WO2020220389A1 - Transparent led display screen and manufacturing method thereof - Google Patents

Abstract

A transparent LED display screen employs a metal piece (4) embedded in a first transparent layer (12) to electrically connect an electrode pin pad positioned at a lamp bead solder region (31) and a power pad (32) having the same polarity, such that distances between respective lamp beads (2) can be further shortened, thereby increasing the resolution thereof. Since the metal piece (4) has a smaller occupied area, a user can see the display screen clearer, thereby ensuring extremely high transparency. Since the metal piece (4) is embedded in the first transparent layer (12) and a printed circuit layer (3) is arranged at the first transparent layer (12) provided with the metal piece (4) therein, electrical connections established between the metal piece (4) and the electrode pin pad and the power pad (32) on the first transparent layer (12) are more reliable. Also provided is a manufacturing method of a transparent LED display screen.

Description

Transparent LED display screen and preparation method thereof Technical field

The present invention relates to the field of LED display, in particular to the field of transparent LED display screens.

Background technique

Transparent LED displays have gradually been widely used in the market, and various product forms have been developed. A transparent LED display technology in which LED lights are arrayed on a transparent substrate has begun to appear. This technology generally uses transparent conductive materials, such as metal mesh (metal mesh), nano silver, ITO, etc., but because the thickness of the above-mentioned materials attached to the transparent substrate is very thin, and the current demand for LED operation is relatively large. The material is difficult to meet the power supply requirements of the LED, especially when the LED array is densely arranged (the LED lamp spacing is less than 10mm), it is difficult to meet the power supply requirements of the entire screen. In addition to power supply, the work of LED lights also requires signal input control. Therefore, the connection of communication signal lines is required between LED lights, which will cause the circuit division on the substrate to be more complicated, thereby reducing the line area of the power supply part and increasing the resistance. Big. Although there are also technical solutions to encapsulate the driver IC in the LED lamp, thereby reducing the complexity of the circuit, at least one or two signal lines between the LED lamps are required. In the case of densely arranged LED lamps, the circuit After the graphics layer is divided, it still cannot meet the demand for power supply.

For example, as shown in FIG. 1, there is currently provided an improved transparent LED display screen, which includes a transparent substrate 1', a printed circuit layer 3'is provided on the transparent substrate 1', and a chip-encapsulated LED lamp The array of beads 2'is mounted on the transparent substrate 1'; as shown in FIG. 2, specifically, the printed circuit layer 3'includes a lamp bead pad 31', a power pad 32', a signal pad 33', etc. , The lamp bead welding area 31' is provided with 4 pads for mounting LED lamp bead pins, in addition, each lamp bead welding area 31' is provided with two signal pin pads and two electrode pins For the pads, the signal pin pads of which are connected in series through printed signal lines, and the two electrode pin pads with opposite polarities are respectively powered by the metal grid 30' printed on the transparent substrate 1'.

This method has a certain advantage that the metal grid 30' for power supply can be directly formed on the transparent substrate 1'through the printing process as a power supply circuit; however, because the thickness of the printed pattern layer 3'is generally only about 35 microns, the formed The current that each metal wire on the metal grid 30' can carry is very small. When the distance between the LED lamp beads 2'is less than 10 mm, its conductivity cannot meet the power supply requirements of the LED lamp beads 2'. Therefore, the area of the metal grid 30' has to be widened to meet the power supply requirements of the LED lamp, and the spacing between the LED lamp beads 2'cannot be made small, and the resolution of the transparent LED display cannot be improved; and the metal grid 30 'To some extent, it will reduce the transparency of the transparent substrate 1'.

Summary of the invention

In order to overcome the fact that the transparent LED display in the prior art adopts a printing process to form a power supply metal grid on the transparent substrate as the power supply circuit, the distance between the LED lamp beads cannot be made small, and the resolution of the transparent LED display cannot be reduced. To improve the problem that the metal grid will reduce the transparency of the transparent substrate to a certain extent, the present invention provides a transparent LED display screen and a preparation method thereof.

One aspect of the present invention provides a transparent LED display screen, which includes a transparent substrate and LED lamp beads; the LED lamp beads include a bracket, a driving chip and a light-emitting chip formed on the bracket; Pins, the pins include electrode pins and signal pins;

The transparent substrate includes a first transparent layer;

The first transparent layer is buried with a metal sheet; the first transparent layer is provided with a printed circuit layer; the printed circuit layer includes power supply pads, signal pads and LED lamp beads arranged in an array Lamp bead welding area;

Each of the lamp bead welding areas is provided with a pin pad corresponding to the pin of the LED lamp bead; the pin pad includes a signal pin pad and an electrode pin pad;

Signal lines for signal transmission are provided between the signal pad and the signal pin pads in the lamp bead welding area, and between the signal pin pads of the lamp bead welding areas, so that each LED lamp bead is controlled to turn on and off The control signal can be transmitted sequentially through each LED lamp bead;

The metal sheet buried in the first transparent layer electrically connects the electrode pin pads of the same polarity on the lamp bead welding area and the power supply pad.

The transparent LED display provided by the present invention uses a metal sheet buried in the first transparent layer to electrically connect the electrode pin pads and power supply pads of the same polarity on the lamp bead welding area, instead of printing. The metal grid on the transparent substrate supplies power to the LED lamp beads, so that it can further reduce the distance between the LED lamp beads and improve its resolution. At the same time, the metal sheet with a smaller footprint also blocks the line of sight. Small, can guarantee extremely high permeability. And the metal sheet is buried in the first transparent layer, and a printed circuit layer is laid on the first transparent layer in which the metal sheet is buried. This method makes the metal sheet and the electrode pin pads on the first transparent layer The electrical connection to the power supply pad is more reliable.

Further, the transparent substrate further includes a second transparent layer, and the first transparent layer is disposed on the second transparent layer.

Further, N rows*M columns of lamp bead welding areas are provided on the printed circuit layer;

M signal pads are arranged on the printed circuit layer; the M signal pads and the signal pin pads in the N lamp bead pads in the same column are serially connected in sequence through signal lines;

Alternatively, N signal pads are arranged on the printed circuit layer; the N signal pads and the signal pin pads in the M lamp bead welding areas on the same line are sequentially connected in series through signal lines.

