CN207115897U - A kind of LED display module - Google Patents

Abstract

A kind of LED display module, it is related to LED encapsulation and LED display technical field, solves the problems, such as that traditional LED display has heat dispersion difference and needs LED support.Upper circuit pack including the LED component containing LED monomers, containing layer of reaching the standard grade and the multiple connection sheets arranged in the lateral direction, the main terminal pads of multiple LED that the top surface of connection sheet is provided with, LED monomers are fixed in the main terminal pads of corresponding LED, upper circuit pack is provided with multiple LED putting holes, LED monomers include three kinds of color LED chips, LED chip is fixed in the main terminal pads of LED, and LED chip is electrically connected with by connecting metal foil with layer of reaching the standard grade.It can not have to LED support in display screen of the present utility model production, the cost of LED and display screen is greatly reduced, LED display luminous point spacing is small, perfect heat-dissipating and stable performance.

Description

A kind of LED display module

Technical field

It the utility model is related to LED encapsulation and the LED display technical field including LED television, LED encapsulation category In semiconductor technology.

Background technology

LED is the light emitting diode that LED chip encapsulation forms.LED television refers to that LED chip is directly luminous and forms image Television set.LED display is in the circuit board and by the directly luminous display screens for forming image of LED by multiple LED installations （There is other control LED electronic component on wiring board）.Particularly (LED is the three-in-one full color display of RGB One luminous point, a LED are a pixel, are placed on by 1 red 1 green 1 blue three LED chips in a LED bowl by envelope Dress forms a LED)；LED display includes outdoor LED display screen, indoor LED display and LED television display screen etc., LED display is referred to as light-emitting diode display.Existing LED display uses PCB, in the upper surface of PCB Multiple LED are installed, multiple control LED integrated package is installed in the lower surface of PCB, PCB does not radiate Structure, the thermal diffusivity of PCB is very poor, and then existing LED and LED display weak heat-dissipating, poor quality, stability are poor；It is existing LED support is needed in the LED production processes of some LED displays, LED support includes straight cutting LED support and paster LED branch Frame, LED support cost is high, and LED support cuts unnecessary part after die bond, solder bonds metal wire and sealing（That is cutting Technique）, LED production costs are high, and LED costs are high, LED stability, and LED display cost is high, and stability is poor.

The content of the invention

There is the problem of needing straight cutting LED support or paster LED bracket in the LED of existing LED display, existing LED is shown There is the problem of cost high and stability difference in screen, and existing LED display has wiring board does not have radiator structure and weak heat-dissipating The problem of, the utility model proposes a kind of LED display module, the utility model uses to solve above-mentioned problem Technical scheme be：

A kind of LED display module, includes luminescence component；Described luminescence component includes LED component and upper component； Described upper component includes multiple connection sheets in left-right situs, and the connection sheet is metal material, each described connection Piece is provided with the main terminal pads of multiple LED in tandem；Described upper component also includes horizontally disposed upper circuit pack, institute The upper substrate that circuit pack includes reach the standard grade layer and insulating materials is stated, described layer of reaching the standard grade is fixedly connected with upper substrate；It is described Upper substrate is located at the lower section of layer of reaching the standard grade, and the connection sheet is located at the lower section of upper substrate, and the top surface of the upper substrate and connection sheet glues Close connection；Described upper component is provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is corresponding There are the main terminal pads of LED described in 1；Described LED component includes multiple LED monomers of array distribution, each described LED Monomer is fixed in corresponding 1 main terminal pad of LED；The layer of reaching the standard grade includes a plurality of first control metal in tandem Paper tinsel, the layer of reaching the standard grade also include a plurality of second control metal foil in tandem, and the layer of reaching the standard grade also includes in tandem It is a plurality of 3rd control metal foil, it is described first control metal foil and second control metal foil be respectively equipped with LED terminal pad, institute State the 3rd control metal foil and be provided with LED times described terminal pad；The position of the main terminal pads of LED is less than LED terminal pad Position.

Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes and bottom Electrode；The bottom electrode of the LED chip is fixedly connected and is electrically connected with the main terminal pads of LED；The connecting elements includes The articulamentum of metal foil and insulating materials is connected, the connection metal foil is metal material, and the articulamentum is with being connected metal foil It is fixedly connected；The connection metal foil surface is provided with the top electricity of the 1st pad and the 2nd pad, the 1st pad and LED chip Pole is fixedly connected and is electrically connected with；2nd pad is fixedly connected and is electrically connected with LED terminal pad；The LED chip Top electrodes are located at the one of the 2nd pad of the connection metal foil connected close to the LED chip on the LED chip length direction Side；Each described LED monomer includes 3 LED chips, is the first color LED chip, the second color LED core respectively Piece and the 3rd color LED chip；First color LED chip of the multiple LED monomers being arranged in a row in left and right and 1 first control Metal foil is electrically connected with；Second color LED chip of the multiple LED monomers being arranged in a row in left and right and 1 second control metal Paper tinsel is electrically connected with；3rd color LED chip of the multiple LED monomers being arranged in a row in left and right and 1 article of the 3rd control metal foil electricity Property connection.

The luminescence component also includes lower circuit pack, radiator and control integrated package, and the radiator is positioned at offline The lower section of road component, the radiator are fixedly connected with lower circuit pack；Described lower circuit pack include lower wiring layer and The lower circuit base plate of insulating materials, the lower wiring layer are fixedly connected with lower circuit base plate；The control integrated package is arranged on down The lower surface of wiring layer；The lower circuit base plate is located at the lower section of connection sheet, and the lower wiring layer is located under lower circuit base plate Side, the lower circuit base plate connect with the bonding of connection sheet lower surface；The lower circuit pack is provided with multiple heat conduction grooves, described to lead Hot slot opening is downward, and the bottom land of the heat conduction groove is the lower surface of connection sheet；The radiator, which includes, is welded on heat conduction Multiple radiating pins of the metal material of groove；Each described connection sheet is corresponding with 1 heat conduction groove described above；It is each The individual corresponding 1 radiating pin described above of the connection sheet；The rear and front end distance of the heat conduction groove is H3, and the heat conduction is recessed The left and right ends distance of groove is H4, and H3 is more than H4.

The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet.

Described luminescence component also includes top layer；The top layer includes the top line base board of the black of insulating materials； The top layer is provided with top layer hole；The top layer hole is more than LED putting holes in the surface of LED putting holes, the top layer hole.

The upper circuit pack is provided with the interstitial hole directly over LED putting holes, the horizontal cross-section face of the interstitial hole Horizontal section area of the product more than LED putting holes；The bottom of the interstitial hole is provided with chip and places position, and chip places the position of position Higher than the position of the main terminal pads of LED, LED chip is fixed on chip and placed on position；The upper circuit pack also includes and upper base The middle line layer of plate upper surface bonding connection；The middle line layer is provided with described chip and places position.

The top surface of the connection sheet includes multiple bonding pads in tandem, and bonding pad is located at front and rear two adjacent LEDs Between main terminal pad, the lower surface bonding connection of bonding pad and upper substrate.

The upper circuit pack is provided with multiple blind holes, and partly or entirely LED times described terminal pad is located in blind hole respectively Bottom.

Distance between the main terminal pad left end of the LED and connection sheet left surface in left and right is H1, the main terminal pads of LED Left end is located at the right of connection sheet left surface, and the distance between the main terminal pad right-hand members of LED and connection sheet right flank in left and right is H2, The main terminal pad right-hand members of LED are located at the left side of connection sheet right flank, and H1 is more than 0, H2 and is more than 0.

Described lower wiring layer includes the multiple lower line layers being distributed up and down, is provided between two neighboring lower line layer exhausted The underlying substrate of edge material；Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, two neighboring upper wiring layer it Between be provided with insulating materials top substrate layer.

The radiator also includes multiple fin of metal material, and each described fin draws with corresponding radiating Pin integrally connected；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin.

