CN112133244B - Drive chip pin embedded LED display screen based on thin film circuit - Google Patents
Drive chip pin embedded LED display screen based on thin film circuit Download PDFInfo
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- CN112133244B CN112133244B CN202011075969.7A CN202011075969A CN112133244B CN 112133244 B CN112133244 B CN 112133244B CN 202011075969 A CN202011075969 A CN 202011075969A CN 112133244 B CN112133244 B CN 112133244B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
A thin film circuit-based drive chip pin embedded LED display screen comprises a substrate, a display device and a drive device, wherein the display device and the drive device are arranged on the substrate; the display device comprises a plurality of LED pixels, each pixel area is provided with at least one LED pixel, each LED pixel comprises at least one LED device, and a gap is formed between every two adjacent LED pixels; in each pixel region, at least one gap is provided as the chip region; the driving device at least comprises a plurality of inner driving chips, the inner driving chips are provided with high pins, the high pins of the inner driving chips are arranged in corresponding chip areas, and the bodies of the inner driving chips span part of the pixel areas. The invention can improve the display resolution and the display effect by increasing the number of the LED devices.
Description
Technical Field
The invention relates to an LED display screen, in particular to a thin film circuit-based drive chip pin embedded LED display screen.
Background
With the development of display technology, display screens with various novel structures such as ultrathin screens, transparent screens, bent screens, flexible screens and the like appear at present.
The LED display screen directly takes the array LED device as a display screen of display pixels, and has the advantages of high brightness, long service life and the like. However, the substrate of the LED display screen is generally a printed circuit board, which generally welds a large number of LED devices on the printed circuit board, and the printed circuit board is generally an opaque hard board body, which limits the structure of the LED display screen, so that the LED display screen is difficult to be made into a display screen with various novel structures, such as an ultra-thin screen, a transparent screen, a curved screen, and a flexible screen.
In order to solve the above problems, a LED display screen based on a thin film circuit is proposed, in which a substrate of the LED display screen is generally a glass substrate (or a plastic film using the glass substrate as a mother substrate), and a driving circuit of the LED display screen is generally a thin film circuit disposed on the glass substrate, and the LED display screen can be easily manufactured into a display screen with various novel structures, such as an ultra-thin screen, a transparent screen, a bending screen, and a flexible screen, under the condition of utilizing various manufacturing processes of a flat display screen (such as LCD and OLED). However, it is difficult for the thin film circuit fabricated on the glass substrate to form conductive holes penetrating through the glass substrate, as in the case of the printed circuit board, and the LED devices and the driving chips are disposed in parallel on the same surface of the glass substrate, generally, the driving chips are disposed in the peripheral region outside the display region of the LED display screen, and then signals of the driving chips are output to the LED devices within the display region through a large number of leads connected between the display region and the peripheral region.
Disclosure of Invention
The invention aims to solve the technical problem of providing a thin film circuit-based drive chip pin embedded LED display screen, which can improve the display resolution and the display effect by increasing the number of LED devices. The technical scheme is as follows:
the utility model provides an embedded LED display screen of drive chip pin based on thin film circuit, includes the base plate to and display device and the drive device of setting on the base plate, the base plate has the first surface, is equipped with the thin film circuit who constitutes by graphical film on the first surface, and the first surface divide into the display area and is in the peripheral region of display area periphery, its characterized in that: the display area is divided into a plurality of driving subareas, and each driving subarea is provided with a pixel area and a chip area; the display device comprises a plurality of LED pixels, each pixel area is provided with at least one LED pixel, each LED pixel comprises at least one LED device, and a gap is formed between every two adjacent LED pixels; in each pixel region, at least one gap is set as the chip region; the driving device at least comprises a plurality of inner driving chips, the inner driving chips are provided with high pins, the high pins of the inner driving chips are arranged in corresponding chip areas, and the bodies of the inner driving chips span part of the pixel areas.