Further, M pairs of power supply pads or N pairs of power supply pads are arranged on the printed circuit layer; each pair of power supply pads includes a first power supply pad and a second power supply pad with opposite polarities;

The electrode pin pad includes a first electrode pin pad and a second electrode pin pad; a first epitaxial portion is drawn on the first electrode pin pad; the second electrode pin pad There is a second extension part on the top lead;

Pass the first epitaxial portion of the first electrode lead pad and the first power supply pad of the same polarity on the N lamp bead pads in the same column through the first metal buried in the first transparent layer The chip is electrically connected; the second epitaxial portion of the second electrode pin pad on the lamp bead pad on the same column and the second power pad of the same polarity are buried in the first transparent layer The two metal sheets are electrically connected; or, the first epitaxial portion of the first electrode pin pad on the M lamp bead pads in the same line and the first power pad of the same polarity are buried in the first The first metal sheet in a transparent layer is electrically connected; the second epitaxial portion of the second electrode pin pad on the lamp bead welding area in the same column and the second power supply pad of the same polarity are buried in the first The second metal sheet in a transparent layer is electrically connected.

Further, M pairs of power supply pads or N pairs of power supply pads are arranged on the printed circuit layer; each pair of power supply pads includes a first power supply pad and a second power supply pad with opposite polarities;

The electrode pin pad includes a first electrode pin pad and a second electrode pin pad; the metal sheet includes M pairs or N pairs of a first metal sheet and a second metal sheet;

Embed the M or N pairs of the first metal sheet and the second metal sheet under the lamp bead welding area;

Electrically connecting the first electrode pin pads on the N lamp bead pads on the same column and the first power supply pads of the same polarity through the first metal sheet buried in the first transparent layer; The second electrode pin pads on the lamp bead pads in the same column and the second power supply pads of the same polarity are electrically connected through a second metal sheet buried in the first transparent layer; or The first electrode pin pads on the M lamp bead pads and the first power supply pads of the same polarity are electrically connected through the first metal sheet buried in the first transparent layer; The second electrode pin pad on the soldering area of the lamp bead is electrically connected with the second power supply pad of the same polarity through a second metal sheet buried in the first transparent layer.

Further, M+1 power supply pads or N+1 power supply pads are arranged on the printed circuit layer;

The M+1 power supply pads or N+1 power supply pads include first power supply pads and second power supply pads with opposite polarities arranged at intervals;

The electrode pin pad includes a first electrode pin pad and a second electrode pin pad; a first epitaxial portion is drawn on the first electrode pin pad; the second electrode pin pad There is a second extension part on the top lead;

Pass the first epitaxial portion of the first electrode lead pad and the first power supply pad of the same polarity on the N lamp bead pads in the same column through the first metal buried in the first transparent layer Sheet welding electrical connection; the second extension part of the second electrode pin pad on the lamp bead welding area on the same column and the second power supply pad of the same polarity are embedded in the first transparent layer The second metal sheet is welded and electrically connected; the first metal sheet and the second metal sheet are arranged at intervals; or, the first electrode pin pads on the M lamp bead welding areas on the same line The extension part and the first power supply pad of the same polarity are electrically connected by welding the first metal sheet buried in the first transparent layer; the second electrode pin pads on the lamp bead welding area on the same column The second epitaxial portion and the second power supply pad of the same polarity are electrically connected by welding a second metal sheet buried in the first transparent layer, and the first metal sheet and the second metal sheet are arranged at intervals.

Further, the first metal sheet and the second metal sheet are arranged in parallel rows and spaced apart from the lamp bead welding areas on each row; the first extension part and the second extension part on each lamp bead welding area are respectively The first metal sheet and the second metal sheet outside the left and right sides thereof are electrically connected; wherein, the extension parts of the metal sheets sharing the same polarity between the lamp bead welding areas on the adjacent columns are connected as a whole;

Alternatively, the first metal sheet and the second metal sheet and the lamp bead welding areas on each row are arranged at intervals in parallel rows; the first and second extension portions on the lamp bead welding areas are respectively up and down The first metal sheet and the second metal sheet outside the two sides are electrically connected; wherein, the extension parts of the metal sheets sharing the same polarity between the lamp bead welding areas on the adjacent rows are connected as a whole.

Further, the signal pin pad on each lamp bead welding area includes at least a first signal input pin pad and a first signal output pin pad;

M signal pads are arranged on the printed circuit layer; the M signal pads are soldered to the first signal input pin pads and the first signal output pins in the N lamp bead soldering areas on the same column The disks are serially connected in sequence through signal lines;

Alternatively, N signal pads are arranged on the printed circuit layer; the N signal pads and the first signal input pin pads and first signal output lead pads in the M lamp bead pads on the same column The pin pads are serially connected in sequence through signal lines.

Further, the upper end surface of the metal sheet and the upper plane of the first transparent layer are located on the same plane.

Further, a sealing glue layer and a transparent cover plate are also provided on the first transparent layer.

The second aspect of the present invention provides a method for preparing a transparent LED display screen, which includes the following steps:

Step S1, the step of embedding the metal sheet; arrange the metal sheet on the second transparent layer, then cast a transparent material, and harden the transparent material to form a first transparent layer, and embed the metal sheet on the first transparent layer Inside;

Step S2, a step of forming a printed circuit layer; forming a printed circuit layer on the first transparent layer; the printed circuit layer includes power supply pads, signal pads and LED lamp beads arranged in an array Welding area; the metal sheet is electrically connected to the printed circuit layer;

Step S3, LED lamp bead installation step: solder the LED lamp bead in the lamp bead soldering area of the printed circuit layer;

Step S4, packaging step: then packaging on the printed circuit layer where the LED lamp beads are welded.

The method for preparing a transparent LED display screen provided by the present invention embeds a metal sheet in a first transparent layer formed of a transparent material, forms a printed circuit layer on the first transparent layer, and then installs the LED on the printed circuit layer The lamp beads are finally packaged; the preparation process of this scheme is simple and easy to implement. The transparent LED display screen prepared according to this method can further reduce the spacing between the LED lamp beads and improve its resolution. At the same time, the metal sheet with a smaller occupied area also has a smaller line of sight obstruction, which can ensure extremely High transparency. And the metal sheet is buried in the first transparent layer, and a printed circuit layer is laid on the first transparent layer in which the metal sheet is buried. This method makes the metal sheet and the electrode pin pads on the first transparent layer The electrical connection to the power supply pad is more reliable, and at the same time, it can effectively prevent the metal strip 4 from oxidizing, ensuring extremely high conductivity stability.

