CN207115898U

CN207115898U - A kind of LED display module

Info

Publication number: CN207115898U
Application number: CN201720807845.0U
Authority: CN
Inventors: 邹志峰
Original assignee: Individual
Current assignee: Individual
Priority date: 2016-07-05
Filing date: 2017-07-05
Publication date: 2018-03-16
Anticipated expiration: 2027-07-05
Also published as: CN207115897U

Abstract

A kind of LED display module, it is related to LED encapsulation and LED display technical field, solves the problems, such as that traditional LED display has heat dispersion difference and needs LED support.Upper circuit pack including the LED component containing LED monomers, containing layer of reaching the standard grade and the multiple connection sheets arranged in the lateral direction, connection sheet is provided with multiple recessed cups to lower recess, the inner bottom part of recessed cup is provided with 1 main terminal pad of LED, LED monomers are fixed in the main terminal pads of corresponding LED, upper circuit pack is provided with multiple LED putting holes corresponding with recessed cup, LED chip is fixed in the main terminal pads of LED, and LED chip is electrically connected with by wire and layer of reaching the standard grade.It can not have to LED support in display screen of the present utility model production, the cost of LED and display screen is greatly reduced, LED display luminous point spacing is small, brightness is high, perfect heat-dissipating and stable performance.

Description

A kind of LED display module

Technical field

LED encapsulation and LED display technical field are the utility model is related to, LED encapsulation belongs to semiconductor technology.

Background technology

LED is the light emitting diode that LED chip encapsulation forms.LED display is installed in the circuit board simultaneously by multiple LED And by the directly luminous display screens for forming image of LED（There is other control LED electronic component on wiring board）.Existing LED Display screen uses PCB, and multiple LED are provided with the upper surface of PCB, is installed in the lower surface of PCB There is multiple control LED integrated package, PCB does not have radiator structure, and the thermal diffusivity of PCB is very poor, then existing LED and LED display weak heat-dissipating, poor quality, stability are poor；LED branch is needed in the LED production processes of existing LED display Frame, LED support include straight cutting LED support and paster LED bracket, and LED support cost is high, and LED support is by die bond, welding key Unnecessary part is cut after closing metal wire and sealing（That is cutting technique）, LED production costs are high, and LED costs are high, LED display Cost is high, and existing outdoor LED display screen has the problem of luminous point spacing is big, cost is high, radiating is bad and performance is unstable.

The content of the invention

There is the problem of needing straight cutting LED support or paster LED bracket in the LED of existing LED display, existing LED is shown There is the problem of cost high and stability difference in screen, and existing LED display has wiring board does not have radiator structure and weak heat-dissipating The problem of, the problem of luminous point spacing is big be present in existing outdoor LED display screen.The utility model is in order to solve above-mentioned ask Topic, proposes a kind of LED display module, the technical solution adopted in the utility model is：

A kind of LED display module, includes luminescence component；Described luminescence component includes LED component and upper component； Described upper component includes multiple connection sheets of left-right situs, and the connection sheet is metal material；Described upper component also wraps Horizontally disposed upper circuit pack is included, the upper circuit pack includes the upper substrate of reach the standard grade layer and insulating materials, described Layer of reaching the standard grade is fixedly connected with upper substrate；The upper substrate is located at the lower section for layer of reaching the standard grade, and the connection sheet is located at the lower section of upper substrate； Each described connection sheet is provided with multiple recessed cups to lower recess in tandem, and the inner bottom part of each recessed cup is provided with 1 The individual main terminal pads of LED；The top surface of each connection sheet includes multiple bonding pads outside recessed cup, the upper substrate The bonding of lower surface and multiple bonding pads connect；Described upper component is provided with multiple LED putting holes of array distribution, each institute The bottom for stating LED putting holes is corresponding with recessed cup described in 1；Multiple LED that described LED component includes array distribution are mono- Body, each described LED monomer are fixed in corresponding 1 main terminal pad of LED；The layer of reaching the standard grade includes in tandem more Bar first controls metal foil, and the layer of reaching the standard grade also includes a plurality of second control metal foil in tandem, described to reach the standard grade layer also Include a plurality of 3rd control metal foil in tandem, the first control metal foil and the second control metal foil are respectively equipped with LED terminal pad, the 3rd control metal foil are provided with LED times described terminal pad；The position of the main terminal pads of LED is less than The position of LED terminal pad.