The beneficial effects of the utility model are：Luminescence component includes LED component and upper component, and upper component includes metal Multiple connection sheets of material, upper component also include the main terminal pads of multiple LED of array distribution, and the main terminal pads of LED are arranged on company On contact pin top surface, upper component is provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is corresponding with one The main terminal pads of described LED, LED component include multiple LED monomers of array distribution, the bottom electricity of the LED chip of LED monomers Pole is fixedly connected and is electrically connected with the main terminal pad of LED, and in LED chip heat transfer to connection sheet, luminescence component also includes Lower circuit pack and radiator, lower circuit pack include the lower circuit base plate of insulating materials, lower circuit base plate with connection sheet Surface bonding connects, and lower circuit pack is provided with heat conduction groove, and the bottom land of heat conduction groove is the lower surface of connection sheet, and radiator includes There is a radiating pin for being welded on heat conduction groove, the heat in connection sheet is delivered to radiator by the pin that radiates, and then LED shows The perfect heat-dissipating of display screen, quality better, stable performance.Connecting elements includes the articulamentum of connection metal foil and insulating materials, Articulamentum is fixedly connected with being connected metal foil, and connecting elements is just stablized, and connection metal foil surface is provided with the 1st pad and the 2nd pad, 1st pad is fixedly connected and is electrically connected with the top electrodes of LED chip, and the 2nd pad is fixedly connected with LED terminal pad and electricity Property connection, the connection connected close to the LED chip that the top electrodes of LED chip be located on the LED chip length direction is golden Belong to the side of the 2nd pad of paper tinsel, connection metal foil would not block the luminous of the non-electrode place of LED chip, then LED display LED requires no solder bonds metal wire, and the tie point of LED chip and the main connection positions of LED is firm, and LED chip is with being connected metal The tie point of paper tinsel is firm, connect metal foil and LED terminal pad tie point it is firm, each LED monomer be broken it is replaceable, no Traditional LED support is needed, also helps and reduces LED chip volume, then the technique of LED display is simple, yield is high, easy Maintenance and stability are good, and LED packaging costs are greatly reduced, and LED costs are greatly reduced, LED display cost is greatly reduced, Make LED display luminous point spacing small, solving the LED of traditional LED display needs solder bonds metal wire and traditional LED Support and have that complex process, yield are low, bond wire line is not shockproof, bond wire line tie point easily disconnects, luminous point spacing Greatly, cost is high and the problem of stability difference.

Brief description of the drawings

Fig. 1 is the main structure diagram of the luminescence component for not drawing radiator of utility model embodiment 1；

Fig. 2 is the overlooking the structure diagram of the luminescence component for not drawing LED component of utility model embodiment 1；

Fig. 3 is the right side structural representation of the luminescence component for not drawing radiator of utility model embodiment 1；

Fig. 4 is the right side structural representation of the connection sheet of utility model embodiment 1；

Fig. 5 is wherein 1 LED chip of utility model embodiment 1, connecting elements and controls the right side of metal foil to show depending on structure Meaning sketch；

Fig. 6 is the overlooking the structure diagram of the LED chip in Fig. 5；

Fig. 7 is structure enlargement diagram in Fig. 2 in the range of 1 top through hole and that position is placed without chip；

Fig. 8 for do not have in Fig. 7 push up substrate have additional chip place position schematic diagram；

Fig. 9 be had additional in Fig. 8 the V-V ' after LED monomers to diagrammatic cross-section；

Figure 10 is to have additional the schematic diagram after LED chip in Fig. 8；

Figure 11 is that the schematic diagram after connection metal foil is had additional in Figure 10；

Figure 12 is the overlooking the structure diagram of the connection sheet of utility model embodiment 1；

Figure 13 is the present invention looks up structural representation of the heat conduction groove of the utility model embodiment 1；

Figure 14 is the main structure diagram of the radiator of utility model embodiment 1；

Figure 15 is the overlooking the structure diagram of the weld assembly of the utility model embodiment 2；

Figure 16 is the overlooking the structure diagram of the connection sheet of utility model embodiment 3；

Figure 17 is the overlooking the structure diagram of the LED chip of utility model embodiment 4.

Embodiment

The present embodiment is utility model preferred embodiment, other its every principle and basic structure and the present embodiment phase It is same or approximate, within the scope of utility model protection.

Embodiment 1

Institute in reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, Figure 11, Figure 12, Figure 13 and Figure 14 Show, a kind of LED display module, include luminescence component；Described luminescence component includes LED component and upper component；It is described Upper component include multiple connection sheets 21 in left-right situs, the connection sheet 21 is metal material, two neighboring connection sheet 21 electrically isolate；Described upper component also includes horizontally disposed upper circuit pack 5, and the upper circuit pack 5 includes The upper substrate 4 of line layer and insulating materials, described layer of reaching the standard grade are fixedly connected with upper substrate 4；The upper substrate 4 is positioned at layer of reaching the standard grade Lower section, the connection sheet 21 are located at the lower section of upper substrate 4, and the lower surface of the upper substrate 4 connects with the top surface bonding of connection sheet 21 Connect；Described upper component also includes the main terminal pads 22 of multiple LED of array distribution, the main companies of being arranged on of terminal pad 22 of LED On the top surface of contact pin 21, the main terminal pads 22 of LED are fixedly connected and are electrically connected with connection sheet 21；Described upper component is provided with battle array Multiple LED putting holes 6 of column distribution, the bottom of each LED putting hole 6 are correspondingly provided with the main connections of LED described in one Disk 22；Described LED component includes multiple LED monomers of array distribution, and multiple LED monomers are separately fixed at described LED In main terminal pad 22, described LED monomers terminal pad 22 main with LED corresponds；The layer of reaching the standard grade includes in tandem It is a plurality of first control metal foil 71, the layer of reaching the standard grade also include in tandem it is a plurality of second control metal foil 72, it is described on Line layer also includes a plurality of 3rd control metal foil in tandem, and the first control metal foil 71 and second controls metal foil 72 are respectively equipped with LED terminal pad 8, and the 3rd control metal foil is provided with described LED terminal pad 8；The main connections of LED Position of the position of disk 22 less than LED terminal pad 8.