Further, the step S1 specifically includes the following steps:

Step S11, fixing the metal sheets at a predetermined position on the second transparent layer, ensuring that each metal sheet is parallel to each other and the upper end faces are on the same plane;

Step S12: Pouring the transparent material so that the transparent material just surpasses the metal sheet, or the upper plane of the transparent material is flush with the upper edge of the metal sheet;

Step S13, oven-baking to harden the transparent material to form a first transparent layer, and fix the metal sheet in the first transparent layer.

Further, the step S1 also includes the following steps:

Step S14: Polish the upper surface of the first transparent layer to ensure that the upper end surface of the metal sheet is exposed from the upper surface of the first transparent layer.

Further, the step S2 specifically includes the following steps:

Step S21, covering the first transparent layer with copper foil;

Step S22, etching the copper foil to form the printed circuit layer.

Further, the step S4 specifically includes the following steps:

Step S41, covering a layer of transparent material on the printed circuit layer after welding the LED lamp beads;

Step S42, covering the transparent cover plate on the transparent material in step S41;

Step S43, passing the furnace to cure the transparent material in step S41 to form a sealant layer.

Description of the drawings

Figure 1 is a schematic cross-sectional view of a transparent LED display provided in the prior art;

2 is a schematic top view of a transparent LED display screen provided in the prior art;

3 is a schematic top view of a transparent LED display screen with a metal sheet and a printed circuit layer embedded on a transparent substrate provided in a specific embodiment of the present invention;

4 is a partial cross-sectional schematic diagram of a transparent LED display (before encapsulation) provided in a specific embodiment of the present invention;

Fig. 5 is an enlarged schematic diagram of A in Fig. 3;

6 is a schematic cross-sectional view of the first LED lamp bead provided in the specific embodiment of the present invention;

7 is a schematic diagram of the bottom surface of the first LED lamp bead provided in the specific embodiment of the present invention;

FIG. 8 is a schematic front view of the first LED lamp bead provided in the specific embodiment of the present invention;

9 is a partial cross-sectional schematic diagram (after sealing) of a transparent LED display screen provided in a specific embodiment of the present invention;

10 is a schematic top view of a transparent LED display screen after mounting LED lamp beads provided in the specific embodiment of the present invention;

Figure 11 is an enlarged schematic view of B in Figure 10;

FIG. 12 is a schematic top view of a second type of transparent LED display screen provided in a specific embodiment of the present invention with a metal sheet and a printed circuit layer embedded on a transparent substrate;

13 is a schematic partial cross-sectional view of a second transparent LED display (before encapsulation) provided in the specific embodiment of the present invention;

Fig. 14 is an enlarged schematic diagram of C in Fig. 12;

15 is a schematic top view of a third transparent LED display screen provided in the specific embodiment of the present invention with a metal sheet and a printed circuit layer embedded on a transparent substrate;

16 is a schematic partial cross-sectional view (before encapsulation) of a third transparent LED display provided in a specific embodiment of the present invention;

Fig. 17 is an enlarged schematic diagram of D in Fig. 15;

18 is a schematic bottom view of the second type of LED lamp beads provided in the specific embodiment of the present invention;

19 is a schematic front view of the second type of LED lamp beads provided in the specific embodiment of the present invention;

FIG. 20 is a production flow chart of the transparent LED display screen provided in the specific embodiment of the present invention;

FIG. 21 is a schematic diagram of fixing and pouring the metal tape in the first transparent layer on the second transparent layer according to the specific embodiment of the present invention;

Figure 22 is a schematic diagram of polishing the upper plane of the first transparent layer provided in the specific embodiment of the present invention;

FIG. 23 is a schematic diagram of copper foil covering the polished first transparent layer provided in the specific embodiment of the present invention; FIG.

24 is a schematic diagram of etching copper foil to form a printed circuit layer provided in the specific embodiment of the present invention;

FIG. 25 is a schematic diagram of installing LED lamp beads on the printed circuit layer provided in the specific embodiment of the present invention;

Fig. 26 is a schematic partial cross-sectional view of the transparent LED display screen after final packaging provided in the specific embodiment of the present invention.

Reference signs in the background art:

1', transparent substrate,; 2', LED lamp beads,; 3', printed circuit layer; 30', metal grid; 31', lamp bead welding area; 32', power pad; 33', signal welding plate;

Reference numerals in the specific embodiments: 1. Transparent substrate; 11. Second transparent layer; 12. First transparent layer; 2. LED lamp beads; 3. Printed circuit layer; 4. Metal sheet; 5. Sealing layer ; 6. Transparent cover plate;

20. Bracket; 21. Pin; 21a, first electrode pin; 21b, second electrode pin; 21c, first signal input pin; 21d, first signal output pin; 22, drive chip; 23, Light-emitting chip; 23R, red light-emitting chip; 23G, green light-emitting chip; 23B, blue light-emitting chip;

31. Lamp bead welding area; 32, power supply pad; 33, signal pad; 34, signal line; 31a, first electrode pin pad; 31b, second electrode pin pad; 31c, first signal input Pin pad; 31d, first signal output pin pad; 311, extension part; 311a, first extension part; 311b, second extension part; 32a, first power supply pad; 32b, second power supply pad ; 34a, the first printed line; 34b, the second printed line; 3a, copper foil;

4a, the first metal sheet; 4b, the second metal sheet.

Detailed ways

In order to make the technical problems, technical solutions, and beneficial effects solved by the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

In the description of the present invention, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", The orientation or positional relationship indicated by "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise clearly specified and limited. For example, they can be fixed or detachable. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present invention can be understood in specific situations.

Example 1

As shown in Figures 3 and 4, this example discloses a transparent LED display screen, which includes a transparent substrate 1 and LED lamp beads 2. The LED lamp beads 2 include a bracket 20, a drive chip 22 formed on the bracket 20, and Light-emitting chip 23; the LED lamp beads 2 are also provided with a number of pins 21, the pins 21 include electrode pins and signal pins;

The transparent substrate 1 includes a first transparent layer 12;

The first transparent layer 12 is embedded with a metal sheet 4; the first transparent layer 12 is provided with a printed circuit layer 3; as shown in FIGS. 3 and 5, the printed circuit layer 3 includes power supply pads 32. The signal pad 33 and the lamp bead welding area 31 for installing the LED lamp beads 2 arranged in an array;

Each of the lamp bead pads 31 is provided with a pin pad corresponding to the pin 21 of the LED lamp bead 2; the pin pad includes a signal pin pad and an electrode pin pad;

A signal line 34 for signal transmission is provided between the signal pad 33 and the signal pin pads in the lamp bead welding area 31 and between the signal pin pads of each lamp bead welding area 31, so that each LED is controlled. The control signals for turning on and off the lamp beads can be transmitted sequentially through each LED lamp bead 2; specifically, for example, between the signal pad 33 and the signal pin pads in the lamp bead welding area 31, and the phases in the same or the same row. A signal line 34 for signal transmission is provided between the signal pin pads in the adjacent lamp bead welding area 31; but it is not limited to the connection between the adjacent LED lamp beads 2 through the signal line 34, such as the tails of the same column The LED lamp beads 2 are led to the LED lamp beads in the head of the adjacent column through the signal line 34 for connection, etc., it is all possible.