According to the LED display screen with the embedded driving chip pins, the internal driving chips for driving the LED devices are dispersedly installed in the driving subareas, so that the functions of the internal driving chips can be simplified, the high pins of the internal driving chips are respectively arranged in the corresponding chip areas, the size of the internal driving chips can not be limited by the area size of the chip areas (the chip areas only need to provide enough area for arranging the high pins of the internal driving chips), the internal driving chips are easier to arrange in narrow gap areas between adjacent pixels, and because each driving subarea is driven by the independent internal driving chips, the number of the driving subareas is not limited basically, and the number of the LED devices can be increased to improve the display resolution and the display effect; and because the main body of the inner driving chip spans part of the pixel area, a larger peripheral area is not required to be reserved for arranging a large-area driving chip, so that more driving partitions can be arranged on the basis of unchanged display screen area to improve the display resolution and the display area. In addition, seams among the driving subareas can be set to be small, the display area and the resolution ratio of the LED display can be made to be very large through splicing of the LED display screens, and the problem that the resolution ratio and the display area of the LED display are difficult to improve is solved.
In a preferred embodiment, the internal driving chip is a packaged IC with high pins.
In a preferred embodiment, the internal driving chip is a static driving chip.
In another preferred scheme, the internal driving chip is a dynamic driving chip.
In a more preferable scheme, the driving device further includes a plurality of peripheral driving chips, each peripheral driving chip is a dynamic driving chip, and each peripheral driving chip is disposed in the peripheral region. The peripheral driving chip is used as an upper-level chip of the internal driving chip and is used for distributing display signals to each internal driving chip; or, the peripheral driving chip and the inner driving chip cooperate with each other to perform display driving.
In a further preferred embodiment, the inner driving chip is a column driving chip constituting a dynamic driving function, and the peripheral driving chip is a row driving chip constituting the dynamic driving function. The row driving chip is generally a multi-channel scan switch chip. From the peripheral region to each of the driving sections, the thin film circuit includes a row driving line connected from the row driving chip to one end (e.g., a positive electrode) of each of the LED devices of each of the driving sections, and an external input line connected to each of the column driving chips (in a serial connection); and within each drive partition, the thin film circuit includes a column drive line from each column drive chip to the other end of its respective LED device. The driving signal of each LED device is input to the driving chip through the serial signal line, the driving chip converts the driving signal into a driving signal and outputs the driving signal to the plurality of column driving lines through the transverse jumper, and the driving signal is output to one welding pin (such as an anode pin) of each LED device through the column driving lines. The row driver chip is connected to another leg (e.g., a negative pin) of each LED device through a plurality of row driver lines, thereby forming a dynamic drive circuit network connection of the column driver chip and the row driver chip to each LED device. The driving partitions in the same row share the same serial signal line, the same row driving line and the same row driving chip.
More preferably, the internal driving chip is provided with a storage unit. The storage unit is used for storing the brightness (or voltage, current) data of the LED devices driven by the internal driving chip so as to store the display state of each LED device within the required display time (such as a refresh period or a frame).
In a preferred embodiment, the substrate is a 0.2 mm-2.0 mm thick transparent glass substrate. In general, the front surface (i.e., the surface for viewing a picture) of the LED display screen is the other surface (not the first surface) of the transparent glass substrate, and the thin film circuit remains partially transparent at the position of the LED device, so that the light emitted from the LED device is emitted from the bottom through the transparent glass substrate.
In another preferred embodiment, the substrate is a 5 μm-200 μm thick plastic film. More preferably, the substrate is a polyimide film. More preferably, the substrate is a colorless polyimide film.
The LED device can be an LED chip, and also can be an LED lamp bead packaged or integrated with the LED chip. Typically, each LED pixel comprises the same number of LED devices, for example: when the LED display screen is a monochrome display screen, each LED pixel includes one LED chip, and when the LED display screen is a color display screen, each LED pixel may include three LED chips (light emission colors are red, green, and blue, respectively), or one LED bead packaged with three color LED chips. In a preferred embodiment, the pixel region is provided with a plurality of LED pixels forming a uniform array, and each LED pixel is composed of three LED devices of three emission colors, namely red, green, and blue.