The main terminal pads 22 of LED are turmeric pad, and the main terminal pads 22 of LED are arranged on the top surface of connection sheet 21, The main terminal pads 22 of LED are not belonging to connection sheet 21.The top surface of the connection sheet 21 includes multiple bonding pads in tandem 212, bonding pad 212 is located between the main terminal pad 22 of front and rear two adjacent LEDs, and bonding pad 212 and the lower surface of upper substrate 4 bond Connection.

1 LED monomer is the LED of 1 pixel, LED monomer spacing 0.1-5 millimeters, i.e. pel spacing 0.1-5 millimeters.

Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes 51, chip Main body 52 and bottom electrode 53；The terminal pad 22 main with LED of bottom electrode 53 of the LED chip is fixedly connected and is electrically connected with； The connecting elements includes the articulamentum 502 of connection metal foil 50 and insulating materials, and the articulamentum 502 is with being connected metal foil 50 are fixedly connected；Connection metal foil 50 surface is provided with the top of the 1st pad and the 2nd pad, the 1st pad and LED chip Portion's electrode 51 is fixedly connected and is electrically connected with；2nd pad is fixedly connected and is electrically connected with LED terminal pad 8；It is described The top electrodes 51 of LED chip are located at the connection metal foil 50 connected close to the LED chip on the LED chip length direction The 2nd pad side；Each described LED monomer includes 3 LED chips, be respectively the first color LED chip, Second color LED chip and the 3rd color LED chip；First color LED chip of the multiple LED monomers being arranged in a row in left and right It is electrically connected with 1 first control metal foil 71；The the second color LED chip and 1 for the multiple LED monomers being arranged in a row in left and right Bar second controls metal foil 72 to be electrically connected with；3rd color LED chip of the multiple LED monomers being arranged in a row in left and right with 1 article 3rd control metal foil is electrically connected with.

The luminescence component also includes lower circuit pack 35, radiator and control integrated package 34, the radiator and is located at The lower section of lower circuit pack 35, the radiator are fixedly connected with lower circuit pack 35；Described lower circuit pack 35 includes The lower circuit base plate 30 of lower wiring layer 36 and insulating materials, the lower wiring layer 36 are fixedly connected with lower circuit base plate 30；It is described Integrated package 34 is controlled to be arranged on the lower surface of lower wiring layer 36；The lower circuit base plate 30 is located at the lower section of connection sheet 21, described Lower wiring layer 36 is located at the lower section of lower circuit base plate 30, and the lower circuit base plate 30 connects with the bonding of the lower surface of connection sheet 21；Institute State lower circuit pack 35 and be provided with multiple heat conduction grooves 78, Open Side Down for the heat conduction groove 78, the bottom land of the heat conduction groove 78 For the lower surface of connection sheet 21；The radiator includes the multiple radiating pins for the metal material being welded at heat conduction groove 78 701；Each described connection sheet 21 is corresponding with 1 heat conduction groove 78 described above；Corresponding 1 of each described connection sheet 21 with The upper radiating pin 701；The rear and front end distance of the heat conduction groove 78 is H3, the left and right ends of the heat conduction groove 78 away from It is more than H4 from for H4, H3.The luminescence component also includes the main control integrated package for being separately mounted to the lower lower surface of wiring layer 36 28 and lead socket 58, the control integrated package 34, which passes through, is arranged on leading among the main terminal pads 22 of four LED that two rows two arrange Electric hole is electrically connected with LED terminal pad 8, and main control integrated package 28 is electrically connected with connection sheet 21.

The radiator also includes multiple fin 702 of metal material, each described fin 702 with it is corresponding Radiate the integrally connected of pin 701；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin 702 703。

The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet 21.