The metal sheet 4 embedded in the first transparent layer 12 electrically connects the electrode pin pads of the same polarity on the lamp bead welding area 31 and the power supply pad 32.

As a preferred manner, this example preferably includes a second transparent layer 11, and the first transparent layer 12 is disposed on the second transparent layer 11.

For example, Figs. 6-8 disclose a four-pin 21 LED lamp bead 2 packaged with a driving chip 22, wherein the pin 21 includes two electrode pins and two signal pins; the electrode The pins include a first electrode pin 21a and a second electrode pin 21b; for example, the two electrode pins have opposite polarities, for example, the first electrode pin 21a is used as a positive electrode pin; the second electrode pin 21b is used as a negative electrode pin Pin. It is used to provide power to the light-emitting chip 23 in the LED lamp bead 2; the two signal pins are called the first signal input pin 21c and the first signal output pin 21d; the driver chip 22 is provided with an interface through binding The wire is electrically connected to each light-emitting chip 23 and each pin.

In this example, the light-emitting chip 23 includes a red light-emitting chip 23R, a green light-emitting chip 23G, and a blue light-emitting chip 23B; they are arranged in a straight line; of course, they can also be arranged in a square shape.

Of course, depending on the control mode, there may be multiple signal pins for input and output of control signals.

The form of the metal sheet 4 is not particularly limited. For example, the cross section of the metal sheet 4 includes a circle, a semicircle, a triangle, an ellipse, a quadrilateral, or other regular or irregular polygons. In this way, the width and height of the metal sheet 4 can be effectively adjusted, so that the width is relatively small, and the height is increased. On the one hand, the power supply requirement is guaranteed, and at the same time, the overall transparency effect of the transparent display screen will not be affected. . In this example, the cross section of the metal sheet 4 is quadrilateral, wherein the width of the metal sheet 4 is 0.1-1 mm and the height is 1-3 mm. This size range can ideally meet the power supply requirements of the entire array of LED lamp beads 2, which is many times stronger than other transparent conductive materials. At the same time, the barrier to the line of sight is relatively small, which can ensure extremely high transparency. For example, specifically, in this example, the metal sheet 4 has a width of 0.3 mm, a height of 2 mm, and a cross-sectional area of 0.6 mm ² , which is equivalent to a copper wire with a diameter of 1.6 mm, and has strong conductivity. Regarding the metal sheet 4, there is no particular limitation on its material and the like, as long as its electrical conductivity meets the requirements, and a metal with high electrical conductivity is generally preferred. In this example, copper sheets are preferably used.

In this example, the upper end surface of the metal sheet 4 and the upper plane of the first transparent layer 12 are located on the same plane, or the upper end surface of the metal sheet 4 is slightly higher than the upper plane. Of course, it is preferable that the upper end surface of the metal sheet 4 is parallel to the upper plane of the first transparent layer 12. Because of the better implementation in technology, and easy to achieve its consistency and stability.

Using the metal sheet 4 provided in this example for power supply can further reduce the size of the LED lamp beads 2 and reduce the gap between the LED lamp beads 2. For example, the length of the LED lamp beads is 1. -5mm, the width is 1-5mm. . The gap between the LED lamp beads 2 is 3-10mm. The gap mentioned here refers to the distance between the centers of adjacent LED lamp beads 2. For example, the gap between the LED lamp beads 2 in this example may be 5 mm.

The second transparent layer 11 can be made of various rigid or flexible materials known to the public. For example, the second transparent layer 11 can be a glass substrate, PET (English name: Polyethylene terephthalate, Chinese name: Polyethylene terephthalate) Ester) substrate, transparent PI (English name: polyimide, Chinese name: polyimide) film, etc.

The first transparent layer 12 is usually a transparent layer obtained by casting and curing a transparent material. The metal sheet 4 is added during the casting process, and the arrangement of the metal sheet 4 is carried out as required, so that the subsequent formed printing The control circuit layer 3 is electrically connected to it. The transparent material can be epoxy resin, PET (English name: Polyethylene terephthalate, Chinese name: Polyethylene terephthalate), acrylic (Chinese name: polymethyl methacrylate; English name: Polymeric Methyl Methacrylate) ; Abbreviation: PMMA), silica gel, etc.

As shown in FIG. 5, the power supply pad 32 in this example is used to connect to an externally connected DC power supply, and the DC power supply is connected to each power supply pad 32 through the metal sheet 4 mentioned in this application. LED lamp beads 2; it includes a first power supply pad 32a and a second power supply pad 32b with opposite polarities; for example, in this example, the first power supply pad 32a is a positive electrode pad; the second power supply pad 32b is a negative electrode welding plate.

The power supply pads 32 may only be provided with two opposite polarities, such as a first power supply pad 32a and a second power supply pad 32b; the lamp beads on the power supply pads 32 distributed in an array can be realized by a plurality of metal sheets 4 The pin pads of the same polarity on the pad 31 are electrically connected. Or the power supply pads 32 can also be provided in multiple, and the pin pads of the same polarity on the lamp bead pads 31 in one row or column can be electrically connected to one power supply pad 32 through the metal sheet 4. Some examples will be given below.

Similarly, the signal pad 33 is used to connect to an external signal input source, and it is usually connected to the upper-level control chip; the number of the signal pad 33 is not specifically limited, for example, as mentioned in the background art There is only one signal pad 33, which inputs a control signal through one signal pad 33, and then the control signal is sequentially transmitted to each LED lamp bead 2 connected in series via the signal line 34. Of course, it can also be set according to the number of I/O ports on the control chip. For example, the LED lamp beads 2 in the same row or the same column use the same signal pad 33, or the LED lamp beads 2 in multiple rows or columns use the same signal pad 33, which is allowed.