Described LED monomers include LED chip, and the LED chip is electrical by bonding wire and LED terminal pad Connection；The LED chip is fixed in the main terminal pads of LED by glue, and the LED chip is electrically connected with the main terminal pads of LED；Often One LED monomer includes 3 LED chips, is the first color LED chip, the second color LED chip and respectively Three color LED chips；First color LED chip of multiple LED monomers that left and right is arranged in a row and 1 first control metal foil electricity Property connection；Second color LED chip of multiple LED monomers that left and right is arranged in a row is electrically connected with 1 second control metal foil； 3rd color LED chip of multiple LED monomers that left and right is arranged in a row is electrically connected with 1 article of the 3rd control metal foil.

The luminescence component also includes lower circuit pack, and described lower circuit pack includes lower wiring layer and insulation material The lower circuit base plate of material, the lower wiring layer are fixedly connected with lower circuit base plate；The lower circuit base plate is located under connection sheet Side, the lower wiring layer are located at the lower section of lower circuit base plate, and the upper surface of the lower circuit base plate and the lower surface of connection sheet are glued Close connection.

The luminescence component also includes radiator and control integrated package, and the radiator is located under lower circuit pack Side, the radiator are fixedly connected with lower circuit pack；The control integrated package is arranged on the lower surface of lower wiring layer；Under described Circuit pack is provided with multiple heat conduction grooves, and the heat conduction slot opening is downward, and the bottom land of the heat conduction groove is under connection sheet Surface；The radiator includes the multiple radiating pins for the metal material for being welded on heat conduction groove；Each described connection Piece is corresponding with 1 heat conduction groove described above；The corresponding 1 radiating pin described above of each described connection sheet.

The luminescence component also includes vertically arranged perpendicular circuit pack and main integrated package；The main integrated package is arranged on The surface of perpendicular circuit pack；The main integrated package is electrically connected with connection sheet.

Described luminescence component also includes top layer；The top layer includes the top line base board of the black of insulating materials； The top layer is provided with top layer hole；The top layer hole is more than LED putting holes in the surface of LED putting holes, the top layer hole.

The upper circuit pack is provided with multiple blind holes, and partly or entirely LED times described terminal pad is located in blind hole respectively Bottom.

The distance of left and right be H1 between the main terminal pad left end of the LED and connection sheet left surface, and main connect of the LED is faced left End is positioned at the right of connection sheet left surface, and the distance of left and right is H2, LED between the main terminal pad right-hand members of LED and connection sheet right flank Main terminal pad right-hand member is located at the left side of connection sheet right flank, and H1 is more than 0, H2 and is more than 0.

Described lower wiring layer includes the multiple lower line layers being distributed up and down, is provided between two neighboring lower line layer exhausted The underlying substrate of edge material；Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, two neighboring upper wiring layer it Between be provided with insulating materials top substrate layer.

The rear and front end distance of the heat conduction groove is H3, and the left and right ends distance of the heat conduction groove is H4, and H3 is more than H4。

The radiator also includes multiple fin of metal material, and each described fin draws with corresponding radiating Pin integrally connected；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin.

The lower circuit base plate is provided with multiple glasss of putting holes of array distribution, and the outer bottom of the recessed cup described in each is put into Into corresponding 1 cup putting hole.

The beneficial effects of the utility model are：Luminescence component includes LED component and upper component, and upper component includes metal Multiple connection sheets of material, the top surface of each connection sheet are recessed formed with multiple recessed cups, each described recessed cup downwards Inner bottom part be provided with 1 main terminal pad of LED, upper component is provided with multiple LED putting holes of array distribution, and each described LED is put The bottom for putting hole is corresponding with recessed cup described in 1, and LED component includes multiple LED monomers of array distribution, described in each LED monomers be fixed on corresponding in main terminal pads of LED described in 1, the LED chip of LED monomers is fixed on the main terminal pads of LED On, in LED chip heat transfer to connection sheet, luminescence component also includes lower circuit pack and radiator, lower circuit pack bag The lower circuit base plate of insulating materials is included, lower circuit base plate connects with the bonding of connection sheet lower surface, and lower circuit pack is provided with heat conduction Groove, the bottom land of heat conduction groove are the lower surface of connection sheet, and radiator includes the radiating pin for being welded on heat conduction groove, even Heat in contact pin is delivered to radiator by the pin that radiates, and then the perfect heat-dissipating of LED display, quality better, performance are steady It is fixed.LED chip is electrically connected with by bonding wire and LED terminal pad, and LED chip is fixed on the main terminal pads of LED by glue On, it is not necessary to traditional LED support, then the cost of LED display be greatly reduced, be advantageous to LED display luminous point spacing Do small, LED chip is reflective by recessed cup, improves LED display luminosity, the hair for solving traditional outdoor LED display screen The problem of luminous point spacing is big, cost is high, radiating is bad and performance is unstable.

