 2, the bracket 100 is formed by combining a frame body 120 and a pad 130, and the receiving groove 110 is defined by the frame body 120 and the pad 130. The first receiving section 111 and the second receiving section 112 are both disposed on the frame body 120. As shown in fig. 9, the second receiving section 112 is further provided with a mounting hole 113 for a socket pad 130. As shown in fig. 10, the pad 130 is provided with a boss 131 engaged with the mounting hole 113, and the boss 131 is sleeved in the mounting hole 113, so that the frame body 120 and the pad 130 together enclose the accommodating groove 110.

The boss 131 and the mounting hole 113 have the same shape and size. And the portion of the surface of the boss 131 located in the mounting hole 113 forms the groove bottom of the second accommodation section 112.

In some embodiments, in order to mount the LED chip 220 on the pad 130 at the bottom of the receiving groove 110, the LED chip 220 is fixedly mounted on the pad 130 by providing the adhesive layer 140 between the LED chip 220 and the pad 130.

For example, the adhesive layer 140 may be a die bond adhesive. The composition material of the solid crystal glue can comprise silver powder (the proportion is 75-80%), epoxy resin (the proportion is 10-15%) and additive (the proportion is 5-10%).

The die bond adhesive can be conductive adhesive or insulating adhesive, wherein the conductive adhesive can be formed by combining silver adhesive and tin paste. The die bond paste has electrical conductivity (conductive paste), thermal conductivity, and light reflection performance (silver powder added shape). In addition, the die bond adhesive also has good bonding performance and lower cost.

In one possible embodiment, in order to facilitate the LED chip 220 to emit light, it is necessary to electrically connect the LED chip 220 with the bonding pads 130 and supply current to the LED chip 220 through the bonding pads 130.

For example, the connecting member for electrical connection may be a gold wire. The gold wire is formed by bonding and drawing a material with the Au (gold) purity of more than 99.99%, and contains trace elements such as Ag (silver)/Cu (copper)/Si (silicon)/Ca (calcium)/Mg (magnesium).

The gold wire has the advantages of high conductivity, corrosion resistance, good toughness and the like, is widely applied to integrated circuits, and has the greatest advantage of oxidation resistance compared with other materials, which is the main reason why the gold wire is widely applied to LED packaging.

As shown in fig. 11, the present application provides an LED light bar 400, which includes a circuit board 410, a plurality of lenses 420 and a plurality of LED package structures in the above embodiments, wherein the LED package structures are disposed on the circuit board 410 at intervals, the lenses 420 and the LED package structures are disposed in a one-to-one correspondence, and the lenses 420 are disposed in notches of a first accommodating section of the LED package structures in a covering manner.

The specific structure, working principle, and the like of the LED package structure have been described in detail in the above embodiments, and are not described in detail herein.

Illustratively, the Circuit board 410 may be an FPC (Flexible Printed Circuit) board, which is a Flexible Printed Circuit board having high reliability and excellent performance manufactured by using polyimide or polyester film as a base material. The wiring structure has the characteristics of high wiring density, light weight, thin thickness and good bending property.

The Circuit Board 410 may be a Printed Circuit Board (PCB). The PCB board has the dual function of a conductive circuit and an insulating base plate.

The number of the LED package structures arranged on the circuit board 410 may be multiple, each LED package structure may be arranged uniformly and at intervals, and the number and the interval of the LED package structures may be designed according to actual requirements, which is not limited in this embodiment.

In this application, the number of the lenses 420 may correspond to the number of the LED package structures, the lenses 420 have a 360-degree rotational symmetry structure, and the shape of the lenses 420 is consistent with the shape of the first receiving segment notch, which may be circular. The white light emitted from the light emitting member 200 is uniformly diffused in all directions by the refraction of the lens 420.

The application also provides a backlight module, which comprises the LED lamp strip and a light guide plate (not marked in the figure) arranged on one side of the LED lamp strip.

The specific structure, working principle, and the like of the LED light bar have been described in detail in the above embodiments, and are not described in detail herein.

The light guide plate is made of an optical acrylic plate or a PC (polycarbonate) plate, has a very high refractive index and does not absorb light, and can effectively convert a linear light source into a surface light source.

The application also provides a display screen (not marked in the figure), which comprises a body and the backlight module arranged on the body.

The detailed structure, working principle, etc. of the backlight module have been described in detail in the above embodiments, and are not described in detail herein.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An LED packaging structure is characterized by comprising a bracket and a light-emitting piece capable of emitting white light, the luminous element comprises fluorescent powder and at least two LED chips, the bracket is provided with a bowl-shaped accommodating groove, the fluorescent powder is arranged in the accommodating groove, the accommodating groove comprises a first accommodating section and a second accommodating section which are arranged along the depth direction of the accommodating groove, the projection of the second accommodating section towards the first accommodating section is positioned in the first accommodating section, the groove bottom of the first accommodating section is communicated with the groove opening of the second accommodating section, the notch of the first accommodating section is circular, the LED chips are arranged at the bottom of the groove of the second accommodating section at intervals, the maximum distance between the edge of the LED wafer and the side wall of the second accommodating section opposite to the edge of the LED wafer is 1-2 times the minimum distance between the edge of the LED wafer and the side wall of the second accommodating section opposite to the edge of the LED wafer.

2. The LED package structure of claim 1, wherein the distance between two adjacent LED dies is less than or equal to the maximum distance between the edge of the LED die and the sidewall of the second receiving section opposite to the edge of the LED die.

3. The LED package structure of claim 2, wherein the shape of the notch of the second receiving section is similar to the shape of the groove bottom of the second receiving section, and the center of symmetry of the notch of the second receiving section coincides with the center of symmetry of the groove bottom of the second receiving section, and the projection of the groove bottom of the second receiving section towards the notch of the second receiving section is located within the groove bottom of the second receiving section.

4. The LED package structure of claim 3, wherein the bottom of the second receiving section is oval.

5. The LED package structure of claim 3, wherein the bottom of the second receiving section is rectangular or rounded rectangular.

6. The LED package structure of claim 3, wherein the bottom of the second receiving section is an elongated hole.

7. The LED package structure of any one of claims 1 to 6, wherein the side wall of the first receiving segment is a slope, and the side wall of the second receiving segment is a slope or protrudes toward the arc surface of the LED chip.

8. The LED package structure according to any one of claims 1 to 6, wherein the diameter of the notch of the first receiving section is 1.8 to 2.2 times the width of the groove bottom of the second receiving section.

9. The LED package structure of claim 1, wherein the number of the LED chips is two, and the two LED chips are symmetrically disposed, and the symmetric centers of the two LED chips coincide with the symmetric center of the accommodating groove.

10. The LED package structure according to claim 1, wherein the support comprises a frame body and a pad on the frame body, the receiving groove is on the frame body, and the pad forms a groove bottom of the second receiving section;

the LED wafer is bonded with the bonding pad through an adhesive layer, and the LED wafer is electrically connected with the bonding pad through a connecting piece.

11. An LED light bar, characterized in that, including circuit board, a plurality of lens and a plurality of LED packaging structure of any one of claims 1 to 10, each LED packaging structure interval sets up on the circuit board, lens with the LED packaging structure one-to-one sets up, the lens lid is established in the notch of the first section of holding of LED packaging structure.

12. A backlight module comprising the LED light bar of claim 11 and a light guide plate disposed on one side of the LED light bar.

13. A display screen, comprising a main body and the backlight module of claim 12 disposed on the main body.