Regarding the signal line 34 defined here, it can be a printed signal line printed on the first transparent layer 12, and the printed signal line can be ITO (full Chinese name: indium tin oxide; full English name: Indium Tin Oxides) Wire, silver paste wire or copper clad wire, etc., in this example, a grid-shaped copper clad wire printed on the first transparent layer 12 is used. Or use a point-to-point metal wire machine to mark up the flying line connection to form a flying line network. Similarly, the pads on the printed circuit layer 3 and the epitaxial portion 311 can also be made of a transparent conductive material as a printed circuit, such as metal mesh, ITO, nano silver and so on.

In particular, the signal line 34 and the extension part 311 can achieve a line width as small as 0.01mm by using copper-clad materials in actual production, and the conductivity is sufficient for the power supply requirements and signal transmission of a single LED lamp, which blocks the line of sight. Very small, can achieve extremely high transparency of the entire LED display.

As shown in FIG. 9, after the LED lamp bead 2 is soldered to the corresponding lamp bead soldering area 31 on the printed circuit layer 3 by surface mount technology, a layer of sealing glue 5 will be packaged on its surface as a whole. Furthermore, according to needs, a transparent cover plate 6 can also be provided on the sealing glue layer 5. The wire harness is drawn from the power supply pad 32 and the signal pad 33, and the edge between the transparent cover 6 and the transparent substrate 1 is sealed and packaged to make it waterproof. Wherein, the sealant layer 5 can be obtained by casting and hardening a certain transparent material, for example, it can be made of epoxy resin or transparent silica gel or other transparent materials. The transparent cover 6 is generally a transparent part made of a glass cover or an alternative printed plastic material. After covering the sealant layer 5 on the first transparent layer 12, the transparent cover plate 6 can be added to ensure good air tightness, and it is not easy for water vapor to invade and cause the LED lamp beads 2 to fail.

The connection mode of the metal sheet 4 and the printed circuit line will be further explained in conjunction with specific preferred embodiments below.

As shown in Fig. 3, the printed circuit layer 3 is provided with N rows*M columns of lamp bead welding areas 31; as an example, suppose N=5; M=5; in this example, the first transparent layer 12 is printed There are 5*5 lamp beads 31. In order to enable those skilled in the art to understand the concept of the present invention, the column composed of the lamp bead pads 31 on the same row is called a welding row; the column composed of the lamp bead pads 31 on the same column is called a welding row.

In this example, five signal pads 33 are arranged on the printed circuit layer 3; the five signal pads 33 pass between the signal pin pads in the five lamp bead pads 31 on the same column. The signal lines 34 are serially connected in sequence; specifically, the first signal input pin pad 31c and the first signal output pin pad 31d are provided in the lamp bead welding area 31; the serial connection, the signal on the corresponding column The pad 33 is connected to the first signal input lead in the first lamp bead pad 31 on the column through a signal line 34 (for the sake of distinction, the signal line 34 is called the first printed line 34a in this example). Foot pad 31c; then through the first signal output pin pad 31d in the first lamp bead pad 31d through the signal line 34 (in this example, the signal line 34 in the adjacent lamp bead pad 31 is called The second printed line 34b) is connected to the first signal input pin pad 31c in the second lamp bead welding area 31 on the same row, and in this way the third, fourth, and fifth lamp bead welding areas 31 are connected in series . Of course, the way of concatenation is not necessarily limited to the same line or the same column. The signal lines 34 in this example all adopt a grid-like form, which can further increase the transparency of the transparent LED display.

In this example, as shown in FIGS. 3 to 5, five pairs of power supply pads 32 are arranged on the printed circuit layer 3; each pair of the power supply pads 32 includes first power supply pads 32a and The second power supply pad 32b;

As shown in FIGS. 3 to 5, the electrode pin pads in each of the lamp bead welding areas 31 include a first electrode pin pad 31a and a second electrode pin pad 31b; A first extension portion 311a is drawn on the electrode pin pad 31a; a second extension portion 311b is drawn on the second electrode pin pad 31b;

The first extension portion 311a of the first electrode pin pad 31a on the five lamp bead pads 31 in the same column and the first power supply pad 32a of the same polarity are electrically connected by welding through the first metal sheet 4a; The second extension portion 311b of the second electrode pin pad 31b on the lamp bead pad 31b in the same column and the second power supply pad 32b of the same polarity are electrically connected by welding through the second metal sheet 4b.

After the LED lamp bead 2 is mounted on the printed circuit layer 3, the result is shown in Fig. 10 and Fig. 11. It passes through the power supply pad 32 through the metal sheet 4 and the electrode pin pad on the lamp bead welding area 31 The extended extension part 311 is electrically connected, and the current is electrically connected from the electrode pin of the LED lamp bead 2 through the electrode pin pad to form a power supply circuit. At the same time, the control signal flowing in from the signal pad 33 sequentially flows through each LED lamp bead 2 connected in series, and is received by the previous LED lamp bead 2 and transmitted to the next LED lamp bead 2. In order to realize the on-off and color change control of the light-emitting chip 23 on each LED lamp bead 2.

As another embodiment, as shown in FIG. 12, FIG. 13, and FIG. 14, it may also be arranged with M+1 power supply pads 32 or N+1 power supply pads 32 on the printed circuit layer 3. ；

In this example, N=M=5 is still used as an example for description. Six power supply pads 32 are arranged on the printed circuit layer 3.

The six power supply pads 32 include first power supply pads 32a and second power supply pads 32b with opposite polarities arranged at intervals; as shown in FIG. 12, the six power supply pads 32 are arranged in a row of lamp bead welding areas. On the upper side of 31, there are first power supply pad 32a, second power supply pad 32b, first power supply pad 32a, second power supply pad 32b, first power supply pad 32a, and second power supply pad 32b;

Similarly, the electrode pin pads include a first electrode pin pad 31a and a second electrode pin pad 31b; the first electrode pin pad 31a has a first extension portion 311a led out; A second extension portion 311b is led out on the second electrode lead pad 31b;