Brief description of the drawings

Fig. 1 is the main structure diagram of the luminescence component for not drawing radiator of utility model embodiment 1；

Fig. 2 is the overlooking the structure diagram of the luminescence component for not drawing LED component of utility model embodiment 1；

Fig. 3 is the right side structural representation of the luminescence component for not drawing radiator of utility model embodiment 1；

Fig. 4 is the overlooking the structure diagram of the connection sheet of utility model embodiment 1；

Fig. 5 is the main structure diagram of the connection sheet of utility model embodiment 1；

Fig. 6 is structure enlargement diagram in Fig. 2 in the range of 1 top through hole and that position is placed without chip；

Fig. 7 is the present invention looks up structural representation of the heat conduction groove of the utility model embodiment 1；

Fig. 8 is the main structure diagram of the radiator of utility model embodiment 1.

Embodiment

The present embodiment is the utility model preferred embodiment, its other every principle and basic structure and the present embodiment It is identical or approximate, within scope of protection of the utility model.

Embodiment 1

Shown in reference picture 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7 and Fig. 8, a kind of LED display module, include hair Optical assembly；Described luminescence component includes LED component and upper component；Described upper component includes multiple companies of left-right situs Contact pin 21, the connection sheet 21 are metal material, and the two neighboring connection sheet 21 in left and right electrically isolates；Described upper component also includes There is horizontally disposed upper circuit pack 5, the upper circuit pack 5 includes the upper substrate 4 of reach the standard grade layer and insulating materials, described Layer of reaching the standard grade is fixedly connected with upper substrate 4；The upper substrate 4 is located at the lower section for layer of reaching the standard grade, and the connection sheet 21 is located at upper substrate 4 Lower section, lower surface and the bonding of connection sheet 21 of the upper substrate 4 connect；Each described connection sheet 21 is provided with to the more of lower recess Individual recessed cup 223, in tandem, the inner bottom part of each recessed cup 223 is provided with the main terminal pads 22 of 1 LED to multiple recessed cups；It is described Upper component be provided with array distribution multiple LED putting holes 6, the bottom of each LED putting hole 6 is corresponding with described in 1 Recessed cup 223；Described LED component includes multiple LED monomers of array distribution, and multiple LED monomers are separately fixed at described The main terminal pads 22 of LED on, described LED monomers terminal pad 22 main with LED corresponds；The layer of reaching the standard grade includes front and rear row Row it is a plurality of first control metal foil, the layer of reaching the standard grade also include in tandem it is a plurality of second control metal foil, it is described on Line layer also includes a plurality of 3rd control metal foil in tandem, the first control metal foil and the second control metal foil point Not She You LED terminal pad 8, it is described 3rd control metal foil be provided with described LED terminal pad 8；The main terminal pads 22 of LED Position less than LED terminal pad 8 position.

Described LED monomers include LED chip, and the LED chip passes through bonding wire and the LED electricity of terminal pad 8 Property connection；The LED chip is fixed in the main terminal pads of LED by glue, and LED chip terminal pad 8 main with LED electrically connects Connect；Each described LED monomer includes 3 LED chips, is the first color LED chip, the second color LED core respectively Piece and the 3rd color LED chip；First color LED chip of multiple LED monomers that left and right is arranged in a row and 1 first control gold Belong to paper tinsel to be electrically connected with；Second color LED chip of multiple LED monomers that left and right is arranged in a row and 1 second control metal foil electricity Property connection；3rd color LED chip of multiple LED monomers that left and right is arranged in a row is electrically connected with 1 article of the 3rd control metal foil.

The main terminal pads 22 of LED are pad；The top surface of each connection sheet 21 includes any front and rear adjacent two Bonding pad 210 between individual recessed cup 223, bonding pad 210 belong to the top surface of connection sheet 21, bonding pad 210 and the following table of upper substrate 4 Face bonding connection.Each bonding pad area is more than 1/5th of the main areas of terminal pad 22 of LED.