Generally, the LED display screen further includes a peripheral circuit and an external circuit, wherein the peripheral circuit is disposed at the periphery of the display screen, and is generally formed by extending the thin film circuit, and is used for disposing an external interface of the LED display screen; in addition, the external circuit is an external circuit component connected to the first surface, such as a flexible circuit board (FPC), which may be used for circuit connection between different driving sections in addition to external connection for the LED display screen.
Generally, the thin film circuit is provided with a plurality of first mounting positions for mounting the respective LED devices, a plurality of second mounting positions for mounting the respective internal driving chips, and a connection circuit for electrically connecting the respective first mounting positions and the respective second mounting positions. The second mounting positions are used as mounting positions of high pins of the inner driving chip and are respectively positioned in gaps between corresponding adjacent LED pixels, and each LED device and each driving chip can be respectively mounted on the corresponding first mounting position or the corresponding second mounting position in a welding mode, an anisotropic conductive adhesive connection mode or a conductive paste (such as carbon paste and silver paste) bonding mode.
In a preferred embodiment, the thin film circuit is composed of at least two patterned conductive film layers, and an insulating film layer is disposed between each two adjacent patterned conductive film layers. The patterned conductive film layer is a metal film (such as copper alloy and Mo-Al-Mo alloy) deposited by magnetron sputtering, and a high-precision film pattern is formed by photoetching. The insulating film layer may be a patterned photosensitive resin coating layer, which is made of a photosensitive resin by extrusion coating (slit-coating), and is formed into a high-precision pattern by exposure and development. Generally, the insulating film layer is provided with a through hole for realizing the conduction of two adjacent patterned conductive film layers, so that flexible circuit routing can be realized in a drive partition with a limited area. The series signal line, the row driving line, the column driving line, the transverse jumper line and other lines are all formed by thin film circuits.
In a preferred embodiment, the gap between adjacent LED pixels at the edge of two adjacent driving sub-regions is the same as the gap distance between adjacent LED pixels in the same driving sub-region. Therefore, the LED pixels in the whole display area of the LED display screen can be ensured to be uniformly arranged.
According to the LED display screen with the embedded driving chip pins, the internal driving chips for driving the LED devices are dispersedly arranged in the driving subareas, so that the functions of the internal driving chips can be simplified, the high pins of the internal driving chips are respectively arranged in the corresponding chip areas, the size of the internal driving chips can not be limited by the area size of the chip areas (the chip areas only need to provide enough area for arranging the high pins of the internal driving chips), the internal driving chips are easier to arrange in narrow gap areas between adjacent pixels, and because each driving subarea is driven by the independent internal driving chip, the number of the driving subareas is not limited basically, and the number of the LED devices can be increased to improve the display resolution and the display effect; and because the main body of the inner driving chip spans part of the pixel area, a larger peripheral area is not required to be reserved for arranging a large-area driving chip, so that more driving partitions can be arranged on the basis of unchanged display screen area to improve the display resolution and the display area. In addition, seams among the driving subareas can be set to be small, the display area and the resolution ratio of the LED display can be made to be very large through splicing of the LED display screens, and the problem that the resolution ratio and the display area of the LED display are difficult to improve is solved.
Drawings
Fig. 1 is a schematic structural view of a preferred embodiment of the present invention.
Fig. 2 is an enlarged view of fig. 1 at a.
Fig. 3 is a schematic diagram of the structure of the driving partition in the preferred embodiment of the present invention.
Fig. 4 is a sectional view taken along line B-B of fig. 3.