Described luminescence component also includes top layer 10；The top layer 10 includes the top line roadbed of the black of insulating materials Plate；The top layer 10 is provided with top layer hole 62；The top layer hole 62 is more than in the surface of LED putting holes 6, the top layer hole 62 LED putting holes 6；The top layer hole 62 makes LED terminal pad 8 not blocked by top layer 10.

Distance between the main left end of terminal pad 22 of the LED and the left surface of connection sheet 21 in left and right is H1, the main companies of LED The right that the left end of disk 22 is located at the left surface of connection sheet 21 is connect, on a left side between the main right-hand members of terminal pad 22 of LED and the right flank of connection sheet 21 Right distance is H2, and the main right-hand members of terminal pad 22 of LED are located at the left side of the right flank of connection sheet 21, and H1 is more than 0, H2 and is more than 0.

The height of the connection sheet 21 is 10 microns to 3 millimeters.The LED monomers, which also include, encases LED chip, connection The Protection glue of metal foil 50 and LED terminal pad 8, Protection glue belong to more than one of silica gel and epoxy resin.

The upper circuit pack 5 is provided with the interstitial hole 63 directly over LED putting holes 6, interstitial hole 63 be square opening or Circular port, the horizontal section area of interstitial hole 63 are more than the horizontal section area of LED putting holes 6；The bottom of interstitial hole 63 is provided with Chip places position 42, and chip places position of the position higher than the main terminal pads 22 of LED of position 42, and chip places position 42 and blocked LED Chip makes LED chip terminal pad 22 main with LED not contact, and LED chip is placed on chip and placed on position 42.

The upper circuit pack 5 also includes the upper circuit base plate 2 of wiring layer 1, middle wiring layer 3 and insulating materials；Institute The lower surface and the bonding of upper circuit base plate 2 for stating wiring layer 1 connect, and the lower surface of the upper circuit base plate 2 and middle wiring layer 3 are viscous Close connection；Described upper circuit pack 5 also includes the tertiary circuit substrate 40 of the 3rd wiring layer 41 and insulating materials, described Chip is placed position 42 and is arranged on the 3rd wiring layer 41；The lower surface of the middle wiring layer 3 is viscous with tertiary circuit substrate 40 Close connection, the bonding of the lower surface of the tertiary circuit substrate 40 and the 3rd wiring layer 41 connects, the 3rd wiring layer 41 with it is upper The upper surface bonding connection of substrate 4.The upper wiring layer 1 includes a plurality of first control metal foil 71, and the middle wiring layer 3 wraps A plurality of second control metal foil 72 and a plurality of 3rd control metal foil are included.

Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, and insulation is provided between two neighboring upper wiring layer The top substrate layer of material, the upper wiring layer 1 and middle wiring layer 3 belong to described upper wiring layer, and upper circuit base plate 2 belongs to described Top substrate layer.

Described upper component also includes control metal foil 7, and the described first control metal foil 71, second controls metal foil 72 and the 3rd control metal foil to belong to described control metal foil 7.

Described upper circuit pack 5 also includes the top substrate 9 of insulating materials, pushes up the lower surface of substrate 9 and upper wiring layer 1 Upper surface be fixedly connected.The LED monomers also include electric conductor, and the connection metal foil 50 passes through electric conductor and LED times Terminal pad 8 connects.In order to eliminate the influence of the difference in height of 3 LED terminal pads 8 corresponding to 3 LED chips, and in order to limit The scope of conductive body, blind hole, each LED terminal pad 8 are respectively equipped with corresponding to each LED monomer at each LED terminal pad 8 Place is located at the inner bottom part of blind hole respectively, and blind hole has spacing not connect with LED putting holes 6.The electric conductor is located in blind hole, Blind hole is divided into the first hole 91, the second hole 92 and the 3rd hole 93.It can not also set or set blind hole less, blind hole can also place with LED Hole 6 connects.For the ease of laser boring, there is rounding 90 at the 3rd 93 4 jiaos of hole（Other various holes can also have rounding）.

The main terminal pads 22 of LED, LED terminal pad 8, the 1st pad and the 2nd pad are turmeric pad, gold plated pads, plating silver soldering One or more among disk, alloy pad, five kinds of spray soldering disk,

Connecting elements is obtained by circuit board technique, and the connection metal foil 50 of connecting elements is copper foil layer, the company of insulating materials Connect layer 502 and use FPC sheet material, the articulamentum 502 connects with being connected the bonding of metal foil 50, is advantageous to connect metal Paper tinsel 50 is easy to operation in process of production and to stablize connection metal foil 50 indeformable.