1 LED monomer is the LED of 1 pixel, LED monomer spacing 0.1-5 millimeters, i.e. pel spacing 0.1-5 millimeters.

The luminescence component also includes lower circuit pack 35, radiator and control integrated package 34, the radiator and is located at The lower section of lower circuit pack 35, the radiator are fixedly connected with lower circuit pack 35；Described lower circuit pack 35 includes The lower circuit base plate 30 of lower wiring layer 36 and insulating materials, the lower wiring layer 36 are fixedly connected with lower circuit base plate 30；It is described Integrated package 34 is controlled to be arranged on the lower surface of lower wiring layer 36；The lower circuit base plate 30 is located at the lower section of connection sheet 21, described Lower wiring layer 36 is located at the lower section of lower circuit base plate 30, and the lower circuit base plate 30 connects with the bonding of the lower surface of connection sheet 21；Institute State lower circuit pack 35 and be provided with multiple heat conduction grooves 78, Open Side Down for the heat conduction groove 78, the bottom land of the heat conduction groove 78 For the lower surface of connection sheet 21；The radiator includes the multiple radiating pins for the metal material being welded at heat conduction groove 78 701；Each described connection sheet 21 is corresponding with 1 heat conduction groove 78 described above；Corresponding 1 of each described connection sheet 21 with The upper radiating pin 701；The rear and front end distance of the heat conduction groove 78 is H3, the left and right ends of the heat conduction groove 78 away from It is more than H4 from for H4, H3.The luminescence component also includes the main control integrated package for being separately mounted to the lower lower surface of wiring layer 36 28 and lead socket 58, the control integrated package 34, which passes through, is arranged on leading among the main terminal pads 22 of four LED that two rows two arrange Electric hole is electrically connected with LED terminal pad 8, and main control integrated package 28 is electrically connected with connection sheet 21.

The radiator also includes multiple fin 702 of metal material, each described fin 702 with it is corresponding Radiate the integrally connected of pin 701；The radiator also includes the radiating piece of the insulating materials for fixing multiple fin 702 703。

Described luminescence component also includes top layer 10；The top layer 10 includes the top line roadbed of the black of insulating materials Plate；The top layer 10 is provided with top layer hole 62；The top layer hole 62 is more than in the surface of LED putting holes 6, the top layer hole 62 LED putting holes 6；The top layer hole 62 makes LED terminal pad 8 not blocked by top layer 10.

The distance of left and right is H1 between the main left end of terminal pad 22 of the LED and the left surface of connection sheet 21, the main connections of LED The left end of disk 22 is located at the right of the left surface of connection sheet 21, left and right between the main right-hand members of terminal pad 22 of LED and the right flank of connection sheet 21 Distance is H2, and the main right-hand members of terminal pad 22 of LED are located at the left side of the right flank of connection sheet 21, and H1 is more than 0, H2 and is more than 0.

The height of the connection sheet 21 is 10 microns to 3 millimeters.The LED monomers, which also include, encases LED chip and LED The Protection glue of secondary terminal pad 8, Protection glue belong to more than one of silica gel and epoxy resin.

The upper circuit pack 5 also includes the upper circuit base plate 2 of wiring layer 1, middle wiring layer 3 and insulating materials；Institute The lower surface and the bonding of upper circuit base plate 2 for stating wiring layer 1 connect, and the lower surface of the upper circuit base plate 2 and middle wiring layer 3 are viscous Close connection.

Described layer of reaching the standard grade includes the multiple upper wiring layers being distributed up and down, and insulation is provided between two neighboring upper wiring layer The top substrate layer of material, the upper wiring layer 1 and middle wiring layer 3 belong to described upper wiring layer, and upper circuit base plate 2 belongs to described Top substrate layer.

Described upper component also includes control metal foil, the described first control metal foil, the second control metal foil and 3rd control metal foil belongs to described control metal foil.

Described upper component also includes the insulator 271 or collets being arranged between two neighboring connection sheet 21.

Described upper circuit group, connection sheet 21 and lower circuit pack 35 and the connection between them all mainly uses circuit Plate technique obtains（Containing printed circuit technology and printed substrate technique）, the copper foil of wiring board can be with turmeric, gold-plated, silver-plated and spray Tin etc. is surface-treated.Using one piece of sheet metal, multiple connection sheets 21 are isolated after stamped, while taken at connection sheet 21 Obtain described recessed cup 223（By punching press）.

After the upper circuit pack 5, connection sheet 21 and the bonding of lower circuit pack 35, the laser at circuit pack 5 on described Get the hole LED putting holes 6, then turmeric at the recessed cup 223 of connection sheet 21 corresponding to the bottom hole in LED putting holes 6, it is gold-plated and One of silver plating process obtains the main terminal pads 22 of LED.