Then the first extension portion 311a of the first electrode pin pad 31a on the five lamp bead pads 31 in the same column and the first power supply pad 32a of the same polarity are welded and electrically connected through the first metal sheet 4a ; That is, the first epitaxial portion 311a on the same welding column is electrically connected to the first power supply pad 32a through the first metal sheet 4a; the second electrode pin pad 31b on the lamp bead welding area 31 on the same column The second epitaxial portion 311b and the second power supply pad 32b of the same polarity are electrically connected by welding through the second metal sheet 4b; that is, the second epitaxial portion 311b on the same welding column is welded to the second power source through the second metal sheet 4b The disk 32b is electrically connected; the first metal sheet 4a and the second metal sheet 4b are spaced apart; the first metal sheet 4a and the second metal sheet 4b are flat with the lamp bead welding area 31 on each row The first and second extension portions 311a and 311b on the lamp bead welding area 31 are respectively electrically connected to the first metal sheet 4a and the second metal sheet 4b on the left and right sides; in this example, As a preferred manner, as shown in FIG. 14, the extension portions 311 of the metal sheets 4 sharing the same polarity between the lamp bead welding areas 31 on adjacent rows are connected as a whole. For example, a first power supply pad 32a is provided on the upper part between the two adjacent welding rows, and three first metal sheets 4a are soldered from the first power supply pad 32a; between two adjacent rows The first extension portion 311a on the lamp bead welding area 31 is extended as a whole. As a preferred method, in order to prevent the first extension portion 311a from interfering with other signal lines 34, etc., as shown in the lamp bead pad 31 on the left in FIG. 14, the first extension portion 311a can be made from four The inside of the lead pad passes through.

Of course, the power supply pads 32 and the signal pads 33 can also be arranged in a row, and the first epitaxial portion 311a of the first electrode pin pad 31a on the M lamp bead pads 31 in the same row and the same polarity The first power supply pad 32a is electrically connected through the first metal sheet 4a by welding; connect the second extension portion 311b of the second electrode pin pad 31b on the lamp bead pad 31 in the same column with the second extension portion 311b of the same polarity. The power supply pad 32b is electrically connected by welding of the second metal sheet 4b, and the first metal sheet 4a and the second metal sheet 4b are arranged at intervals.

In this example, as a preferred way, there are multiple metal wires 4 that are soldered and connected to the extension portion 311 on the lamp bead pad 31 in the same column or row from the same power supply pad 32. For example, in this example, among the power supply pads 32 arranged from left to right, there are 3 metal wires 4 arranged on 2-5 power supply pads 32. The three metal wires 4 are spot-welded and connected to the same-polarity extension part 311 on the adjacent welding row. Dividing the metal wire 4 into a plurality of weldings can further reduce the diameter of the metal wire 4, making the metal wire 4 more difficult to be observed. The transparency of the transparent LED display is enhanced.

As shown in FIG. 15, FIG. 16, and FIG. 17, five pairs of power supply pads 32 are arranged on the printed circuit layer 3; each pair of the power supply pads 32 includes a first power supply pad 32a and a first power supply pad 32a with opposite polarities. Two power supply pads 32b;

The electrode lead pad includes a first electrode lead pad 31a and a second electrode lead pad 31b; the metal sheet 4 includes five pairs of a first metal sheet 4a and a second metal sheet 4b;

Embed the five pairs of the first metal sheet 4a and the second metal sheet 4b under the lamp bead welding area 31;

Pass the first electrode pin pads 31a and the first power supply pads 32a of the same polarity on the five lamp bead pads 31 in the same column through the first metal sheet embedded in the first transparent layer 12 4a is electrically connected; the second electrode pin pads 31b on the lamp bead pads 31 on the same column and the second power supply pads 32b of the same polarity pass through the second buried in the first transparent layer 12 The metal sheet 4b is electrically connected.

In this example, a very small metal wire is also used as the signal wire 34 to connect the signal pin pad on the lamp bead welding area 31.

The LED lamp bead 2 specifically corresponding to the lamp bead welding area 31 is installed on the lamp bead welding area 31. Specifically, this kind of LED lamp bead 2 is shown in Fig. 18 and Fig. 19, and the LED lamp bead 2 with a driving chip 22 is packaged with four pins 21, wherein the pin 21 includes two electrode pins and two Signal pin; the electrode pin includes a first electrode pin 21a and a second electrode pin 21b; for example, the polarity of the two electrode pins is opposite, for example, the first electrode pin 21a is used as a positive pin; The electrode pin 21b serves as a negative pin. It is used to provide power to the light-emitting chip 23 in the LED lamp bead 2; the two signal pins are called the first signal input pin 21c and the first signal output pin 21d; the driver chip 22 is provided with an interface through binding The wire is electrically connected to each light-emitting chip 23 and each pin. Wherein, viewed from the bottom surface, the first electrode pin 21a and the second electrode pin 21b are arranged on the left and right sides of the bottom surface of the LED lamp bead 2, which correspond to the first electrode pin on the lamp bead welding area 31 The pad 31a and the second electrode lead pad 31b. The above two signal pins are arranged on the upper and lower parts of the bottom surface of the LED lamp bead 2. In this way, the electrode pins and signal pins on the LED lamp bead 2 can be electrically connected with the corresponding electrode pin pads and signal pin pads very conveniently. In this way, the extension part 311 in the above example can be eliminated, and the metal sheet 4 can be arranged directly under the LED lamp bead 2.

In this example, the light-emitting chip 23 includes a red light-emitting chip 23R, a green light-emitting chip 23G, and a blue light-emitting chip 23B; they are arranged in a straight line; of course, they can also be arranged in a square shape.

The transparent LED display provided in this example uses the metal sheet 4 embedded in the first transparent layer 12 to electrically connect the electrode pin pads of the same polarity on the lamp bead welding area 31 and the power supply pad 32 , To replace the metal grid printed on the transparent substrate to supply power to the LED lamp beads 2, so that it can further reduce the distance between the LED lamp beads 2 and improve its resolution, while occupying a smaller area of the metal sheet 4 The obstruction to the line of sight is also relatively small, which can ensure extremely high transparency. And the metal sheet 4 is embedded in the first transparent layer 12, and the printed circuit layer 3 is laid on the first transparent layer 12 on which the metal sheet 4 is embedded. This way makes the metal sheet 4 and the first transparent layer 12 The upper electrode pin pad and the power supply pad 32 are electrically connected in a more reliable manner. At the same time, it can effectively prevent the metal strip 4 from being oxidized and ensure extremely high conductivity stability.