LED chip uses the LED chip of vertical stratification, and LED chip rectangle, the top electrodes 51 of LED chip, which are located at, to be leaned on The side of nearly LED terminal pad 8, connecting elements would not block the luminous of the non-electrode place of LED chip.Top electrodes 51 pass through altogether Brilliant technique or soldering tin technique are fixedly connected with connecting elements, or top electrodes 51 pass through ultrasonic welding process and connecting elements It is fixedly connected, requires no solder bonds wire, the area of required top electrodes 51 is smaller, is easy to reduce the body of LED chip Product, beneficial to the cost for reducing LED chip.

Described upper component also includes the insulator 271 or collets being arranged between two neighboring connection sheet 21.

Using four kinds of the soldering tin technique containing Reflow Soldering, eutectic welding procedure, ultrasonic welding process and dispensing die bond technique Among more than a kind of technique, connection metal foil 50 is fixedly connected with corresponding LED top electrodes 51 and secondary terminal pad 8, It is fixedly connected with the terminal pad 22 main with LED of LED bottom electrodes 53.

Described upper circuit group, connection sheet 21 and lower circuit pack 35 and the connection between them all mainly uses circuit Plate technique obtains（Containing printed circuit technology and printed substrate technique）, the copper foil of wiring board can be with turmeric, gold-plated, silver-plated and spray Tin etc. is surface-treated.Described connection sheet 21 is copper foil layer, and the upper circuit pack 5, connection sheet 21 and lower circuit pack 35 are viscous After conjunction, laser gets the hole LED putting holes 6 at circuit pack 5 on described, then connects corresponding to the bottom hole in LED putting holes 6 The top surface turmeric of contact pin 21 obtains the main terminal pads 22 of LED.

In actual use, when LED display, which is erect, to be set, this is now defined as in front of the light-emitting area of LED display The upper direction of text, the bonnet direction of LED display are defined as this paper lower direction, i.e., being defined as this paper's in front of LED display Top, LED display rear are defined as this paper lower section, the length direction rule of the connection sheet 21 of luminescence component in LED display It is set to this paper fore-and-aft direction, the orientation of the connection sheet 21 in LED display in the upper component of 1 of luminescence component is defined as This paper left and right directions, now the light-emitting area of LED display be defined as this paper horizontal plane or the horizontal plane close to this paper.

Because the luminescence component includes LED component and upper component, upper component includes multiple connections of metal material Piece 21, upper component also include the main terminal pads 22 of multiple LED of array distribution, and the main terminal pads 22 of LED are arranged on connection sheet 21 and pushed up On face, upper component is provided with multiple LED putting holes 6 of array distribution, and the bottom of each LED putting hole 6 is corresponding with described in one The main terminal pads 22 of LED, LED component includes multiple LED monomers of array distribution, the bottom electrode of the LED chip of LED monomers 53 terminal pads 22 main with LED are fixedly connected and are electrically connected with, and in LED chip heat transfer to connection sheet 21, luminescence component also wraps Lower circuit pack 35 and radiator are included, lower circuit pack 35 includes the lower circuit base plate 30 of insulating materials, lower circuit base plate 30 connect with the bonding of the lower surface of connection sheet 21, and lower circuit pack 35 is provided with heat conduction groove 78, and the bottom land of heat conduction groove 78 is connection The lower surface of piece 21, radiator include the radiating pin 701 being welded at heat conduction groove 78, and the heat in connection sheet 21 passes through Radiating pin 701 is delivered to radiator, then the perfect heat-dissipating of LED display, quality better, stable performance.

Because the connecting elements includes the articulamentum 502 of connection metal foil 50 and insulating materials, articulamentum 502 is with connecting Connect metal foil 50 to be fixedly connected, connecting elements is just stablized, and connection metal foil 50 surface is provided with the 1st pad and the 2nd pad, the 1st weldering Disk is fixedly connected and is electrically connected with the top electrodes 51 of LED chip, and the 2nd pad is fixedly connected and electrically with LED terminal pad 8 Connection, the top electrodes 51 of LED chip are located at the connection connected close to the LED chip the gold on the LED chip length direction Belong to the side of the 2nd pad of paper tinsel 50, connection metal foil 50 would not block the luminous of the non-electrode place of LED chip, and then LED is shown The LED of screen requires no solder bonds metal wire, and the tie point of LED chip and the main connection positions of LED is firm, and LED chip is with being connected The tie point of metal foil 50 is firm, and the tie point of connection metal foil 50 and LED terminal pad 8 is firm, and each LED monomer is broken It is replaceable, it is not necessary to traditional LED support, to also help and reduce LED chip volume, then the technique of LED display is simple, good Rate is high, easily maintenance and stability are good, and LED packaging costs are greatly reduced, and LED costs are greatly reduced, LED is greatly reduced and shows Display screen cost, solving the LED of traditional LED display needs solder bonds metal wire and traditional LED support and technique be present It is complicated, yield is low, bond wire line is not shockproof, bond wire line tie point easily disconnects, luminous point spacing is big, cost is high and stably The problem of property difference.