The lower circuit base plate 30 is provided with multiple glasss of putting holes of array distribution, recessed cup 223 described in each it is outer under Portion 213 is put into corresponding 1 cup putting hole.

The upper circuit pack 5 also includes the upper circuit base plate 2 of wiring layer 1, middle wiring layer 3 and insulating materials；Institute The lower surface and the bonding of upper circuit base plate 2 for stating wiring layer 1 connect, and the lower surface of the upper circuit base plate 2 and middle wiring layer 3 are viscous Close connection；The upper wiring layer 1 includes a plurality of first control metal foil, and the middle wiring layer 3 includes a plurality of second control Metal foil and a plurality of 3rd control metal foil.

Described upper circuit pack 5 also includes the top substrate 9 of insulating materials, pushes up the lower surface of substrate 9 and upper wiring layer 1 Upper surface be fixedly connected.Blind hole, each LED connection are respectively equipped with corresponding to each LED monomer at each LED terminal pad 8 Pan8Chu is located at the inner bottom part of blind hole respectively, and blind hole has spacing not connect with LED putting holes 6.The blind hole is divided into the first hole 91st, the second hole 92 and the 3rd hole 93.It can not also set or set blind hole less, blind hole can also connect with LED putting holes 6.In order to just There is rounding 90 at laser boring, the 3rd 93 4 jiaos of hole（Other various holes can also have rounding）.

In actual use, when LED display, which is erect, to be set, this is now defined as in front of the light-emitting area of LED display The upper direction of text, the bonnet direction of LED display are defined as this paper lower direction, i.e., being defined as this paper's in front of LED display Top, LED display rear are defined as this paper lower section, the length direction rule of the connection sheet 21 of luminescence component in LED display It is set to this paper fore-and-aft direction, the orientation of the connection sheet 21 in LED display in the upper component of 1 of luminescence component is defined as This paper left and right directions, now the light-emitting area of LED display be defined as this paper horizontal plane or the horizontal plane close to this paper.

Because luminescence component includes LED component and upper component, upper component includes multiple connection sheets of metal material, often Depression is provided with 1 LED master to the top surface of one connection sheet formed with multiple recessed cups, the inner bottom part of each recessed cup downwards Terminal pad, upper component are provided with multiple LED putting holes of array distribution, and the bottom of each LED putting hole is corresponding with 1 institute The recessed cup stated, LED component include multiple LED monomers of array distribution, and each described LED monomer is fixed on corresponding 1 In the main terminal pads of described LED, the LED chip of LED monomers is fixed in the main terminal pads of LED, LED chip heat transfer to company In contact pin, luminescence component also includes lower circuit pack and radiator, and lower circuit pack includes the offline roadbed of insulating materials Plate, lower circuit base plate connect with the bonding of connection sheet lower surface, and lower circuit pack is provided with heat conduction groove, and the bottom land of heat conduction groove is company The lower surface of contact pin, radiator include the radiating pin for being welded on heat conduction groove, and the heat in connection sheet is drawn by radiating Pin is delivered to radiator, then the perfect heat-dissipating of LED display, quality better, stable performance.LED chip passes through bond wire Silk is electrically connected with LED terminal pad, and LED chip is fixed in the main terminal pads of LED by glue, it is not necessary to traditional LED support, Then the cost of LED display is greatly reduced, and is advantageous to LED display luminous point spacing and does small, LED chip is anti-by recessed cup Light, LED display luminosity is improved, the luminous point spacing for solving traditional outdoor LED display screen is big, cost is high, radiating The problem of bad and performance is unstable.

Embodiment 2

Embodiment 2 is similar to Example 1, the bonding pad 210 of the main huge top surface for not being the connection sheet 21 and main connection Disk 22 is all electrodeposited coating.The bottom of each LED putting hole 6 correspondingly sets the main terminal pads 22 of LED described in one.In production The connection sheet 21 is first electroplated, and then connection sheet 21 connects with the upper circuit pack 5 and the bonding of lower circuit pack 35 again.