Detailed Description
As shown in fig. 1-4, the thin film circuit-based LED display panel with embedded driver ic pins includes a substrate 1, and a display device 2 and a driver device 3 disposed on the substrate 1, where the substrate 1 has a first surface 11, a thin film circuit 12 formed by a patterned thin film is disposed on the first surface 11, and the first surface 11 is divided into a display area 111 and a peripheral area 112 located at the periphery of the display area 111; the display area 111 is divided into a plurality of driving subareas 113, and each driving subarea 113 is provided with a pixel area 114 and a chip area 115; the display device 2 comprises a plurality of LED pixels 21, each pixel region 114 is provided with at least one LED pixel 21, each LED pixel 21 comprises at least one LED device 211, and a gap is formed between every two adjacent LED pixels 21; in each pixel region 114, at least one gap is provided as the chip region 115; the driving device 3 includes a plurality of inner driving chips 31 and a plurality of peripheral driving chips 32, each inner driving chip 31 and each peripheral driving chip 32 are dynamic driving chips, the inner driving chip 31 has a high pin 311, the high pin 311 of the inner driving chip 31 is disposed in the corresponding chip region 115, the main body 312 of the inner driving chip 31 spans over a part of the pixel region 114, and each peripheral driving chip 32 is disposed in the peripheral region 112.
In the present embodiment, the substrate 1 is a 0.2 mm-2.0 mm thick transparent glass substrate. The front surface (i.e., the surface for viewing a picture) of the LED display screen is the other surface (not the first surface 11) of the transparent glass substrate, and the thin-film circuit 12 remains partially transparent at the position of the LED device 211, so that the light emitted from the LED device 211 is emitted from the bottom through the transparent glass substrate.
In the present embodiment, the internal driving chip 31 is a packaged IC with high pins.
In the present embodiment, the pixel region 114 is provided with a plurality of LED pixels 21 constituting a uniform array, and each LED pixel 21 is composed of three LED devices 211 of three emission colors of red, green, and blue.
In the present embodiment, the gap between the adjacent LED pixels 21 at the edge of two adjacent driving partitions 113 is the same as the gap distance between the adjacent LED pixels 21 in the same driving partition 113. This ensures that the LED pixels 21 are uniformly arranged throughout the display area 111.
In the present embodiment, the internal driving chip 31 is a column driving chip constituting a dynamic driving function, and the peripheral driving chip 32 is a row driving chip (typically, a multi-channel scan switch chip) constituting a dynamic driving function. From the peripheral region 112 to each of the driving partitions 113, the thin film circuit 12 includes a row driving line 122 connected from the row driving chip to one end (e.g., a positive electrode) of each of the LED devices 211 of each of the driving partitions 113, and an external input line connected to each of the column driving chips (in a serial connection manner); and within each drive partition 113, the thin-film circuit 12 includes a column drive line 123 from each column drive chip to the other end of its respective LED device 211; the driving signal of each LED device 211 is input to the column driving chip via the serial signal line 121, and the column driving chip converts the driving signal into a driving signal and outputs the driving signal to the plurality of column driving lines 123 via the horizontal jumper line 124, and then outputs the driving signal to one pad (e.g., a positive electrode pad) of each LED device 211 via the column driving line 123. The row driver chip is connected to another leg (e.g., a negative leg) of each LED device 211 via a plurality of row driver lines 122, thereby forming a dynamic drive circuit network connection of the column driver chip and the row driver chip to each LED device 211. The driving partitions 113 in the same row share the same serial signal line 121, the same row driving line 122 and the same row driving chip.
In the present embodiment, the internal driving chip 31 is provided with a storage unit. The storage unit is used for storing the brightness (or voltage, current) data of the LED devices 211 driven by the internal driving chip 31, so as to store the display state of each LED device 211 within the required display time (such as a refresh period or frame).