Embodiment 2

Embodiment 2 is similar to Example 1, shown in reference picture 15, for the ease of production, using weld assembly, welding group Part includes welding matrix 503 and multiple connecting elements, welds and is provided with the 1st connector 505 or the between matrix 503 and connecting elements The 1st connector 505 and the 2nd connector 506 are provided between 2 connectors 506, or welding matrix 503 and connecting elements, welds base Body 503 is fixedly connected by the 1st connector 505 and the one of both of the 2nd connector 506 or both with multiple connecting elements respectively. Weld assembly is provided with matrix hole 504, and matrix hole 504 is easy to the movement and positioning of weld assembly in production.

Weld assembly is obtained by circuit board technique, and connection metal foil 50 is copper foil layer, and the articulamentum 502 of insulating materials uses FPC sheet material, the 1st connector 505, the 2nd connector 506 and welding matrix 503 use the FPC of insulating materials Sheet material.

Embodiment 3

Embodiment 3 is similar to Example 1, shown in reference picture 16, main difference be connection sheet 21 left side or right side One of or the left and right sides be provided with multiple breach 215, breach 215 is located between front and rear two neighboring main terminal pad 22, and left and right is adjacent The breach 215 of two connection sheets 21 is oppositely arranged.

Embodiment 4

Embodiment 4 is similar to Example 1, shown in reference picture 17, it is huge be not the position of LED chip top electrodes 51 not Together.In order to not have the electric conductor of spilling after the welding of top electrodes 51 and connecting elements（The electric conductor of spilling easily makes LED Chip short circuit or electric leakage）, top electrodes 51 four in outer rim four less than the LED chip top surface outer rim.

Embodiment 4 and embodiment 1 it is other it is huge be not that the upper circuit pack 5 does not set chip and places position 42, the LED chip It is fixed on by glue in main terminal pad 22.Described lower wiring layer includes the multiple lower line layers being distributed up and down；It is described offline Road component 35 also includes the underlying substrate of the insulating materials between two neighboring lower line layer, i.e., described lower circuit pack 35 be multilayer circuit board.

Embodiment 5

Embodiment 5 is similar to Example 1, and mainly huge is not that the main terminal pad 22 belongs to the connection sheet 21, the company The bonding pad 212 of the top surface of contact pin 21 and main terminal pad 22 are all electrodeposited coatings.The bottom of each LED putting hole 6 is corresponding If the main terminal pads 22 of LED described in one, the main terminal pads 22 of described LED belong to the bottom of LED putting holes 6.Connect described in production Contact pin 21 is first electroplated, and then connection sheet 21 bonds with the upper circuit pack 5 and lower circuit pack 35 again.

Claims (10)

1. a kind of LED display module, includes luminescence component；It is characterized in that：Described luminescence component include LED component and Upper component；Described upper component includes multiple connection sheets of left-right situs, and the connection sheet is metal material, described in each Connection sheet is provided with the main terminal pads of multiple LED in tandem；Described upper component also includes horizontally disposed upper circuit group Part, the upper circuit pack include the upper substrate of reach the standard grade layer and insulating materials, and described layer of reaching the standard grade is fixedly connected with upper substrate； The upper substrate is located at the lower section for layer of reaching the standard grade, and the connection sheet is located at the top of the lower section of upper substrate, the upper substrate and connection sheet Face bonding connection；Described upper component is provided with multiple LED putting holes of array distribution, the bottom of each LED putting hole It is corresponding with the main terminal pads of LED described in 1；Described LED component includes multiple LED monomers of array distribution, each institute LED monomers are stated to be fixed in corresponding 1 main terminal pad of LED；The layer of reaching the standard grade includes a plurality of first control in tandem Metal foil, the layer of reaching the standard grade also include a plurality of second control metal foil in tandem, and the layer of reaching the standard grade also includes front and rear The a plurality of 3rd control metal foil of arrangement, the first control metal foil and the second control metal foil are respectively equipped with LED connection Disk, the 3rd control metal foil are provided with LED times described terminal pad；Less than the LED times connection in the position of the main terminal pads of LED The position of disk；Described LED monomers include LED chip and connecting elements, and the LED chip includes top electrodes and bottom Portion's electrode；The bottom electrode of the LED chip is fixedly connected and is electrically connected with the main terminal pads of LED；The connecting elements includes There is the articulamentum of connection metal foil and insulating materials, the articulamentum is fixedly connected with being connected metal foil；The connection metal foil Surface is provided with the 1st pad and the 2nd pad, and the 1st pad is fixedly connected and is electrically connected with the top electrodes of LED chip；Institute The 2nd pad is stated to be fixedly connected and be electrically connected with LED terminal pad.