Example 2

As shown in Fig. 20, this example will specifically describe the preparation method of the transparent LED display screen provided in Example 1. The preparation method specifically includes the following steps:

Step S1, metal sheet embedding step; fix the metal sheet 4, then cast a transparent material, and harden the transparent material to form a first transparent layer 12, and embed the metal sheet 4 in the first transparent layer 12;

Wherein, the step S1 specifically includes the following steps:

Step S11. The metal sheets 4 are fixedly arranged at predetermined positions on the second transparent layer 11, ensuring that each metal sheet 4 is parallel to each other and the upper end faces are on the same plane; when fixing the metal sheet 4, it can be fixed on Pouring in the mold, so that the subsequent pouring of transparent materials can be poured in the mold.

Step S12. As shown in FIG. 21, the transparent material is poured so that the transparent material just surpasses the metal sheet 4, or the upper plane of the transparent material is flush with the upper edge of the metal sheet 4;

Step S13, oven baking, within 5 hours, slowly increase the temperature from 90°C to 150°C, harden the transparent material to form the first transparent layer 12, and fix the metal sheet 4 on the first In the transparent layer 12, the result is shown in FIG. 21.

As a preferred manner, as shown in FIG. 22, it further includes step S14, polishing the upper surface of the first transparent layer 12 to ensure that the upper end surface of the metal sheet 4 is exposed from the upper surface of the first transparent layer 12. In this example, the upper end surface of the metal sheet 4 is flush with the upper plane of the first transparent layer 12.

Step S2, a step of forming a printed circuit layer; forming a printed circuit layer 3 on the first transparent layer 12; the printed circuit layer 3 includes power supply pads 32, signal pads 33 and mounted LEDs arranged in an array The lamp bead welding area 31 of the lamp bead 2; the metal sheet 4 is electrically connected to the printed circuit layer 3;

Wherein, the step S2 specifically includes the following steps:

Step S21, as shown in FIG. 23, a copper foil 3a is coated on the first transparent layer 12; the thickness of the copper foil 3a is 10-35 microns.

Step S22, as shown in FIG. 24, the copper foil 3a is etched to form the printed circuit layer 3. The excess copper foil 3a is removed to form the signal line and the extension 311 between the lamp bead pad 31, the power pad 32, the signal pad 33, and the LED pad area.

Step S3, LED lamp bead installation steps: as shown in FIG. 25, the LED lamp bead 2 is welded in the lamp bead welding area 31 of the printed circuit layer 3; the method of welding the LED lamp bead 2 is generally surface mount Assembling technology, after pre-fixing the LED lamp bead 2 on the printed circuit layer 3, the LED lamp bead 2 is soldered on the lamp bead welding area 31 by means of reflow soldering.

Step S4, packaging step: packaging is performed on the printed circuit layer 3 on which the LED lamp beads 2 are welded. Specifically, as shown in FIG. 26, the step S4 specifically includes the following steps:

Step S41: Cover a layer of transparent material on the printed circuit layer 3 after welding the LED lamp beads 2;

Step S42, covering the transparent cover 6 on the transparent material in step S41;

In step S43, the transparent material described in step S41 is cured by passing the furnace to form the sealant layer 5.

The method for preparing a transparent LED display screen provided by the present invention embeds a metal sheet 4 in a first transparent layer 12 formed of a transparent material, and forms a printed circuit layer 3 on the first transparent layer 12, and then the printed circuit The LED lamp bead 2 is installed on the layer 3, and finally encapsulated; the preparation process of this scheme is simple and easy to implement. The transparent LED display screen prepared according to this method can further reduce the distance between the LED lamp beads 2 and improve its resolution. At the same time, the metal sheet 4 with a smaller occupied area also has a smaller obstruction to the line of sight. Ensure extremely high permeability. And the metal sheet 4 is embedded in the first transparent layer 12, and the printed circuit layer 3 is laid on the first transparent layer 12 on which the metal sheet 4 is embedded. This way makes the metal sheet 4 and the first transparent layer 12 The upper electrode pin pad and the power supply pad 32 are electrically connected in a more reliable manner. At the same time, it can effectively prevent the metal band 4 from oxidizing, ensuring extremely high conductivity stability.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection of the present invention. Within range.

Claims (15)

1. A transparent LED display screen, comprising a transparent substrate and LED lamp beads; characterized in that, the LED lamp beads include a bracket, a driving chip and a light-emitting chip formed on the bracket; and a number of pins are also provided on the LED lamp beads , The pins include electrode pins and signal pins;

   The transparent substrate includes a first transparent layer;

   The first transparent layer is buried with a metal sheet; the first transparent layer is provided with a printed circuit layer; the printed circuit layer includes power supply pads, signal pads and LED lamp beads arranged in an array Lamp bead welding area;

   Each of the lamp bead welding areas is provided with a pin pad corresponding to the pin of the LED lamp bead; the pin pad includes a signal pin pad and an electrode pin pad;

   Signal lines for signal transmission are provided between the signal pad and the signal pin pads in the lamp bead welding area, and between the signal pin pads of the lamp bead welding areas, so that each LED lamp bead is controlled to turn on and off The control signal can be transmitted sequentially through each LED lamp bead;

   The metal sheet buried in the first transparent layer electrically connects the electrode pin pads of the same polarity on the lamp bead welding area and the power supply pad.
2. The transparent LED display screen of claim 1, wherein the transparent substrate further comprises a second transparent layer, and the first transparent layer is disposed on the second transparent layer.
3. The transparent LED display according to claim 2, wherein the printed circuit layer is provided with N rows * M columns of lamp bead welding areas;

   M signal pads are arranged on the printed circuit layer; the M signal pads and the signal pin pads in the N lamp bead pads in the same column are serially connected in sequence through signal lines;

   Alternatively, N signal pads are arranged on the printed circuit layer; the N signal pads and the signal pin pads in the M lamp bead welding areas on the same line are sequentially connected in series through signal lines.
4. The transparent LED display screen according to claim 3, wherein M pairs of power supply pads or N pairs of power supply pads are arranged on the printed circuit layer; each pair of the power supply pads includes a first A power supply pad and a second power supply pad;

   The electrode pin pad includes a first electrode pin pad and a second electrode pin pad; a first epitaxial portion is drawn on the first electrode pin pad; the second electrode pin pad There is a second extension part on the top lead;