In the present embodiment, the thin film circuit 12 is composed of three patterned conductive film layers, and an insulating film layer is disposed between two adjacent patterned conductive film layers. The patterned conductive film layer is a metal film (such as copper alloy and Mo-Al-Mo alloy) deposited by magnetron sputtering, and a high-precision film pattern is formed by photoetching. The insulating film layer may be a patterned photosensitive resin coating layer, which is made of a photosensitive resin by extrusion coating (slit-coating), and is formed into a high-precision pattern by exposure and development. The insulating film layer is provided with through holes for realizing the conduction of two adjacent graphical conductive film layers, so that flexible circuit routing can be realized in the drive partition 113 with a limited area. The serial signal line 121, the row driving line 122, the column driving line 123, the transverse jumper line 124 and the like are all formed by the thin film circuit 12.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (10)
1. The utility model provides an embedded LED display screen of drive chip pin based on thin film circuit, includes the base plate to and display device and the drive device of setting on the base plate, the base plate is transparent substrate, and the base plate has a first surface, is equipped with the thin film circuit who constitutes by graphical film on the first surface, and the first surface divide into the display area and is in the peripheral region of display area periphery, its characterized in that: the display area is divided into a plurality of driving subareas, and each driving subarea is provided with a pixel area and a chip area; the display device comprises a plurality of LED pixels, each pixel area is provided with at least one LED pixel, each LED pixel comprises at least one LED device, the light emitted by the LED devices is emitted through the substrate, and a gap is formed between every two adjacent LED pixels; in each pixel region, at least one gap is set as the chip region; the driving device at least comprises a plurality of inner driving chips, the inner driving chips are provided with high pins, the high pins of the inner driving chips are arranged in corresponding chip areas, and the bodies of the inner driving chips span part of the LED pixels in part of the pixel areas.
2. The thin film circuit-based pin-embedded LED display screen of the driver chip of claim 1, wherein: the inner driving chip is a packaged IC with high pins.
3. The thin film circuit-based pin-embedded LED display screen of the driver chip of claim 1, wherein: the inner driving chip is a static driving chip.
4. The thin film circuit-based pin-embedded LED display screen of the driver chip of claim 1, wherein: the inner driving chip is a dynamic driving chip.
5. The thin film circuit-based pin-embedded LED display screen of the driver chip of claim 4, wherein: the driving device further comprises a plurality of peripheral driving chips, each peripheral driving chip is a dynamic driving chip, and each peripheral driving chip is arranged in the peripheral area.
6. The thin film circuit-based pin-embedded LED display screen of the driver chip of claim 5, wherein: the inner driving chip is a column driving chip forming a dynamic driving function, and the peripheral driving chip is a row driving chip forming the dynamic driving function.
7. The thin film circuit-based pin-embedded LED display screen of the driver chip of claim 4, wherein: the inner driving chip is provided with a storage unit.
8. The thin film circuit-based driving chip pin embedded LED display screen according to any one of claims 1-7, wherein: the pixel area is provided with a plurality of LED pixels forming a uniform array, and each LED pixel consists of three LED devices with three luminous colors of red, green and blue.
9. The thin film circuit-based driving chip pin embedded LED display screen according to any one of claims 1-7, wherein: the thin film circuit is composed of at least two graphical conductive film layers, and an insulating film layer is arranged between every two adjacent graphical conductive film layers.
10. The thin film circuit-based driving chip pin embedded LED display screen according to any one of claims 1-7, wherein: and the gap between the adjacent LED pixels at the edges of the two adjacent driving subareas is the same as the gap distance between the adjacent LED pixels in the same driving subarea.
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| CN202011075969.7A Active CN112133244B (en) | 2020-09-10 | 2020-10-10 | Drive chip pin embedded LED display screen based on thin film circuit |
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| CN115762429A (en) * | 2022-12-21 | 2023-03-07 | 广州长嘉电子有限公司 | LED backlight module partitioned lighting control method and backlight module |
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| US5818404A (en) * | 1996-03-04 | 1998-10-06 | Motorola, Inc. | Integrated electro-optical package |
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| CN112201670B (en) | 2023-04-07 |
| CN112133245A (en) | 2020-12-25 |
| CN112201670A (en) | 2021-01-08 |
| CN112133244A (en) | 2020-12-25 |
| CN112133245B (en) | 2021-12-21 |
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