Claims

1. a kind of LED display module, includes luminescence component；It is characterized in that：Described luminescence component include LED component and Upper component；Described upper component includes multiple connection sheets of left-right situs, and the connection sheet is metal material；Described upper group Part also includes horizontally disposed upper circuit pack, and the upper circuit pack includes the upper substrate of reach the standard grade layer and insulating materials, Described layer of reaching the standard grade is fixedly connected with upper substrate；The upper substrate is located at the lower section for layer of reaching the standard grade, and the connection sheet is located at upper substrate Lower section；Each described connection sheet is provided with multiple recessed cups to lower recess, and the inner bottom part of each recessed cup is provided with 1 The main terminal pads of LED；The top surface of each connection sheet includes multiple bonding pads outside recessed cup, the upper substrate Lower surface connects with the bonding of multiple bonding pads；Described upper component is provided with multiple LED putting holes of array distribution, described in each The bottom of LED putting holes is corresponding with the recessed cup described in 1；Described LED component includes multiple LED monomers of array distribution, Each described LED monomer is fixed in corresponding 1 main terminal pad of LED；The layer of reaching the standard grade includes in tandem a plurality of First control metal foil, the layer of reaching the standard grade also include a plurality of second control metal foil in tandem, and the layer of reaching the standard grade also wraps A plurality of 3rd control metal foil in tandem is included, the first control metal foil and the second control metal foil are respectively equipped with LED terminal pad, the 3rd control metal foil are provided with LED times described terminal pad；The position of the main terminal pads of LED is less than The position of LED terminal pad；Described LED monomers include LED chip, and the LED chip passes through bonding wire and LED Secondary terminal pad is electrically connected with；The LED chip is fixed in the main terminal pads of LED by glue, the LED chip and the main connections of LED Disk is electrically connected with；The luminescence component also includes lower circuit pack, and described lower circuit pack includes lower wiring layer and absolutely The lower circuit base plate of edge material, the lower wiring layer are fixedly connected with lower circuit base plate；The lower circuit base plate is located at connection sheet Lower section, the lower wiring layer is located at the lower section of lower circuit base plate, the upper surface of the lower circuit base plate and the following table of connection sheet Face bonding connection.

2. a kind of LED according to claim 1 display module, it is characterized in that：The luminescence component also includes radiating Device and control integrated package, the radiator are located at the lower section of lower circuit pack, and the radiator is fixedly connected with lower circuit pack； The lower circuit pack is provided with multiple heat conduction grooves, and the heat conduction slot opening is downward, and the bottom land of the heat conduction groove is connection The lower surface of piece；The radiator includes the multiple radiating pins for the metal material for being welded on heat conduction groove；Each institute State connection sheet and be corresponding with 1 heat conduction groove described above；The corresponding 1 radiating pin described above of each described connection sheet.

3. a kind of LED according to claim 1 display module, it is characterized in that：The luminescence component also includes vertically The perpendicular circuit pack and main integrated package set；The main integrated package is arranged on the surface of perpendicular circuit pack；The main integrated package with Connection sheet is electrically connected with.

4. a kind of LED according to claim 1 display module, it is characterized in that：Described luminescence component also includes top Layer；The top layer includes the top line base board of the black of insulating materials；The top layer is provided with top layer hole；The top layer hole exists The surface of LED putting holes, the top layer hole are more than LED putting holes.

5. a kind of LED according to claim 1 display module, it is characterized in that：Each described LED monomer includes 3 The individual LED chip, it is the first color LED chip, the second color LED chip and the 3rd color LED chip respectively；Line up left and right First color LED chip of multiple LED monomers of one row is electrically connected with 1 first control metal foil；What left and right was arranged in a row Second color LED chip of multiple LED monomers is electrically connected with 1 second control metal foil；Multiple LED that left and right is arranged in a row 3rd color LED chip of monomer is electrically connected with 1 article of the 3rd control metal foil.

6. a kind of LED according to claim 1 display module, it is characterized in that：Described lower wiring layer includes up and down Multiple lower line layers of distribution, the underlying substrate of insulating materials is provided between two neighboring lower line layer；Described layer bag of reaching the standard grade The multiple upper wiring layers being distributed up and down are included, the top substrate layer of insulating materials is provided between two neighboring upper wiring layer.

7. a kind of LED according to claim 2 display module, it is characterized in that：The rear and front end of the heat conduction groove away from From for H3, the left and right ends distance of the heat conduction groove is H4, and H3 is more than H4.

8. a kind of LED according to claim 2 display module, it is characterized in that：The radiator also includes metal material Multiple fin of matter, each described fin and corresponding radiating pin integrally connected；The radiator also includes use In the radiating piece of the insulating materials of the multiple fin of fixation.

9. a kind of LED according to claim 1 display module, it is characterized in that：The lower circuit base plate is provided with array point Multiple glasss of putting holes of cloth, the outer bottom of the recessed cup described in each are put into corresponding 1 cup putting hole.