   Pass the first epitaxial portion of the first electrode lead pad and the first power supply pad of the same polarity on the N lamp bead pads in the same column through the first metal buried in the first transparent layer The chip is electrically connected; the second epitaxial portion of the second electrode pin pad on the lamp bead pad on the same column and the second power pad of the same polarity are buried in the first transparent layer The two metal sheets are electrically connected; or, the first epitaxial portion of the first electrode pin pad on the M lamp bead pads in the same line and the first power pad of the same polarity are buried in the first The first metal sheet in a transparent layer is electrically connected; the second epitaxial portion of the second electrode pin pad on the lamp bead welding area in the same column and the second power supply pad of the same polarity are buried in the first The second metal sheet in a transparent layer is electrically connected.
5. The transparent LED display screen according to claim 3, wherein M pairs of power supply pads or N pairs of power supply pads are arranged on the printed circuit layer; each pair of the power supply pads includes a first A power supply pad and a second power supply pad;

   The electrode pin pad includes a first electrode pin pad and a second electrode pin pad; the metal sheet includes M pairs or N pairs of a first metal sheet and a second metal sheet;

   Embed the M or N pairs of the first metal sheet and the second metal sheet under the lamp bead welding area;

   Electrically connecting the first electrode pin pads on the N lamp bead pads on the same column and the first power supply pads of the same polarity through the first metal sheet buried in the first transparent layer; The second electrode pin pads on the lamp bead pads in the same column and the second power supply pads of the same polarity are electrically connected through a second metal sheet buried in the first transparent layer; or The first electrode pin pads on the M lamp bead pads and the first power supply pads of the same polarity are electrically connected through the first metal sheet buried in the first transparent layer; The second electrode pin pad on the soldering area of the lamp bead is electrically connected with the second power supply pad of the same polarity through a second metal sheet buried in the first transparent layer.
6. The transparent LED display screen of claim 3, wherein M+1 power supply pads or N+1 power supply pads are arranged on the printed circuit layer;

   The M+1 power supply pads or N+1 power supply pads include first power supply pads and second power supply pads with opposite polarities arranged at intervals;

   The electrode pin pad includes a first electrode pin pad and a second electrode pin pad; a first epitaxial portion is drawn on the first electrode pin pad; the second electrode pin pad There is a second extension part on the top lead;

   Pass the first epitaxial portion of the first electrode lead pad and the first power supply pad of the same polarity on the N lamp bead pads in the same column through the first metal buried in the first transparent layer Sheet welding electrical connection; the second extension part of the second electrode pin pad on the lamp bead welding area on the same column and the second power supply pad of the same polarity are embedded in the first transparent layer The second metal sheet is welded and electrically connected; the first metal sheet and the second metal sheet are arranged at intervals; or, the first electrode pin pads on the M lamp bead welding areas on the same line The extension part and the first power supply pad of the same polarity are electrically connected by welding the first metal sheet buried in the first transparent layer; the second electrode pin pads on the lamp bead welding area on the same column The second epitaxial portion and the second power supply pad of the same polarity are electrically connected by welding a second metal sheet buried in the first transparent layer, and the first metal sheet and the second metal sheet are arranged at intervals.
7. The transparent LED display screen according to claim 6, wherein the first metal sheet and the second metal sheet are arranged at intervals in parallel with the lamp bead welding areas on each row; The first extension part and the second extension part on the area are respectively electrically connected to the first metal sheet and the second metal sheet outside the left and right sides; wherein, the lamp bead welding areas on adjacent columns share the same polarity metal The extension part of the film is connected as a whole;

   Alternatively, the first metal sheet and the second metal sheet and the lamp bead welding areas on each row are arranged at intervals in parallel rows; the first and second extension portions on the lamp bead welding areas are respectively up and down The first metal sheet and the second metal sheet outside the two sides are electrically connected; wherein, the extension parts of the metal sheets sharing the same polarity between the lamp bead welding areas on the adjacent rows are connected as a whole.
8. The transparent LED display screen according to claim 3, wherein the signal pin pad on each lamp bead welding area includes at least a first signal input pin pad and a first signal output pin pad;

   M signal pads are arranged on the printed circuit layer; the M signal pads are soldered to the first signal input pin pads and the first signal output pins in the N lamp bead soldering areas on the same column The disks are serially connected in sequence through signal lines;

   Alternatively, N signal pads are arranged on the printed circuit layer; the N signal pads and the first signal input pin pads and first signal output lead pads in the M lamp bead pads on the same column The pin pads are serially connected in sequence through signal lines.
9. The transparent LED display screen of claim 2, wherein the upper plane of the metal sheet and the upper plane of the first transparent layer are located on the same plane.
10. The transparent LED display screen according to claim 2, wherein the first transparent layer is further provided with a sealant layer and a transparent cover plate.
11. A method for preparing a transparent LED display screen is characterized in that it comprises the following steps:

    Step S1, the step of embedding the metal sheet; arranging the metal sheet, then pouring a transparent material, and hardening the transparent material to form a first transparent layer, and embedding the metal sheet in the first transparent layer;

    Step S2, a step of forming a printed circuit layer; forming a printed circuit layer on the first transparent layer; the printed circuit layer includes power supply pads, signal pads and LED lamp beads arranged in an array Welding area; the metal sheet is electrically connected to the printed circuit layer;

    Step S3, LED lamp bead installation step: solder the LED lamp bead in the lamp bead soldering area of the printed circuit layer;

    Step S4, packaging step: then packaging on the printed circuit layer where the LED lamp beads are welded.
12. The method for manufacturing a transparent LED display screen according to claim 11, wherein the step S1 specifically includes the following steps:

    Step S11, fixing the metal sheets at a predetermined position on the second transparent layer, ensuring that each metal sheet is parallel to each other and the upper end faces are on the same plane;

    Step S12: Pouring the transparent material so that the transparent material just surpasses the metal sheet, or the upper plane of the transparent material is flush with the upper edge of the metal sheet;

    Step S13, oven-baking to harden the transparent material to form a first transparent layer, and fix the metal sheet in the first transparent layer.
13. The method for manufacturing a transparent LED display screen according to claim 12, wherein the step S1 further includes the following steps:

    Step S14: Polish the upper surface of the first transparent layer to ensure that the upper end surface of the metal sheet is exposed from the upper surface of the first transparent layer.
14. The method for manufacturing a transparent LED display screen according to claim 12, wherein the step S2 specifically includes the following steps:

    Step S21, covering the first transparent layer with copper foil;

    Step S22, etching the copper foil to form the printed circuit layer.
15. The method for manufacturing a transparent LED display screen according to claim 11, wherein the step S4 specifically includes the following steps:

    Step S41, covering a layer of transparent material on the printed circuit layer after welding the LED lamp beads;

    Step S42, covering the transparent cover plate on the transparent material in step S41;

    Step S43, passing the furnace to cure the transparent material in step S41 to form a sealant layer.

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