2. a kind of LED according to claim 1 display module, it is characterized in that：The luminescence component also includes offline Road component, radiator and control integrated package, the radiator are located at the lower section of lower circuit pack, the radiator and lower circuit group Part is fixedly connected；Described lower circuit pack includes the lower circuit base plate of lower wiring layer and insulating materials, the lower wiring layer It is fixedly connected with lower circuit base plate；The control integrated package is arranged on the lower surface of lower wiring layer；The lower circuit base plate is located at The lower section of connection sheet, the lower wiring layer are located at the lower section of lower circuit base plate, and the lower circuit base plate glues with connection sheet lower surface Close connection；The lower circuit pack is provided with multiple heat conduction grooves, and the heat conduction slot opening is downward, the bottom land of the heat conduction groove For the lower surface of connection sheet；The radiator includes the multiple radiating pins for the metal material for being welded on heat conduction groove；Often One connection sheet is corresponding with 1 heat conduction groove described above；Corresponding 1 radiating described above of each described connection sheet is drawn Pin.

3. a kind of LED according to claim 2 display module, it is characterized in that：The rear and front end of the heat conduction groove away from From for H3, the left and right ends distance of the heat conduction groove is H4, and H3 is more than H4.

4. a kind of LED according to claim 1 display module, it is characterized in that：Described luminescence component also includes top Layer；The top layer includes the top line base board of the black of insulating materials；The top layer is provided with top layer hole；The top layer hole exists The surface of LED putting holes, the top layer hole are more than LED putting holes.

5. a kind of LED according to claim 1 display module, it is characterized in that：The upper circuit pack, which is provided with, is located at LED Interstitial hole directly over putting hole, the horizontal section area of the interstitial hole are more than the horizontal section area of LED putting holes；It is described The bottom of interstitial hole is provided with chip and places position, and chip places position of the position higher than the main terminal pads of LED of position, and LED chip is fixed Placed in chip on position；The upper circuit pack also includes the middle line layer with the bonding connection of upper substrate upper surface；In described Line layer is provided with described chip and places position.

6. a kind of LED according to claim 1 display module, it is characterized in that：The upper circuit pack is provided with multiple blind Hole, part or all of LED times described terminal pad are located at blind hole inner bottom part respectively.

7. a kind of LED according to claim 1 display module, it is characterized in that：The top electrodes of the LED chip are located at The side of 2nd pad of the connection metal foil connected close to the LED chip on the LED chip length direction.

8. a kind of LED according to claim 1 display module, it is characterized in that：Before the top surface of the connection sheet includes The multiple bonding pads arranged afterwards, bonding pad are located between the main terminal pad of front and rear two adjacent LEDs, the following table of bonding pad and upper substrate Face bonding connection.

9. a kind of LED according to claim 2 display module, it is characterized in that：The radiator also includes metal material Multiple fin of matter, each described fin and corresponding radiating pin integrally connected；The radiator also includes use In the radiating piece of the insulating materials of the multiple fin of fixation.

10. a kind of LED according to claim 1 display module, it is characterized in that：Each described LED monomer includes 3 The individual LED chip, it is the first color LED chip, the second color LED chip and the 3rd color LED chip respectively；Line up left and right First color LED chip of multiple LED monomers of one row is electrically connected with 1 first control metal foil；What left and right was arranged in a row Second color LED chip of multiple LED monomers is electrically connected with 1 second control metal foil；Multiple LED that left and right is arranged in a row 3rd color LED chip of monomer is electrically connected with 1 article of the 3rd control metal foil.